Claims
- 1. A metallic material having a solidification temperature below 0.degree. C. which comprises gallium, indum, zinc and copper wherein said gallium constitutes between 70 and 80 wt %, said indium constitutes between 20 and 29 wt %, said zinc constitutes between 0.05 and 5 wt %, and said copper constitutes between 0.0001 and 1 wt %.
- 2. The metallic material of claim 1 wherein said gallium constitutes between 72 and 78 wt %, said indium constitutes between 20 and 26 wt %, said zinc constitutes between 0.1 and 1 wt %, and said copper constitutes between 0.0001 and 0.3 wt %.
- 3. A metallic material having a solidification temperature below 0.degree. C. which consists essentially of gallium, indium, zinc, and copper, wherein said gallium constitutes between 70 and 80 wt %, said indium constitutes between 20 and 29 wt %, said zinc constitutes between 0.05 and 5 wt %, and said copper constitutes between 0.0001 and 1 wt %.
- 4. The metallic material of claim 3 wherein said gallium constitutes between 72 and 78 wt %, said indium constitutes between 20 and 26 wt %, said zinc constitutes between 0.1 and 1 wt %, and said copper constitutes between 0.0001 and 0.3 wt %.
CROSS-REFERENCE TO RELATED APPLICATIONS
This patent application is a continuation-in-part (CIP) application of the co-pending patent application having U.S. Ser. No. 08/199,875 filed Feb. 22, 1994, and is also a CIP of the patent application having U.S. Ser. No. 08/022,118 filed Feb. 25, 1993, now U.S. Pat. No. 5,391,846. The complete contents of both co-pending applications is herein incorporated by reference.
US Referenced Citations (1)
Number |
Name |
Date |
Kind |
3462573 |
Rabinowitz et al. |
Mar 1995 |
|
Foreign Referenced Citations (1)
Number |
Date |
Country |
60-135548 |
Mar 1995 |
JPX |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
199875 |
Feb 1994 |
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