This disclosure describes an antenna array, and more particularly to an antenna array that utilizes reactive impedance surface and guard rings around the antenna element and a guard skirt surrounding the perimeter of the antenna array.
The explosion of network connected devices has led to an increased use of certain wireless protocols. For example, simple wireless network devices are being implemented as temperature sensors, humidity sensors, pressure sensors, motion sensors, cameras, light sensors, dimmers, light sources, and other functions. Additionally, these wireless network devices have become smaller and smaller.
These wireless network devices are typically equipped with an embedded antenna. In certain embodiments, an antenna array may be required. For example, for Angle of Arrival and Angle (AoA) of Departure (AoD) calculations, an antenna array is necessary. In certain embodiments, the array may be a two dimensional array, such as an N×M array, where N and M are both greater than one. In other embodiments, the array may be a one dimensional array, such as N×1 or 1×M, where N and M are greater than one.
There are many design considerations that must be taken into account when designing an antenna array. For example, for accurate directional angle estimations in AoX (i.e. collective of AoA and AoD) solutions, well isolated radiator elements are required in the antenna array to reduce the crosstalk between them.
In certain embodiments, ground guard rings may not be used. In this configuration, the coupling between the antenna elements causes impedance, radiation pattern and radiation efficiency spreading, which depends on the location within the array. This complicates the array design and makes EM simulations and tuning take a significant amount of time.
To address this issue, massive ground rings may be disposed around each antenna element. However, a quite large gap is required between the antenna and the ground guard ring to avoid return loss (S11) and radiation pattern detuning and degradation of radiation gain and efficiency. These gaps together with the massive ground guard rings increase the overall array size.
In some wireless devices, the amount of space that may be allocated for the antenna array is limited. Thus, it may be difficult to provide the space necessary to incorporate the ground guard rings.
Therefore, it would be advantageous if there were an antenna array that had a small form factor, but also had very limited coupling between the antennas.
An antenna array that utilizes ground guard rings and metamaterial structures is disclosed. In certain embodiments, the antenna array is constructed from a plurality of antenna unit cells, wherein each antenna unit cell is identical. The antenna unit cell comprises a top surface, that contains a patch antenna and a ground guard ring. A reactive impedance surface (RIS) layer is disposed beneath the top surface and contains the metamaterial structures. The metamaterial structures are configured to present an inductance to the patch antennas, thereby allowing the patch antennas to be smaller than would otherwise be possible. In some embodiments, the metamaterial structures comprise hollow square frames. An antenna array constructed using this antenna unit cell has less coupling than conventional antenna arrays, which results in better performance. Furthermore, this new antenna array also requires less space than conventional antenna arrays. A ground skirt surrounds the perimeter of the antenna array to improve the radiation pattern balance within the array.
According to one embodiment, an antenna unit cell is disclosed. The antenna unit cell comprises a top surface, comprising a patch antenna and a ground guard ring surrounding the patch antenna; a reactive impedance surface (RIS) layer disposed beneath the top surface, wherein the RIS layer comprises metamaterial structures; and a ground layer disposed beneath the RIS layer, wherein vias electrically connect the ground guard ring to the ground layer. In certain embodiments, the RIS layer is immediately adjacent to the top layer. In some embodiments, the ground layer is immediately adjacent to the RIS layer. In certain embodiments, the metamaterial structures comprise hollow square frames. In some embodiments, an integral number of metamaterial structures are disposed on the RIS layer in an area defined by the ground guard ring. In certain embodiments, the integral number is N2, wherein N is an integer. In some embodiments, the antenna unit cell further comprises a RIS ground guard ring disposed on the RIS layer, vertically aligned with the ground guard ring and electrically connected to the vias and the ground layer.
According to another embodiment, an antenna array comprising a plurality of the antenna unit cells described above is disclosed. The antenna array may comprise N×M antenna unit cells, wherein at least one of N and M is greater than 1.
According to another embodiment, an antenna unit cell is disclosed. The antenna unit cell comprises a top surface, comprising a patch antenna and a ground guard ring surrounding the patch antenna; a reactive impedance surface (RIS) layer disposed beneath the top surface, wherein the RIS layer comprises metamaterial structures; a ground layer disposed beneath the RIS layer, wherein vias electrically connect the ground guard ring to the ground layer; and one or more unused metal layers disposed between the top surface and the RIS layer and/or between the RIS layer and the ground layer. In certain embodiments, the antenna unit cell comprises a RIS ground guard ring disposed on the RIS layer, vertically aligned with the ground guard ring and electrically connected to the vias and the ground layer. In some embodiments, the metamaterial structures comprise hollow square frames. In some embodiments, an integral number of metamaterial structures are disposed on the RIS layer in an area defined by the ground guard ring. In certain embodiments, the integral number is N2, wherein N is an integer. In some embodiments, one or more unused metal layers are disposed between the top surface and the RIS layer and between the ground layer and the RIS layer. In certain embodiments, the antenna unit cell further comprises auxiliary ground guard rings disposed on at least one of the one of more unused metal layers, vertically aligned with the ground guard ring and electrically connected to the vias and the ground layer.
According to another embodiment, an antenna array comprising a plurality of the antenna unit cells described above is disclosed. The antenna array may comprise N×M antenna unit cells, wherein at least one of N and M is greater than 1.
According to another embodiment, an antenna array comprising a plurality of antenna unit cells described above is disclosed. Each antenna unit cell comprises a top surface, comprising a patch antenna and a ground guard ring surrounding the patch antenna; a reactive impedance surface (RIS) layer disposed beneath the top surface, wherein the RIS layer comprises metamaterial structures; and a ground layer disposed beneath the RIS layer, wherein vias electrically connect the ground guard ring to the ground layer. A ground skirt surrounds a perimeter of the antenna array on the top surface and vias electrically connect the ground skirt to the ground layer. In certain embodiments, the RIS layer is immediately adjacent to the top surface. In some embodiments, the ground layer is immediately adjacent to the RIS layer. In certain embodiments, the metamaterial structures comprise hollow square frames. In some embodiments, an integral number of metamaterial structures are disposed on the RIS layer in an area defined by the ground guard ring. In certain embodiments, the integral number is N2, wherein N is an integer. In some embodiments, the antenna unit cell further comprises a RIS ground guard ring disposed on the RIS layer, vertically aligned with the ground guard ring and electrically connected to the vias and the ground layer. The antenna array may comprise N×M antenna unit cells, wherein at least one of N and M is greater than 1. In some embodiments, the antenna array comprises one or more unused metal layers disposed between the top surface and the RIS layer and/or between the RIS layer and the ground layer. In some embodiments, auxiliary ground guard rings are disposed on at least one of the one or more unused metal layers, vertically aligned with the ground guard ring and electrically connected to the vias and the ground layer. In certain embodiments, a second ground skirt is disposed on a different layer and vertically aligned with the ground skirt on the top surface.
According to another embodiment, an antenna array comprising a plurality of antenna unit cells described above is disclosed. Each antenna unit cell comprises a top surface, comprising a patch antenna and a ground guard ring surrounding the patch antenna; and a ground layer disposed beneath the top surface, wherein vias electrically connect the ground guard ring to the ground layer. A ground skirt surrounds a perimeter of the antenna array on the top surface and vias electrically connect the ground skirt to the ground layer. The antenna array may comprise N×M antenna unit cells, wherein at least one of N and M is greater than 1. In some embodiments, the antenna array comprises one or more unused metal layers disposed between the top surface and the ground layer. In some embodiments, auxiliary ground guard rings are disposed on at least one of the one or more unused metal layers, vertically aligned with the ground guard ring and electrically connected to the vias and the ground layer. In certain embodiments, a second ground skirt is disposed on a different layer and vertically aligned with the ground skirt on the top surface. In some embodiments, additional ground skirts are disposed on additional layers or on all layers.
For a better understanding of the present disclosure, reference is made to the accompanying drawings, in which like elements are referenced with like numerals, and in which:
As shown in
The top surface of the printed circuit board is used for the patch antenna 20, while a lower layer is used for the ground layer 80. A reactive impedance surface (RIS) layer 60 is disposed beneath the top surface and above the ground layer 80. In certain embodiments, the RIS layer 60 is the layer immediately adjacent to the top surface. In some embodiments, the ground layer 80 is the layer immediately below the RIS layer 60, such that the top layer, the RIS layer 60 and the ground layer 80 are adjacent.
In other embodiments, there may be one or more intermediate layers between the RIS layer 60 and the ground layer 80, if thicker dielectric is required between them. In certain embodiments, no metal is disposed on these intermediate layers, except another instantiation of the top guard ring.
As stated above, in certain embodiments, a patch antenna 20 is disposed on the top layer of the printed circuit board. The patch antenna 20 may be square such that the patch antenna 20 may be used to receive and transmit both horizontally and vertically polarization signals. The size of the patch antenna 20 is typically defined by the desired resonant frequency, the thickness of the printed circuit board and the dielectric constant of the printed circuit board. In RIS antenna cell structures, additional tuning knobs may include the dielectric thickness between the patch antenna 20 and the RIS layer 60 and between the RIS layer 60 and the ground layer 80. Also, additional tuning knobs are the metamaterial structure frame size and width on the RIS layer.
The patch antenna 20 may be made of copper or another conductive material. The process of creating a plated area on a surface of a printed circuit board is well known.
As best seen in
A ground guard ring 30 is disposed around the perimeter of the patch antenna 20. In certain embodiments, the ground guard ring 30 may be a hollow square frame, having a thickness of at least the half of the total thickness between the top layer and the ground layer 80. The inner dimension of the ground guard ring is larger than the outer dimension of the patch antenna 20, such that there may be a gap 25 separating the patch antenna 20 from the ground guard ring 30 on all sides. In certain embodiments, the gap 25 may be approximately three times the total thickness between the top layer and the ground layer 80 or higher.
As can be seen in
Beneath the top surface is the RIS layer 60, which is also shown in
In one particular embodiment, the metamaterial structure 70 may be a hollow square frame, having an outer dimension and an inner dimension that defines a hollow interior portion 75. The width of the frame, defined as one half of the difference between the outer dimension and the inner dimension, may be adjusted to tune the resonant frequency of the metamaterial structure 70. Again, the dimensions of the metamaterial structure 70 may depend on the resonant frequency, the dielectric constant of the printed circuit board, the thickness of the dielectric between the RIS layer 60 and ground layer 80, the thickness of the applied metal, the spacing between the consecutive metamaterial structures and width of the frame of the metamaterial structures 70.
In certain embodiments, the metamaterial structures 70 are sized such that an integral number of these structures may be arranged in the area defined by the ground guard ring 30 on the top surface of the printed circuit board. In certain embodiments, this integral number may be N2, where N is an integer. In other embodiments, this integral number may be N×M, where N and M are integers. In
A top view of the antenna array is shown in
Thus, the present disclosure describes an antenna unit cell that utilizes three layers of a printed circuit board. The top layer comprises a patch antenna 20 and a ground guard ring 30 that surrounds the patch antenna 20. Beneath the top layer comprises a RIS layer 60 that comprises an integral number of metamaterial structures 70 that fit within the area defined by the ground guard ring 30 on the top layer. In some embodiments, the RIS layer 60 also includes a RIS ground guard ring 65. Below the RIS layer 60 is the ground layer.
Thus, in one embodiment, the present disclosure describes an antenna array that a utilizes a plurality of antennas wherein each antenna includes a ground guard ring and metamaterial structures disposed on a RIS layer.
Additionally, in another embodiment, the present disclosure describes an antenna unit cell, which is modular in design. In other words, an antenna array may be constructed simply by arranging the desired number of antenna unit cells 10 next to one another in one or two perpendicular directions. The metamaterial structures 70 are dimensioned such that an integral number of structures are contained in the area defined by the ground guard ring 30. In this way, the antenna unit cell is identical for each antenna in the antenna array.
Importantly, the RIS layer 60 has the effect of presenting a larger inductance. Therefore, a smaller patch antenna, having lower capacitance, can achieve the same resonant frequency as a larger patch antenna that does not utilize the RIS layer 60.
In one particular embodiment, the antenna array may be designed to transmit and receive radio frequency signals having a nominal frequency of about 2.45 GHz. This is the frequency used for many wireless protocols, including Bluetooth, WiFi, Zigbee, Thread and other 802.15.4 protocols.
In these embodiments, the patch antenna 20 may be a square having a dimension of 22×22 mm. Further, in these embodiments, the inner dimension of the metamaterial structure 70 may be 4×4 mm, while the outer dimension may be 16×16 mm. In certain embodiments, each of the metamaterial structures 70 may be dimensioned such that a side of the square structure is close to λ/4. This dimension may vary based on the distance between adjacent metamaterial structures and also on the cumulative dielectric thickness between the RIS layer 60 and the ground layer 80.
In some embodiments, the antenna array may be used in conjunction with an Angle of Arrival or Angle of Departure (collective, AoX) algorithm to determine a location of another wireless device. Various algorithms exist to determine the AoX of another device. For example, the MUSIC algorithm creates a one or two dimensional graph, depending on the configuration of the antenna array, where each peak on the graph represents a direction of arrival for an incoming signal. This one or two dimensional graph may be referred to as a pseudo-spectrum. The MUSIC algorithm calculates a value for each point on the graph.
In addition to the MUSIC algorithm, other algorithms may also be used. For example, the Minimum Variance Distortionless Response (MVDR) beamformer algorithm (also referred to as Capon's beamformer), the Bartlett beamformer algorithm, and variations of the MUSIC algorithm may also be used. In each of these, the algorithms use different mathematical formulas to calculate the angle of arrival.
This system and method have many advantages.
The use of a RIS layer 60, in conjunction with ground guard rings results in a smaller antenna array with improved performance.
First, with respect to size, a conventional antenna array, optimized for operation at 2.45 GHz, may utilize patch antennas that are each 27.50 mm squares, and are spaced apart by 12.5 mm. Thus, a conventional 4×4 antenna array may consume an area of about 170 mm×170 mm. In contrast, each of the present antenna unit cells, operating at the same frequency, has an area of 37.5 mm×37.5 mm. Thus, a 4×4 antenna array only occupies an area of about 150 mm×150 mm. Thus, the new antenna array consumes less than 80% of the area of a conventional antenna array.
Second, with respect to performance, as shown in
ER=PRAD/PINPUT.
Third, as described above, in certain embodiments, the antenna array is used in conjunction with an AoX algorithm. In each of these algorithms, the algorithm utilizes phase information from each of the plurality of antennas in the antenna array. Because the phase error of each antenna is reduced due to the ground guard rings, the results of an AoX calculation are much improved.
Additionally, the improved isolation between adjacent antenna unit cells simplifies the design and simulation of the antenna array. With this well isolated unit cell building block concept the return loss, the bandwidth, the radiation pattern and the gain and efficiency spreading are minimized. Further, these RF properties are stable everywhere within the antenna array. Consequently, it is sufficient to tune and properly design only the unit cell building block and not the whole array. This saves simulation process time and makes the array design much simpler.
In certain embodiments, it may be beneficial to include a ground skirt on the top layer of the printed circuit board. This is shown in
The ground skirt 90 is electrically connected to the ground layer 80 using a plurality of vias, similar to the vias 50 used to connect the ground guard ring 30 to the ground layer 80.
To demonstrate the effect of the ground skirt 90, several simulations were performed. In these simulations, the coordinate system is as shown in
It was found that, without the ground skirt 90, in case of the θ polarized characteristics, the main direction of radiation is in parallel with the port polarizations and there are nulls to the orthogonal directions. In case of the φ polarized signals, the main direction of radiations are orthogonal to the port polarizations.
Further, it was found that the φ polarized radiated phase characteristics are significantly deteriorated and become more asymmetric, especially at low PCB elevations (i.e. at higher θ degrees), where the signal polarization is nearly parallel to the PCB plane.
Due to the improved isolation provided by the ground skirt 90, their φ polarized phase radiation characteristics become less asymmetric and thus, be closer to that of a center patch. This is demonstrated in
Thus, the inclusion of the ground skirt 90 may improve phase uniformity for different unit cells. While the ground skirt 90 is shown on the top layer, it is understood that the disclosure is not limited to this embodiment. For example, a second ground skirt may be disposed directly below the ground skirt on the RIS layer 60, or on another intermediate layer, such that the ground skirts are vertically aligned. When multiple ground skirts are used, they may be connected to one another and to the ground layer 80 using vias, similar to the vias 50 used to connect the ground guard rings 30 and RIS ground guard ring 65.
It is noted that the ground skirt 90 may be utilized with other configurations. For example, the ground skirt 90 may be used with an array of antenna unit cells, where each antenna unit cell comprises a patch antenna on the top surface and a ground guard ring surrounding the path antenna. In other words, the antenna unit cell may not include metamaterial structures.
Further, while the figures show the array as being arranged as a rectangle or square, other configurations are also possible. For example, the antenna unit cells may be configured as a pentagon, hexagon, octagon or other shape.
The present disclosure is not to be limited in scope by the specific embodiments described herein. Indeed, other various embodiments of and modifications to the present disclosure, in addition to those described herein, will be apparent to those of ordinary skill in the art from the foregoing description and accompanying drawings. Thus, such other embodiments and modifications are intended to fall within the scope of the present disclosure. Further, although the present disclosure has been described herein in the context of a particular implementation in a particular environment for a particular purpose, those of ordinary skill in the art will recognize that its usefulness is not limited thereto and that the present disclosure may be beneficially implemented in any number of environments for any number of purposes. Accordingly, the claims set forth below should be construed in view of the full breadth and spirit of the present disclosure as described herein.
This application is a continuation-in-part of U.S. patent application Ser. No. 17/356,853, filed Jun. 24, 2021, the disclosure of which is incorporated by reference in its entirety.
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Number | Date | Country | |
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Number | Date | Country | |
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Parent | 17356853 | Jun 2021 | US |
Child | 17830536 | US |