Claims
- 1. A method of providing a strip of coated fasteners, comprising the steps of
- a) providing a plurality of metal wires positioned substantially in parallel engagement with each other;
- b) electrostatically covering the exterior surfaces of each wire with a material composed substantially of solid particles;
- c) removing any excess material from desired portions of said wires;
- d) curing the material, thereby causing said solid particles to adhere to one another and to said wires, such that said wires become adhered to one another and form a continuous band of parallel wires;
- e) cooling said coating material after said curing step, thereby forming a coating having voids therein such that a shear strength of the coating is less than a shear strength that would have resulted from the particles adhering together and forming a coating having no voids therein; and
- f) forming said band of parallel wires into fastener strips.
- 2. The method as defined in claim 1 wherein said curing step includes heating said material to a predetermined temperature and subsequent cooling such that virtually no solvent emissions are produced.
- 3. The method as defined in claim 1 including, before step b), separating said wires into predetermined parallel positions with respect to each other and, after step b), merging said wires together so they are positioned substantially in parallel engagement with each other.
- 4. The method as defined in claim 1 including performing steps a)-f) by continuously passing said plurality of metal wires through a plurality of stations.
- 5. The method as defined in claim 1 wherein said curing step includes heating to a temperature of between 550.degree. and 650.degree. F. for 1-12 seconds and said cooling step includes cooling said material immediately after said heating step.
- 6. The method as defined in claim 5 wherein said cooling includes quenching with water at about 70.degree. F.
Parent Case Info
This application is a continuation of U.S. patent application Ser. No. 08/297,003, filed Aug. 31, 1994, now abandoned, as a continuation-in-part of U.S. patent application Ser. No. 08/121,915, filed Sep. 17, 1993, now abandoned.
US Referenced Citations (11)
Continuations (1)
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Number |
Date |
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Parent |
297003 |
Aug 1994 |
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Continuation in Parts (1)
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Number |
Date |
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121915 |
Sep 1993 |
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