Claims
- 1. A method of forming a three-dimensional object on a layer-by-layer basis using a selective deposition modeling process wherein selective deposition involves using at least one orifice which dispenses a droplet of flowable material that solidifies upon being dispensed, comprising the steps of:detecting the drop volume capability of each orifice; forming a portion of the three-dimensional object; determining a predetermined drop volume capability of each orifice based upon a pre-determined drop volume capability produced by a simulation of the selective deposition modeling process; comparing the predetermined drop volume capability with the detected drop volume of each orifice; and adjusting a drop volume capability of each orifice until substantially all orifices have a uniform drop volume capability and all dispensed droplets of the flowable material have a uniform volume.
- 2. The method of claim 1, wherein the step of adjusting further comprises adjusting the drop volume capability of each orifice until all orifices have a uniform drop volume capability within 10%.
- 3. The method of claim 1, wherein the step of adjusting comprises adjusting the drop volume capability of each orifice until all orifices have a uniform drop volume capability within 5%.
- 4. The method of claim 1, wherein the step of adjusting comprises adjusting the drop volume capability of each orifice until all orifices have a uniform drop volume capability within 2%.
- 5. The method of claim 1, wherein the step of adjusting comprises adjusting the drop volume capability of each orifice using a control voltage pulse shape.
- 6. The method of claim 1, wherein the step of adjusting further comprises adjusting a drop volume capability of each orifice until substantially all orifices have uniform drop volume capabilities within all layers.
- 7. The method of claim 1, wherein the step of adjusting further comprises adjusting a drop volume capability of each orifice until substantially all orifices have uniform drop volume capabilities and each dispensed droplet of a flowable material has a uniform volume within all layers.
- 8. The method of claim 1, wherein the step of adjusting further comprises adjusting a drop volume capability of each orifice until substantially all orifices have uniform drop volume capabilities and each dispensed droplet of a flowable material has a uniform volume within a layer.
- 9. The method of claim 1, wherein the step of adjusting further comprises adjusting a drop volume capability of each orifice until substantially all orifices have uniform drop volume capabilities and each dispensed droplet of a flowable material has a uniform volume within all layers.
- 10. A method of forming a three-dimensional object, comprising the steps of:forming a portion of the three-dimensional object on a layer-by-layer basis using selective deposition modeling, wherein selective deposition modeling involves using at least one orifice which dispenses a droplet of a flowable material that solidifies upon being dispensed; creating a first region of the formed portion, the first region having a first deposition height and a first area deposition, and a second region of the formed portion, the second region having a second deposition height and a second area deposition, wherein the first area deposition is different than the second area deposition; and adjusting a drop volume capability of each orifice until the first deposition height and the second deposition height are uniform.
- 11. The method of claim 10, wherein the step of adjusting further comprises adjusting a drop volume capability of each orifice until the first deposition height and the second deposition height are uniform within 10%.
- 12. The method of claim 10, wherein the step of adjusting further comprises adjusting a drop volume capability of each orifice until the first deposition height and the second deposition height are uniform within 5%.
- 13. The method of claim 10, wherein the step of adjusting further comprises adjusting the drop volume capability of each orifice until the first deposition height and the second deposition height are uniform within 2%.
- 14. The method of claim 10, wherein the step of adjusting comprises adjusting the drop volume capability of each orifice using a control voltage pulse shape to dispense each droplet of the flowable material.
- 15. The method of claim 10, comprises adjusting the drop volume capability of each orifice based on a pre-determined drop volume capability, wherein the pre-determined drop volume capability is produced by a simulation of the selective deposition modeling process.
- 16. The method of claim 15, wherein the step of adjusting further comprises the steps of:before forming the portion of the three-dimensional object, detecting the drop volume capability of each orifice; comparing the detected drop volume capability of each orifice to the predetermined drop volume capability; and calibrating the detected drop volume capability of each orifice based on the comparison.
- 17. The method of claim 15, wherein the step of adjusting further comprises adjusting a drop volume capability of each orifice until substantially all orifices have uniform drop volume capabilities within a layer.
- 18. A method of forming a three-dimensional object, comprising the steps of:forming a portion of the three-dimensional object on a layer-by-layer basis using selective deposition modeling, wherein selective deposition modeling involves using at least one orifice which dispenses a droplet of a flowable material that solidifies upon being dispensed; creating a first region of the formed portion using a first group of orifices, and a second region of the formed portion using a second group of orifices; adjusting a drop volume capability of the first group of orifices and a drop volume capability of the second group of orifices until a deposition height of the first region and a deposition height of the second region are uniform; and controlling a drop volume capability of the first group of orifices and a drop volume capability of the second group of orifices until all dispensed droplets of the flowable material have a uniform volume.
- 19. The method of claim 18, wherein the step of controlling further comprises controlling the drop volume capability of each orifice until all dispensed droplets of the flowable material have a uniform volume within 10%.
- 20. The method of claim 18, wherein the step of controlling further comprises controlling the drop volume capability of each orifice until all dispensed droplets of the flowable material have a uniform volume within 5%.
- 21. The method of claim 18, wherein the step of controlling further comprises controlling the drop volume capability of each orifice until all dispensed droplets of the flowable material have a uniform volume within 2%.
- 22. The method of claim 18, wherein the step of adjusting comprises adjusting the drop volume capability of each orifice using a control voltage pulse shape.
- 23. The method of claim 18, wherein the step of adjusting comprises adjusting the drop volume capability of each orifice based on a pre-determined drop volume capability, wherein the pre-determined drop volume capability is produced by a simulation of the selective deposition modeling process.
- 24. The method of claim 23, wherein the step of adjusting further comprises the steps of:before forming the portion of the three-dimensional object, detecting the drop volume capability of each orifice; comparing the detected drop volume capability of each orifice to the predetermined drop volume capability; and calibrating the detected drop volume capability of each orifice based on the comparison.
- 25. The method of claim 18, wherein the step of adjusting further comprises adjusting a drop volume capability of each orifice until substantially all orifices have uniform drop volume capabilities and each dispensed droplet of a flowable material has a uniform volume within a layer.
RELATED APPLICATION
The present application is a continuation-in-part of U.S. Pat. No. 5,943,235 issued Aug. 24, 1999, which is a continuation-in-part of U.S. patent application Ser. No. 08/534,813, filed Sep. 27. 1995, now abandoned.
US Referenced Citations (13)
Continuation in Parts (2)
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Number |
Date |
Country |
Parent |
08/722326 |
Sep 1996 |
US |
Child |
09/258019 |
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US |
Parent |
08/534813 |
Sep 1995 |
US |
Child |
08/722326 |
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US |