Claims
- 1. A method of determining the thermoparticulating temperature of a compound which thermoparticulates at a temperature below 230.degree. C. comprising
- (1) mixing about 20 to about 250 phr of said compound into a liquid resin which is unreactive with said compound and which is solidifiable and stable at the thermoparticulating temperature of said compound;
- (2) solidifying said resin;
- (3) providing a flow of gas over said mixture;
- (4) monitoring said gas for the presence of particles therein;
- (5) gradually heating said mixture; and
- (6) noting the temperature of said mixture when said monitor detects particles in said gas.
- 2. A method according to claim 1 wherein said gas is hydrogen.
- 3. A method according to claim 1 wherein said monitoring is performed by an ion chamber.
- 4. A method according to claim 1 wherein said resin is air-dryable.
- 5. A method according to claim 1 wherein said resin is an epoxy resin.
- 6. A method according to claim 1 wherein the amount of said compound is about 40 to about 60 phr.
- 7. A method according to claim 1 wherein said resin is in a solution of a solvent, and the solvent is evaporated to solidify the resin.
- 8. Apparatus for determining the thermoparticulation temperature of a compound which thermoparticulates at a temperature below 230.degree. C. comprising
- (1) a liquid resin which is unreactive with said compound and which is solidifiable and stable at the thermoparticulation temperature of said compound;
- (2) means for mixing said liquid resin with about 20 to about 250 phr of said compound and for thereafter solidifying said resin;
- (3) means for providing a flow of gas over said mixture;
- (4) means for monitoring the presence of particles in said gas;
- (5) means gradually heating said mixture; and
- (6) means for determining the temperature of said mixture.
- 9. Apparatus according to claim 8 wherein said gas is hydrogen.
- 10. Apparatus according to claim 8 wherein said means for monitoring is an ion chamber.
- 11. Apparatus according to claim 8 wherein said resin is air-dryable.
- 12. Apparatus according to claim 11 wherein said resin is an epoxy resin.
- 13. Apparatus according to claim 8 wherein the amount of said compound is about 40 to about 60 phr.
- 14. Apparatus according to claim 8 wherein said resin is in a solution of a solvent, and the solvent is evaporated to solidify the resin.
Parent Case Info
This application is a division of application Ser. No. 669,554 filed Mar. 23, 1976, now U.S. Pat. No. 4,102,809 which in turn is a division of application Ser. No. 390,284 filed Aug. 21, 1973, now U.S. Pat. No. 3,973,438.
US Referenced Citations (11)
Foreign Referenced Citations (1)
Number |
Date |
Country |
2122385 |
Nov 1972 |
DEX |
Non-Patent Literature Citations (1)
Entry |
Murphy, C. B., "TPA-A New . . . Materials", Plastics Design & Processing-Reprint, Jul. 1964, pp. 1-4. |
Divisions (2)
|
Number |
Date |
Country |
Parent |
669554 |
Mar 1976 |
|
Parent |
390284 |
Aug 1973 |
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