The Fing-Pitch Screen-Printing Process, by Gary Preeman, MPM Corp., SMT Fine Pitch (No date given). |
Process Modelling Maps for Solder Paste Printing, by N. N. Ekere, E. K. Lo and S. H.Mannan, Dept. of Aeronautical and Mechanical Engineering, University of Salford, Salford, England (No date given). |
A Study of the Off-Contact Screen Printing Process-Part I: Model of the Printing Process and Some Results Derived from Experiments, by Jerzy A. Owczarek and Frank L. Howland, IEEE Transaction on Components, Hybrids, and Manufacturing Technology, vol. 13, No. 2, Jun. 1990, pp. 358-367. |
Parameters for Solder Paste Printing by Scott K. Buttars, Compaq Computer, Houston Texas, pp. 799-806 (No date given). |
Estimation of Shear Rates During "Rolling" in the Screening and Stencilling Process, by Joseph Kevra, Central Research Labs. Alpha Metals, Inc., The International Journal for Hybrid Microelectronics, vol. 12, No. 4, Dec., 1989. |
Analytical Engineering Model of the Screen Printing Process: Part I, by Dietrich E. Riemer, Solid State Technology/Aug. 1988, pp. 107-111. |
Analytical Engineering Model of the Screen Printing Process, Part II, by Dietrich E. Riemer, Solid State Technology/Sep. 1988 pp. 85-90. |
Screen Process Printing Techniques, Finding a Solution to Smearing and Skipping Will Effectively Resolve Registration Problems., by Mike Young, PC FAB, Feb. 1987, pp. 77-90. |