Patent Application
20220339751
The background description provided herein is for the purpose of generally presenting the context of the disclosure. Work of the presently named inventor, to the extent it is described in this background section, as well as aspects of the description that may not otherwise qualify as prior art at the time of filing, are neither expressly nor impliedly admitted as prior art against the present disclosure.
Demand is strong and increasing for high edge strength thin glass display substrates of complex form factors. Where demand for such substrates conventionally resided in the consumer electronics space (e.g., handheld electronics), it is now growing rapidly in new spaces such as automotive and even advanced optics applications. Much like their handheld electronics counterparts (cell phones and tablets), new thin glass substrates of complex shapes are often made from thin glass to satisfy consumer requirements for overall weight (as in the case of automotive glazing products), surface cleanliness (as in the case of electrochromic windows in the architectural glass space), and functionality (as in the case of automotive interior products) while maintaining high mechanical edge strength.
Conventional singulation of thin substrates, such as glass substrates, having relatively high strength often includes a plurality of mechanical edge grinding and polishing steps. Typically, edges may be formed using course grinding materials, which may introduce subsurface damage on substrate edges. The edges may further be subject to a progression of grinding steps with a plurality of grinding wheels having decreasing abrasive sizes in order to reduce the subsurface damage introduced by the initial edge forming. The edge grinding steps may be used to reduce subsurface damage introduced by initial grinding or other edge forming processes.
Such conventional edge forming and finishing processes may be time consuming, capital inefficient, and expensive, often comprising one of the most expensive and time-consuming operations of the substrate formation, particularly where edges of interior features of a substrate are formed and finished as well. In some cases, edge forming and finishing may comprise up to 50% of the total substrate manufacturing cost. As may be appreciated from
Substrate edge strength achieved by conventional mechanical grinding and polishing may be relatively low, falling short of 300 MPa in some cases, as may be appreciated with respect to
Thus, there is a need in the art for an improved edge forming and finishing process suitable for manufacturing high strength, complex form, thin substrates.
The following presents a simplified summary of one or more embodiments of the present disclosure in order to provide a basic understanding of such embodiments. This summary is not an extensive overview of all contemplated embodiments and is intended to neither identify key or critical elements of all embodiments, nor delineate the scope of any or all embodiments.
The present disclosure relates to high strength thin substrates of complex form factor. In particular, the present disclosure relates to singulation of high strength thin substrates, such as high strength glass substrates, including near net shaping, edge profiling and finishing. More particularly, the present disclosure relates to methods and devices for forming and finishing edges of high strength thin glass substrates.
The present disclosure, in one or more embodiments, relates to a substrate with a polished edge, the substrate having a mechanical edge strength of at least 700 MPa and edge flaws of not more than 2 microns in size. The substrate may comprise a brittle material (as described herein). The polished edge may have a plurality of brush marks arranged thereon in a substantially parallel configuration. The substrate may have a thickness of between approximately 0.01 mm and approximately 6 mm. In some embodiments, the substrate may have a mechanical edge strength of at least 1 GPa. The substrate may have a chamfered or radiused edge profile in some embodiments. Moreover, the substrate may be a glass laminate in some embodiments.
The present disclosure, in one or more embodiments, additionally relates to a method of simultaneously forming and finishing an edge surface of a substrate. The method may include arranging a near-net shaped substrate between a first interposer and a second interposer, applying a compressive force to the substrate and interposers, and simultaneously shaping and polishing an edge surface of the substrate using a brush, wherein each interposer device includes a size and edge profile configured to guide the brush to achieve a desired edge profile shape of the substrate. In some embodiments, shaping and polishing the edge surface of the substrate may include brushing the edge surface with a rotary brush and a polishing slurry. The polishing slurry may include a cerium oxide with a grain size ranging from 0.3 to 15.0 μm. The polishing slurry may include a mechanical abrasive slurry with an abrasive size ranging from 30 nm to 100 μm. Moreover, the polishing slurry may have an alkalinity ranging from pH 6-10. In some embodiments, the brush may have a plurality of filaments, each having a diameter of not more than 0.2 mm. Each interposer device may include a contoured edge and a thickness of between 0.01 and 10 times a thickness of the substrate. In some embodiments, simultaneously shaping and polishing an edge surface of the substrate may include chamfering and polishing an edge surface of the substrate. A liquid impermeable seal may be formed between each interposer device and the substrate. In some embodiments, the substrate may include strengthened glass, unstrengthened glass, ceramic, or silicon. Additionally, in some embodiments, the first interposer may have a first size and the second interposer may have a second size smaller than the first size.
The present disclosure, in one or more embodiments, additionally relates to an interposer for separating adjacent near-net shaped substrates during a brushing operation performed on an edge surface of the substrates. The interposer may include a perimeter shape configured to align with a perimeter shape of the substrates, a thickness of between 0.01 and 10 times a thickness of the substrates, an edge profile corresponding to a desired edge profile shape of the substrates, and a width corresponding to the desired edge profile shape of the substrates. In some embodiments, the interposer may include a gromet arranged through an opening in the interposer, the gromet configured to increase friction between the interposer and adjacent substrates. Additionally, the interposer may have an opening configured to align with an opening of the substrates for brushing of an interior edge of the substrates.
While multiple embodiments are disclosed, still other embodiments of the present disclosure will become apparent to those skilled in the art from the following detailed description, which shows and describes illustrative embodiments of the invention. As will be realized, the various embodiments of the present disclosure are capable of modifications in various obvious aspects, all without departing from the spirit and scope of the present disclosure. Accordingly, the drawings and detailed description are to be regarded as illustrative in nature and not restrictive.
While the specification concludes with claims particularly pointing out and distinctly claiming the subject matter that is regarded as forming the various embodiments of the present disclosure, it is believed that the invention will be better understood from the following description taken in conjunction with the accompanying Figures, in which:
The present disclosure relates to processes and devices by which a brittle material substrate, which may be near-net shaped by a range of cutting and separation technologies, may be edge formed and finished to simultaneously remove corresponding damage remaining on the edges in the areas formed by cutting and separation while imposing a desired edge profile and achieving a desired mechanical edge strength. Processes and devices of the present disclosure may be employed to achieve a substrate edge with flaws of no more than 1.0 micrometers and a mechanical edge strength of up to or exceeding 1.25 GPa. Additionally, processes and devices of the present disclosure may be employed to achieve a substrate edge with an average roughness (Ra) of no more than 10 nm, root mean square roughness (Rms) of no more than 20 nm, and a peak to valley (PV) or no more than 500 nm. The brittle material substrates may be of primitive form (unstrengthened glasses, strengthened glasses, ceramics, silicon, metals, or other) or processed with coatings, decorations, and/or thin film devices.
Some particular substrate materials that may be formed and finished using processes and devices of the present disclosure may include soda-lime glass, annealed soda-lime glass, aluminosilicate glass, alkali aluminosilicate glass, laminated glass (or glass laminates) having any suitable core and clad materials, and/or other brittle materials. Processes and devices described herein may be employed to form and/or finish a substrate having any suitable edge profile shape, which may be a symmetric shape or asymmetric shape.
Processes of the present disclosure may include a chemical and mechanical brush polishing process configured to shape and/or polish a surface of one or more thin substrates. In some embodiments, a plurality of substrates may be formed and finished together in a batch brushing process. The plurality of substrates may be arranged in a stacked configuration, and engineered interposer devices may be arranged between the stacked substrates. The interposers may provide space between the substrates and may additionally be configured to direct filament placement during brushing so as to guide material removal on the substrate edges. In this way, the interposers may be shaped and sized so as to expose desired portions of the substrate edges and side surfaces to brushing while protecting other portions from brushing. Substrate edge profile shapes, including symmetric and asymmetric profiles, may be formed by strategic manipulation of interposer properties including dimensions, mechanical features, material properties, and positioning within the processing batch.
Brittle substrates having a thickness of between approximately 0.005 mm and approximately 12.0 mm, or between approximately 0.01 mm and approximately 6.0 mm, or having any other relatively small thickness, may be used in a variety of industries and for a variety of technologies and applications, including for example screens or surfaces for handheld electronics such as cell phones and tablet computers and automotive interior surfaces, such as dashboard components. Such substrates may have, for example, a length, width, or diameter of between approximately 50 mm and approximately 1500 mm, or may have any other suitable dimensions. Materials for such applications may include glass, glass laminates, silicon, and/or other suitable materials. These thin components may have particular consumer or manufacturer requirements for overall weight, surface cleanliness, functionality, and edge strength. Such components may additionally have relatively complex shapes and/or may have interior features in some cases.
Conventional forming and finishing processes may introduce cracks, chips, and/or other flaws into a substrate.
Turning now to
The process 500 may be used in the manufacture of relatively thin substrates comprising glass, glass laminate, other laminate, glass composite, silicon, or other relatively brittle materials for use in automotive applications, architectural applications, consumer electronics, and/or other industries. The glass substrate or other substrate may be pre-strengthened. In one or more embodiments, the glass substrate is strengthened and exhibits a compressive stress (CS) region that extends from one or both side surfaces (e.g., side surfaces 712A, 714A of
In one or more embodiments, the glass substrate may be strengthened mechanically by utilizing a mismatch of the coefficient of thermal expansion between portions of the substrate to create a compressive stress region and a central region exhibiting a tensile stress. In some embodiments, the glass substrate may be strengthened thermally by heating the glass to a temperature above the glass transition point and then rapidly quenching.
In one or more embodiments, the glass substrate may be chemically strengthening by ion exchange. In the ion exchange process, ions at or near the surface of the glass substrate are replaced by—or exchanged with—larger ions having the same valence or oxidation state. In those embodiments in which the glass substrate comprises an alkali-containing glass, ions in the surface layer of the article and the larger ions are monovalent alkali metal cations, such as Li+, Na+, K+, Rb+, and Cs+. Alternatively, monovalent cations in the surface layer may be replaced with monovalent cations other than alkali metal cations, such as Ag+ or the like. In such embodiments, the monovalent ions (or cations) exchanged into the glass substrate generate a stress.
In one or more embodiments, the glass substrate has a CSmax that is about 900 MPa or greater, about 920 MPa or greater, about 940 MPa or greater, about 950 MPa or greater, about 960 MPa or greater, about 980 MPa or greater, about 1000 MPa or greater, about 1020 MPa or greater, about 1040 MPa or greater, about 1050 MPa or greater, about 1060 MPa or greater, about 1080 MPa or greater, about 1100 MPa or greater, about 1120 MPa or greater, about 1140 MPa or greater, about 1150 MPa or greater, about 1160 MPa or greater, about 1180 MPa or greater, about 1200 MPa or greater, about 1220 MPa or greater, about 1240 MPa or greater, about 1250 MPa or greater, about 1260 MPa or greater, about 1280 MPa or greater, or about 1300 MPa or greater. In one or more embodiments, the CSmax is in a range from about 900 MPa to about 1500 MPa, from about 920 MPa to about 1500 MPa, from about 940 MPa to about 1500 MPa, from about 950 MPa to about 1500 MPa, from about 960 MPa to about 1500 MPa, from about 980 MPa to about 1500 MPa, from about 1000 MPa to about 1500 MPa, from about 1020 MPa to about 1500 MPa, from about 1040 MPa to about 1500 MPa, from about 1050 MPa to about 1500 MPa, from about 1060 MPa to about 1500 MPa, from about 1080 MPa to about 1500 MPa, from about 1100 MPa to about 1500 MPa, from about 1120 MPa to about 1500 MPa, from about 1140 MPa to about 1500 MPa, from about 1150 MPa to about 1500 MPa, from about 1160 MPa to about 1500 MPa, from about 1180 MPa to about 1500 MPa, from about 1200 MPa to about 1500 MPa, from about 1220 MPa to about 1500 MPa, from about 1240 MPa to about 1500 MPa, from about 1250 MPa to about 1500 MPa, from about 1260 MPa to about 1500 MPa, from about 1280 MPa to about 1500 MPa, from about 1300 MPa to about 1500 MPa, from about 900 MPa to about 1480 MPa, from about 900 MPa to about 1460 MPa, from about 900 MPa to about 1450 MPa, from about 900 MPa to about 1440 MPa, from about 900 MPa to about 1420 MPa, from about 900 MPa to about 1400 MPa, from about 900 MPa to about 1380 MPa, from about 900 MPa to about 1360 MPa, from about 900 MPa to about 1350 MPa, from about 900 MPa to about 1340 MPa, from about 900 MPa to about 1320 MPa, from about 900 MPa to about 1300 MPa, from about 900 MPa to about 1280 MPa, from about 900 MPa to about 1260 MPa, from about 900 MPa to about 1250 MPa, from about 900 MPa to about 1240 MPa, from about 900 MPa to about 1220 MPa, from about 900 MPa to about 1210 MPa, from about 900 MPa to about 1200 MPa, from about 900 MPa to about 1180 MPa, from about 900 MPa to about 1160 MPa, from about 900 MPa to about 1150 MPa, from about 900 MPa to about 1140 MPa, from about 900 MPa to about 1120 MPa, from about 900 MPa to about 1100 MPa, from about 900 MPa to about 1080 MPa, from about 900 MPa to about 1060 MPa, from about 900 MPa to about 1050 MPa, or from about 950 MPa to about 1050 MPa, or from about 1000 MPa to about 1050 MPa. CSmax may be measured at a major surface or may be found at a depth from the major surface within the CS region.
In one or more embodiments, the glass substrate has stress profile a CS magnitude of 800 MPa or greater at a depth within the glass substrate of about 10 micrometers from one or both side surfaces (CS10). In one or more embodiments, the CS10 is about 810 MPa or greater, about 820 MPa or greater, about 830 MPa or greater, about 840 MPa or greater, about 850 MPa or greater, about 860 MPa or greater, about 870 MPa or greater, about 880 MPa or greater, about 890 MPa or greater, or about 900 MPa or greater. In one or more embodiments, the CS10 is in a range from about 800 MPa to about 1000 MPa, from about 825 MPa to about 1000 MPa, from about 850 MPa to about 1000 MPa, from about 875 MPa to about 1000 MPa, from about 900 MPa to about 1000 MPa, from about 925 MPa to about 1000 MPa, from about 950 MPa to about 1000 MPa, from about 800 MPa to about 975 MPa, from about 800 MPa to about 950 MPa, from about 800 MPa to about 925 MPa, from about 800 MPa to about 900 MPa, from about 800 MPa to about 875 MPa, or from about 800 MPa to about 850 MPa.
In one or more embodiments, the glass substrate has a stress profile with a CS magnitude of 700 MPa or greater, or about 750 MPa or greater at a depth within the glass substrate from one or both side surfaces of about 5 micrometers from the first major surface 102 (CS5). In one or more embodiments, the CS5 is about 760 MPa or greater, about 770 MPa or greater, about 775 MPa or greater, about 780 MPa or greater, about 790 MPa or greater, about 800 MPa or greater, about 810 MPa or greater, about 820 MPa or greater, about 825 MPa or greater, or about 830 MPa or greater. In one or more embodiments, the CS5 is in a range from about 700 MPa to about 900 MPa, from about 725 MPa to about 900 MPa, from about 750 MPa to about 900 MPa, from about 775 MPa to about 900 MPa, from about 800 MPa to about 900 MPa, from about 825 MPa to about 900 MPa, from about 850 MPa to about 900 MPa, from about 700 MPa to about 875 MPa, from about 700 MPa to about 850 MPa, from about 700 MPa to about 825 MPa, from about 700 MPa to about 800 MPa, from about 700 MPa to about 775 MPa, from about 750 to about 800 MPa, from about 750 MPa to about 850 MPa, or from about 700 MPa to about 750 MPa.
In one or more embodiments, the CTmax magnitude is about 80 MPa or less, about 78 MPa or less, about 76 MPa or less, about 75 MPa or less, about 74 MPa or less, about 72 MPa or less, about 70 MPa or less, about 68 MPa or less, about 66 MPa or less, about 65 MPa or less, about 64 MPa or less, about 62 MPa or less, about 60 MPa or less, about 58 MPa or less, about 56 MPa or less, about 55 MPa or less, about 54 MPa or less, about 52 MPa or less, or about 50 MPa or less. In one or more embodiments, the CTmax magnitude is in a range from about 40 MPa to about 80 MPa, from about 45 MPa to about 80 MPa, from about 50 MPa to about 80 MPa, from about 55 MPa to about 80 MPa, from about 60 MPa to about 80 MPa, from about 65 MPa to about 80 MPa, from about 70 MPa to about 80 MPa, from about 40 MPa to about 75 MPa, from about 40 MPa to about 70 MPa, from about 40 MPa to about 65 MPa, from about 40 MPa to about 60 MPa, from about 40 MPa to about 55 MPa, or from about 40 MPa to about 50 MPa.
In one or more embodiments, the DOC of the glass substrate is about 0.2*thickness of the glass substrate (0.2*t) or less. For example, DOC may be about 0.18t or less, about 0.18t or less, about 0.16t or less, about 0.15t or less, about 0.14t or less, about 0.12t or less, about 0.1t or less, about 0.08t or less, about 0.06t or less, about 0.05t or less, about 0.04t or less, or about 0.03t or less. In one or more embodiments, DOC is in a range from about 0.02t to about 0.2t, from about 0.04t to about 0.2t, from about 0.05t to about 0.2t, from about 0.06t to about 0.2t, from about 0.08t to about 0.2t, from about 0.1t to about 0.2t, from about 0.12t to about 0.2t, from about 0.14t to about 0.2t, from about 0.15t to about 0.2t, from about 0.16t to about 0.2t, from about 0.02t to about 0.18t, from about 0.02t to about 0.16t, from about 0.02t to about 0.15t, from about 0.02t to about 0.14t, from about 0.02t to about 0.12t, from about 0.02t to about 0.1t, from about 0.02t to about 0.08, from about 0.02t to about 0.06t, from about 0.02t to about 0.05t, from about 0.1t to about 0.8t, from about 0.12t to about 0.16t, or from about 0.14t to about 0.17t.
In one or more embodiments, the glass may be unstrengthened. In some embodiments, the unstrengthened glass comprises an annealed glass.
Exemplary compositions for such glass substrate may include a soda-lime silicate glass composition, an aluminosilicate glass composition, or an alkali aluminosilicate glass composition. In some embodiments, the glass substrate may be or include Corning® Gorilla® Glass, Lotus™ NXT, Eagle XG® glass, Willow® Glass, and/or any other glass types and other brittle materials.
The glass substrate may have a thickness in a range from about 0.1 mm to about 6 mm or that is in a range from about 0.1 mm to about 1.5 mm. For example, glass substrate may have a thickness that is greater than about 0.125 mm (e.g., about 0.13 mm or greater, about 0.13 mm or greater, about 0.13 mm or greater, about 0.13 mm or greater, about 0.13 mm or greater, about 0.13 mm or greater, about 0.13 mm or greater, about 0.13 mm or greater, about 0.13 mm or greater, about 0.13 mm or greater, about 0.13 mm or greater, about 0.13 mm or greater, about 0.13 mm or greater, about 0.13 mm or greater, about 0.13 mm or greater). In one or more embodiments, the glass substrate thickness may be in a range from about 0.01 mm to about 1.5 mm, 0.02 mm to about 1.5 mm, 0.03 mm to about 1.5 mm, 0.04 mm to about 1.5 mm, 0.05 mm to about 1.5 mm, 0.06 mm to about 1.5 mm, 0.07 mm to about 1.5 mm, 0.08 mm to about 1.5 mm, 0.09 mm to about 1.5 mm, 0.1 mm to about 1.5 mm, from about 0.15 mm to about 1.5 mm, from about 0.2 mm to about 1.5 mm, from about 0.25 mm to about 1.5 mm, from about 0.3 mm to about 1.5 mm, from about 0.35 mm to about 1.5 mm, from about 0.4 mm to about 1.5 mm, from about 0.45 mm to about 1.5 mm, from about 0.5 mm to about 1.5 mm, from about 0.55 mm to about 1.5 mm, from about 0.6 mm to about 1.5 mm, from about 0.65 mm to about 1.5 mm, from about 0.7 mm to about 1.5 mm, from about 0.01 mm to about 1.4 mm, from about 0.01 mm to about 1.3 mm, from about 0.01 mm to about 1.2 mm, from about 0.01 mm to about 1.1 mm, from about 0.01 mm to about 1.05 mm, from about 0.01 mm to about 1 mm, from about 0.01 mm to about 0.95 mm, from about 0.01 mm to about 0.9 mm, from about 0.01 mm to about 0.85 mm, from about 0.01 mm to about 0.8 mm, from about 0.01 mm to about 0.75 mm, from about 0.01 mm to about 0.7 mm, from about 0.01 mm to about 0.65 mm, from about 0.01 mm to about 0.6 mm, from about 0.01 mm to about 0.55 mm, from about 0.01 mm to about 0.5 mm, from about 0.01 mm to about 0.4 mm, from about 0.01 mm to about 0.3 mm, from about 0.01 mm to about 0.2 mm, from about 0.01 mm to about 0.1 mm, from about 0.04 mm to about 0.07 mm, from about 0.1 mm to about 1.4 mm, from about 0.1 mm to about 1.3 mm, from about 0.1 mm to about 1.2 mm, from about 0.1 mm to about 1.1 mm, from about 0.1 mm to about 1.05 mm, from about 0.1 mm to about 1 mm, from about 0.1 mm to about 0.95 mm, from about 0.1 mm to about 0.9 mm, from about 0.1 mm to about 0.85 mm, from about 0.1 mm to about 0.8 mm, from about 0.1 mm to about 0.75 mm, from about 0.1 mm to about 0.7 mm, from about 0.1 mm to about 0.65 mm, from about 0.1 mm to about 0.6 mm, from about 0.1 mm to about 0.55 mm, from about 0.1 mm to about 0.5 mm, from about 0.1 mm to about 0.4 mm, or from about 0.3 mm to about 0.7 mm.
In one or more embodiments, the glass substrate has a width in a range from about 5 cm to about 250 cm, from about 10 cm to about 250 cm, from about 15 cm to about 250 cm, from about 20 cm to about 250 cm, from about 25 cm to about 250 cm, from about 30 cm to about 250 cm, from about 35 cm to about 250 cm, from about 40 cm to about 250 cm, from about 45 cm to about 250 cm, from about 50 cm to about 250 cm, from about 55 cm to about 250 cm, from about 60 cm to about 250 cm, from about 65 cm to about 250 cm, from about 70 cm to about 250 cm, from about 75 cm to about 250 cm, from about 80 cm to about 250 cm, from about 85 cm to about 250 cm, from about 90 cm to about 250 cm, from about 95 cm to about 250 cm, from about 100 cm to about 250 cm, from about 110 cm to about 250 cm, from about 120 cm to about 250 cm, from about 130 cm to about 250 cm, from about 140 cm to about 250 cm, from about 150 cm to about 250 cm, from about 5 cm to about 240 cm, from about 5 cm to about 230 cm, from about 5 cm to about 220 cm, from about 5 cm to about 210 cm, from about 5 cm to about 200 cm, from about 5 cm to about 190 cm, from about 5 cm to about 180 cm, from about 5 cm to about 170 cm, from about 5 cm to about 160 cm, from about 5 cm to about 150 cm, from about 5 cm to about 140 cm, from about 5 cm to about 130 cm, from about 5 cm to about 120 cm, from about 5 cm to about 110 cm, from about 5 cm to about 110 cm, from about 5 cm to about 100 cm, from about 5 cm to about 90 cm, from about 5 cm to about 80 cm, or from about 5 cm to about 75 cm.
In one or more embodiments, the glass substrate has a length in a range from about 5 cm to about 250 cm, from about 10 cm to about 250 cm, from about 15 cm to about 250 cm, from about 20 cm to about 250 cm, from about 25 cm to about 250 cm, from about 30 cm to about 250 cm, from about 35 cm to about 250 cm, from about 40 cm to about 250 cm, from about 45 cm to about 250 cm, from about 50 cm to about 250 cm, from about 55 cm to about 250 cm, from about 60 cm to about 250 cm, from about 65 cm to about 250 cm, from about 70 cm to about 250 cm, from about 75 cm to about 250 cm, from about 80 cm to about 250 cm, from about 85 cm to about 250 cm, from about 90 cm to about 250 cm, from about 95 cm to about 250 cm, from about 100 cm to about 250 cm, from about 110 cm to about 250 cm, from about 120 cm to about 250 cm, from about 130 cm to about 250 cm, from about 140 cm to about 250 cm, from about 150 cm to about 250 cm, from about 5 cm to about 240 cm, from about 5 cm to about 230 cm, from about 5 cm to about 220 cm, from about 5 cm to about 210 cm, from about 5 cm to about 200 cm, from about 5 cm to about 190 cm, from about 5 cm to about 180 cm, from about 5 cm to about 170 cm, from about 5 cm to about 160 cm, from about 5 cm to about 150 cm, from about 5 cm to about 140 cm, from about 5 cm to about 130 cm, from about 5 cm to about 120 cm, from about 5 cm to about 110 cm, from about 5 cm to about 110 cm, from about 5 cm to about 100 cm, from about 5 cm to about 90 cm, from about 5 cm to about 80 cm, or from about 5 cm to about 75 cm.
In some embodiments, the substrate may be or include a relatively thin steel laminate or other thin laminate product. The substrate may additionally or alternatively be coated, decorated, or otherwise pre-treated. For example, the substrate may be coated with one or more inks or thin films. In some embodiments, such decorations may be applied prior to near-net shaping. Additionally or alternatively, a decoration layer may be applied after near-net shaping and/or at any other suitable point in the manufacturing process. Each of the process steps 502-510 will be described in more detail below with reference to the additional drawings.
The substrate may be near-net shaped 502 using any suitable method. For example, the substrate may be near-net shaped using a mechanical score and break process wherein a larger sheet of glass or other substrate is scored with an outline of the component to be formed and finished, and the component is mechanically separated from the larger sheet along the score line. In other embodiments, near-net shaping may be performed by nano-perforation and thermal separation, using for example, lasers supplied by Corning Laser Technologies (CLT). In some embodiments, near-net shaping may include a first step of nanoperforation via, for example, Crack Propagation Control (CPC) technology and a second step of thermal separation via a CO2 laser or other suitable laser device. In other embodiments, near-net shaping may include nanoperforation (such as via CPC) and self-separation. In some embodiments, the substrate may be edge profiled during near-net shaping, or as part of a near-net shaping step. For example, laser edge chamfering technology may be used to simultaneously near-net shape and edge profile the substrate. Strengthening, decoration, coating, and/or other treatments may be performed prior to edge forming and finishing in some embodiments.
The near-net shaped substrate may be arranged between a first interposer and a second interposer 504. Each interposer may be sized and shaped similar to the substrate. The interposers may be configured to separate adjacent substrates, and may additionally be configured to expose and protect desired areas or portions of substrate edges so as to direct brush filaments during brushing operations. In some embodiments, a plurality of substrates may be aligned and arranged in a stacked configuration with interposers arranged between individual substrates.
For example, in some embodiments, the interposer 600 may have a length L sized to match a desired finished length of a corresponding substrate to be formed and finished. That is, where the finished substrate is configured to have a final length of 100 mm, for example, the corresponding interposer may additionally have a length L of 100 mm. In other embodiments, the interposer 600 may have a length L that is slightly smaller than a desired finished length of a corresponding substrate to be formed and finished. For example, where the substrate is configured to have a final length of 100 mm, the corresponding interposer may have a length L of 99 mm, 98 mm, 97 mm, 96 mm, 95 mm, or a different length. In this way, the interposer 600 may be sized to expose more substrate material to brushing operations, as described in more detail below. In still other embodiments, the interposer 600 may have a length L sized to be larger than a desired finished length of a corresponding substrate. The width W of the interposer may additionally be sized to match, be smaller than, or be larger than a desired finished width of a corresponding substrate to be formed and finished. In some embodiments, the length L of the interposer 600 may range between approximately 50 mm and approximately 1500 mm, and the width W may range between approximately 50 mm and approximately 500 mm. In other embodiments, the interposer 600 may have smaller or larger dimensions sized to correspond with the particular substrate(s) to be processed.
As shown in
The interposer 600 may have a perimeter or outer edge surface 604 having a defined profile shape. The profile shape may be configured for directing brush filaments to desired portions of the substrate, as described in more detail below, to achieve a desired substrate edge profile shape. The profile shape of the interposer edge 604 may be a chamfered edge and with two chamfered corners 605, as shown for example in
The interposer 600 may be constructed of Polytetrafluoroethylene (PTFE) in some embodiments. The interposer 600 may additionally or alternatively include one or more paper materials, one or more plastics, neoprene, silicone, elastomer materials, and/or other suitable materials. The interposer 600 may be constructed with materials configured to be resistant to relatively harsh chemistries (e.g., acidity, alkalinity), capable of withstanding processing temperature extremes, relatively soft where the range of polymeric materials is concerned, and non-marking with respect to the substrate surface. In some embodiments, the interposer 600 may be constructed of one or more materials having a pH of between approximately 6.0 and 11.0, or between approximately 7.0 and approximately 9.0. Interposer material(s) may additionally be configured to be readily machined and configured to possess a relatively high degree of mechanical rigidity enabling robotic handling. Interposer material(s) may be configured to be easily cleaned and reused. Interposer material(s) may be configured to be non-marking, such that the interposer does not leave markings on substrates. In some embodiments, interposer material(s) may be relatively soft and may be configured to expand laterally when compressed. Interposer material(s) may be configured to form a seal, which may be a liquid impermeable seal, against substrate materials. Such a seal may be configured to prevent the polishing slurry from flowing onto the substrate beyond the exposed portions, and/or may be configured to distribute the compressive force applied to the substrate/interposer stack to prevent crushing of the substrate.
In some embodiments, the interposer 600 may have one or more through holes 602 extending between the two side surfaces 601. The interposer 600 may have between 1 and 10, or more, through holes 602 symmetrically or otherwise strategically spaced across the interposer. In some embodiments, each through hole 602 may be a counterbored, or countersunk, through hole having a double-chambered cross-sectional shape. Each through hole 602 may have first and second chambers 606 each having a depth extending into first and second sides 601 of the interposer, respectively, and a channel 608 extending between the chambers. The channel 608 may have a width or diameter smaller than that of the chambers 606. In other embodiments, the through holes 602 may have a constant width or diameter, or may have any other suitable cross-sectional shape. In some embodiments, the through holes 602 may each be configured to receive a stabilizer or stabilizing material. Stabilizers or stabilizing material may include one or more rubbers or other moldable materials configured to have a higher coefficient of friction against the substrate material, as compared with the surrounding interposer material. In some embodiments, the stabilizers may be readily removable from the through holes 602. In some embodiments, arranging the substrate between a first and second interposer may include placing a stabilizer or stabilizing material into each through hole 602 before, during, or after each interposer is arranged in the stack. However, in other embodiments, interposers 600 may be employed without a stabilizer or stabilizing material arranged in the through holes 602.
It is to be appreciated that the interposer 600 may be sized and shaped to correspond with a substrate or plurality of substrates to be formed and finished. In at least one embodiment, the interposer 600 may have a length L of between approximately 100 mm and approximately 1000 mm, and a width W of between approximately 30 mm and approximately 300 mm. The interposer 600 may have a thickness T of between approximately 0.1 mm and approximately 10 mm. Through holes 602 may have a width or diameter of between approximately 1 mm and approximately 20 mm. However, in other embodiments, interposers 600 may have any other suitable dimensions sized to correspond with substrate(s) to be finished. The interposer 600 may be sized with a length L and width W that is equal to, or slightly smaller than, or slightly larger than, a desired length and width of the substrate(s) to be finished. In some embodiments, the interposer 600 may have a length configured to be between 0.1-10 mm smaller than a finished substrate length, and a width configured to be between 0.1-10 mm smaller than a finished substrate width. In other embodiments, the interposer 600 may have other suitable dimensions relative to the substrate(s).
In some embodiments, a plurality of substrates may be arranged in a stack with an interposer arranged between each adjacent pair of substrates. The substrates may each have a same desired finished shape and size. In this way, a plurality of substrates arranged in a stack may have their edges formed and finished simultaneously in a batch process. In some embodiments, up to 5, up to 10, up to 20, up to 50, up to 100, up to 200, up to 300, up to 400, or up to 500 substrates may be arranged together in a stack with interposers arranged between each pair of substrates. In other embodiments, more or fewer substrates may be arranged together in a stack for batch processing. Endcaps or chucks may be arranged at each end (e.g., top and bottom) of the part stack in some embodiments. Endcaps or chucks may be constructed of one or more metals or other suitable materials. In some embodiments, interposers may be screen printed directly onto substrates. For example, a first substrate may be positioned in a stack, an interposer having desired shape and dimensions may be screen printed directly onto a side surface of the substrate, and a second substrate may be arranged in the stack over the printed interposer. In such embodiments, the interposers may be mechanically and/or chemically removed after brushing operations.
With reference back to
Brushing the substrate edges 508 may include contacting an edge of the substrate with a brush and a polishing material or slurry. The brush and slurry may be configured to polish an edge surface of the substrate in order to remove chips, cuts, or other flaws. Additionally, in some embodiments, the brush and slurry may be configured to simultaneously shape the edge surface of the substrate by mechanically and/or chemically removing substrate material to achieve a desired shape.
The brush may be sized to correspond with the stack of substrates and may have a plurality of bristles or filaments extending from a base portion. Brush filaments may be constructed of one or more polymeric, resin materials, or carbon fiber materials in some embodiments. In other embodiments, other suitable filament materials may be used. Additionally, brush filaments may each have a diameter of not more than 0.500 mm or not more than 0.200 mm in some embodiments. In some embodiments, brush filaments may have a diameter of between approximately 0.100 mm and approximately 0.500 mm. Filaments may have a circular or polygonal cross-sectional shape in some embodiments. Brush filaments may have a length of between approximately 1 mm and approximately 200 mm. Filaments of a brush may have varied lengths and/or varied diameters in some embodiments. Moreover, brush filaments may be arranged in discrete tufts or bundles, each tuft or bundle having a diameter of between approximately 1.0 mm and approximately 10.0 mm. Individual filaments or tufts of filaments may be arranged in a particular pattern on the brush base. For example, bundles or tufts may be arranged in a straight, spiral, staggered, random or other pattern. Additionally, a brush may have a brush density (or filament density) of between approximately 10% and approximately 95%, or between approximately 30% and approximately 90%, or between approximately 50% and approximately 85%. In at least one embodiment, a brush of the present disclosure may have a brush density of approximately 68.5%. In other embodiments, filaments and tufts may have any other suitable sizing and configuration.
In some embodiments, the brush may be a rotary brush configured to rotate about a central longitudinal axis. In some embodiments, the rotary brush may be configured to rotate about its central axis while it is moved laterally along an edge of the substrate, while the substrate and interposer stack is fixed. In other embodiments, the substrate stack may additionally or alternatively be configured to rotate about a central axis of the stack, which may be parallel to the rotation axis of the brush. In some embodiments, the brushing step may be performed by rotating the brush in a first direction and additionally rotating the substrate and interposer stack in an opposing second direction. This may be particularly useful where the substrate(s) have a round planar shape. It is to be appreciated that a brushing process of the present disclosure may operate to polish an entire perimeter edge of a substrate using a single pass polar motion, and without a need for corner dwelling or rounding motions.
The brush may be operated to apply a polishing material or slurry to the substrate. The polishing material or slurry may be configured to chemically and/or mechanically remove substrate material to simultaneously shape and/or polish an edge surface of the substrate. In some embodiments, the polishing material may be or include an abrasive slurry, such as a cerium oxide or diamond slurry. In some embodiments, the polishing material may include cerium oxide or another abrasive or chemical abrasive with a grain size of between approximately 0.01 micrometers and approximately 15.0 micrometers, or between 0.05 and 7.0 micrometers, between 0.1 and 1.0 micrometers, or between 0.1 and 0.5 micrometers. In at least one embodiment, the polishing material may have a cerium oxide or other abrasives or chemical abrasives having a grain size of between approximately 0.1 and approximately 0.3 micrometers. The cerium oxide slurry or other polishing material may have an alkalinity ranging from a pH of 6 to a pH of 11. In at least one embodiment, the polishing material may include a DND Dia-Sol Nanodiamond in 50 ct/liter with a diamond abrasive size ranging from approximately 30 nm to approximately 100 micrometers. Other polishing materials, including chemical and/or mechanical polishing materials may be used in other embodiments. In some embodiments, multiple polishing materials may be used consecutively or simultaneously.
In some embodiments, the brush may be configured for receiving and distributing the polishing material. For example, the brush base from which brush filaments extend may have perforations or channels configured for ejecting polishing material from the brush base onto the filaments and substrate. Perforations may be distributed throughout the brush base. Polishing material may be expelled through the perforations via an extrusion system or via centripetal force of a rotating brush. Perforations may have a circular, polygonal, or any other suitable cross-sectional shape with any diameter suitable for achieving a desired flow rate of a polishing material having a defined viscosity. In some embodiments, the brush base may have a rotary union configured to enable continuous polishing material recharging from an external source as needed.
During the brushing operation, the brush may be driven at a speed of between approximately 10 and approximately 1000 rpm. Additionally, in some embodiments, a brush may be driven with a linear speed along an edge of the substrates of between approximately 1 and approximately 1000 m/min. The brush may be arranged such that a butting distance between the substrate edge and brush filaments is maintained at between approximately 0.1 and approximately 10.0 mm. In some embodiments, butting distance may be varied, such as with each pass of the brush. In some embodiments, a first butting distance may be configured to achieve material removal for edge forming, while a second butting distance may be configured to achieve edge polishing. In this way, each pass of the brush may be directed primarily toward shaping or primarily toward polishing, depending on the butting distance. Brushing may be performed until a desired edge profile is achieved and until a maximum flaw size or average flaw size on the substrate edge is reduced to less than 3 micrometers, less than 2 micrometers, or less than 1 micrometer. The brushing step may operate to form a desired edge shape of the substrate, which may be a chamfered, beveled, radiused, or other suitable edge profile or shape, and to simultaneously polish the substrate edge.
In some embodiments, the brushing step may include a single stage brushing step. That is, in some embodiments, a single brush may be used with a suitable number of passes over the edge surface to both shape and polish the edges. In other embodiments, brushing may be performed in multiple steps using, for example, more than one brush and/or more than one polishing material. For example, a first brushing step may be performed using a first brush and polishing material having a first grain size, and a second brushing step may be performed using the brush and a polishing material having a second, smaller grain size. As a particular example, a second brushing step may include brushing substrate edges with a fine polishing cerium oxide slurry having a grain size of between approximately 0.1 micrometers and approximately 0.5 micrometers.
During the brushing step, the interposers may operate to direct the brush filaments to remove substrate material into a desired edge profile or shape. In particular, the interposers may be configured to expose a desired amount of the substrate edge to the brush surface, such that a desired amount of the substrate edge may be subject to material removal from the brushing step.
For example,
As another example,
In some embodiments, interposers may be used to produce an asymmetric edge profile of a substrate. For example, one or more substrates may be spaced apart by differently sized and/or differently shaped interposers.
In other embodiments, an asymmetric edge profile of a substrate may be achieved with interposers having an asymmetric edge.
In other embodiments, interposers may have other edge profile shapes. For example,
It is thus to be appreciated that interposers of the present disclosure may have any suitable length and width, thickness, and edge profile shape configured to achieve a desired substrate edge profile. The interposers may be configured to expose a particular area or amount of substrate to the brushing and/or to protect other areas, so as to guide or direct contact between brush filaments and the substrates. In this way, the interposers may channel any defects caused by brushing onto the substrate edge, rather than allowing defects to be formed on the substrate surface.
With reference back to
It is to be appreciated that, in some embodiments, the process 500 described above may operate to simultaneously form and finish an edge surface of a substrate without mechanical grinding. That is, edge chamfering or other edge shaping may be provided by chemical and/or mechanical interaction between the polishing material and the substrate material as the polishing material is brushed over the edge surface. The process described above may operate to form and shape an edge surface without inflicting the damage that mechanical grinding, such as from grinding wheels, often produces. It is further to be appreciated that, without scratches, chips, and/or other flaws inflicted by mechanical grinding, a relatively high edge strength may be achieved using the process described above.
The process 500 described above may provide for a finished substrate with a relatively high edge strength. In particular, a substrate having edges shaped and polished using the processes and apparatuses described herein may have a mechanical edge strength of at least 100 MPa, at least 300 MPa, at least 500 MPa, at least 700 MPa, at least 900 MPa, at least 1 GPa, at least 1.25 GPa, or more.
With continued reference to
With continued reference to
Additionally, processes of the present disclosure may produce a substrate having a relatively low edge roughness. For example, the process 500 may produce a substrate having an edge with an of between approximately 1 nm and approximately 10 nm. In some average roughness (Ra) embodiments, the Ra may be between approximately 6 nm and approximately 8 nm. Moreover, brushing processes described herein may produce a substrate edge with a root mean square roughness (rms) of between approximately 2 nm and approximately 20 nm. In some particular embodiments, the edge may have a rms of between approximately 2 nm and approximately 12 nm, or between approximately 10 nm and approximately 12 nm. In some embodiments, brushing processes described herein may produce a substrate edge with a peak to valley (PV) measurement of between approximately 50 nm and approximately 500 nm, or between approximately 80 nm and approximately 300 nm. In still other embodiments, brushing processes of the present disclosure may produce a substrate edge having a different Ra, rms, and/or PV.
Simultaneous edge shaping and polishing processes of the present disclosure may be used to form and finish chemically strengthened substrates as well as multi-layered substrates, such as glass laminates or other laminates. It is to be appreciated that processes of the present disclosure thus may provide an improvement over conventional forming and finishing processes, as conventional mechanical grinding processes may be unsuitable for laminates and chemically strengthened materials. For example, conventional mechanical edge grinding may be unsuitable for glass laminates and other laminates because different grinding materials and/or grinders may be needed to grind core materials and clad materials of the laminated substrate.
A substrate formed and/or finished by a process of the present disclosure may have any desired edge profile shape. To achieve a desired edge profile shape, interposers may be sized (length, width, and thickness) and/or shaped (e.g., chamfered) to expose a desired portion or area of the substrate to the brush filaments. Additionally, in some embodiments, a brush and/or brush filaments may be sized, shaped, and/or positioned to achieve a desired substrate edge profile. For example, brush filaments may be sized, shaped, and/or arranged to define a reverse geometry of a desired edge profile shape. For example, brush filaments with varying lengths may be arranged along a brush core in rows to achieve a reverse profile shape of a desired edge profile.
For example, in some embodiments, a substrate of the present disclosure may be formed and/or finished to have a flat or squared edge profile shape. For example, and as described above with respect to
In some embodiments, a substrate may be provided with a symmetrically chamfered (or double chamfered) edge profile shape. With reference for example to
In some embodiments, a substrate may be provided with a bullnose or other rounded or radiused edge profile shape. With reference for example to
In some embodiments, a substrate of the present disclosure may have an asymmetrical edge profile shape. For example, a substrate may be finished to have a chamfered, beveled, or mitered edge profile shape. With reference for example to
It is to be appreciated that different edge profile shapes may be configured or suitable for different applications. In addition to those discussed above, in still other embodiments, a substrate of the present disclosure may be finished to have a double beveled, half-bullnose demi-bullnose, or ogee edge profile shape. In some embodiments, a substrate edge profile shape may be configured to have a combination of two or more of the shape elements described above. For example, in at least one embodiment, a substrate edge may be configured to have half-radiused or half-bullnose profile shape in combination with a chamfered or beveled corner surface. In particular, a substrate of the present disclosure may have a profile that extends from a first side surface of the substrate with a curved or radiused edge and extends from an opposing second side surface of the substrate with a chamfered or beveled edge having an angle of approximately 45 degrees, for example. Other asymmetrical or symmetrical edge profile shapes are contemplated as well and may be achieved by the processes described herein.
In some embodiments, a substrate of the present disclosure may be finished with a relatively complex edge profile shape.
With continued reference to
Additionally, processes of the present disclosure may be used to shape and/or polish decorated substrates. For example, substrates having an ink, film, device layer, which may include electrically active devices, and/or other decoration may be formed and finished using processes of the present disclosure. In at least one embodiment, a substrate of the present disclosure may have an electronic device layer printed or otherwise affixed to or arranged on a surface of the substrate. The device layer may include, for example, microLED materials having metallized (e.g., Cu) interconnects in some embodiments. In other embodiments, the device layer may have other suitable electronic components. As another example, a substrate of the present disclosure may have an ink layer printed or otherwise affixed to or arranged on a surface of the substrate. The ink layer may include organic and/or inorganic inks. Other decorative layers may include, films, or overlays are contemplated as well. Such device layers, ink layers, and/or other layers may be arranged on the substrate prior to application of a brushing process described herein. Conventional mechanical edge grinding processes may be unsuitable for such decorated substrates as the grinding may cause damage to the decoration layer. In some embodiments, processes of the present disclosure may provide for improved printing or coating processes. For example, a brushing process of the present disclosure may be used to finish a printed ink line or other decoration line. Because brushing processes of the present disclosure may be performed after decorations are applied without harming the decorations, the brushing may be used to achieve desired printing tolerances and print lines. For example,
In some embodiments, interposers of the present disclosure may be used to apply, or assist in applying, decorations to substrates. For example, an interposer of the present disclosure may have an electronic device layer, or other desired decoration or layer, affixed thereto with a reverse configuration. The device layer or other decoration or layer may be configured to be transferrable, such that the decoration or layer may transfer from the interposer onto a substrate when the substrate is arranged in contact with the interposer. In some embodiments, the compressive force applied to a stack of substrates and interposers may help to transfer the decoration or layer from the interposer onto the substrate. In some embodiments, an adhesive layer may be applied between the decoration and substrate.
Simultaneous edge shaping and polishing processes of the present disclosure may additionally provide for a substantial time savings over conventional forming and finishing processes. That is, rather than a series of mechanical grinding steps to remove edge material and a series of polishing steps to remove flaws inflicted from the grinding, the single-stage brushing step described above may provide for a less time-consuming and less labor-intensive process.
It is to be appreciated that the processes described herein may provide for replacement of conventional mechanical near net shaping and edge finishing with a single step, semi-batch brush polishing process that simultaneously forms and finishes thin glass edges. The above solutions represent a larger opportunity to deploy a superior finishing process technology across numerous projects. This may be particularly seen with respect to automotive interior products. For example, finished thin glass product edge quality specifications for automotive interior products may be particularly demanding, requiring an edge strength of up to 215 MPa prior to chemical strengthening. Such a mechanical edge strength has been calculated to require maximum flaws post grinding not to exceed 11 microns, for example. A consequence of this is that manufacturing lines are now undergoing installation and commissioning that are not capable of meeting commercial and/or cost model objectives for edge finished thin glass products. Additionally, some manufacturers and industries have shown an increasing demand for thin glass parts that can be cold formed; such capability requires relatively high edge strength, which may be higher than can be achieved by conventional mechanical edge grinding followed by chemical strengthening.
While the edge forming and finishing processes described herein may be used in place of conventional grinding steps, it may further be appreciated that brushing processes described herein may be used in combination with substrate edge grinding in some embodiments. For example, a near-net shaped substrate may have edges formed by one or more mechanical grinding steps, after which the substrate may be arranged between interposers and subject to a brushing process described herein to polish edges to achieve a desire edge strength. Mechanical grinding may be performed using an abrasive grinding medium having a suitable abrasive size. Additionally, edge forming and finishing processes described herein may be used in place of, or in combination with, chemical edge strengthening processes such as, but not limited to, HF treatment and ion exchange treatment.
Forming and finishing processes of the present disclosure may provide for an ability to meet or exceed relatively high edge strength requirements by forming and finishing with brushing and polishing material and, in some embodiments, without employing mechanical edge grinding. Conventional mechanical edge grinding processes may not be capable of achieving the thin substrate edge strength that can be achieved using brushing processes of the present disclosure. As described above, edge strength of substrates prior to final chemical strengthening may reach up to 150, 200, 250, 300 or more MPa using brushing processes of the present disclosure. Moreover, with the addition of a final chemical strengthening step, edge strength of a finished product may reach up to 500, 700, 800, 900, or 1000 MPa in some embodiments. Forming and finishing processes of the present disclosure may provide for up to, or more than, a 30% edge strength increase over conventional processing paths, which may in turn enable cold forming applications for thin glass products. Additionally, the polished edge surfaces and low flaws of the substrates may allow for automated inspection of sampled parts.
Forming and finishing processes of the present disclosure may additionally provide for more efficient and cost-effective manufacturing. In particular, a plurality of substrates, including tens or even hundreds of substrates, may be arranged in a stack with an interposer arranged between each substrate. The stack of substrates may be formed and finished together using the brushing processes described herein. Thus, processing time may be reduced to less than 10 minutes, less than 5 minutes, or less than 3 minutes per part. Additionally, processes of the present disclosure may have lower material waste as compared with conventional forming and finishing processes. In particular, brush polishing may achieve a desired edge shape and polish with less material removal than may be needed with a conventional grinding process. Moreover, processes of the present disclosure may provide for improved processing efficiency by allowing for edge forming and finishing to be performed on substrates after application of inks, devices, films, and/or other decorations. By applying decorations prior to edge forming and finishing, process time may be reduced dramatically. Forming and finishing processes of the present disclosure may also be versatile in that such processes may be applied to a relatively wide variety of substrate materials, including for example, laminate materials and chemically strengthened materials, both of which may present challenges for conventional forming and finishing processes.
Following are some additional advantages that may be achieved by edge forming and finishing processes of the present disclosure:
In some embodiments, a substrate produced or processed by brushing processes described herein may have an optical quality edge with fine brush marks visible via magnification on the substrate edge, bevel, and/or side surface adjacent to the edge. Additionally, the substrate may have an optical quality border region on a side surface adjacent the edge. The substrate may have optically visible vertical nanoperforation edge striations obscured by an optical quality edge finish. Additionally, where a substrate with a printed decoration is subject to a brushing process of the present disclosure, an ink line of the decoration may be crisp with a sharp definition and may be free of a jagged or waved shape. Visible brush marks resulting from a brushing process of the present disclosure may be seen, according to one embodiment, in the photomicrographic images of
A number of embodiments are described in the following paragraphs to provide some examples of manufacturing processes of the present disclosure. It is to be appreciated that the following embodiments are provided as examples, and the application is not limited to the following embodiments.
In at least one embodiment of the present disclosure, non-strengthened thin glass substrates or other non-strengthened substrates may be prepared by a range of near net shaping technologies including, but not limited to: conventional picosecond laser cutting (nanoperforation and subsequent thermal separation); crack propagation control (CPC) picosecond laser cutting (nanoperforation and subsequent thermal separation); picosecond partial laser cutting (partial nanoperforation) and subsequent mechanical separation; ablative laser cutting (CO2, fiber laser) and subsequent mechanical separation; mechanically scoring, breaking, and edge grinding, and/or mechanically scoring and breaking. The non-strengthened thin glass substrates or other non-strengthened substrates may have edges simultaneously formed to a desired edge profile and polished to a high-quality edge finish with characteristically low residual damage and flaw distribution and therefore high mechanical edge strength. A stack composed of alternating thin substrates and engineered interposers may be produced. The interposers may be strategically positioned to control exposure of the edge to be polished to the polishing medium(s) and slurry(ies). The interposers employed may be designed with a combination of desired mechanical (relative dimensions, edge profile, compressibility, slip-stick coefficient, coefficient of thermal expansion, abrasion resistance, static charge), chemical (polishing slurry resistance, alkalinity resistance), electrical (static charge), and magnetic material properties. The stack may be restrained via simple prolonged mechanical compression. The thin substrate edges with controlled edge exposure may be subjected to a brush polishing process in which brushes are brought into controlled contact with the engineered stack of thin substrates and contacted with continuous streams of polishing slurry in a programmed set of operating motions. Brushes may be cylindrical brushes composed of engineered filaments of small (≤0.200 mm) diameter and a range of lengths fastened together in bundles or “tufts” of a range of sizes (e.g., 3-5 mm), patterns (e.g., spiral, staggered, straight), and brush densities, and may be rotated at prescribed linear or surface speeds (10-1000 rpm). The substrates may be brush polished until residual subsurface damage from near net shaping is reduced to characteristic maximum flaw size <2 microns and the desired edge profile is imposed. The substrates may be further polished via subsequent brush polish step(s) with engineered finer polishing slurries employing separate brushes thereby further reducing residual subsurface damage. Thin glass substrates or other substrates processed via this process may be subsequently strengthened after forming and finishing by to further increase mechanical strength. Thin glass substrates or other substrates that are of ion exchangeable composition may be chemically strengthened to incrementally increase mechanical edge strength after forming and finishing.
In at least one embodiment of the present disclosure, strengthened or laminated thin glass articles or other substrates may be prepared by a range of near net shaping technologies, including but not limited to, those listed above. The strengthened or laminated thin glass substrates or other substrates may have edges simultaneously formed to a desired edge profile and polished to a high-quality edge finish with characteristically low residual damage and flaw distribution and therefore high mechanical edge strength by the processes described herein.
In at least one embodiment of the present disclosure, strengthened and decorated thin glass substrates or other substrates prepared by decoration via screen printing of multiple parts on a full sheet with fiducials applied to enable crack propagation control (CPC) picosecond laser cutting (nanoperforation followed by self-separation) may have edges simultaneously formed to a desired edge profile and polished to a high-quality edge finish with characteristically low residual damage and flaw distribution and therefore high mechanical edge strength by the processes described herein.
In at least one embodiment of the present disclosure, strengthened and subsequently over-decorated thin glass substrate or other substrates prepared by decoration via screen printing of multiple parts on a full sheet with fiducials applied to enable crack propagation control (CPC) picosecond laser cutting (nanoperforation followed by self-separation) may have edges simultaneously formed to a desired edge profile and polished to a high-quality edge finish with characteristically low residual damage and flaw distribution and therefore high mechanical edge strength by processes described herein. Strategic interposers may be positioned between the substrates in such a way as to simultaneously allow removal by polishing a section of surface over-decoration thereby forming the decoration boundary instead of just preserving an existing one.
In at least one embodiment of the present disclosure, edges of internal features of thin glass substrates or other substrates may be simultaneously formed and finished. Internal features may be machined (mechanically formed or laser ablated/laser cut) into thin glass parts, such as non-strengthened glass, strengthened glass, laminated glass, strengthened and decorated glass substrates, or other substrates. Internal features may include holes, slots, and/or irregular features such as keyholes and other regular or irregular shapes. Interposers may be configured to have corresponding internal features. A stack may be produced composed of alternating substrates and engineered interposers such that internal features are aligned to allow access to internal edges. The interposers may be strategically positioned to control exposure of the internal edges to be polished to the polishing medium(s) and slurry(ies). The interposers may be designed with a combination of desirable mechanical (relative dimensions, edge profile, compressibility, slip-stick coefficient, coefficient of thermal expansion, abrasion resistance, static charge), chemical (polishing slurry resistance, alkalinity resistance), electrical (static charge), and magnetic material properties. The stack may be restrained via simple prolonged mechanical compression. The thin glass edges with controlled edge exposure may be subjected to a brush polishing process in which one or more brushes are brought into controlled contact with the stack allowing passage of reduced diameter brushes through the internal feature openings with a honing motion. Brushes may be cylindrical brushes composed of engineered filaments of small (≤0.200 mm) diameter and a range of lengths fastened together in bundles or “tufts” of a range of sizes (e.g., 3-5 mm), patterns (e.g., spiral, staggered, or straight), and brush densities may be rotated at prescribed speeds (100-1000 rpm) and contacted with continuous streams of polishing slurry in a programmed set of operating motions. The substrate internal features may be polished until residual subsurface damage from near net shaping is reduced to characteristic maximum flaw size <2 microns and the desired edge profile is imposed. The internal feature edges may be further polished via subsequent brush polish step(s) with engineered finer polishing slurries employing separate brushes thereby further reducing residual subsurface damage. The internal features may be chemically strengthened by exposure to HF to incrementally increase mechanical edge strength after brushing.
In at least one embodiment, glass or aluminum discs intended for use in data storage (e.g., hard drive storage discs) may be molded or fusion formed and then laser near net shaped. The discs may have a perimeter edge and may additionally have an internal feature edge surrounding a central hole. Edges of both the perimeter and internal center hole may be brush polished according to processes of the present disclosure until both perimeter and internal center hole edges are formed and finished to the desired shape, strength, smoothness, and/or degrees of flaws or damage.
In at least one embodiment of the present disclosure, intricate edge features, such as those used in collimation of incident light in light guides may be formed and finished using a brushing process of the present disclosure. For example, thin glass light guides bearing collimation features, such as those shown in
Where a substrate, such as a thin glass light guide, has a device layer imprinted or deposited on a side surface, which may be relatively fragile or sensitive, interposer materials may be selected to protect the device layer. For example, a suitable interposer may be configured with one or more soft, compressible materials or material layers. The interposer may have one or more outer liner layers. The interposer may be configured to mechanically absorb substrate surface devices to protect such devices from slurry incursion but also from compression damage. As an example, the interposer may be or include HT6135 silicone elastomer material, as manufactured by Marian Chicago, Inc., with plastic liners arranged on both sides. Additionally, when arranged in a stack for brushing, the substrates may each be oriented such that the side bearing sensitive features faces downward. A plastic liner may be removed from one side from each interposer, and the interposers may be oriented such that the soft elastomer face with plastic liner removed is pressed against the sensitive device layer of one substrate, and the other side of the interposer (with plastic liner still adhered to interposer) put in contact with the back of an adjacent substrate. The elastomer material may form a seal against the device layer of the substrate, which may be a liquid impermeable seal. In some embodiments, the interposers may remain in place during downstream post-brushing processing. The interposers may be readily peeled from the glass surfaces bearing sensitive features.
In at least one embodiment of the present disclosure, substrate edges may be formed and finished using mechanical slurry particles. A suitable mechanical slurry may be or include the DND Nanodiamond slurry product portfolio (includes DIA-SOL HL product name and brand) manufactured for and distributed by Fujimi Corporation—these slurries are produced in concentrated (50 ct/liter) form and in a wide range of particle sizes (30 nm-75 μm) and types (friable, metal bond). Other suitable mechanical slurry particles may be used additionally or alternatively. The slurry is dispensed in its most concentrated form (e.g., 50 ct/liter) for maximum efficiency, however dilution with water may be practiced as desired. The mechanical slurry particles may be readily rinsed clean after brushing.
In at least one embodiment of the present disclosure, substrate edges may be formed and finished using a colloidal silica and accelerant (commonly KOH but not limited to this) as a chemical/mechanical slurry. This may be particularly useful for forming and finishing edges of silicon substrates. Continuous streams of the colloidal silica/KOH polishing slurry may be released during brushing. The slurry may be dispensed in dilute form (e.g., 20:1 slurry in deionized water), however other dilutions may be used. The substrates may be further polished via subsequent brush polish step(s) with engineered finer chemical/mechanical polishing slurries (e.g., highly dilute, ammonia stabilized colloidal silica finishing slurries such as Fujimi Glanzox products).
In at least one embodiment of the present disclosure, brush polishing may be performed using interposers having a transferrable pattern (e.g., decal), enabling edge finishing to be conducted while the pressure used to restrain the stack is used to simultaneously transfer the pattern on the interposer onto a surface of the thin glass substrates. For example, a stack may be produced composed of alternating substrates and interposers. The interposers may be strategically positioned to control exposure of the edge to be polished to the polishing medium(s) and slurry(ies). The interposers may be designed with a combination of desired mechanical (relative dimensions, edge profile, compressibility, slip-stick coefficient, coefficient of thermal expansion, abrasion resistance, static charge), chemical (polishing slurry resistance, alkalinity resistance), electrical (static charge), and/or magnetic material properties. The interposers may additionally each have a transferrable decoration material arranged thereon and configured for activation by contact and pressure, such that during restraint by compression and brush polishing, desired decoration patterns may be transferred to the substrates being polished. The stack may be restrained via simple prolonged mechanical compression. The substrate edges may be subjected to a brush polishing process in which cylindrical brushes composed of engineered filaments of small (≤0.200 mm) diameter and a range of lengths fastened together in bundles or “tufts” of a range of sizes (e.g., 3-5 mm), patterns (e.g., spiral, staggered, straight), and/or brush densities are rotated at prescribed speeds (10-1000 rpm) and contacted with continuous streams of polishing slurry in a programmed set of operating motions. The filaments may be brought into controlled contact with the engineered stack of substrates. The substrates may be polished until residual subsurface damage from near net shaping is reduced to characteristic maximum flaw size <2 microns and the desired edge profile is imposed. The substrates may be further polished via subsequent brush polish step(s) with engineered finer polishing slurries employing separate brushes thereby further reducing residual subsurface damage. The substrates may be further chemically strengthened by exposure to HF and/or ion exchange.
In at least one embodiment, a brushing process of the present disclosure may provide for reduced polishing cycle time, as compared with conventional polishing operations. For example, a brush may be operated to have a smooth polar polishing motion along an edge of the substrate stack, without intentional dwelling of polishing pressure and/or time on substrate corners or other edge features. In this way, a brush of the present disclosure may be continuously moved along a substrate perimeter edge with a constant or near constant linear speed (e.g., between 5-100 mm/min, or another suitable speed). It is to be appreciated that without corner or other feature dwelling or rounding motions, typical of conventional brushing operations, brush polishing operations of the present disclosure may be performed with reduced pass cycle times. Such compact polar polishing passes may be repeated to achieve a relatively high resolution.
In at least one embodiment, an interposer of the present disclosure may be or include one or more magnetically active materials. Moreover, in some embodiments, endcaps or chucks arranged at each end of the part stack may be configured to provide an electrostatic force. Together, the electrostatic endcaps and magnetic interposers may operate to maintain alignment of the interposers and substrates during brush processing. In some embodiments, this may be used to maintain alignment instead of, or in addition to, a compressive force applied to the stack.
Aspect (1) of this disclosure pertains to a substrate with a polished edge, the substrate comprising: a mechanical edge strength of at least 700 MPa; and edge flaws of not more than 2 microns in size.
Aspect (2) of this disclosure pertains to the substrate of Aspect (1) wherein the polished edge comprises a plurality of brush marks arranged thereon in a substantially parallel configuration, the brush marks imparted by a brush polishing process.
Aspect (3) of this disclosure pertains to the substrate of Aspect (2), wherein the brush marks are arranged parallel to a longitudinal axis of the polished edge.
Aspect (4) of this disclosure pertains to the substrate of any one of Aspects (1) through (3), wherein the substrate comprises a thickness of between approximately 0.01 mm and approximately 6.0 mm.
Aspect (5) of this disclosure pertains to the substrate of any one of Aspects (1) through (4), wherein the substrate comprises a mechanical edge strength of at least 1 GPa.
Aspect (6) of this disclosure pertains to the substrate of any one of Aspects (1) through (5), wherein the substrate comprises a chamfered or radiused edge profile.
Aspect (7) of this disclosure pertains to the substrate of any one of Aspects (1) through (5), wherein the substrate comprises a square, bullnose, or chamfered edge profile.
Aspect (8) of this disclosure pertains to the substrate of any one of Aspects (1) through (7), wherein the substrate comprises a symmetrical edge profile.
Aspect (9) of this disclosure pertains to the substrate of any one of Aspects (1) through (7), wherein the substrate comprises an asymmetrical edge profile.
Aspect (10) of this disclosure pertains to the substrate of Aspect (8), wherein the asymmetrical edge profile comprises a chamfered surface and a radiused surface.
Aspect (11) of this disclosure pertains to the substrate of Aspect (9), wherein the edge profile comprises a chamfered surface and a radiused surface.
Aspect (12) of this disclosure pertains to the substrate of any one of Aspects (1) through (11), wherein the polished edge has a plurality of shaped protrusions extending laterally therefrom.
Aspect (13) of this disclosure pertains to the substrate of Aspect (10), wherein each protrusion has a first tapered sidewall and a second tapered sidewall.
Aspect (14) of this disclosure pertains to the substrate of any one of Aspects (1) through (13), wherein the substrate comprises an edge average roughness of between approximately 1 nm and approximately 10 nm.
Aspect (15) of this disclosure pertains to the substrate of any one of Aspects (1) through (14), wherein the substrate comprises an edge root mean square roughness of between approximately 2 nm and approximately 20 nm.
Aspect (16) of this disclosure pertains to the substrate of any one of Aspects (1) through (15), wherein the substrate comprises an edge roughness peak to valley measurement of between approximately 5 nm and approximately 500 nm.
Aspect (17) of this disclosure pertains to the substrate of any one of Aspects (1) through (16), wherein the substrate comprises strengthened glass, unstrengthened glass, a steel laminate, a ceramic substrate, or silicon substrate.
Aspect (18) of this disclosure pertains to the substrate of any one of Aspects (1) through (17), wherein the substrate comprises an electronic device layer arranged on a surface thereof.
Aspect (19) of this disclosure pertains to the substrate of any one of Aspects (1) through (18), wherein the substrate comprises an ink layer arranged on a surface thereof.
Aspect (20) of this disclosure pertains to the substrate of Aspect (19), wherein an edge of the ink layer is brush polished.
Aspect (21) of this disclosure pertains to the substrate of any one of Aspects (1) through (20), wherein the substrate is a strengthened glass comprising a chemically strengthened glass or a glass laminate.
Aspect (22) of this disclosure pertains to a method of simultaneously forming and finishing an edge surface of a substrate, the method comprising: arranging a near-net shaped substrate between a first interposer and a second interposer; applying a compressive force to the substrate and interposers; and simultaneously shaping and polishing an edge surface of the substrate using a brush; wherein each interposer device comprises a size and edge profile configured to guide the brush to achieve a desired edge profile shape of the substrate.
Aspect (23) of this disclosure pertains to the method of Aspect (22), wherein simultaneously shaping and polishing the edge surface of the substrate comprises brushing the edge surface of the substrate with a rotary brush and polishing slurry.
Aspect (24) of this disclosure pertains to the method of Aspect (23), wherein the polishing slurry comprises at least one of a cerium oxide of grain size ranging from 0.3 to 15.0 μm and a mechanical abrasive slurry with an abrasive size ranging from 30 nm to 100 μm.
Aspect (25) of this disclosure pertains to the method of any one of Aspects (22) through (24), wherein the polishing slurry comprises an alkalinity ranging from pH 6-11.
Aspect (26) of this disclosure pertains to the method of any one of Aspects (22) through (25), wherein the brush comprises a plurality of filaments, each having a diameter of not more than 0.2 mm.
Aspect (27) of this disclosure pertains to the method of any one of Aspects (22) through (26), wherein each interposer device comprises a thickness of between 0.01 and 10 times a thickness of the substrate.
Aspect (28) of this disclosure pertains to the method of any one of Aspects (22) through (27), wherein simultaneously shaping and polishing an edge surface of the substrate comprises chamfering and polishing an edge surface of the substrate.
Aspect (29) of this disclosure pertains to the method of any one of Aspects (22) through (28), wherein a liquid impermeable seal is formed between each interposer device and the substrate.
Aspect (30) of this disclosure pertains to the method of any one of Aspects (22) through (29), wherein the substrate comprises strengthened glass, unstrengthened glass, a steel laminate, a ceramic substrate, or a silicon substrate.
Aspect (31) of this disclosure pertains to the method of any one of Aspects (22) through (30), wherein the first interposer has a first size and the second interposer has a second size smaller than the first size.
Aspect (32) of this disclosure pertains to the method of any one of Aspects (22) through (31), further comprising near-net shaping the substrate using a laser edge chamfering process.
Aspect (33) of this disclosure pertains to an interposer for separating adjacent near-net shaped substrates during a brushing operation performed on an edge surface of the substrates, the interposer comprising: a perimeter shape configured to align with a perimeter shape of the substrates; a thickness of between 0.01 and 10 times a thickness of the substrates; an edge profile corresponding to a desired edge profile of the substrates; and a width corresponding to a desired the desired edge profile of the substrates.
Aspect (34) of this disclosure pertains to the interposer of Aspect (33), further comprising a gromet arranged through an opening in the interposer, the gromet configured to increase friction between the interposer and adjacent substrates.
Aspect (35) of this disclosure pertains to the interposer of Aspect (33) or Aspect (34), wherein the interposer comprises an opening configured to align with an opening of the substrates for brushing of an interior edge of the substrates.
As used herein, the terms “substantially” or “generally” refer to the complete or nearly complete extent or degree of an action, characteristic, property, state, structure, item, or result. For example, an object that is “substantially” or “generally” enclosed would mean that the object is either completely enclosed or nearly completely enclosed. The exact allowable degree of deviation from absolute completeness may in some cases depend on the specific context. However, generally speaking, the nearness of completion will be so as to have generally the same overall result as if absolute and total completion were obtained. The use of “substantially” or “generally” is equally applicable when used in a negative connotation to refer to the complete or near complete lack of an action, characteristic, property, state, structure, item, or result. For example, an element, combination, embodiment, or composition that is “substantially free of” or “generally free of” an element may still actually contain such element as long as there is generally no significant effect thereof.
To aid the Patent Office and any readers of any patent issued on this application in interpreting the claims appended hereto, applicants wish to note that they do not intend any of the appended claims or claim elements to invoke 35 U.S.C. § 112(f) unless the words “means for” or “step for” are explicitly used in the particular claim.
Additionally, as used herein, the phrase “at least one of [X] and [Y],” where X and Y are different components that may be included in an embodiment of the present disclosure, means that the embodiment could include component X without component Y, the embodiment could include the component Y without component X, or the embodiment could include both components X and Y. Similarly, when used with respect to three or more components, such as “at least one of [X], [Y], and [Z],” the phrase means that the embodiment could include any one of the three or more components, any combination or sub-combination of any of the components, or all of the components.
In the foregoing description various embodiments of the present disclosure have been presented for the purpose of illustration and description. They are not intended to be exhaustive or to limit the invention to the precise form disclosed. Obvious modifications or variations are possible in light of the above teachings. The various embodiments were chosen and described to provide the best illustration of the principals of the disclosure and their practical application, and to enable one of ordinary skill in the art to utilize the various embodiments with various modifications as are suited to the particular use contemplated. All such modifications and variations are within the scope of the present disclosure as determined by the appended claims when interpreted in accordance with the breadth they are fairly, legally, and equitably entitled.
This application claims the benefit of priority under 35 U.S.C. § 119 of U.S. Provisional Application Ser. No. 62/872,410 filed on Jul. 10, 2019 and U.S. Provisional Application Ser. No. 62/864,131 filed on Jun. 20, 2019, the content of which are relied upon and incorporated herein by reference in their entirety.
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/US2020/037120 | 6/11/2020 | WO |
| Number | Date | Country | |
|---|---|---|---|
| 62864131 | Jun 2019 | US | |
| 62872410 | Jul 2019 | US |
