This application is a continuation, of application Ser. No. 616,287, filed Nov. 20, 1990, now abandoned.
Number | Name | Date | Kind |
---|---|---|---|
3641648 | Kalberman | Feb 1972 | |
3713575 | Cushman | Jan 1973 | |
4604648 | Kley | Aug 1986 | |
4675993 | Harada | Jun 1987 | |
4677473 | Okamoto et al. | Jun 1987 | |
4728195 | Silver | Mar 1988 | |
4813588 | Srivastava | Mar 1989 | |
4848639 | Belanger, Jr. | Jul 1989 | |
4970380 | Miller | Nov 1990 | |
5033665 | Todd | Jul 1991 |
Number | Date | Country |
---|---|---|
0020345 | Jan 1986 | JPX |
61-280628 | May 1987 | JPX |
63-005243 | Jun 1988 | JPX |
Entry |
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IBM Technical Disclosure Bulletin, vol. 30, No. 4, Sep. 1987, pp. 1506-1508, "Optical Inspection/Alignment of Multisides Component Connections". |
IBM Bulletin, vol. 32 No. 11 Apr. 1990. Illuminator for integrated circuits, pp. 459-461. |
IBM Bulletin, vol. 28 No. 11 Apr. 1986. Chip-Orientation detector, 5083-5084. |
IBM Bulletin, vol. 22 No. 9 Feb. 1980. Inspection Technique for Solder Reflow Pad, p. 4068. |
IBM Bulletin, vol. 31 No. 10 Mar. 1989 Assembly Technique for Placing Electronic Components, pp. 222-228. |
Number | Date | Country | |
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Parent | 616287 | Nov 1990 |