Claims
- 1. A method for supporting a processed substrate as it is transferred from a processing unit of a printing press, comprising the steps of:providing a rotatable member having a substrate support surface thereon; providing a base covering of electrically semi-conductive material having a frictional coefficient which is less than the frictional coefficient of the substrate support surface; securing the semi-conductive base covering around the substrate support surface and in electrical contact with the rotatable member; and, rotating the rotatable member to support a processed substrate on the semi-conductive base covering.
- 2. The method as set forth in claim 1, wherein the semi-conductive base covering comprises a sheet of woven material which is covered with a semi-conductive compound, wherein the step of securing the semi-conductive covering to the rotatable member is performed by wrapping the semi-conductive covering around the substrate support surface.
- 3. The method as set forth in claim 1, wherein the base covering comprises a layer of semi-conductive material, and the step of securing the conductive layer is performed by applying the conductive material directly onto the substrate support surface.
- 4. The method as set forth in claim 1, wherein the base covering comprises a sheet of woven material having warp and weft strands, the warp and weft strands being covered with a coating of semi-conductive material, including the step of engaging the substrate against the coated warp and weft strands.
- 5. The method as set forth in claim 1, wherein the base covering comprises a carrier sheet having radially projecting, circumferentially spaced nodes, with the nodes being covered by a coating of semi-conductive material, including the step of engaging the substrate against the coated nodes.
- 6. The method as set forth in claim 1, wherein the base covering is a carrier sheet having an array of beads which are circumferentially spaced and disposed on the surface of the carrier sheet and covered by a coating of semi-conductive material, including the step of engaging the substrate against the coated beads.
- 7. In the operation of a printing press having a support cylinder mounted adjacent to an impression cylinder for guiding a freshly processed substrate, the improvement comprising the step of discharging electrostatic charges from the freshly processed substrate through a semi-conductive base covering disposed on the support cylinder.
- 8. The method as set forth in claim 7, wherein the conductive base covering comprises a sheet of woven material having warp and weft strands which are covered by a semi-conductive material, including the step of concentrating the area of electrostatic discharge by engaging the freshly processed substrate against radially projecting portions of the warp and weft strands.
- 9. The method as set forth in claim 7, wherein the conductive base covering comprises a carrier sheet having radially projecting, circumferentially spaced nodes which are coated with a semi-conductive material, including the step of concentrating the area of electrostatic discharge by engaging the freshly processed substrate against the coated nodes.
- 10. The method as set forth in claim 7, wherein the conductive base covering is a carrier sheet having an array of metal beads which are circumferentially spaced and disposed in electrical contact on the surface of the carrier sheet, and which are coated with a semi-conductive material, including the step of concentrating the area of electrostatic discharge by engaging the freshly processed substrate against the coated beads.
- 11. A method for handling a printed substrate in a rotary offset press having multiple printing units, each printing unit employing a blanket cylinder and an impression cylinder for printing an image onto one side of a substrate transferring between, comprising the following steps performed at each printing unit in succession:transferring printing ink from an image area on the blanket cylinder onto a substrate as the substrate is transferred through the nip between the impression cylinder and the blanket cylinder; gripping and transferring the freshly printed substrate from the impression cylinder; guiding the freshly printed substrate around a support cylinder as the freshly printed sheet is transferred from the impression cylinder; supporting the freshly printed side of the substrate on a semi-conductive base covering disposed on the support cylinder; conducting electrostatic charges from the freshly printed substrate to the semi-conductive base covering; and, conducting electrostatic charges from the semi-conductive base covering to the support cylinder.
- 12. The method as set forth in claim 11, wherein the semi-conductive base covering has structurally differentiated surface portions defining electrostatic precipitation points, and the step of conducting electrostatic charges is performed by discharging electrostatic charges from the freshly printed substrate through the electrostatic precipitation points.
- 13. The method as set forth in claim 11, wherein the semi-conductive base covering comprises a sheet of woven material having warp and weft portions defining electrostatic precipitation points which are covered by a semi-conductive coating, and the discharging step is performed by engaging the freshly printed substrate against the coated warp and weft portions.
- 14. The method as set forth in claim 11, wherein the base covering comprises a carrier sheet having radially projecting, circumferentially spaced nodes defining electrostatic precipitation points which are covered with a semi-conductive coating, and the discharging step is performed by engaging the freshly printed substrate against the coated nodes.
- 15. The method as set forth in claim 11, wherein the base covering is a carrier sheet having an array of beads defining electrostatic precipitation points which are circumferentially spaced and disposed in electrical contact with the carrier sheet, and wherein said beads are covered with a semi-conductive coating, and the discharge step is performed by engaging the freshly printed substrate against the coated beads.
- 16. In a support cylinder having substrate support surface for guiding a freshly processed substrate as it is transferred from one printing unit to another, the improvement comprising:a base covering of semi-conductive material disposed on the support cylinder, the semi-conductive base covering having a frictional coefficient which is less than the frictional coefficient of the sheet support surface.
- 17. The invention as set forth in claim 16, wherein the electrically semi-conductive material comprises a fluoropolymer resin containing a conductive agent.
- 18. The invention as set forth in claim 17, wherein the fluoropolymer resin comprises polytetrafluoroethylene (PTFE).
- 19. The invention as set forth in claim 17, wherein the semi-conductive agent comprises carbon black.
- 20. The invention as set forth in claim 17, wherein the semi-conductive agent comprises graphite.
- 21. The invention as set forth in claim 16, wherein the semi-conductive material comprises woven polyamide glass filaments covered with a fluoropolymer resin which contains a conductive agent.
- 22. The invention as set forth in claim 16, wherein the semi-conductive base covering comprises a layer of a dielectric resin containing a semi-conductive agent which is disposed on the substrate support surface of the support cylinder.
- 23. The invention as set forth in claim 16, wherein the semi-conductive base covering comprises a sheet of woven material having warp and weft strands covered with a semi-conductive material.
- 24. The invention as set forth in claim 16, wherein the semi-conductive base covering comprises a carrier sheet having radially projecting, circumferentially spaced nodes, said nodes being covered with a semi-conductive material.
- 25. The invention as set forth in claim 16, wherein the semi-conductive base covering comprises a metallic carrier sheet having an array of beads which are circumferentially spaced across the surface of the carrier sheet, the carrier sheet and the beads being covered by a coating of a semi-conductive material.
- 26. The invention as set forth in claim 16, wherein the semi-conductive base material comprises a resin selected from the group consisting of linear polyamides, linear polyesters, including polyethylene terephthalate, hydrocarbon or halogenated hydrocarbon resins including polyethylene, polypropylene and ethylene-propylene copolymers, and acrylonitrile butadiene styrene and polytetrafluoroethylene (PTFE).
- 27. The invention as set forth in claim 26, wherein the semi-conductive base material comprises fluorinated ethylene propylene (FEP) resin containing a conductive agent.
- 28. The invention as set forth in claim 26, wherein the base covering of semi-conductive material comprises a layer of porous metal disposed on the sheet support surface, the porous metal layer containing an infusion of an organic lubricant.
- 29. The invention as set forth in claim 28, wherein the porous layer comprises boron alloyed with a metal selected from the group consisting of nickel and cobalt.
- 30. The invention as set forth in claim 28, wherein the organic lubricant comprises polytetrafluoroethylene (PTFE).
- 31. The invention as set forth in claim 28, wherein the base covering of electrically conductive material comprises an electrochemical plating deposition of a porous metal alloy.
- 32. A support cylinder for guiding a freshly processed substrate as it is transferred from one printing unit to another comprising, in combination:a rotatable support member having a porous surface region; and, an organic lubricant disposed within the porous surface region.
- 33. The invention as set forth in claim 32, wherein the organic lubricant comprises polytetrafluroethylene (PTFE).
- 34. A support cylinder for guiding a freshly processed substrate as it is transferred from one printing unit to another comprising, in combination:a rotatable support member having a sheet support surface; and, a base covering of semi-conductive material disposed on the sheet support surface.
- 35. The invention as set forth in claim 34, wherein the semi-conductive material comprises a dielectric resin containing a conductive agent.
- 36. The invention as set forth in claim 35, wherein the dielectric resin and the amount of conductive agent contained in the dielectric resin are selected to provide the base covering with a surface resistivity not exceeding approximately 75,000 ohms-centimeter and a coefficient of friction not exceeding approximately 0.110.
- 37. The invention as set forth in claim 35, wherein the dielectric resin comprises a fluoropolymer selected from the group consisting of linear polyamides, linear polyesters, including polyethylene terephthalate, hydrocarbon or halogenated hydrocarbon resins including polyethylene, polypropylene and ethylene-propylene copolymers, acrylonitrile butadiene styrene, fluorinated ethylene-propylene polymers and polytetrafluoroethylene.
- 38. The invention as set forth in claim 35, wherein the conductive agent comprises carbon black.
- 39. The invention as set forth in claim 35, wherein the conductive agent comprises graphite.
- 40. The invention as set forth in claim 34, wherein the base covering of semi-conductive material comprises a layer of porous metal, the porous metal layer containing an infusion of an organic lubricant.
- 41. The invention as set forth in claim 40, wherein the porous metal comprises boron alloyed with a metal selected from the group consisting of nickel and cobalt.
- 42. The invention as set forth in claim 40, wherein the organic lubricant comprises polytetrafluoroethylene.
- 43. The invention as set forth in claim 34, wherein the base covering of semi-conductive material comprises an electrochemical plating deposition of a porous metal alloy.
CROSS-REFERENCE TO RELATED APPLICATION
This application is a continuation-in-part of U.S. patent application Ser. No. 08/259,634, filed Jun. 14, 1994, now U.S. Pat. No. 6,119,597.
US Referenced Citations (9)
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
08/259634 |
Jun 1994 |
US |
Child |
08/379722 |
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US |