1. Field of the Invention
The disclosure relates to a method and apparatus for printing substantially uniform organic films over target print areas and having profiled edges. More specifically, the disclosure relates to novel method and apparatus for printing an organic film (interchangeably, layer) by providing vaporized material, distributing the vaporized material over a target area and condensing the vaporized material to form a substantially uniform film on the target area.
2. Description of Related Art
The manufacture of organic light emitting devices (OLEDs) requires depositing one or more organic films on a substrate and coupling the top and bottom of the film stack to electrodes. The film thickness is a prime consideration. The total layer stack thickness is about 100 nm and each layer is optimally deposited uniformly with an accuracy of better than +/−2%. Film purity is also important. Conventional devices form the film stack using one of two methods: (1) thermal evaporation of organic material in a relative vacuum environment and subsequent condensation of the organic vapor on the substrate; or, (2) dissolution of organic material into a solvent, coating the substrate with the resulting solution, and subsequent removal of the solvent.
Another consideration in depositing the organic thin films of an OLED is placing the films precisely at the desired location. There are two conventional technologies for performing this task, depending on the method of film deposition. For thermal evaporation, shadow masking is used to form OLED films of a desired configuration. Shadow masking techniques require placing a well-defined physical mask over a region of the substrate followed by depositing the film over the entire substrate area. Once deposition is complete, the shadow mask is removed. The regions exposed through the mask define the pattern of material deposited on the substrate. This process is inefficient, as the entire substrate must be coated, even though only the regions exposed through the shadow mask require a film. Furthermore, the shadow mask becomes increasingly coated with each use, and must eventually be discarded or cleaned. Finally, the use of shadow masks over large areas is made difficult by the need to use very thin masks (to achieve small feature sizes) that make said masks structurally unstable. However, the vapor deposition technique yields OLED films with high uniformity and purity and adequate thickness control.
For solvent deposition, ink jet printing can be used to deposit patterns of OLED films. Ink jet printing requires dissolving organic material into a solvent that yields a printable ink. Furthermore, ink jet printing is conventionally limited to the use of one or two layer OLED film stacks, which typically have lower performance as compared to four for five layer film stacks used in vapor deposited devices. The stack limitation arises because printing typically causes destructive dissolution of any underlying organic layers. Consequently, one must engineer each layer such that it is undamaged by the wet deposition of each subsequent layer, and this greatly constrains the material and stack options. Finally, unless the substrate is first prepared with defined regions that contain the ink within the areas where the films are to be deposited, a step that increases the cost and complexity of the process, ink jet printing has very poor thickness uniformity as compared to vapor deposited films. The material quality is also typically lower, due to structural changes in the material that occur during the drying process and due to material impurities present in the ink. However, the ink jet printing technique is capable of providing patterns of OLED films over very large areas with good material efficiency.
No conventional technique combines the large area patterning capabilities of ink jet printing with the high uniformity, purity, and thickness control achieved with vapor deposition for organic thin films. Because ink jet processed OLED devices continue to have inadequate quality for widespread commercialization, and thermal evaporation remains too expensive and impractical for scaling to large areas, it is a major technological challenge for the OLED industry to develop a technique that can offer both high film quality and cost-effective large area scalability.
Finally, manufacturing OLED displays may also require the patterned deposition of thin films of metals, inorganic semiconductors, and/or inorganic insulators. Conventionally, vapor deposition and/or sputtering have been used to deposit these layers. Patterning is accomplished using prior substrate preparation (e.g., patterned coating with an insulator), shadow masking as described above, and when a fresh substrate or protective layers are employed, conventional photolithography. Each of these approaches is inefficient as compared to the direct deposition of the desired pattern, either because it wastes material or requires additional processing steps. Thus, there is a need for these materials as well for a method and apparatus for depositing high-quality, cost effective, large area scalable films.
An apparatus for printing a uniform-thickness film on a substrate according to one embodiment of the disclosure includes: a nozzle for communicating a mixture of vaporized organic material and a carrier gas stream; a plurality of micropores communicating the mixture from the nozzle, the plurality of micropores arranged to provide a plurality of overlapping sub-streams; and a substrate for receiving and condensing the plurality of overlapping sub-streams into a film. The plurality of micropores can be independent of each other. At least two of the plurality of micropores can be connected to another by a cavity.
In another embodiment, the disclosure provides a method for printing a film having a substantially uniform thickness. The method includes providing a first gas stream carrying vaporized material. The vaporized material can comprise an organic ink composition. “Ink” is generally defined as any mixture having a volume of fluid components (in either the liquid or gas phase); examples of such generalized “inks” include mixtures of gaseous materials, mixtures of liquid particles suspended in a carrier gas, and mixtures of solid particles suspended in a carrier gas. The first gas steam can have a first temperature. The first gas stream can be divided into a plurality of sub-streams with each sub-stream carrying vaporized material. The sub-streams can have a shortest cross-sectional dimension on the microscale (that is, generally between 1 μm and 200 μm. (The sub-stream cross section is generally defined as the area of flow through the plane perpendicular average flow vector. For example, if the sub-stream flows through a long tube having a rectangular cross section with 3 um short side and 15 um long side, the cross section of the sub-stream is the rectangular cross section of the tube itself, and the shortest dimension of that cross-section is about 3 um. The sub-streams are then directed to a substrate. Simultaneously, a second gas stream can be directed to the substrate. The second gas stream forms a fluid curtain about the plurality of sub-streams to contain the vaporized material within a targeted region. The vaporized material condenses on the substrate, within the targeted region, to form a substantially solid film or layer. In a preferred embodiment, the substrate has a lower temperature than the vaporized material to expedite condensation. The fluid curtain can be positioned relative to the substrate and the sub-streams to allow formation of a printed layer having a substantially uniform film thickness. The fluid curtain can also be positioned relative to the substrate such that the film has a substantially profiled edges.
In another embodiment, the disclosure relates to a film deposition apparatus having a conduit for communicating a first gas stream carrying vaporized material. The first gas stream contains vaporized material of ink composition. A multipore nozzle can be placed in fluid communication with the conduit. The multipore nozzle divides the first gas stream into a plurality of micron-scale sub-streams with each sub-stream carrying the vaporized material. A secondary nozzle provides a gas curtain about the plurality of sub-streams. A substrate can be positioned relative to the multipore nozzle and the secondary nozzle to condensate the vaporized material of ink composition and thereby form a substantially solid film on a target print area. The plurality of sub-streams can also be positioned relative to each other and the fluid curtain to deposit a film having a substantially uniform film thickness with a profiled edge.
In still another embodiment, the disclosure relates to a method for printing a film of uniform thickness profile by: targeting a print area on a substrate; directing a first stream having a carrier gas and a quantity of organic material to the print area to deposit a layer of organic material on the substrate; addressing a second stream to the print area, the second stream targeting an edge of the print layer; wherein the first stream has a higher temperature than the substrate to thereby condense the organic material on the print area. In an exemplary implementation, the sub-streams overlap each other.
In yet another embodiment, the disclosure relates to an apparatus for forming a profiled edge on a print layer. The apparatus comprises: a first discharge nozzle for discharging a carrier gas containing a quantity of organic material in a plurality of sub-streams; a substrate for receiving and condensing the quantity of organic material onto a print layer having an edge, the substrate having a target print area; a second (auxiliary) discharge nozzle forming a fluid curtain over at least a portion of the target print area, the fluid curtain contacting an edge of the print layer to form a substantially profiled edge. The plurality of sub-streams can be positioned to deposit a film having a substantially uniform film thickness profile.
Another embodiment of the disclosure relates to a method for controlling organic material discharge from a nozzle. The method comprises the steps of: (a) supplying a carrier gas with an organic material to a discharge nozzle, the discharge nozzle having multiple pores; (b) forming a plurality of discharge streams at the discharge nozzle, each discharge stream having a quantity of organic material; (c) discharging the quantity of organic material from the discharge nozzle by heating the discharge nozzle; (d) condensing the organic material in the multiple pores of the discharge nozzle by removing heat from the discharge nozzle; (e) repeating steps (a) through (d) to control the deposition rate from the print nozzle.
An apparatus according to yet another embodiment of the disclosure comprises a discharge nozzle having a plurality of micropores; a conduit for communicating a carrier gas having a quantity of an organic material to a discharge nozzle; a heater for heating at least one of the micropores; and a controller for modulating the heater to communicate the quantity of organic material through the micropores or condense the quantity of organic material in the micropores.
In another embodiment, the disclosure relates to a method for printing a film having a profiled edge by delivering a carrier gas stream containing a vaporized organic material; distributing the gas stream and the vaporized material into a plurality of sub-streams, each sub-stream having a quantity of vaporized organic material; and directing the plurality of sub-streams to a substrate surface. The substrate surface condenses the quantity of vaporized material into a printed layer of organic material. The profiled edge can be defined as an edge connecting two substantially orthogonal edges of the deposited layer.
In still another embodiment, an array of multiple nozzles is formed for film deposition. The multi-nozzle array can include any number of nozzles. The number of nozzles can be determined by considerations such as the size of the targeted print area. Each nozzle may have a multipore discharge so as to provide overlapping or non-overlapping sub-streams.
These and other embodiments of the disclosure will be discussed with reference to the following exemplary and non-limiting illustrations, in which like elements are numbered similarly, and where:
Patterning of organic thin film is useful in variety of applications, including fabrication of light emitting displays. This is critical for OLED displays in particular because such displays require fabricating a number of patterned layers on a substrate. Each layer defines one of the colors: red, green and blue in each full color pixel. The patterning is performed using shadow mask evaporation. The shadow mask process is expensive and labor intensive. It is also prone to error and believed to be applicable only to relatively small areas.
The disclosed embodiments overcome the deficiencies of the conventional techniques by providing a method and apparatus for depositing patterned organic thin films at low cost over large areas that further offer good uniformity over the target printed area and, where required, sharp edge profiles. While the disclosure is described in the context of using a carrier gas to communicate organic vapor material, it should be noted that the disclosed principles are not limited to organic vapor material and can apply to all printing methods in which a carrier medium is used to convey the deposition material to a destination substrate.
In one embodiment, the disclosure relates to a structure for depositing a film of substantially uniform thickness by receiving a carrier gas stream containing organic vapor material at a nozzle, distributing the carrier gas stream into a plurality of sub-streams at a microscale distributor (interchangeably, micron-scale showerhead) and directing the sub-streams through a plurality of micropores onto a substrate. The substrate having a lower temperature relative to the carrier gas stream causes condensation of the organic vapor material. The micropores can be organized to such that the vapor stream from each micropore simultaneously delivers an overlapping deposit of organic material on the substrate. The cross section of the deposit from a single microscale distributor can have a continuous, non-zero cross section that can be controlled through the proper engineering of the size, shape and pattern of the micropores. Thus, in an inventive embodiment, multiple vapor streams (or sub-streams) are at least partially merged to form a uniform deposited film.
The single orifice nozzle 125 produces an approximately Gaussian shaped film profile as shown in
In addition, due to the high temperature and flow rate of the carrier gas, not all the material deposits on the substrate directly. Instead, the material bounces off the substrate and flows laterally, eventually depositing on the substrate far from the desired region as illustrated in
The multipore nozzle can be fabricated using conventional techniques. In one embodiment of the disclosure, the multipore nozzle was fabricated using MEMS fabrication techniques by forming very small pore (orifice) arrays and by depositing very small features. The pores and the features typically have a diameter of between 1-10 μm, though pore sizes of up to 100 μm are possible. The small, micron-scale size of the pores enable excellent film deposit uniformity and profiled edges (sharp sidewall).
In certain applications it may be advantageous to convert the micropore patterns into a single continuous orifice (or several orifices) by strategically forming thin openings between two or more micropores. This structure is shown in
Gas stream 810 is directed to nozzles 825. Nozzle 825 includes several micropores which divide gas stream 810 into a corresponding number of sub-streams. Each sub-stream carries a quantity of vaporized organic material. The sub-streams are then directed to substrate 830. Substrate 830 can have a temperature lower than that of the first gas stream, allowing the vaporized organic material to condense on the surface thereof.
Simultaneous with the deposition process, auxiliary gas stream 850 is directed through corresponding micropores of nozzle 825 to form auxiliary sub-streams 855. The auxiliary sub-streams can have a lower temperature than gas stream 810 and may contain no vapor organic material. The auxiliary gas stream can be, for example, a noble gas. Depending on the location of the micropores, auxiliary gas streams 855 can form a fluid (or gas) curtain about the target deposition area. The fluid curtain can form a profiled edge and a substantially uniform thickness for the condensed organic vapor material 815. The cool gas curtain also prevents lateral spreading of the organic vapor material.
To control the rapidly changing temperature of the pores, a controller can be used. The controller can have one or more microprocessor circuits connected to one or more memory circuits. In addition, a flow regulator can be incorporated in the system to communicate with the controller. The flow regulator can optionally increase or decrease the hot gas flow rate (1110 in
By integrating a heating element and then modulating the heat applied to the multipore nozzle (or directly to the pores), the flow of organic vapor material through the nozzles can be modulated. When the heater is on, the material flows through the micropores without condensing on the micropore walls. When the heater is off (with optional support from a heat sink), the micropores are cool enough that the material condenses on the walls instead of passing through.
The disclosed embodiments can be combined to further control the film thickness, uniformity and the profiled edge. For example, a nozzle heater and the fluid curtain can be used conjunctively to further control deposition thickness and profile. Alternatively, the fluid curtain can be activated only when the heater is on to further enhance deposition profile. Both the nozzle heater and the fluid curtain can be combined with a multipore nozzle to provide even more accuracy and control over film deposition profile.
While the principles of the disclosure have been illustrated in relation to the exemplary embodiments shown herein, the principles of the disclosure are not limited thereto and include any modification, variation or permutation thereof.
The instant application claims priority to provisional application No. 61/174,943, which was filed on May 1, 2009, the disclosure of which is incorporated herein in its entirety.
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