Method and apparatus for positioning heating elements

Information

  • Patent Grant
  • 10215423
  • Patent Number
    10,215,423
  • Date Filed
    Friday, October 27, 2017
    7 years ago
  • Date Issued
    Tuesday, February 26, 2019
    5 years ago
Abstract
An underlayment system is provided that includes a plurality of protrusions that extend from a common base member. The protrusions and base member can include an opening therethrough that allows for subsequent layers of material, such as adhesive, to interact and bond to each other. The protrusions are arranged in such a way to contain a wire, string, or heating element, within a receiving area. The arrangement of the protrusions allow for routing of the wire, string, or heating element in a variety of angles, bends, and other routing layouts.
Description
FIELD OF THE INVENTION

Embodiments of the present invention are generally related to underlayments associated with radiant floor or wall heating systems.


BACKGROUND

In-floor and in-wall heating and cooling is well known that utilizes heat conduction and radiant heat, for example, for indoor climate control rather than forced air heating that relies on convection. The heat is usually generated by a series of pipes that circulate heated water or by electric cable, mesh, or film that provide heat when a current is applied thereto. In-floor radiant heating technology is used commonly in homes and businesses today.


Electrical floor heating systems have very low installation costs and are well suited for kitchens, bathrooms, or in rooms that require additional heat, such as basements. One advantage of electric floor heating is the height of installation. For example, floor buildup can be as little as about one millimeter as the electric cables are usually associated with a specialized installation board or directly onto the sub floor. Electric underfloor heating is also installed very quickly, usually taking a half a day to a day depending on the size of the area to be heated. In addition, warm up times are generally decreased because the cables are installed approximate to the finished flooring, e.g., tile, wherein direct connection is made with the heat source rather than a stored water heater as in fluid-based systems. Electric systems are offered in several different forms, such as those that utilize a long continuous length cable or those that employ a mat with embedded heating elements. In order to maximize heat transfer, a bronze screen or carbon film heating element may be also used. Carbon film systems are normally installed under the wire and onto a thin insulation underlay to reduce thermal loss to the sub floor. Vinyls, carpets, and other soft floor finishes can be heated using carbon film elements or bronze screen elements.


Another type of in-floor heating system is based on the circulation of hot water, i.e., a “hydronic” system. In a hydronic system, warm water is circulated through pipes or tubes that are incorporated into the floor and generally uses pipes from about 11/16 inch to 1 inch to circulate hot water from which the heat emanates. The size of tubes generally translates into a thicker floor, which may be undesirable. One other disadvantage of a hydronic system is that a hot water storage tank must be maintained at all times, which is less efficient than an electric floor heating system.


In order to facilitate even heating of a floor, the wires must preferably be spaced at specific locations. One such system is disclosed in U.S. Patent Application Publication No. 2009/0026192 to Fuhrman (“Fuhrman”), which is incorporated by reference in its entirety herein. Fuhrman discloses a mat with a plurality of studs extending therefrom that help dictate the location of the wires. The mat with associated studs is placed over a sub floor with a layer of adhesive therebetween. Another layer of adhesive is placed above of the studs. The studs also guide the finishers to form a correct floor thickness. The studs thus provide a location for interweaving the wire or wires that are used in the heating system. The wire of Fuhrman, however, is not secured between adjacent studs and still may separate therefrom, which may cause uneven heating or wire damage. Furthermore, Fuhrman discloses a continuous mat wherein subsequent layers of adhesive are not able to interact with those previously placed.


SUMMARY

It is with respect to the above issues and other problems that the embodiments presented herein were contemplated. In general, embodiments of the present disclosure provide methods, devices, and systems by which various elements, such as wire, heating elements, and the like, may be routed and/or contained in a flooring underlayment. In one embodiment, the underlayment may include a number of protrusions extending from a base material. The protrusions may be configured in a cluster, or array, or even as part of another protrusion, forming routing hubs. As provided herein, a wire may be routed around, through, and even around and through the routing hubs and/or protrusions. The unique shape and arrangement of the protrusions disclosed herein can provide for the efficient routing of wires in an underlayment for any shape and/or purpose.


In some embodiments, the protrusion forms a geometric shape extending away from a base material surface to a contact surface (e.g., the contact surface for flooring, tile, etc.). This extension between the base material surface and the contact surface defines the overall protrusion height. The protrusion may include a number of sides extending from the base material to the contact surface. As can be appreciated, at least one of the sides of the protrusion may include a surface configured to receive a wire. This receiving surface can be concave, convex, arcuate, linear, etc., and/or combinations thereof. Additionally or alternatively, the surface may follow, or contour, the geometric shape of the protrusion.


It is an aspect of the present disclosure that at least two protrusions are arranged adjacent to one another on an underlayment base material. In one embodiment, the protrusions may be arranged such that the receiving surface of a first protrusion is offset from and facing the receiving surface of a second protrusion. The distance of the offset and the receiving surfaces can form a receiving cavity configured to receive a wire, heating element, or other element. For example, an underlayment may include a number of protrusions arranged about an array axis to form a routing hub. Where four protrusions make up a routing hub, there may exist heating element receiving cavities disposed between each protrusion. Additionally or alternatively, the underlayment may include a number of routing hubs equally-spaced along a first linear direction and/or a second linear direction to form a matrix of routing hubs. In this case, additional heating element receiving cavities may be disposed between each routing hub. As can be appreciated, the matrix of routing hubs and the array of protrusions allow for heating elements to be routed in the underlayment according to any configuration of routing curves, angles, and/or lines.


In some embodiments, the protrusions, base material, and/or other features of the underlayment may be formed into a shape from at least one material. Examples of forming can include, but are not limited to, thermoforming, thermo-molding, injection molding, casting, molding, rotational molding, reaction injection, blow molding, vacuum forming, twin sheet forming, compression molding, machining, 3D printing, etc., and/or combinations thereof.


The protrusions, base material, and/or other features of the underlayment may include a number of cutouts, or holes. In some embodiments, the cutouts can extend at least partially into the protrusion, base material, and/or the underlayment. In one embodiment, one or more of the cutouts may completely pass through the underlayment. In any event, the cutouts may be configured to receive a mating material. For instance, the cutouts may be configured to receive adhesive, epoxy, grout, cement, glue, plastic, or other material capable of flowing at least partially into the cutouts. These cutouts can provide a number of surfaces on the underlayment to which material can adhere, or key. Additionally or alternatively, these cutouts can increase the strength of the underlayment by providing a structural skeleton, around which material can flow and cure in addition to providing a pathway for airflow, thereby enabling the utilization of a modified thinset, which requires air for curing. The cutouts further provide a passageway for moisture to flow out of the subfloor. In one embodiment, the cutouts may be provided via the forming process of the underlayment. In another embodiment, the cutouts may be made via a cutting operation performed prior to the forming process. In yet another embodiment, the cutouts may be made via a cutting operation performed subsequent to the forming process.


The underlayment may include areas in and/or between the routing hubs that are configured to receive material. For instance, the areas may be configured to receive adhesive, epoxy, grout, cement, glue, plastic, or other material capable of flowing at least partially into the areas. These areas can provide a number of surfaces on the underlayment to which material can adhere, or key. Additionally or alternatively, these areas can increase the strength of the underlayment by providing a structural skeleton, around which material can flow and cure.


In some embodiments, the underlayment may include a pad layer. The pad layer may include a sound dampening material; a heat reflective material, such as aluminum foil; an insulative material, such as polystyrene, fleece, or wool; a porous substrate; a vapor barrier; a waterproof material; an energy reflective material; etc., and/or combinations thereof. Examples of pad layers can include, but are in no way limited to, non-woven fabrics or materials, foil, cork, rubber, plastic, concrete, wood, organic materials, inorganic materials, composites, compounds, etc., and/or combinations thereof. The pad layer may be attached to the base material via adhesive, thermal bonding, welding, mechanical attachment, etc., and/or combinations thereof. As can be appreciated, the pad layer may include adhesive on the side opposite the base material side for affixing to a surface, such as a subfloor, floor, etc. In one embodiment, the pad layer may be configured to receive adhesive for affixing to a surface.


The phrases “at least one”, “one or more”, and “and/or” are open-ended expressions that are both conjunctive and disjunctive in operation. For example, each of the expressions “at least one of A, B and C”, “at least one of A, B, or C”, “one or more of A, B, and C”, “one or more of A, B, or C” and “A, B, and/or C” means A alone, B alone, C alone, A and B together, A and C together, B and C together, or A, B and C together. When each one of A, B, and C in the above expressions refers to an element, such as X, Y, and Z, or class of elements, such as X1-Xn, Y1-Ym, and Z1-Z0, the phrase is intended to refer to a single element selected from X, Y, and Z, a combination of elements selected from the same class (e.g., X1 and X2) as well as a combination of elements selected from two or more classes (e.g., Y1 and Z0).


The term “a” or “an” entity refers to one or more of that entity. As such, the terms “a” (or “an”), “one or more” and “at least one” can be used interchangeably herein. It is also to be noted that the terms “comprising”, “including”, and “having” can be used interchangeably.


The term “means” as used herein shall be given its broadest possible interpretation in accordance with 35 U.S.C., Section 112, Paragraph 6. Accordingly, a claim incorporating the term “means” shall cover all structures, materials, or acts set forth herein, and all of the equivalents thereof. Further, the structures, materials or acts and the equivalents thereof shall include all those described in the summary of the invention, brief description of the drawings, detailed description, abstract, and claims themselves.


It should be understood that every maximum numerical limitation given throughout this disclosure is deemed to include each and every lower numerical limitation as an alternative, as if such lower numerical limitations were expressly written herein. Every minimum numerical limitation given throughout this disclosure is deemed to include each and every higher numerical limitation as an alternative, as if such higher numerical limitations were expressly written herein. Every numerical range given throughout this disclosure is deemed to include each and every narrower numerical range that falls within such broader numerical range, as if such narrower numerical ranges were all expressly written herein.


The preceding is a simplified summary of the disclosure to provide an understanding of some aspects of the disclosure. This summary is neither an extensive nor exhaustive overview of the disclosure and its various aspects, embodiments, and configurations. It is intended neither to identify key or critical elements of the disclosure nor to delineate the scope of the disclosure but to present selected concepts of the disclosure in a simplified form as an introduction to the more detailed description presented below. As will be appreciated, other aspects, embodiments, and configurations of the disclosure are possible utilizing, alone or in combination, one or more of the features set forth above or described in detail below.





BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are incorporated into and form a part of the specification to illustrate several examples of the present disclosure. These drawings, together with the description, explain the principles of the disclosure. The drawings simply illustrate preferred and alternative examples of how the disclosure can be made and used and are not to be construed as limiting the disclosure to only the illustrated and described examples. Further features and advantages will become apparent from the following, more detailed, description of the various aspects, embodiments, and configurations of the disclosure, as illustrated by the drawings referenced below.



FIG. 1 shows a plan view of an underlayment section in accordance with embodiments of the present disclosure;



FIG. 2 shows a cross-sectional view of an area of the underlayment taken along line A-A shown in FIG. 1;



FIG. 3 shows a detail cross-sectional view of an area of the underlayment in accordance with embodiments of the present disclosure;



FIG. 4 shows a detail plan view of a routing hub of the underlayment in accordance with embodiments of the present disclosure;



FIG. 5 shows a plan view of routing hubs of an underlayment in accordance with a first embodiment of the present disclosure;



FIG. 6 shows a plan view of routing hubs of an underlayment in accordance with a second embodiment of the present disclosure;



FIG. 7 shows a detail cross-sectional view of a first embodiment of the routing hubs taken along line D-D shown in FIG. 6; and



FIG. 8 shows a detail cross-sectional view of a second embodiment of the routing hubs taken along line D-D shown in FIG. 6.





DETAILED DESCRIPTION

Before any embodiments of the disclosure are explained in detail, it is to be understood that the disclosure is not limited in its application to the details of construction and the arrangement of components set forth in the following description or illustrated in the following drawings. The disclosure is capable of other embodiments and of being practiced or of being carried out in various ways. Also, it is to be understood that the phraseology and terminology used herein is for the purpose of description and should not be regarded as limiting. The use of “including,” “comprising,” or “having” and variations thereof herein is meant to encompass the items listed thereafter and equivalents thereof as well as additional items.



FIG. 1 shows a plan view of an underlayment section 1 in accordance with embodiments of the present disclosure. The underlayment section 1 includes a number of routing hubs 2, comprising four protrusions 2a arranged in an equally-spaced circular array about an array axis 2b, in a matrix configuration. The matrix is configured in the form of an eight row by twelve column matrix of routing hubs 2. The matrix provides heating element receiving cavities 3 in the X-direction, Y-direction, and in directions approximately 45 degrees to the X-direction and/or the Y-direction. A sample routing 4 of the heating element 5 is shown in FIG. 1. In particular, the heating element section 5 shown runs along the Y-direction between the first and second columns of routing hubs 2, proceeds around the routing hub 2 in the first row and second column (2, 8) and along the negative Y-direction between the second and third columns to the (3, 1) routing hub 2, proceeds along the Y-direction between the third and fourth columns until about the (3, 4) routing hub 2, and then proceeds diagonally through the heating element receiving cavities 3 in the (4, 5), (5, 6), (6, 7), and (7, 8) routing hubs 2, and so on.



FIG. 2 shows a cross-sectional view of an area of the underlayment 1 taken along line A-A. In some embodiments, one or more of the protrusions 2a can extend from the base material surface 6 to a contact surface 7. The contact surface 7 may be configured to support tile, flooring, or other material. The distance from the base material 6 to the contact surface 7 is called the protrusion height 7a. The thickness of the base material 6 is called the base thickness 6a. In some embodiments, the protrusions 2a may be formed from the base material 6, and as such, may have a wall thickness approximately equal to that of the base thickness 6a.



FIG. 3 shows a detail cross-sectional view of an area of the underlayment 1 in accordance with embodiments of the present disclosure. In one embodiment, the areas adjacent to each protrusion 2a can form a heating element receiving cavity 3. Each heating element receiving cavity 3 can include an interference fit 8, or contained area, to hold a heating element 5 or wire in place. In some cases, the heating element 5 may be inserted into the heating element receiving cavity 3 with a predetermined amount of force required to part (e.g., elastically deform, plastically deform, flex, and/or deflect, etc.) at least one of the receiving surfaces 9 of the cavity. In one embodiment, when the heating element 5 is inserted into the heating element receiving cavity 3 the at least one of the receiving surfaces 9 may return to an original position thereby closing the heating element receiving cavity 3 and containing the heating element 5.



FIG. 4 shows a detail plan view of a routing hub 2 of the underlayment 1 in accordance with embodiments of the present disclosure. The heating element receiving cavities 3 are shown disposed between protrusions 2a and/or routing hubs 2. In some embodiments, one or more of the heating element receiving cavities 3 can be configured differently from another heating element receiving cavity 3. For instance, several heating element receiving cavities 3 may be configured to provide a frictional fit for holding a heating element 5, while other heating element receiving cavities 3 may be configured to merely contain a heating element 5. In any event, the underlayment 1 can include one or more configurations of heating element receiving cavity 3.



FIG. 5 shows a plan view of routing hubs 2 of an underlayment 1 in accordance with a first embodiment of the present disclosure. As described above, the protrusions 2a, base material 6, and/or other features of the underlayment 1 may include a number of cutouts 10, or holes. In some embodiments, the cutouts 10 can extend at least partially into the protrusion 2a, base material 6, and/or the underlayment 1. In some embodiments, the cutouts 10 are shown as extending at least partially into at least one side of at least one protrusion 2a.



FIG. 6 shows a plan view of routing hubs 2 of an underlayment 1 in accordance with a second embodiment of the present disclosure. The underlayment 1 section includes a number of routing hubs 2, comprising four protrusions 2a arranged in an equally-spaced circular array about an array axis 2b, in a matrix configuration. A sample routing 4 of the heating element 5 is shown in FIG. 6. In particular, the heating element section 5 shown runs along the Y-direction of the first column of routing hubs 2, proceeds around the routing hub 2 in the second row and first column (1, 2) and along the negative Y-direction between the first and second columns, and then proceeds diagonally through the heating element receiving cavity 3 in the (2, 1) routing hub 2.



FIG. 7 shows a detail cross-sectional view of a first embodiment of the routing hubs 2 taken along line D-D shown in FIG. 6. As shown, the heating element receiving cavity 3 in FIG. 7 includes arcuate receiving surfaces 9. The arcuate receiving surfaces 9 may be configured as concave, curvilinear, arched, and/or other shape configured to receive the heating element 5. In some cases, at least one of the arcuate receiving surfaces 9 of the routing hubs may be configured to contact the heating element receiving cavity 3. The contact may provide a frictional force that retains the heating element 5 in the underlayment 1. In some embodiments, the arcuate receiving surfaces 9 may contain the heating elements 5 in the heating element receiving cavity 5 without frictional contact.


Additionally or alternatively, the underlayment 1 may include a pad layer 11. The pad layer 11 may include a sound dampening material; a heat reflective material, such as aluminum foil; an insulative material, such as polystyrene, fleece, or wool; a porous substrate; a vapor barrier; a waterproof material; an energy reflective material; etc., and/or combinations thereof. Examples of pad layers 11 can include, but are in no way limited to, non-woven fabrics or materials, foil, cork, rubber, plastic, concrete, wood, organic materials, inorganic materials, composites, compounds, etc., and/or combinations thereof. The pad layer 11 may be attached to the base material 6 via adhesive, thermal bonding, welding, mechanical attachment, etc., and/or combinations thereof. As can be appreciated, the pad layer 11 may include adhesive on the side opposite the base material 6 side for affixing to a surface, such as a subfloor, floor, etc. In one embodiment, the pad layer 11 may be configured to receive adhesive for affixing to a surface. It should be appreciated that any of the underlayment 1 embodiments as disclosed may include such a pad layer 11. In some embodiments, there may be additional pad layers 11, one above another (e.g., a stack of two, three, four, five, or more pad layers 11) for strengthening and controlling anti-fracture. This enables isolation of cracks in a substrate from traveling to the tile layer.



FIG. 8 shows a detail cross-sectional view of a second embodiment of the routing hubs 2 taken along line D-D shown in FIG. 6. As shown, the heating element receiving cavity 3 in FIG. 8 includes angular receiving surfaces 9. The angular receiving surfaces 9 may be configured as a draft angle 9a, a dovetail, a “V” shape, or other channel shape configured to receive the heating element 5. In some cases, at least one of the angular receiving surfaces 9 of the routing hubs 2 may be configured to contact the heating element receiving cavity 3. The contact may provide a frictional force that retains the heating element 5 in the underlayment 1. In some embodiments, the angular receiving surfaces 9 may contain the heating elements 5 in the heating element receiving cavity 5 without frictional contact.


The exemplary systems and methods of this disclosure have been described in relation to electronic shot placement detecting systems and methods. However, to avoid unnecessarily obscuring the present disclosure, the preceding description omits a number of known structures and devices. This omission is not to be construed as a limitation of the scopes of the claims. Specific details are set forth to provide an understanding of the present disclosure. It should, however, be appreciated that the present disclosure may be practiced in a variety of ways beyond the specific detail set forth herein.


While the flowcharts have been discussed and illustrated in relation to a particular sequence of events, it should be appreciated that changes, additions, and omissions to this sequence can occur without materially affecting the operation of the disclosed embodiments, configuration, and aspects.


A number of variations and modifications of the disclosure can be used. It would be possible to provide for some features of the disclosure without providing others.


The present disclosure, in various aspects, embodiments, and/or configurations, includes components, methods, processes, systems and/or apparatus substantially as depicted and described herein, including various aspects, embodiments, configurations embodiments, subcombinations, and/or subsets thereof. Those of skill in the art will understand how to make and use the disclosed aspects, embodiments, and/or configurations after understanding the present disclosure. The present disclosure, in various aspects, embodiments, and/or configurations, includes providing devices and processes in the absence of items not depicted and/or described herein or in various aspects, embodiments, and/or configurations hereof, including in the absence of such items as may have been used in previous devices or processes, e.g., for improving performance, achieving ease and/or reducing cost of implementation.


The foregoing discussion has been presented for purposes of illustration and description. The foregoing is not intended to limit the disclosure to the form or forms disclosed herein. In the foregoing Detailed Description for example, various features of the disclosure are grouped together in one or more aspects, embodiments, and/or configurations for the purpose of streamlining the disclosure. The features of the aspects, embodiments, and/or configurations of the disclosure may be combined in alternate aspects, embodiments, and/or configurations other than those discussed above. This method of disclosure is not to be interpreted as reflecting an intention that the claims require more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive aspects lie in less than all features of a single foregoing disclosed aspect, embodiment, and/or configuration. Thus, the following claims are hereby incorporated into this Detailed Description, with each claim standing on its own as a separate preferred embodiment of the disclosure.


Moreover, though the description has included description of one or more aspects, embodiments, and/or configurations and certain variations and modifications, other variations, combinations, and modifications are within the scope of the disclosure, e.g., as may be within the skill and knowledge of those in the art, after understanding the present disclosure. It is intended to obtain rights which include alternative aspects, embodiments, and/or configurations to the extent permitted, including alternate, interchangeable and/or equivalent structures, functions, ranges or steps to those claimed, whether or not such alternate, interchangeable and/or equivalent structures, functions, ranges or steps are disclosed herein, and without intending to publicly dedicate any patentable subject matter.

Claims
  • 1. A floor underlayment comprising: a base layer having a top side and a bottom side;a pad layer attached to the bottom side;a plurality of protrusions extending to a first height above the top side, each protrusion comprising: a top surface at the first height, the top surface substantially parallel to the base layer;an inner wall sloping from the top surface to the top side of the base layer, the inner wall sloped in a first direction; andan outer wall extending from the top surface to the top side of the base layer, at least a portion of the outer wall sloped in the first direction, the outer wall contacting the base layer underneath the top surface,wherein the sloped inner wall and the outer wall are curved in a horizontal plane.
  • 2. The floor underlayment of claim 1, wherein the pad layer comprises a sound dampening material.
  • 3. The floor underlayment of claim 1, wherein the pad layer comprises a heat reflective material.
  • 4. The floor underlayment of claim 3, wherein the heat reflective material is aluminum foil.
  • 5. The floor underlayment of claim 1, wherein the pad layer comprises an insulative material.
  • 6. The floor underlayment of claim 5, wherein the insulative material is polystyrene.
  • 7. The floor underlayment of claim 5, wherein the insulative material is fleece.
  • 8. The floor underlayment of claim 5, wherein the insulative material is wool.
  • 9. The floor underlayment of claim 1, wherein the pad layer comprises a non-woven fabric.
  • 10. The floor underlayment of claim 1, wherein the pad layer comprises a vapor barrier.
  • 11. The floor underlayment of claim 1, wherein the pad layer comprises a waterproof material.
  • 12. An underlayment comprising: a plurality of substantially circular routing hubs, each routing hub comprising separate symmetrical segments, each symmetrical segment extending upward from a top side of a base and comprising: a curved outer wall;a curved inner wall; anda top surface connecting the curved outer wall to the curved inner wall, the top surface having a variable width,wherein at least a portion of the curved outer wall slopes underneath the top surface; anda pad layer attached to a bottom side of the base.
  • 13. The underlayment of claim 12, wherein the pad layer comprises a heat reflective material.
  • 14. The underlayment of claim 13, wherein the heat reflective material is aluminum foil.
  • 15. The underlayment of claim 12, wherein the pad layer comprises an insulative material.
  • 16. The underlayment of claim 15, wherein the insulative material is polystyrene.
  • 17. The underlayment of claim 15, wherein the insulative material is fleece.
  • 18. The underlayment of claim 15, wherein the insulative material is wool.
  • 19. The underlayment of claim 12, wherein the pad layer comprises a non-woven fabric.
  • 20. A floor underlayment comprising: a base layer having an upper side and a lower side opposite the upper side;a pad layer attached to the lower side, the pad layer comprising a non-woven fabric;a plurality of raised features extending upwardly from the upper side, each of the plurality of raised features comprising a contact surface substantially parallel to the base layer and supported on opposite sides by an inner sidewall and an outer sidewall, the inner sidewall sloping away from the outer sidewall and defining a circular shape at the base layer, and at least a portion of the outer sidewall sloping underneath the contact surface,wherein the plurality of raised features are arranged on the base layer to provide a plurality of routing options for a heating element.
CROSS REFERENCE TO RELATED APPLICATIONS

The present application is a continuation-in-part of U.S. patent application Ser. No. 15/648,152, filed Jul. 12, 2017, which is a continuation of U.S. patent application Ser. No. 15/260,848, filed Sep. 9, 2016, now U.S. Pat. No. 9,777,931, which is a divisional of U.S. patent application Ser. No. 14/829,108, filed Aug. 18, 2015, now U.S. Pat. No. 9,625,163, which claims the benefit of U.S. Provisional Patent Application Ser. No. 62/038,733, filed Aug. 18, 2014, all of which are fully incorporated by reference herein.

US Referenced Citations (127)
Number Name Date Kind
254269 Brown Feb 1882 A
1485370 Cumfer Mar 1924 A
1549773 Hynes Aug 1925 A
1809620 Cole Jun 1931 A
1961374 Mazer Jun 1934 A
2139512 Nagorny Dec 1938 A
2325303 Brooke Jul 1943 A
2502642 Currlin Apr 1950 A
2928445 Van Buren, Jr. Mar 1960 A
2956785 Richl Oct 1960 A
3135040 Watson Jun 1964 A
3235712 Watson Feb 1966 A
3288998 Press, Jr. Nov 1966 A
3419457 Bleasdale Dec 1968 A
3434401 Kiewit Mar 1969 A
3487579 Brettingen Jan 1970 A
3495367 Kobayashi Feb 1970 A
3597891 Martin Aug 1971 A
3695615 Shoptaugh Oct 1972 A
3757481 Skinner Sep 1973 A
3854372 Gutshall Dec 1974 A
4016692 Jordan et al. Apr 1977 A
4183167 Jatich Jan 1980 A
4250674 Feist Feb 1981 A
4326366 Werner Apr 1982 A
4338994 Hewing Jul 1982 A
4576221 Fennesz Mar 1986 A
4640067 Hagemann et al. Feb 1987 A
4640854 Radtke Feb 1987 A
4889758 Rinkewich Dec 1989 A
4923733 Herbst May 1990 A
4955471 Hirose et al. Sep 1990 A
4993202 Thiel Feb 1991 A
4997308 Welling, Jr. Mar 1991 A
5042569 Siegmund Aug 1991 A
5052161 Whitacre Oct 1991 A
5078203 Shiroki Jan 1992 A
D325428 Vitsur Apr 1992 S
5105595 Tokei et al. Apr 1992 A
5131458 Bourne et al. Jul 1992 A
5374466 Bleasdale Dec 1994 A
5381709 Louw Jan 1995 A
5386670 Takeda et al. Feb 1995 A
5443332 Hollis Aug 1995 A
5447433 Perry, Jr. Sep 1995 A
5480259 Thrower Jan 1996 A
5499476 Adams et al. Mar 1996 A
D372158 Bonaddio et al. Jul 1996 S
D370034 Kipfer Aug 1996 S
5585154 Rhoades Dec 1996 A
5789462 Motani et al. Aug 1998 A
5863440 Rink et al. Jan 1999 A
6076315 Kondo Jun 2000 A
6094878 Schluter Aug 2000 A
6178662 Legatzke Jan 2001 B1
6279427 Francis Aug 2001 B1
6434901 Schluter Aug 2002 B1
6805298 Corbett Oct 2004 B1
6918217 Jakob-Bamberg et al. Jul 2005 B2
D508332 Julton Aug 2005 S
7118138 Rowley et al. Oct 2006 B1
D541396 Fawcett et al. Apr 2007 S
7250570 Morand et al. Jul 2007 B1
D551152 Funk et al. Sep 2007 S
D568006 Shin Apr 2008 S
D587358 Stephan et al. Feb 2009 S
7585556 Julton Sep 2009 B2
7669371 Hill Mar 2010 B2
7880121 Naylor Feb 2011 B2
D636098 Reynolds et al. Apr 2011 S
8002241 Shaw Aug 2011 B1
D659529 Ojanen et al. May 2012 S
8176694 Batori May 2012 B2
8220221 Gray Jul 2012 B2
8288689 Adelman Oct 2012 B1
8341911 Collison et al. Jan 2013 B2
8414996 Senior Apr 2013 B2
8517473 Monyak et al. Aug 2013 B2
8573901 de Souza Filho et al. Nov 2013 B2
D706459 Schluter et al. Jun 2014 S
D709368 van de Klippe et al. Jul 2014 S
D709369 van de Klippe et al. Jul 2014 S
D712159 Clerici et al. Sep 2014 S
8950141 Schluter et al. Feb 2015 B2
D733558 Wyne Jul 2015 S
D747502 Reynolds et al. Jan 2016 S
D747503 Reynolds et al. Jan 2016 S
9228749 Morand et al. Jan 2016 B2
9248492 Sullivan et al. Feb 2016 B2
9275622 Claeys et al. Mar 2016 B2
9284693 Tabibnia Mar 2016 B2
9416979 Larson Aug 2016 B2
9482262 Richards Nov 2016 B2
D773697 Amend Dec 2016 S
9518746 Larson Dec 2016 B2
9625163 Larson Apr 2017 B2
9719265 Bordin et al. Aug 2017 B2
9726383 Bordin Aug 2017 B1
D797957 Larson Sep 2017 S
9777931 Larson Oct 2017 B2
20020109291 Lawrence Aug 2002 A1
20030024190 Stanchfield Feb 2003 A1
20050184066 Brooks et al. Aug 2005 A1
20060086717 Oosterling Apr 2006 A1
20060260233 Schluter Nov 2006 A1
20060265975 Geffe Nov 2006 A1
20060278172 Ragonetti et al. Dec 2006 A1
20070039268 Ambrose, Jr. Feb 2007 A1
20070056233 Kang et al. Mar 2007 A1
20080017725 Backman, Jr. Jan 2008 A1
20080173060 Cymbalisty et al. Jul 2008 A1
20080276557 Rapaz Nov 2008 A1
20080290503 Karavakis et al. Nov 2008 A1
20080290504 Karavakis et al. Nov 2008 A1
20080295441 Carolan et al. Dec 2008 A1
20090026192 Fuhrman Jan 2009 A1
20090230113 Batori Sep 2009 A1
20100048752 Vignola et al. Feb 2010 A1
20110047907 Smolka Mar 2011 A1
20140069039 Schluter Mar 2014 A1
20150345155 Pastrana Dec 2015 A1
20160377300 Larson Dec 2016 A1
20170073980 Szonok Mar 2017 A1
20170175389 Liang et al. Jun 2017 A1
20170284108 Larson Oct 2017 A1
20170307228 Bordin Oct 2017 A1
20170307229 Larson Oct 2017 A1
Foreign Referenced Citations (53)
Number Date Country
1186470 May 1985 CA
2822392 Mar 2014 CA
657690 Sep 1986 CH
2840149 Mar 1980 DE
8413516 Oct 1984 DE
3317131 Nov 1984 DE
3730144 Apr 1988 DE
4201553 Nov 1992 DE
9114591 Mar 1993 DE
4230168 Aug 1993 DE
4226312 Feb 1994 DE
4242026 Jun 1994 DE
29609497 Aug 1996 DE
19750277 May 1999 DE
19828607 Dec 1999 DE
19936801 Aug 2000 DE
19912922 Jan 2001 DE
10040643 Nov 2001 DE
202006013453 Nov 2006 DE
102006004626 Aug 2007 DE
102006004755 Aug 2007 DE
001079214-0005 Mar 2009 EM
60547 Sep 1982 EP
74490 Mar 1983 EP
133556 Feb 1985 EP
189020 Jul 1986 EP
367176 May 1990 EP
368804 May 1990 EP
437999 Jul 1991 EP
514684 Nov 1992 EP
0582031 Feb 1994 EP
0811808 Dec 1997 EP
0947778 Oct 1999 EP
1054217 Nov 2000 EP
1068413 Jan 2001 EP
1074793 Feb 2001 EP
1096079 May 2001 EP
1338413 Aug 2003 EP
1063478 Oct 2003 EP
1208332 Mar 2004 EP
1770337 Apr 2007 EP
2695986 Mar 1994 FR
2746426 Sep 1997 FR
2006548 May 1979 GB
2097836 Nov 1982 GB
2364565 Jan 2002 GB
2373042 Sep 2002 GB
H01-139935 Jun 1989 JP
H05-264051 Oct 1993 JP
2008-025295 Feb 2008 JP
WO 8203099 Sep 1982 WO
WO 9522671 Aug 1995 WO
WO 2004111544 Dec 2004 WO
Non-Patent Literature Citations (26)
Entry
Official Action for U.S. Appl. No. 15/648,152, dated Apr. 18, 2018 12 pages.
Official Action for U.S. Appl. No. 15/504,188, dated Jun. 19, 2018 8 pages.
U.S. Appl. No. 29/493,206, filed Jun. 6, 2014, Larson.
U.S. Appl. No. 29/573,009, filed Aug. 2, 2016, Bordin.
U.S. Appl. No. 15/796,328, filed Oct. 27, 2017, Bordin.
“5 Facts You May Not Know About Heated Flooring,” southcypress.com, Sep. 12, 2015, 4 pages [retrieved Aug. 3, 2016 from: https://web.archive.org/web/20150912220312/http://www.southcypress.com/v3/articles/heated-flooring.htm].
“Ditra Heat,” GlensFalls Tile & Supplies, Sep. 4, 2014, 1 page [retrieved Aug. 3, 2016 from: http://www.glensfallstile.com/general-tips/ditra-heat/772/].
“Illustrated price list BT 7,” Schlüter-Systems KG, Dec. 7, 28 pages.
“Wall Skimmer Octagonal Nut (on-line),” National Pool Wholesalers, dated Aug. 12, 2012, 1 page [retrieved from internet Nov. 18, 2016, URL: https://web.archive.org/web/20120812084211/http://www.nationalpoolwholesalers.com/_Wall_Skimmer_Octagonal_Nut_--SKU_PWSP17BUW.html].
Polypipe Brochure; “Redefining Heating Systems,” www.ufch.com; Polyplumb: Hot & Cold Plumbing & Heating System; © 2006, Polypipe Group; Printed: Feb. 2007, 44 pages.
Schluter Systems, Profile of Innovation, Illustrated Price List, Jan. 1, 2008, 2 pages.
International Search Report and Written Opinion for International (PCT) Patent Application No. PCT/US2015/045688, dated Nov. 12, 2015 9 pages.
International Preliminary Report on Patentability for International (PCT) Patent Application No. PCT/US2015/045688, dated Mar. 2, 2017 8 pages.
Extended European Search Report for European Patent Application No. 15833528.1, dated Dec. 14, 2017, 14 pages.
Official Action for U.S. Appl. No. 14/829,108, dated Jan. 20, 2016, 10 pages.
Third Party Submission for U.S. Appl. No. 14/829,108, mailed Aug. 17, 2016, 17 pages.
Official Action for U.S. Appl. No. 14/829,108, dated Aug. 18, 2016 5 pages Restriction Requirement.
Notice of Allowance for U.S. Appl. No. 14/829,108, dated Dec. 21, 2016 7 pages.
Official Action for U.S. Appl. No. 15/260,848, dated Oct. 11, 2016 10 pages.
Official Action for U.S. Appl. No. 15/260,848, dated Mar. 17, 2017 11 pages.
Notice of Allowance for U.S. Appl. No. 15/260,848, dated Jun. 2, 2017 7 pages.
Official Action for U.S. Appl. No. 15/648,152, dated Aug. 11, 2017 10 pages.
Official Action for U.S. Appl. No. 15/648,152, dated Sep. 20, 2017 16 pages.
Official Action for U.S. Appl. No. 15/504,188, dated Oct. 19, 2017 7 pages.
M-D Building Products, Inc.'s Answer to Progress Profiles SPA's Complaint, filed Oct. 23, 2018 (Case No. 5:18-CV-00890-R) 37 pages.
Official Action for U.S. Appl. No. 16/121,232, dated Oct. 9, 2018 10 pages.
Related Publications (1)
Number Date Country
20180051893 A1 Feb 2018 US
Provisional Applications (1)
Number Date Country
62038733 Aug 2014 US
Divisions (1)
Number Date Country
Parent 14829108 Aug 2015 US
Child 15260848 US
Continuations (1)
Number Date Country
Parent 15260848 Sep 2016 US
Child 15648152 US
Continuation in Parts (1)
Number Date Country
Parent 15648152 Jul 2017 US
Child 15796225 US