Embodiments of the present invention are generally related to underlayments associated with radiant floor or wall heating systems
In-floor and in-wall heating and cooling is well known that utilizes heat conduction and radiant heat, for example, for indoor climate control rather than forced air heating that relies on convection. The heat is usually generated by a series of pipes that circulate heated water or by electric cable, mesh, or film that provide heat when a current is applied thereto. In-floor radiant heating technology is used commonly in homes and businesses today.
Electrical floor heating systems have very low installation costs and are well suited for kitchens, bathrooms, or in rooms that require additional heat, such as basements. One advantage of electric floor heating is the height of installation. For example, floor buildup can be as little as about one millimeter as the electric cables are usually associated with a specialized installation board or directly onto the sub floor. Electric underfloor heating is also installed very quickly, usually taking a half a day to a day depending on the size of the area to be heated. In addition, warm up times are generally decreased because the cables are installed approximate to the finished flooring, e.g., tile, wherein direct connection is made with the heat source rather than a stored water heater as in fluid-based systems. Electric systems are offered in several different forms, such as those that utilize a long continuous length cable or those that employ a mat with embedded heating elements. In order to maximize heat transfer, a bronze screen or carbon film heating element may be also used. Carbon film systems are normally installed under the wire and onto a thin insulation underlay to reduce thermal loss to the sub floor. Vinyls, carpets, and other soft floor finishes can be heated using carbon film elements or bronze screen elements.
Another type of in-floor heating system is based on the circulation of hot water, i.e., a “hydronic” system. In a hydronic system, warm water is circulated through pipes or tubes that are incorporated into the floor and generally uses pipes from about 11/16 inch to 1 inch to circulate hot water from which the heat emanates. The size of tubes generally translates into a thicker floor, which may be undesirable. One other disadvantage of a hydronic system is that a hot water storage tank must be maintained at all times, which is less efficient than an electric floor heating system.
In order to facilitate even heating of a floor, the wires must preferably be spaced at specific locations. One such system is disclosed in U.S. Patent Application Publication No. 2009/0026192 to Fuhrman (“Fuhrman”), which is incorporated by reference in its entirety herein. Fuhrman discloses a mat with a plurality of studs extending therefrom that help dictate the location of the wires. The mat with associated studs is placed over a sub floor with a layer of adhesive therebetween. Another layer of adhesive is placed above of the studs. The studs also guide the finishers to form a correct floor thickness. The studs thus provide a location for interweaving the wire or wires that are used in the heating system. The wire of Fuhrman, however, is not secured between adjacent studs and still may separate therefrom, which may cause uneven heating or wire damage. Furthermore, Fuhrman discloses a continuous mat wherein subsequent layers of adhesive are not able to interact with those previously placed.
It is with respect to the above issues and other problems that the embodiments presented herein were contemplated. In general, embodiments of the present disclosure provide methods, devices, and systems by which various elements, such as wire, heating elements, and the like, may be routed and/or contained in a flooring underlayment. In one embodiment, the underlayment may include a number of protrusions extending from a base material. The protrusions may be configured in a cluster, or array, or even as part of another protrusion, forming routing hubs. As provided herein, a wire may be routed around, through, and even around and through the routing hubs and/or protrusions. The unique shape and arrangement of the protrusions disclosed herein can provide for the efficient routing of wires in an underlayment for any shape and/or purpose.
In some embodiments, the protrusion forms a geometric shape extending away from a base material surface to a contact surface (e.g., the contact surface for flooring, tile, etc.). This extension between the base material surface and the contact surface defines the overall protrusion height. The protrusion may include a number of sides extending from the base material to the contact surface. As can be appreciated, at least one of the sides of the protrusion may include a surface configured to receive a wire. This receiving surface can be concave, convex, arcuate, linear, etc., and/or combinations thereof. Additionally or alternatively, the surface may follow, or contour, the geometric shape of the protrusion.
It is an aspect of the present disclosure that at least two protrusions are arranged adjacent to one another on an underlayment base material. In one embodiment, the protrusions may be arranged such that the receiving surface of a first protrusion is offset from and facing the receiving surface of a second protrusion. The distance of the offset and the receiving surfaces can form a receiving cavity configured to receive a wire, heating element, or other element. For example, an underlayment may include a number of protrusions arranged about an array axis to form a routing hub. Where four protrusions make up a routing hub, there may exist heating element receiving cavities disposed between each protrusion. Additionally or alternatively, the underlayment may include a number of routing hubs equally-spaced along a first linear direction and/or a second linear direction to form a matrix of routing hubs. In this case, additional heating element receiving cavities may be disposed between each routing hub. As can be appreciated, the matrix of routing hubs and the array of protrusions allow for heating elements to be routed in the underlayment according to any configuration of routing curves, angles, and/or lines.
In some embodiments, the protrusions, base material, and/or other features of the underlayment may be formed into a shape from at least one material. Examples of forming can include, but are not limited to, thermoforming, thermo-molding, injection molding, casting, molding, rotational molding, reaction injection, blow molding, vacuum forming, twin sheet forming, compression molding, machining, 3D printing, etc., and/or combinations thereof.
The protrusions, base material, and/or other features of the underlayment may include a number of cutouts, or holes. In some embodiments, the cutouts can extend at least partially into the protrusion, base material, and/or the underlayment. In one embodiment, one or more of the cutouts may completely pass through the underlayment. In any event, the cutouts may be configured to receive a mating material. For instance, the cutouts may be configured to receive adhesive, epoxy, grout, cement, glue, plastic, or other material capable of flowing at least partially into the cutouts. These cutouts can provide a number of surfaces on the underlayment to which material can adhere, or key. Additionally or alternatively, these cutouts can increase the strength of the underlayment by providing a structural skeleton, around which material can flow and cure in addition to providing a pathway for airflow, thereby enabling the utilization of a modified thinset, which requires air for curing. The cutouts further provides a passageway for moisture to flow out of the subfloor. In one embodiment, the cutouts may be provided via the forming process of the underlayment. In another embodiment, the cutouts may be made via a cutting operation performed prior to the forming process. In yet another embodiment, the cutouts may be made via a cutting operation performed subsequent to the forming process.
The underlayment may include areas in and/or between the routing hubs that are configured to receive material. For instance, the areas may be configured to receive adhesive, epoxy, grout, cement, glue, plastic, or other material capable of flowing at least partially into the areas. These areas can provide a number of surfaces on the underlayment to which material can adhere, or key. Additionally or alternatively, these areas can increase the strength of the underlayment by providing a structural skeleton, around which material can flow and cure.
In some embodiments, the underlayment may include a pad layer. The pad layer may include a sound dampening material, heat reflective material, insulative material, porous substrate, vapor barrier, waterproof material, energy reflective material, etc., and/or combinations thereof. Examples of pad layers can include, but are in no way limited to, foil, cork, rubber, plastic, concrete, wood, organic materials, inorganic materials, composites, compounds, etc., and/or combinations thereof. The pad layer may be attached to the base material via adhesive, thermal bonding, welding, mechanical attachment, etc., and/or combinations thereof. As can be appreciated, the pad layer may include adhesive on the side opposite the base material side for affixing to a surface, such as a subfloor, floor, etc. In one embodiment, the pad layer may be configured to receive adhesive for affixing to a surface.
The phrases “at least one”, “one or more”, and “and/or” are open-ended expressions that are both conjunctive and disjunctive in operation. For example, each of the expressions “at least one of A, B and C”, “at least one of A, B, or C”, “one or more of A, B, and C”, “one or more of A, B, or C” and “A, B, and/or C” means A alone, B alone, C alone, A and B together, A and C together, B and C together, or A, B and C together. When each one of A, B, and C in the above expressions refers to an element, such as X, Y, and Z, or class of elements, such as X1-Xn, Y1-Ym, and Z1-Zo, the phrase is intended to refer to a single element selected from X, Y, and Z, a combination of elements selected from the same class (e.g., X1 and X2) as well as a combination of elements selected from two or more classes (e.g., Y1 and Zo).
The term “a” or “an” entity refers to one or more of that entity. As such, the terms “a” (or “an”), “one or more” and “at least one” can be used interchangeably herein. It is also to be noted that the terms “comprising”, “including”, and “having” can be used interchangeably.
The term “means” as used herein shall be given its broadest possible interpretation in accordance with 35 U.S.C., Section 112, Paragraph 6. Accordingly, a claim incorporating the term “means” shall cover all structures, materials, or acts set forth herein, and all of the equivalents thereof. Further, the structures, materials or acts and the equivalents thereof shall include all those described in the summary of the invention, brief description of the drawings, detailed description, abstract, and claims themselves.
It should be understood that every maximum numerical limitation given throughout this disclosure is deemed to include each and every lower numerical limitation as an alternative, as if such lower numerical limitations were expressly written herein. Every minimum numerical limitation given throughout this disclosure is deemed to include each and every higher numerical limitation as an alternative, as if such higher numerical limitations were expressly written herein. Every numerical range given throughout this disclosure is deemed to include each and every narrower numerical range that falls within such broader numerical range, as if such narrower numerical ranges were all expressly written herein.
The preceding is a simplified summary of the disclosure to provide an understanding of some aspects of the disclosure. This summary is neither an extensive nor exhaustive overview of the disclosure and its various aspects, embodiments, and configurations. It is intended neither to identify key or critical elements of the disclosure nor to delineate the scope of the disclosure but to present selected concepts of the disclosure in a simplified form as an introduction to the more detailed description presented below. As will be appreciated, other aspects, embodiments, and configurations of the disclosure are possible utilizing, alone or in combination, one or more of the features set forth above or described in detail below.
The accompanying drawings are incorporated into and form a part of the specification to illustrate several examples of the present disclosure. These drawings, together with the description, explain the principles of the disclosure. The drawings simply illustrate preferred and alternative examples of how the disclosure can be made and used and are not to be construed as limiting the disclosure to only the illustrated and described examples. Further features and advantages will become apparent from the following, more detailed, description of the various aspects, embodiments, and configurations of the disclosure, as illustrated by the drawings referenced below.
Before any embodiments of the disclosure are explained in detail, it is to be understood that the disclosure is not limited in its application to the details of construction and the arrangement of components set forth in the following description or illustrated in the following drawings. The disclosure is capable of other embodiments and of being practiced or of being carried out in various ways. Also, it is to be understood that the phraseology and terminology used herein is for the purpose of description and should not be regarded as limiting. The use of “including,” “comprising,” or “having” and variations thereof herein is meant to encompass the items listed thereafter and equivalents thereof as well as additional items.
Additionally or alternatively, the underlayment 1 may include a pad layer 11. The pad layer 11 may include a sound dampening material, heat reflective material, insulative material, porous substrate, vapor barrier, waterproof material, energy reflective material, etc., and/or combinations thereof. Examples of pad layers 11 can include, but are in no way limited to, foil, cork, rubber, plastic, concrete, wood, organic materials, inorganic materials, composites, compounds, etc., and/or combinations thereof. The pad layer 11 may be attached to the base material 6 via adhesive, thermal bonding, welding, mechanical attachment, etc., and/or combinations thereof. As can be appreciated, the pad layer 11 may include adhesive on the side opposite the base material 6 side for affixing to a surface, such as a subfloor, floor, etc. In one embodiment, the pad layer 11 may be configured to receive adhesive for affixing to a surface. It should be appreciated that any of the underlayment 1 embodiments as disclosed may include such a pad layer 11. In some embodiments, there may be additional pad layers 11, one above another (e.g., a stack of two, three, four, five, or more pad layers 11) for strengthening and controlling anti-fracture. This enables isolation of cracks in a substrate from traveling to the tile layer.
The exemplary systems and methods of this disclosure have been described in relation to electronic shot placement detecting systems and methods. However, to avoid unnecessarily obscuring the present disclosure, the preceding description omits a number of known structures and devices. This omission is not to be construed as a limitation of the scopes of the claims. Specific details are set forth to provide an understanding of the present disclosure. It should, however, be appreciated that the present disclosure may be practiced in a variety of ways beyond the specific detail set forth herein.
While the flowcharts have been discussed and illustrated in relation to a particular sequence of events, it should be appreciated that changes, additions, and omissions to this sequence can occur without materially affecting the operation of the disclosed embodiments, configuration, and aspects.
A number of variations and modifications of the disclosure can be used. It would be possible to provide for some features of the disclosure without providing others.
The present disclosure, in various aspects, embodiments, and/or configurations, includes components, methods, processes, systems and/or apparatus substantially as depicted and described herein, including various aspects, embodiments, configurations embodiments, subcombinations, and/or subsets thereof. Those of skill in the art will understand how to make and use the disclosed aspects, embodiments, and/or configurations after understanding the present disclosure. The present disclosure, in various aspects, embodiments, and/or configurations, includes providing devices and processes in the absence of items not depicted and/or described herein or in various aspects, embodiments, and/or configurations hereof, including in the absence of such items as may have been used in previous devices or processes, e.g., for improving performance, achieving ease and/or reducing cost of implementation.
The foregoing discussion has been presented for purposes of illustration and description. The foregoing is not intended to limit the disclosure to the form or forms disclosed herein. In the foregoing Detailed Description for example, various features of the disclosure are grouped together in one or more aspects, embodiments, and/or configurations for the purpose of streamlining the disclosure. The features of the aspects, embodiments, and/or configurations of the disclosure may be combined in alternate aspects, embodiments, and/or configurations other than those discussed above. This method of disclosure is not to be interpreted as reflecting an intention that the claims require more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive aspects lie in less than all features of a single foregoing disclosed aspect, embodiment, and/or configuration. Thus, the following claims are hereby incorporated into this Detailed Description, with each claim standing on its own as a separate preferred embodiment of the disclosure.
Moreover, though the description has included description of one or more aspects, embodiments, and/or configurations and certain variations and modifications, other variations, combinations, and modifications are within the scope of the disclosure, e.g., as may be within the skill and knowledge of those in the art, after understanding the present disclosure. It is intended to obtain rights which include alternative aspects, embodiments, and/or configurations to the extent permitted, including alternate, interchangeable and/or equivalent structures, functions, ranges or steps to those claimed, whether or not such alternate, interchangeable and/or equivalent structures, functions, ranges or steps are disclosed herein, and without intending to publicly dedicate any patentable subject matter.
This application is a national stage application under 35 U.S.C. 371 of PCT Application No. PCT/US2015/045688, having an international filing date of Aug. 18, 2015, which designated the United States, which PCT application claimed the benefit of U.S. Application Ser. No. 62/038,733, filed on Aug. 18, 2014, both of which are incorporated herein by reference in their entirety.
Filing Document | Filing Date | Country | Kind |
---|---|---|---|
PCT/US2015/045688 | 8/18/2015 | WO | 00 |
Publishing Document | Publishing Date | Country | Kind |
---|---|---|---|
WO2016/028775 | 2/25/2016 | WO | A |
Number | Name | Date | Kind |
---|---|---|---|
254269 | Brown | Feb 1882 | A |
584875 | Jameton | Jun 1897 | A |
731158 | Blackmore | Jun 1903 | A |
1485370 | Cumfer | Mar 1924 | A |
1549773 | Hynes | Aug 1925 | A |
1809620 | Cole | Jun 1931 | A |
1961374 | Mazer | Jun 1934 | A |
2139512 | Nagorny | Dec 1938 | A |
2325303 | Brooke | Jul 1943 | A |
2421171 | Trautvetter et al. | May 1947 | A |
2502642 | Currlin | Apr 1950 | A |
2928445 | Van Buren, Jr. | Mar 1960 | A |
2956785 | Richl | Oct 1960 | A |
3135040 | Watson | Jun 1964 | A |
3235712 | Watson | Feb 1966 | A |
3288998 | Press, Jr. | Nov 1966 | A |
3419457 | Bleasdale | Dec 1968 | A |
3434401 | Kiewit | Mar 1969 | A |
3487579 | Brettingen | Jan 1970 | A |
3495367 | Kobayashi | Feb 1970 | A |
3597891 | Martin | Aug 1971 | A |
3695615 | Shoptaugh | Oct 1972 | A |
3757481 | Skinner | Sep 1973 | A |
3802790 | Blackburn | Apr 1974 | A |
3854372 | Gutshall | Dec 1974 | A |
4016692 | Jordan et al. | Apr 1977 | A |
4183167 | Jatich | Jan 1980 | A |
4188231 | Valore | Feb 1980 | A |
4222695 | Sarides | Sep 1980 | A |
4250674 | Feist | Feb 1981 | A |
4326366 | Werner | Apr 1982 | A |
4338994 | Hewing et al. | Jul 1982 | A |
4576221 | Fennesz | Mar 1986 | A |
4640067 | Hagemann | Feb 1987 | A |
4640854 | Radtke | Feb 1987 | A |
4889758 | Rinkewich | Dec 1989 | A |
4923733 | Herbst | May 1990 | A |
4955471 | Hirose et al. | Sep 1990 | A |
4993202 | Thiel | Feb 1991 | A |
4995471 | Hara et al. | Feb 1991 | A |
4997308 | Welling, Jr. | Mar 1991 | A |
5042569 | Siegmund | Aug 1991 | A |
5052161 | Whitacre | Oct 1991 | A |
5078203 | Shiroki | Jan 1992 | A |
5082712 | Starp | Jan 1992 | A |
D325428 | Vitsur | Apr 1992 | S |
5105595 | Tokei et al. | Apr 1992 | A |
5131458 | Bourne et al. | Jul 1992 | A |
5374466 | Bleasdale | Dec 1994 | A |
5381709 | Louw | Jan 1995 | A |
5386670 | Takeda et al. | Feb 1995 | A |
5443332 | Hollis | Aug 1995 | A |
5447433 | Perry, Jr. | Sep 1995 | A |
5480259 | Thrower | Jan 1996 | A |
5499476 | Adams | Mar 1996 | A |
D372158 | Bonaddio et al. | Jul 1996 | S |
D370034 | Kipfer | Aug 1996 | S |
5585154 | Rhoades | Dec 1996 | A |
5619832 | Myrvold | Apr 1997 | A |
5789462 | Motani et al. | Aug 1998 | A |
5863440 | Rink et al. | Jan 1999 | A |
6076315 | Kondo | Jun 2000 | A |
6094878 | Schluter | Aug 2000 | A |
6178662 | Legatzke | Jan 2001 | B1 |
6220523 | Fiedrich | Apr 2001 | B1 |
6279427 | Francis | Aug 2001 | B1 |
6283382 | Fitzmeyer | Sep 2001 | B1 |
6434901 | Schluter | Aug 2002 | B1 |
6539681 | Siegmund | Apr 2003 | B1 |
6805298 | Corbett | Oct 2004 | B1 |
6918217 | Jakob-Bamberg et al. | Jul 2005 | B2 |
D508332 | Julton | Aug 2005 | S |
7118138 | Rowley et al. | Oct 2006 | B1 |
D541396 | Fawcett et al. | Apr 2007 | S |
7250570 | Morand et al. | Jul 2007 | B1 |
D551152 | Funk et al. | Sep 2007 | S |
D568006 | Shin | Apr 2008 | S |
D587358 | Stephan et al. | Feb 2009 | S |
7488523 | Muncaster et al. | Feb 2009 | B1 |
7585556 | Julton | Sep 2009 | B2 |
7651757 | Jones et al. | Jan 2010 | B2 |
7669371 | Hill | Mar 2010 | B2 |
7880121 | Naylor | Feb 2011 | B2 |
D636098 | Reynolds et al. | Apr 2011 | S |
8002241 | Shaw | Aug 2011 | B1 |
D659529 | Ojanen et al. | May 2012 | S |
8176694 | Batori | May 2012 | B2 |
8220221 | Gray | Jul 2012 | B2 |
8288689 | Adelman | Oct 2012 | B1 |
8341911 | Collison et al. | Jan 2013 | B2 |
8414996 | Senior | Apr 2013 | B2 |
8517473 | Monyak et al. | Aug 2013 | B2 |
8573901 | de Souza Filho et al. | Nov 2013 | B2 |
D706459 | Schluter et al. | Jun 2014 | S |
D709368 | van de Klippe et al. | Jul 2014 | S |
D709369 | van de Klippe et al. | Jul 2014 | S |
8808826 | Pinto et al. | Aug 2014 | B2 |
D712159 | Clerici et al. | Sep 2014 | S |
8950141 | Schluter et al. | Feb 2015 | B2 |
8955278 | Mills | Feb 2015 | B1 |
D733558 | Wyne | Jul 2015 | S |
9188348 | Larson | Nov 2015 | B2 |
D747502 | Reynolds et al. | Jan 2016 | S |
D747503 | Reynolds et al. | Jan 2016 | S |
9228749 | Morand | Jan 2016 | B2 |
9248492 | Sullivan et al. | Feb 2016 | B2 |
9275622 | Claeys et al. | Mar 2016 | B2 |
9284693 | Tabibnia | Mar 2016 | B2 |
9328520 | Kriser | May 2016 | B1 |
9416979 | Larson | Aug 2016 | B2 |
9482262 | Richards | Nov 2016 | B2 |
D773697 | Amend | Dec 2016 | S |
9518746 | Larson | Dec 2016 | B2 |
9625163 | Larson | Apr 2017 | B2 |
D806274 | Bordin | Dec 2017 | S |
D806275 | Bordin | Dec 2017 | S |
D806276 | Bordin | Dec 2017 | S |
D806277 | Bordin | Dec 2017 | S |
D806278 | Bordin | Dec 2017 | S |
D806279 | Bordin | Dec 2017 | S |
D806280 | Bordin | Dec 2017 | S |
D806911 | Faotto | Jan 2018 | S |
D806912 | Bordin | Jan 2018 | S |
D810324 | Brousseau et al. | Feb 2018 | S |
9890959 | Houle et al. | Feb 2018 | B2 |
D817521 | Bordin | May 2018 | S |
D818615 | Bordin | May 2018 | S |
D818616 | Bordin | May 2018 | S |
D818617 | Bordin | May 2018 | S |
D830584 | Comitale et al. | Oct 2018 | S |
D832467 | Bordin | Oct 2018 | S |
1010051 | Liang et al. | Oct 2018 | A1 |
D840057 | Faotto | Feb 2019 | S |
D847384 | Faotto | Apr 2019 | S |
D857244 | Faotto et al. | Aug 2019 | S |
D857933 | Julton et al. | Aug 2019 | S |
20020109291 | Lawrence | Aug 2002 | A1 |
20030024190 | Stanchfield | Feb 2003 | A1 |
20050184066 | Brooks et al. | Aug 2005 | A1 |
20060086717 | Oosterling | Apr 2006 | A1 |
20060260233 | Schluter | Nov 2006 | A1 |
20060265975 | Geffe | Nov 2006 | A1 |
20060278172 | Ragonetti et al. | Dec 2006 | A1 |
20070039268 | Ambrose, Jr. et al. | Feb 2007 | A1 |
20070056233 | Kang et al. | Mar 2007 | A1 |
20080017725 | Backman, Jr. | Jan 2008 | A1 |
20080173060 | Cymbalisty et al. | Jul 2008 | A1 |
20080276557 | Rapaz | Nov 2008 | A1 |
20080290503 | Karavakis et al. | Nov 2008 | A1 |
20080290504 | Karavakis | Nov 2008 | A1 |
20080295441 | Carolan et al. | Dec 2008 | A1 |
20090026192 | Fuhrman | Jan 2009 | A1 |
20090230113 | Batori | Sep 2009 | A1 |
20100048752 | Vignola et al. | Feb 2010 | A1 |
20110047907 | Smolka | Mar 2011 | A1 |
20140069039 | Schluter | Mar 2014 | A1 |
20150345155 | Pastrana | Dec 2015 | A1 |
20160192443 | Schluter | Jun 2016 | A1 |
20160273232 | Bordin et al. | Sep 2016 | A1 |
20160377299 | Larson | Dec 2016 | A1 |
20160377300 | Larson | Dec 2016 | A1 |
20170073980 | Szonok | Mar 2017 | A1 |
20170175389 | Liang et al. | Jun 2017 | A1 |
20180223543 | Faotto | Aug 2018 | A1 |
20190226686 | White et al. | Jul 2019 | A1 |
Number | Date | Country |
---|---|---|
1186470 | May 1985 | CA |
657690 | Sep 1986 | CH |
1270295 | Oct 2000 | CN |
1986165 | May 1968 | DE |
2819385 | Nov 1979 | DE |
2840149 | Mar 1980 | DE |
8129930 | Feb 1982 | DE |
8413516 | Oct 1984 | DE |
3317131 | Nov 1984 | DE |
8429708 | Feb 1985 | DE |
3730144 | Apr 1988 | DE |
3543688 | Mar 1990 | DE |
4201553 | Nov 1992 | DE |
9114591 | Mar 1993 | DE |
4230168 | Aug 1993 | DE |
4238943 | Jan 1994 | DE |
4226312 | Feb 1994 | DE |
4210468 | Jun 1994 | DE |
4242026 | Jun 1994 | DE |
29609497 | Aug 1996 | DE |
29822293 | Apr 1999 | DE |
19750277 | May 1999 | DE |
19828607 | Dec 1999 | DE |
19936801 | Aug 2000 | DE |
19912922 | Jan 2001 | DE |
10040643 | Nov 2001 | DE |
202006013453 | Nov 2006 | DE |
102006004626 | Aug 2007 | DE |
102006004755 | Aug 2007 | DE |
202007014616 | Dec 2007 | DE |
102012001557 | Aug 2013 | DE |
0035722 | Sep 1981 | EP |
0044469 | Jan 1982 | EP |
60547 | Sep 1982 | EP |
74490 | Mar 1983 | EP |
133556 | Feb 1985 | EP |
189020 | Jul 1986 | EP |
367176 | May 1990 | EP |
368804 | May 1990 | EP |
437999 | Jul 1991 | EP |
514684 | Nov 1992 | EP |
0582031 | Feb 1994 | EP |
0448928 | Mar 1994 | EP |
0637720 | Feb 1995 | EP |
0811808 | Dec 1997 | EP |
947778 | Oct 1999 | EP |
1054217 | Nov 2000 | EP |
1068413 | Jan 2001 | EP |
1074793 | Feb 2001 | EP |
1096079 | May 2001 | EP |
1338413 | Aug 2003 | EP |
1063478 | Oct 2003 | EP |
1134503 | Nov 2003 | EP |
1208332 | Mar 2004 | EP |
1460345 | Sep 2004 | EP |
1462727 | Sep 2004 | EP |
1770337 | Apr 2007 | EP |
1531306 | Feb 2008 | EP |
001079214-000 | Mar 2009 | EP |
2466029 | Feb 2015 | EP |
2584272 | May 2016 | EP |
2695986 | Mar 1994 | FR |
2746426 | Sep 1997 | FR |
2006548 | May 1979 | GB |
2097836 | Nov 1982 | GB |
2364565 | Jan 2002 | GB |
2373042 | Sep 2002 | GB |
2444241 | Jun 2008 | GB |
H01-139935 | Jun 1989 | JP |
H05-264051 | Oct 1993 | JP |
2001-012067 | Jan 2001 | JP |
2005-249303 | Sep 2005 | JP |
2008-025295 | Feb 2008 | JP |
1998-063147 | Nov 1998 | KR |
200152632 | Apr 1999 | KR |
200195437 | Jun 2000 | KR |
200387066 | Jun 2005 | KR |
100869841 | Nov 2008 | KR |
20090088978 | Aug 2009 | KR |
WO 8203099 | Sep 1982 | WO |
WO 9522671 | Aug 1995 | WO |
WO 9955985 | Nov 1999 | WO |
WO 2004111544 | Dec 2004 | WO |
WO 2006123862 | Nov 2006 | WO |
WO 2008098413 | Aug 2008 | WO |
Entry |
---|
U.S. Appl. No. 29/493,206, filed Jun. 6, 2014, Larson. |
U.S. Appl. No. 29/547,874, filed Dec. 8, 2015, Larson. |
U.S. Appl. No. 15/185,576, filed Jun. 17, 2016, Bordin. |
U.S. Appl. No. 29/573,009, filed Aug. 2, 2016, Bordin. |
“5 Facts You May Not Know About Heated Flooring,” southcypress.com, Sep. 12, 2015, 4 pages [retrieved Aug. 3, 2016 from: https://web.archive.org/web/20150912220312/http://www.southcypress.com/v3/articles/heated-flooring.htm]. |
“Ditra Heat,” GlensFalls Tile & Supplies, Sep. 4, 2014, 1 page [retrieved Aug. 3, 2016 from: http://www.glensfallstile.com/general-tips/ditra-heat/772/]. |
“Illustrated price list BT 7,” Schlüter-Systems KG, Dec. 7, 28 pages. |
“Wall Skimmer Octagonal Nut (on-line),” National Pool Wholesalers, dated Aug. 12, 2012, 1 page [retrieved from Internet Nov. 18, 2016, URL: https://web.archive.org/web/20120812084211/http://www.nationalpoolwholesalers.com/_Wall_Skimmer_Octagonal_Nut_--SKU_PWSP17BUW.html]. |
Polypipe Brochure; “Redefining Heating Systems,” www.ufch.com; Polyplumb: Hot & Cold Plumbing & Heating System; © 2006, Polypipe Group; Printed: Feb. 2007, 44 pages. |
Schluter Systems, Profile of Innovation, Illustrated Price List, Jan. 1, 2008, 2 pages. |
International Search Report and Written Opinion for International (PCT) Patent Application No. PCT/US2015/045688, dated Nov. 12, 2015 9 pages. |
International Preliminary Report on Patentability for International (PCT) Patent Application No. PCT/US2015/045688, dated Mar. 2, 2017 8 pages. |
Official Action for U.S. Appl. No. 14/829,108, dated Jan. 20, 2016, 10 pages. |
Third Party Submission for U.S. Appl. No. 14/829,108, mailed Aug. 17, 2016, 17 pages. |
Official Action for U.S. Appl. No. 14/829,108, dated Aug. 18, 2016 5 pages Restriction Requirement. |
Notice of Allowance for U.S. Appl. No. 14/829,108, dated Dec. 21, 2016 7 pages. |
Official Action for U.S. Appl. No. 15/260,848, dated Oct. 11, 2016 10 pages. |
Official Action for U.S. Appl. No. 15/260,848, dated Mar. 17, 2017 11 pages. |
Extended European Search Report for European Patent Application No. 15833528.1, dated Dec. 14, 2017, 14 pages. |
U.S. Appl. No. 15/796,225, filed Oct. 27, 2017, Bordin et al. |
U.S. Appl. No. 15/796,328, filed Oct. 27, 2017, Bordin. |
Official Action for U.S. Appl. No. 15/796,225, dated Dec. 22, 2017 16 pages. |
U.S. Appl. No. 15/648,152, filed Jul. 12, 2017, Larson. |
U.S. Appl. No. 15/647,510, filed Jul. 12, 2017, Bordin. |
Notice of Allowance for U.S. Appl. No. 15/260,848, dated Jun. 2, 2017 7 pages. |
Official Action for U.S. Appl. No. 15/648,152, dated Aug. 11, 2017 10 pages. |
Official Action for U.S. Appl. No. 15/648,152, dated Sep. 20, 2017 16 pages. |
Official Action for U.S. Appl. No. 15/648,152, dated Apr. 18, 2018 12 pages. |
M-D Building Products, Inc.'s Answer to Progress Profiles SPA's Complaint, filed Oct. 23, 2018 (Case No. 5:18-CV-00890-R) 37 pages. |
Notice of Allowance for U.S. Appl. No. 15/648,152, dated Jul. 25, 2018 7 pages. |
Official Action for U.S. Appl. No. 15/796,225, dated Jul. 27, 2018 11 pages. |
Notice of Allowance for U.S. Appl. No. 15/796,225, dated Nov. 5, 2018 5 pages. |
Official Action for U.S. Appl. No. 16/121,232, dated Oct. 9, 2018 10 pages. |
Defendants M-D Building Products, Inc. and Loxcreen Canada Ltd.'s Preliminary Invalidity Contentions, filed Feb. 19, 2019 (Case No. 5:18-cv-00890-R) 202 pages. |
Intention to Grant for European Patent Application No. 15833528.1, dated Oct. 25, 2018 6 pages. |
Official Action for U.S. Appl. No. 16/121,232, dated Feb. 7, 2019 10 pages. |
“Easy Heat”—Genesee Ceramic Tile (on-line), dated Jul. 3, 2017. Retrieved from Internet Aug. 26, 2019, URL: https://web.archive.org/ web/20170703005309/http://gtile.com/product/easy-heat/ (1 page) (Year: 2017). |
“Flächen-Heiz- and Kühlsysteme Systemlösungen für alle Anwendungsbereiche,” Roth Werke Buchenau, as of May 2, 2005, 24 pages [retrieved online from: web.archive.org/web/20050502054722/http:/www.rothwerke.de/daten/Prospekt_FHS.pdf]. |
“Nuheat Membrane Tile Uncoupling & Heating Contractors Direct (on-line),” dated Sep. 25, 2017. Retrieved from Internet Aug. 26, 2019, URL: https://web.archive.org/web/20170925163922/https://www.contractorsdirect.com/nuheat-tile-uncoupling-heating/reviews (2 pages) (Year: 2017). |
“Prodeso heat membrane—uncoupling waterproofing membrane for electric heating (on-line),” no date available. Retrieved from Internet Aug. 26, 2019, URL: https://www.progressprofiles.com/en/membrana-desolidarizzante-e-im-1 (4 pages). |
“Roth Clima Comfort™ System,” Roth, Feb. 27, 2013, 1 page, 39 second mark [retrieved online from: youtube.com/watch?v=QkhUr88McRk]. |
Official Action for Australia Patent Application No. 2015305689, dated Nov. 12, 2019 2 pages. |
Official Action for Canadian Patent Application No. 2,958,571, dated Apr. 12, 2019, 4 pages. |
Notice of Allowance for Canadian Patent Application No. 2,958,571, dated Aug. 6, 2019, 1 page. |
Extended European Search Report for European Patent Application No. 19167867.1, dated May 16, 2019 13 pages. |
Notice of Allowance for U.S. Appl. No. 16/121,232, dated Jun. 21, 2019 5 pages. |
Notice of Allowance for U.S. Appl. No. 16/121,232, dated Jul. 18, 2019 7 pages. |
Official Action for U.S. Appl. No. 16/546,024, dated Oct. 3, 2019 12 pages. |
Notice of Opposition with English Translation for European Patent Application No. 15833528.1, dated Dec. 17, 2019 78 pages. |
Notice of Opposition for European Patent Application No. 15833528.1, dated Jan. 20, 2020 41 pages. |
Notice of Opposition for European Patent Application No. 15833528.1, dated Jan. 20, 2020 51 pages. |
Notice of Opposition for European Patent Application No. 15833528.1, dated Jan. 20, 2020 65 pages. |
Number | Date | Country | |
---|---|---|---|
20170284108 A1 | Oct 2017 | US |
Number | Date | Country | |
---|---|---|---|
62038733 | Aug 2014 | US |