Patent Application
20170364295
The exemplary embodiment(s) of the present invention relates to the field of storage for digital computing systems. More specifically, the exemplary embodiment(s) of the present invention relates to non-volatile memory (“NVM”) storage devices.
With increasing popularity of electronic devices, such as computers, smart phones, mobile devices, server farms, mainframe computers, and the like, the demand for more and faster data is constantly growing. To handle and facilitate voluminous data between such electronic devices, NVM devices are typically required. A conventional type of NVM device, for example, is a flash memory based storage device such as solid-state drive (“SSD”).
One conventional type of NVM SSD is flash memory based SSD which, for example, can be used for an electronic NVM storage capable of maintaining, erasing, and/or reprogramming data. The flash memory can be fabricated with several different types of integrated circuit (“IC”) technologies such as NOR or NAND logic gates with, for example, floating-gate transistors. Depending on the applications, the access to data stored in flash memory can be configured to be units of blocks, pages, words, and/or bytes.
A drawback associated with a typical flash based SSD is that it has structural limitations, limited port configuration, connectivity difficulties, limited power availability, as well as interface limitations.
A method or system capable of providing additional storage capacity using small form-factor (“SFP”) non-volatile memory (“NVM”) solid state drive (“SSD”) with modular to modular configuration is disclosed. A system includes a processing device, SFP auxiliary plug (“SAP”), and power SAP. In one embodiment, the processing device includes multiple SFP sockets operable to provide data communication. The SAP, having a SSD connector and an auxiliary connector, facilitates storing information persistently via NVM. The SSD connector of SAP is used for communicating with the processing device when the SAP is plugged into one of the SFP sockets. The power SAP, having a power connector and a power extension connector, is capable of providing electrical power to the SAP when the power extension connector and the auxiliary connector are coupled or connected.
Additional features and benefits of the exemplary embodiment(s) of the present invention will become apparent from the detailed description, figures and claims set forth below.
The exemplary embodiment(s) of the present invention will be understood more fully from the detailed description given below and from the accompanying drawings of various embodiments of the invention, which, however, should not be taken to limit the invention to the specific embodiments, but are for explanation and understanding only.
Embodiments of the present invention are described herein with context of a method and/or apparatus for providing memory storage using small form-factor pluggable (“SFP”) non-volatile memory (“NVM”) solid state drive (“SSD”) capable of adapting module-to-module linkage.
The purpose of the following detailed description is to provide an understanding of one or more embodiments of the present invention. Those of ordinary skills in the art will realize that the following detailed description is illustrative only and is not intended to be in any way limiting. Other embodiments will readily suggest themselves to such skilled persons having the benefit of this disclosure and/or description.
In the interest of clarity, not all of the routine features of the implementations described herein are shown and described. It will, of course, be understood that in the development of any such actual implementation, numerous implementation-specific decisions may be made in order to achieve the developer's specific goals, such as compliance with application- and business-related constraints, and that these specific goals will vary from one implementation to another and from one developer to another. Moreover, it will be understood that such a development effort might be complex and time-consuming, but would nevertheless be a routine undertaking of engineering for those of ordinary skills in the art having the benefit of embodiment(s) of this disclosure.
Various embodiments of the present invention illustrated in the drawings may not be drawn to scale. Rather, the dimensions of the various features may be expanded or reduced for clarity. In addition, some of the drawings may be simplified for clarity. Thus, the drawings may not depict all of the components of a given apparatus (e.g., device) or method. The same reference indicators will be used throughout the drawings and the following detailed description to refer to the same or like parts.
In accordance with the embodiment(s) of present invention, the components, process steps, and/or data structures described herein may be implemented using various types of operating systems, computing platforms, computer programs, and/or general purpose machines. In addition, those of ordinary skills in the art will recognize that devices of a less general purpose nature, such as hardware devices, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), or the like, may also be used without departing from the scope and spirit of the inventive concepts disclosed herein. Where a method comprising a series of process steps is implemented by a computer or a machine and those process steps can be stored as a series of instructions readable by the machine, they may be stored on a tangible medium such as a computer memory device (e.g., ROM (Read Only Memory), PROM (Programmable Read Only Memory), EEPROM (Electrically Erasable Programmable Read Only Memory), FLASH Memory, Jump Drive, and the like), magnetic storage medium (e.g., tape, magnetic disk drive, and the like), optical storage medium (e.g., CD-ROM, DVD-ROM, paper card and paper tape, and the like) and other known types of program memory.
The term “system” or “device” is used generically herein to describe any number of components, elements, sub-systems, devices, packet switch elements, packet switches, access switches, routers, networks, computer and/or communication devices or mechanisms, or combinations of components thereof. The term “computer” includes a processor, memory, and buses capable of executing instruction wherein the computer refers to one or a cluster of computers, personal computers, workstations, mainframes, or combinations of computers thereof.
One embodiment of the present invention discloses a method or apparatus for configuring or fabricating non-volatile memory (“NVM”) solid state drive (“SSD”) into a small form-factor pluggable (“SFP”) or quad small form-factor pluggable (“QSFP”) memory device. With various existing SFPs and/or QSFP used in switches/routers for network communication, SSD type of storage device can be directly plugged into SFP or QSFP sockets existed in switches and routers. To operate SFP NVM SSD (“SNS”) device, one or more SNS or SFP auxiliary plugs (“SAP”), in one embodiment, are used to facilitate and enhance the capability as well as performance of the device. For example, a network system can be configured to employ one or more SAPs to enhance efficiency of storage capacity offered in a network switch. A network switch which may contain multiple SFP sockets capable of housing one or more SNS devices. Note that each SNS device or SAP contains an Ethernet protocol, a first SSD connector, and a second SSD connector.
It should be noted that the terms “SNS device” and “SAP” are synonymous referring approximately the same device or plug. The terms “SAP” and “SNS plug” can be used interchangeably for the forgoing description.
An SSD with an Ethernet protocol can be configured and/or fabricated in a small form factor such as SFP/QSFP form-factor whereby it can be directly plugged into a network switch fabric for providing multi-terabytes storage space. Depending on the applications, any types of volatile or nonvolatile media such as NAND Flash, DRAM, RRAM, MRAM, and the like can be used. Alternatively, a fixture of NVM devices such as NAND Flash, DRAM, RRAM, MRAM, and phase-changing memory (“PCM”) devices may be plugged into the switch, router, and/or modem. For example, a 10 or 40 gigabits per second (“Gb/s”) standard Ethernet port in a switch may be used for hosting a terabyte SSD using NVM_OE.
In one aspect, one embodiment of the presently claimed invention discloses a mechanism of linking multiple SAPs or SNS plugs together via module-to-module (“MOM”) or plug-to-plug (“POP”) linkage. SAP or SNS plug is a non-volatile SSD fabricated into a small form factor such as SFP or QSFP. With various existing SFPs and/or QSFP ports at switches/routers for network communication, an SAP or SSD type of storage device pluggable to SFP or QSFP ports can be advantageous because such configuration can save space, power consumption, and complexity.
The network system can be a switch or router capable of hosting an SAP or SAPs to expend its storage capacity. Note that each SAP or SFP NVM SSD storage device contains Ethernet protocol, SSD connector, and auxiliary connector.
In one embodiment, a system includes a processing device, SAP, and power SAP, wherein the processing device further includes multiple SFP sockets operable to provide data communication. SAP includes an SSD connector and auxiliary connector and is able to store information persistently via NVM. The SSD connector of SAP is used for communicating with the processing device when the SAP is plugged into one of the SFP sockets. The power SAP, having a power connector and a power extension connector, is capable of providing electrical power to SAP when the power extension connector of power SAP and the auxiliary connector of SAP are coupled or connected.
In operation, upon inserting an SNS plug or SAP into an SFP socket which is capable of facilitating optical communication at a host system, a handshaking process between the host system and the SNS plug, for example, is initiated using an Ethernet based protocol. After activating an NVM internal bus connecting to NVM array to reboot NVM storage blocks, the host system is allowed to see external memory space at the SNS plug.
During operation, a first SSD connector is plugged into one of SFP sockets of the network switch and provides additional storage capacity to the switch. The SFP auxiliary plug, containing a first connector, and a second connector, is inserted or plugged into one of the SFP sockets for providing auxiliary functions, such as, but not limited to, power supply, storage capacity, storage control, and the like. In one example, the first connector draws power from the network switch and the second connector supplies power to a connected SFP NVM SSD storage device. The SFP auxiliary plug can also be used for providing additional storage space when it is coupled with an SFP NVM SSD storage device or network switch. Moreover, the SFP auxiliary plug can also be used for providing memory control, NVM storage management, and the like.
Digital processing system 122, in one example, is a network router which includes multiple ports 128 used for network communications. The network router, for example, includes a group of ports physically configured in small form factor sockets such as SFP or QSFP sockets. Each SFP socket, for instance, includes a connector 130 which is used to electrically couple to connector of a plug. A function of SFP socket, in one example, is to facilitate electrical data storage as well as optical data communication with optical transceiver.
The SFP format is generally relating to small size pluggable transceiver used for data communications. It should be noted that the form factor and electrical interface are standard defined by a multi-source agreement (“MSA”) under the SFF (small form factor) committee. An application of such SFP is to facilitate network communication between optical data and electrical data. For instance, SFP transceivers support various communication methods, such as, but not limited to, SONET, gigabit Ethernet, Fibre Channel, and other communications standards.
SNS plug or SAP 126, in one embodiment, has a front side 120 and back side 124 wherein front side 120 and back side 124 are connected by a printed circuit board (“PCB”) 102. PCB 102, in one aspect, includes a connector 104, memory controller 106, NVM 108, and auxiliary interface or auxiliary connector 110. While connector 104 is used to couple to socket connector or socket contact 130, memory controller 106, also known as controller, includes a host interface module, CPU, buffer, and NVM interface. NVM 108, in one example, includes one or more NVM dies having a storage range from 64 GB to 128 TB. Auxiliary interface 110, in one aspect, is used to provide extended storage capacity. Alternatively, auxiliary interface 110 can also be used to couple to a second SFP plug, secondary power supply, or optical SFP transceiver.
In operation, SNS plug 126 can be inserted into any one of SFP sockets 128 at digital processing system 122 wherein front side 120 of SFP plug 126 enters an SFP socket 128 to reach connector 130. After handshaking initialization between SNS plug 126 and digital processing system 122, digital processing system 122 can access NVM 108 via SNS plug 126. In one example, digital processing system 122 views SNS plug or SAP 126 as a high-speed external storage memory for data storage.
SFP connector 202, in one embodiment, is physically configured so that it can be inserted or plugged into an SFP socket of a digital processing system such as a network router. SFP connector 202, for example, includes multiple pins configured to provide electrical connection to a host computer when the SNS plug is inserted into the SFP socket of host computer. A host computer, for example, can be a switching router containing multiple ports wherein some of these ports are configured to SFP configurations. It should be noted that a network system such as router may contain multiple SFP ports used for optical communication.
SFP connector 202 includes one or more power pins that are used to draw power from the SFP socket of a host for power supply. In one example, the host or digital processing system, which can be a network router, network switch, networking hub, computer, server, or a cluster of routers, switches, hubs, and servers, provides power to SNS plug or SAP via its SFP ports. It should be noted that SFP connector 202 can also be configured to comply with QSFP or XSFP (10 Gigabit SFP) configurations or specifications. A benefit of using an SNS plug or SAP is that it can be directly plugged into an existing SFP or QSFP sockets at a switch or router whereby it takes up minimum space while provides substantial amount of storage capacity.
Controller or memory controller 220, in one aspect, includes multiple modules, such as, but not limited, Ethernet interface 212, flash interface 214, CPU (central processing unit) 222, initiator 224, buffer 226, thermal module 228, power module 230, and clock module 232. A function of memory controller 220 is to manage and facilitate data transmission between NVM 210 and a connected host via connector 202. To facilitate memory management, controller 220, in one embodiment, uses a translation layer such as flash translation layer (“FTL”) to manage and control data access to and from NVM 210.
Ethernet interface 212, also known as host interface or interface module, includes one or more input output (“IO”) modules used for facilitating data transmission between a host and NVM chip(s). For instance, Ethernet interface 212 is able to facilitate high-speed data transfer between a host and NVM dies using Ethernet based protocol such as NVMoE™ (NVM over Ethernet) protocol. Flash interface 214, also known as NVM interface, is an NVM interface module configured to communicate or interface with NVM 210. In one aspect, flash interface 214 and Ethernet interface 212 are coupled in such a way that data can be efficiently transmitted between NVM 210 and a host system via connector 202.
CPU 222 is a digital processor capable of control various operations and functions provided by the SNS plug via execution of instruction. For example, CPU 222 assists controller 220 to perform various SSD operations, such as, but not limited to, storing data persistently, reading data, transmitting data, recycling storage space, and/or organizing storage space using FTL.
Initiator 224, also known as plug initiator, is coupled to CPU 222 and facilitates system reboot function via boot bios. Initiator 224, in one aspect, is responsible for monitoring handshaking process between the SNS plug and the host when the SNS plug is initially plugged into a port of host. The functions of hot plugging and hot unplugging are managed and/or assisted by initiator 224. The handshaking process is a process of negotiating and establishing various communication parameters and channel(s) between two devices such as a router and SNS plug when the two devices are initially connected. Hot plugging or hot unplugging which is also known as hot swapping is a process of replacing or adding components without stopping or shutting down the system with minimum interruption to the normal operation of the system.
Buffer 226, in one aspect, is volatile memory such as DRAM (dynamic random access memory) configured to buffer data during NVM memory access operation. A function of buffer is to enhance NVM efficiency by temporarily storing data before it is being written to NVM permanently.
Thermal module 228 is used to regulate thermal temperature or condition within the SNS plug. For example, thermal module 228 is able to dissipate heat through housing 204 of the SNS plug. The housing 204 can be fabricated with thermal conductive material such as aluminum. Note that the SNS plug can produce a large amount of heat depending on the type of NVM used. Alternatively, thermal module 228 can also shut down certain functions and/or modules in the SNS plug if thermal module 228 detects that the temperature in the SNS plug exceeds a predefined thermal limit. Also, thermal module 228 is configured to communicate with clock module 232 to adjust clock speed based on the thermal conditions. Clock module 232 generates cycles which are fed to other modules such as CPU 222.
Power module 230, in one embodiment, is able to provide power supply to various modules and NVM 210 using power supplied by the host via connector 202. For example, power module 230 is able to draw power from an SFP socket of host and redistributes the power to fulfill power requirements for the SNS plug. Depending on the type of NVM, different power consumption level may be required. It should be noted that several different types of NVM may be used in the SNS plug.
NVM, NVM chip, or NVM die 210, in one example, includes multiple flash based IC dies having a storage capacity between one (1) gigabytes (“GB”) and 64 terabytes (“TB”). NVM 210, in one aspect, is organized in planes, blocks, and pages based on SSD configuration. PCB 208 also includes extension 216 and LED (light emitting diode) module 218. LED module 218 is used to indicate the status of the plug while extension 216 is used to provide additional connections. In one aspect, extension 216 which can be circuit or component is configured to facilitate auxiliary interface or auxiliary connection.
The SNS plug or SAP, in one aspect, is an NVM SSD using Ethernet based protocol, such as NVMoE for providing additional data storage to existing apparatus via connectors such SFP and/or QSFP. For example, the SNS plug is configured and/or integrated into an SFP/QSFP form-factor whereby it can be directly plugged into a network switch fabric for providing multi-terabytes storage space. Depending on the applications, any types of volatile or nonvolatile media such as NAND Flash, DRAM, RRAM, MRAM, and the like can be used. For example, a 10-to-40 gigabits per second (“Gb/s”) Ethernet port in a switch may be occupied by an SNS plug configured in small form-factor to provide a terabyte storage space using Ethernet based protocol.
An advantage of using an SAP or SNS plug is that it provides additional storage space to an existing port at the host with minimum space requirement.
Memory SAP or SNS plug 252, in one embodiment, contains a PCB 278 housing multiple banks of NVM 270-272, extension or auxiliary connector 276, and SFP connector 202. A function of memory SAP 252 is to provide storage capacity. However, memory SAP 252, in one aspect, requires a MOM linkage to a control SAP for managing its NVM banks. MOM or POP linkage, in one example, is a cable configured to physically link two or more SAPs via the auxiliary or extension connectors.
Power SAP or SNS plug 256, in one embodiment, includes a PCB 288 housing an auxiliary or extension connector 286, power management 280, and SFP connector 202 wherein SFP connector 202, in one embodiment, is able to couple to a power outlet situated nearby the host system. For example, a power source on the back panel of the system or on the wall adjacent to the system. Power management 280 includes a flash interface 284 and Ethernet interface 282. Flash interface 284 is used to couple to other SAP for providing power via extension 286 as a secondary or auxiliary power supply.
NVM memory device such as a flash memory package 402 contains one or more flash memory dies or LUNs wherein each LUN or die 404 is further organized into more NVM or flash memory planes 406. For example, die 404 may have a dual planes or quad planes. Each NVM or flash memory plane 406 can include multiple memory blocks or blocks. In one example, plane 406 can have a range of 1000 to 8000 blocks 408. Each block such as block 408 can have a range of 64 to 512 pages. For instance, a flash memory block can have 256 or 512 pages 410.
A flash memory page, for example, can have 8 KBytes or 16 KBytes of data plus extra redundant area for ECC parity data to be stored. One flash memory block is the minimum unit of erase. One flash memory page is the minimum unit of program. To avoid marking an entire flash memory block bad or defective which will lose anywhere from 256 to 512 flash memory pages, a page removal or decommission can be advantageous. It should be noted that 4 Megabytes (“MB”) to 16 MB of storage space can be saved to move from block decommissioning to page decommissioning.
Note that based on flash memory characteristics, a relatively small number of flash memory pages can usually be defective or become bad or unusable when the flash memory page PE (program erase) cycles, for example, are getting higher. For example, the bad page during program or read operation of that flash memory page can be discovered. A bad page can also be discovered if that page has much higher read errors during the normal read work load. A bad page can be further discovered when that page is bad and other pages in the same block are good.
SAP or SNS plug is configured in small form factor (“SFF”) connectors which offer high-speed, physical compactness, and the versatility of utilizing existing networking sockets for storage. For example, such SFF connectors are used by switches and routers for transmitting electrical as well as optical information. An advantage of using SAP is hot-swappable.
SFP module 508, which could be part of FTL 584, is configured to implement and/or facilitate SSD functions in the SNS plug. For example, SFP module 508 is responsible to communicate with host(s) using small form factor connection. Also, SFP module 508 facilitates the handshaking process between SNS plug and host upon initial connection.
Storage device 583, in one example, is flash based NVM containing multiple arrays of flash memory cells for storing data persistently. The flash memory, which generally has a read latency less than 200 microseconds (“μs”), is organized in blocks and pages wherein a minimum access unit, for example, can be set to four (4) kilobyte (“Kbyte”), eight (8) Kbyte, or sixteen (16) Kbyte memory capacity depending on the flash technologies. To simplify forgoing discussion, a four (4) Kbyte page or flash memory page (“FMP”) is used.
Referring back to
FTL 584, which may be implemented in DRAM, includes a FTL database or table that stores mapping information. For example, the size of FTL database is generally a positive proportion to the total storage capacity. For instance, one way to implement the FTL in SSD is that it uses a DRAM size that approximately equals to 1/1000 of SSD capacity. Since each page has a 4-Kbyte capacity and each entry of FTL database has a 4-byte capacity of entry, the size of FTL database can be calculated as SSD capacity/4 KByte*4 Byte (SSD capacity/1000) which is approximately 1 over 1000 (or 1/1000).
In operation, upon receipt of data input or data packets 502, FTL 584 maps LBA to physical page address (“PPA”) in storage device 583. After identifying PPA, write circuit 587 writes the data from data packets 582 to a page or pages within a block pointed by PPA. In one aspect, MNS 508 allocates or divides storage space into basic storage units wherein the storage capacities for the basic storage units are essentially the same or similar. Based on the incoming command, one or more basic storage units can be assigned or allocated to one NSID.
It should be noted that storage device 583 can also include NAND flash memory, NOR flash memory, phase change memory (“PCM”), nano random access memory (“NRAM”), magneto-resistive RAM (“MRAM”), resistive random-access memory (“RRAM”), programmable metallization cell (“PMC”), magnetic storage media (e.g., hard disk, tape), optical storage media, or the like. To simplify the forgoing discussion, the flash memory or flash memory based SSD is herein used as an exemplary NVM or NV storage device.
SAP 712 includes PCB 716, auxiliary connector 722, and SFP connector 726, wherein PCB 716 houses multiple chips or components 706. Chips 706 include, but not limited to, NVM dies, controller, power management, buffer, and/or the like. Similarly, SAP 714 includes a PCB 718, auxiliary connector 724, and SFP connector 728, wherein PCB 718 houses multiple chips or components 706. SFP connectors 726-728 of SAPs 712-714, in one example, are pluggable to SFP sockets or ports located at a system, not shown in
SAPs 712-714, in one example, are coupled or linked by an MOM or POP cable 720 via auxiliary connectors 722-724. SAP 712 is configured to supply power to neighboring SAP or SAPs such as SAP 714 via a flexible MOM cable 720. Alternatively, SAP 712 can supply additional memory capacity to SAP 714 or module B. In yet another embodiment, SAP 712 can be configured to provide memory control or management to SAP 714. Furthermore, SAP 712 can also be configured to supply power, storage, and/or control to SAP 714.
SAP 712, in one example, is a power delivery or secondary power supply plug wherein the physical dimension of SAP can be QSPF, SFP, or SFP+. For example, SAP 712 is an active QSPF containing SOC (system on chip), NAND Flash, and Power subsystem. The SOC can be referred to as ASIC (application-specific integrated circuit) chip configured to provide logic functions such as memory controller or system communication. SAP 714 as module B is a passive QSPF for providing extra storage capacity accessed by nearby or neighboring SAPs.
An advantage of using SAP is that it can manage per port power consumption associated with a connected switch or system. Also, SAP enhances overall system performance by supply additional high-speed storage capacity. Moreover, a power SAP is able to redistribute power to various connected SAPs by drawing power from one area of the plugged system and subsequently redistributing the power to nearby SAPs. Depending on the material of MOM cable 720, it can facilitate dissipating heat generated by SAP(s).
In one embodiment, an SAP or SNS plug such as SAP 712 or 714 is configured to provide high-speed storage, memory controller/management, status monitor, power consumption, power distribution, port management, or a combination of storage, control, monitor, and power management. To provide storage persistently, an SAP such as SAP 714 is configured to manage and store information using onboard NVM chips. In one aspect, the SAP includes a memory controller which is capable of managing various different types of NVM in one or more SAPs.
Alternatively, SAP 712 can be used to provide secondary power to SAP 714 for boosting power requirement associated with SAP 714 while keeping the power consumption at each port operating within predefined limits. It should be noted that power delivery from secondary SAP such as SAP 712 to primary SAP such as SAP 714 can be implemented using flexible PCB which is latched to both modules using connector plug & hold mechanism. In one embodiment, a power SAP also includes a power loss protection (“PLP”) circuit capable of providing backup power during unplanned power loss either due to module hot unplug or sudden power loss.
A control SAP such as SAP 712, in one example, is used to manage one or more nearby SAPs including, but not limited to, memory SAPs, power SAPs, and/or other control SAPs. The control SAP includes ASIC or SOC configured to provide memory control and/or management, and it is capable of performing data transfer to and from the storage device over native or non-native Ethernet implementation.
SAPs and MOM cables, in one embodiment, are used to manage thermal conditions. For example, an MOM cable such as cable 720 for power delivery may be coated with special heat dissipation material so that it can act as a heat sink. Heat generated within the active module can be dissipated via thermal contact and/or heat spreader tapes.
An advantage of using SAPs with MOM linkage is that it simplifies device connection by minimizing inter-module cablings whereby air flow between modules or plugs can be enhanced.
Module A, in one embodiment, is an active module containing ASIC, power subsystem, and primary flash device, while modules B/C/D are pseudo active module with secondary flash modules and power delivery. In one example, module A includes storage unit, control unit (ASIC), and power unit wherein its auxiliary connector couples to MOM cable 820 or cable A for power or storage expansion. Module B, in this example, is a memory SAP capable of providing additional storage capacity to the attached system. Module C, in one example, can be a power SAP capable of supplying power to module B and/or module D. It should be noted that the configuration of MOM linkage scheme addresses limitations of per module power consumption which allows obtaining additional power from neighboring SAPs or modules whereby a seamless expansion of storage can be achieved with neighboring as well as pseudo active modules/plugs.
Diagram 802 illustrates an interconnection configuration of SAPs to address storage expansion, directional expansion, and storage control. For example, modules can be near neighbors or far neighbors and layout in horizontal or vertical direction. The retime and redrive can be embedded on interconnect itself with latest fabrication and design technology. The communication between modules or SAPs can be master-slave configuration or a daisy chain format.
Diagram 1002 is a 3D diagram of 4-SAP module 1008 which is similar to 4-SAP module illustrated in diagram 1000. Diagram 1002 includes 4-SAP module 1008 and digital processing system 122 wherein system 122 further includes 3-by-3 (nine) SFP sockets or ports 1020-1036. 4-SAP module 1008, in one embodiment, includes four SAPS 1054-1060 wherein the auxiliary connectors of SAP 1054-1060 are coupled to base module 1050. SFP connectors 1010-1016 of SAP 1054-1060 are configured to be pluggable to SFP sockets 1020, 1024, 1032, and 1036. It should be noted that base module 1052 can be reconfigured so that SFP connectors 1010-1016 can connect to any of the four of SFP sockets 1020-1036. Base module 1052, in one aspect, includes a memory controller situated in ASIC 1052. Base module 1050, in one embodiment, provides a linkage function capable of linking SAPs 1054-1060 to facilitate SAPs 1054-1060 working in concert to perform sophisticated tasks.
In one aspect, 4-SAP module 1008 is able to perform various different types of tasks, such as channel expansion, ports combining, power supply, memory control, and storage capacity. Channel Expansion on a switch device, for example, can increase throughput and performance of network communication. Combining ports can expand channels for enhancing device or module communication.
Bus 1111 is used to transmit information between various components and processor 1102 for data processing. Processor 1102 may be any of a wide variety of general-purpose processors, embedded processors, or microprocessors such as ARM® embedded processors, Intel® Core™ Duo, Core™ Quad, Xeon®, Pentium™ microprocessor, Motorola™ 68040, AMD® family processors, or Power PC™ microprocessor.
Main memory 1104, which may include multiple levels of cache memories, stores frequently used data and instructions. Main memory 1104 may be RAM (random access memory), MRAM (magnetic RAM), or flash memory. Static memory 1106 may be a ROM (read-only memory), which is coupled to bus 1111, for storing static information and/or instructions. Bus control unit 1105 is coupled to buses 1111-1112 and controls which component, such as main memory 1104 or processor 1102, can use the bus. Bus control unit 1105 manages the communications between bus 1111 and bus 1112. Mass storage memory or SSD 106, which may be a magnetic disk, an optical disk, hard disk drive, floppy disk, CD-ROM, and/or flash memories are used for storing large amounts of data.
I/O unit 1120, in one embodiment, includes a display 1121, keyboard 1122, cursor control device 1123, and communication device 1125. Display device 1121 may be a liquid crystal device, cathode ray tube (“CRT”), touch-screen display, or other suitable display device. Display 1121 projects or displays images of a graphical planning board. Keyboard 1122 may be a conventional alphanumeric input device for communicating information between computer system 1100 and computer operator(s). Another type of user input device is cursor control device 1123, such as a conventional mouse, touch mouse, trackball, or other type of cursor for communicating information between system 1100 and user(s).
Communication device 1125 is coupled to bus 1111 for accessing information from remote computers or servers, such as server 104 or other computers, through wide-area network 102. Communication device 1125 may include a modem or a network interface device, or other similar devices that facilitate communication between computer 1100 and the network. Computer system 1100 may be coupled to a number of servers via a network infrastructure such as the Internet.
The exemplary embodiment of the present invention includes various processing steps, which will be described below. The steps of the embodiment may be embodied in machine or computer executable instructions. The instructions can be used to cause a general purpose or special purpose system, which is programmed with the instructions, to perform the steps of the exemplary embodiment of the present invention. Alternatively, the steps of the exemplary embodiment of the present invention may be performed by specific hardware components that contain hard-wired logic for performing the steps, or by any combination of programmed computer components and custom hardware components.
At block 1204, a handshaking process between the digital processing system and the SNS plug is initiated using Ethernet based protocol.
At block 1206, an NVM internal bus connecting to NVM array is activated for rebooting NVM storage blocks and drawing power from a secondary power supply via an auxiliary connector of the SFP NVM SNS plug.
At block 1208, the digital processing system is able to see its available external memory associated with the SFP NVM SNS plug or SAP. In one embodiment, upon inserting a power SFP auxiliary plug into an SFP socket at a digital processing system for providing the secondary power supply, the process is able to draw power by the power SFP auxiliary plug from a power supply pin at the SFP socket for power redistribution to the SPF NVM SNS plug.
While particular embodiments of the present invention have been shown and described, it will be obvious to those of ordinary skills in the art that based upon the teachings herein, changes and modifications may be made without departing from this exemplary embodiment(s) of the present invention and its broader aspects. Therefore, the appended claims are intended to encompass within their scope all such changes and modifications as are within the true spirit and scope of this exemplary embodiment(s) of the present invention.
This application claims the benefit of priority based upon U.S. Provisional Patent Application having an application Ser. No. 62/350,606, filed on Jun. 15, 2016, and having a title of “Method and Apparatus for Providing Small Form-Factor Pluggable (“SFP”) Auxiliary Plugs,” which is hereby incorporated by reference in its entirety.
| Number | Date | Country | |
|---|---|---|---|
| 62350606 | Jun 2016 | US |
