Claims
- 1. A method for securing a first aluminum piece to a second aluminum piece, the first aluminum piece is a metallic substrate and the second aluminum piece is a metallic housing, the method comprising the steps of:firing a first solderable coating to an edge of the first aluminum piece; firing a second solderable coating to a portion of the second aluminum piece; joining the first aluminum piece to the second aluminum piece to form a joint at the first solderable coating and the second solderable coating; applying a solder to the joint; solder bonding the first aluminum piece to the second aluminum piece to provide a hermetic seal at the joint.
- 2. The method of claim 1 wherein the step of firing the first solderable coating to the edge of the first aluminum piece includes firing a high temperature processed glass filled ink.
- 3. The method of claim 1 wherein the step of firing the second solderable coating to the portion of the second aluminum piece includes firing a high temperature processed glass filled ink.
- 4. The method of claim 1 wherein the step of applying the solder to the joint includes applying a solder paste.
- 5. The method of claim 4 wherein the step or solder bonding the first aluminum piece to the second aluminum piece includes reflowing the solder in a reflow oven.
- 6. The method of claim 1 further comprising the step of applying an electrically insulating layer to the first aluminum piece and the second aluminum piece prior to the step of firing a first solderable coating and firing a second solderable coating.
- 7. A method for securing a metallic substrate to a metallic housing, the method comprising the steps of:firing a first solderable coating to an edge of the metallic substrate; firing a second solderable coating to a groove of the metallic housing; joining the edge of the metallic substrate to the groove of the metallic housing to form a joint at the first solderable coating and the second solderable coating; applying a solder so joint; solder bonding the metallic substrate to the metallic housing to provide a hermetic seal at the joint.
- 8. The method of claim 7 wherein the metallic substrate and the metallic housing are made of aluminum.
- 9. A The method of claim 7 wherein the step of firing the first solderable coating to the edge of the metallic substrate includes firing a high temperature processed glass filled ink.
- 10. The method of claim 7 wherein the step of firing the second solderable coating to the groove of the metallic housing includes firing a high temperature processed glass filled ink.
- 11. The method of claim 7 wherein the step of applying the solder to the joint includes applying a solder paste.
- 12. The method of claim 11 wherein the step of solder bonding the metallic substrate to the metallic housing include reflowing the solder in a reflow oven.
- 13. The method of claim 7 further comprising the step of applying an electrically insulating layer to the metallic substrate and the metallic housing prior to the step of firing a first solderable coating and firing a second solderable coating.
CROSS-REFERENCE TO RELATED APPLICATION
This application is related to the following co-pending and commonly assigned patent application, which is hereby incorporated by reference herein: application Ser. No. 10/103,084, entitled “Method and Apparatus for Securing an Electrically Conductive Interconnect Through a Metallic Substrate,” filed on same date herewith, by Stanton F. Rak and Ying Wang, attorney's docket number AP01992.
US Referenced Citations (39)
Foreign Referenced Citations (1)
Number |
Date |
Country |
0 411 551 |
Jul 1990 |
EP |