Method and apparatus for sensing the force with which a button is pressed

Information

  • Patent Grant
  • 7721609
  • Patent Number
    7,721,609
  • Date Filed
    Friday, March 31, 2006
    18 years ago
  • Date Issued
    Tuesday, May 25, 2010
    14 years ago
Abstract
Disclosed is an apparatus for sensing a force, comprising an actuator having a conductive deformable surface, a substrate having a first conductive trace and a second conductive trace, a housing coupled to the actuator and to the substrate, holding the actuator in proximity to the substrate, and a circuit for measuring a capacitance value.
Description
TECHNICAL FIELD

The present invention relates generally to electronic circuits and in particular to circuits for sensing force.


BACKGROUND

Force-sensing buttons have found recent widespread use in human interface devices such as gamepads for the entertainment consoles like the Sony PlayStation™ and Microsoft Xbox™. A conventional gamepad 100 is shown in FIG. 1. The conventional gamepad 100 comprises a housing 110, having four force-sensing triggers 120, a D-pad 130 with four force sensing buttons controlled by a left hand, four force sensing buttons 140 controlled by a right hand, and two thumbsticks 150 controlled by thumbs. The force sensing buttons comprise electronic force sensing actuators (in which the force applied to a button is sensed, rather than the binary state of a button) to provide variable force inputs to the console. In this conventional gamepad, there are twelve force sensing buttons/actuators. Typically each force sensing button/actuator output is translated in a six or eight bit value representing the force applied.


One conventional implementation for a force sensing actuator is the use of a force sensing resistor, such as those sold by Interlink Electronics (cited in information disclosure statement). However the force sensing resistor solution is too expensive for many applications where cost is an important factor. Many purchasers of gamepads and other consumer products are very price sensitive, so having a low manufacturing cost is important.


Another lower cost conventional implementation (which has been adopted by many gamepad manufacturers) is to use a resistive track printed on a printed circuit board (PCB). Printed circuit boards typically comprise a substrate, with one or more layers of copper traces on the surface or sandwiched between layers of substrate. To prevent corrosion and to prevent short circuits, the copper traces are coated with a thin film of “solder resist” except at the locations of pads or holes where components are to be soldered to the copper traces. In some cases, the copper traces may be gold plated.


In some cases, PCBs also contain resistive carbon traces printed on one or both sides of the PCB. The resistivity of such traces may vary between a few ohms/square and several kilo ohms/square. Such carbon traces may be used for a variety of purposes, including preventing corrosion of exposed copper contacts and to implement a variable resistance in combination with an external actuator or wiper.


The cost of a PCB is determined primarily by its area, the type of substrate material used, the number and size of holes in the PCB, and the number of layers of copper traces. The minimum width of the traces, and the minimum distance between traces also may significantly affect PCB cost, but the number of traces, or the percentage of the area of the PCB that is covered in copper are not significant factors affecting the cost of a PCB.



FIG. 2 shows a conventional actuator button 200 such as one used in a gamepad or other control device. The button has a carbon-impregnated domed rubber actuator, which makes contact with a resistive carbon PCB track. As the button is pressed harder, the rubber dome deforms, progressively shorting out more of the printed carbon PCB track, reducing the end-to-end resistance of the track, as shown in FIG. 2.


When the button is in the ‘rest’ position 210, it is not in contact with a carbon track 250, and resistive value of the track is shown as the resistor representation 260. When the button is gently pressed it goes to position 220, where the tip of the dome contacts the carbon track 250, and shorts across a small portion of the track 250. This is visible as the ‘shorted out’ portion of the resistor representation 265. When the button is pressed more firmly as shown in position 230, the tip of the dome deforms to become flatter and shorts out a larger portion of the track 250. This is visible as the wider ‘shorted out’ portion of the resistor representation 270. Finally, if the button is pressed hard as shown in position 240, the tip of the dome deforms to become quite flat and shorts out a much wider portion of the track 250, such that almost the entire track 250 is shorted out. This is visible as the widest ‘shorted out’ portion of the resistor representation 275.


The arrows in the drawing show the portion of the track which is not shorted out, and which is therefore resistive. The area between the arrows shows the area of the track which is shorted out. It can therefore be seen that as the rubber button is pressed harder, more of the track is shorted out, and the total resistance between the 2 ends of the track is reduced. The resistive track usually has a total resistance of a few kilo ohms, while the resistance of the conductive coating on the bottom of the rubber button is typically a few ohms at most. The resistance may be measured by placing a second resistor (for example 10K Ohms) in series with it to form a potentiometer, and measuring the output voltage from the potentiometer using an analog to digital converter (ADC).


This conventional actuator button and resistive track of FIG. 2 is somewhat less accurate than the force sensing resistor (FSR) approach, and has lower linearity. The main reason for the lower accuracy and non-linearity of the conventional actuator button and resistive track is the difficulty in printing a resistive track with a consistent resistivity along its length, and consistent resistivity from printed track to printed track. It is difficult to accurately control the thickness of the printed trace in a mass manufacturing process. However, absolute accuracy and linearity may not be important in many applications, and with calibration it is possible to give reasonably consistent results. Firmware may be used to calibrate for the non-linearity and also to calibrate for the changes in resistance as the rubber dome wears out with use. However, while the conventional actuator button and resistive track solution is less expensive than a force sensing resistor, it still costs several cents for each printed resistive trace on the PCB, and such costs can be significant in a consumer product with many force-sensing buttons (for example twelve buttons in the example of FIG. 1).



FIG. 3 shows a disassembled conventional gamepad 300, with resistive carbon traces 310, and conductive rubber dome actuators 320.



FIG. 4 shows a printed circuit board layout 400 of the conventional gamepad. The layout 400 shows resistive carbon printed traces 410, PCB traces 420, and solder resist (in this case blue, generally green in color) 430.


It would be desirable to have a less expensive force sensing button. A preferred force sensing button would be “free” (apart from the cost of the actuator itself) and provide linear sensing of force, with absolute accuracy that was consistent after calibration (low drift).





BRIEF DESCRIPTION OF THE DRAWINGS


FIG. 1 illustrates a conventional gamepad device.



FIG. 2 illustrates a conventional actuator button.



FIG. 3 illustrates a disassembled conventional gamepad.



FIG. 4 illustrates a printed circuit board layout of the conventional gamepad layout.



FIG. 5 illustrates a side view of an improved force sensing actuator.



FIG. 6 illustrates a plan view of an improved force sensing actuator



FIG. 7 illustrates an alternative embodiment of the improved force sensing actuator.



FIG. 8 illustrates another embodiment of the improved force sensing actuator.



FIG. 9 illustrates another alternative embodiment of the improved force sensing actuator



FIG. 10 illustrates another alternative embodiment of the improved force sensing actuator





DETAILED DESCRIPTION

Described is a solution for a force sensing actuation that uses the electrical properties of a printed circuit board, together with a conductive-tip actuator as to make a force-sensing button at extremely low cost.



FIG. 5 shows a side view 500 of the improved solution. The improved solution comprises a rubber actuator dome 510 which has a conductive layer (in one embodiment carbon) on the surface. In another embodiment, the entire actuator dome could be formed of conductive flexible material, or be impregnated with conductive material. The rubber actuator dome 510 is positioned above a PCB substrate 530. A conductive layer 550 is formed on the PCB substrate 530, and an insulating solder resist layer 520 is formed over the conductive layer 550. In one embodiment, the conductive layer 550 is a PCB trace comprising copper or an alloy thereof. A trace 540 is formed on a lower layer or on the opposite side of the PCB from the conductive layer 550 and the solder resist 520. The trace 540 is electrically isolated (i.e. not shorted to) from the conductive layer 550, the trace 540 forms a contact 545 on the PCB on the same side as the solder resist 520. The contact 545 is not fully covered by solder resist 520, such that any conducting material pressed down onto the top surface of the substrate will make electrical contact with contact 545. In another embodiment the contact 545 is exposed (i.e. there is no solder resist over it).



FIG. 6 shows a plan view 600 of the arrangement of FIG. 5. Plan view 600 shows the PCB trace 550 (in one embodiment in a circular shape, but could have any shape). Located between the edges of the PCB trace is the contact 545. In one embodiment this may be located approximately in the center of the PCB trace 550. Trace 540 is shown as a dotted line, this trace will be electrically connected to the rubber actuator dome 510 (which is not shown in the plan view) when the dome is pressed into contact with the substrate. Trace 560 is the trace from the lower electrode which is coupled to conductive PCB trace 550.


The actuator 510 is formed of, impregnated with or coated with a conductive material with a low resistivity, for example carbon. The rubber actuator dome may be the same type as used in conventional solutions. Solder resist is commonly used to coat the copper traces of a PCB to protect it from short circuits and oxidation and is of relatively uniform thickness and reasonably constant relative permitivity, with a value of approximately 4 in one example.


The value of the capacitance between two parallel plates is calculated as the permitivity of the material between the plates (the dielectric) multiplied by the overlapping area of the two plates, divided by the distance between the plates. Permitivity is commonly specified as two parts the permitivity of free space (epsilon-0 or E0) and the relative permitivity of a particular material (gas, liquid, solid) known as epsilon-r or Er. Thus, the permitivity (epsilon) is E0*Er.


A capacitor may be formed by the combination of a copper trace 550 (which acts as a lower plate), the solder resist 520 (which acts as a dielectric) and the conductive (e.g. carbon-printed) rubber actuator dome (which acts as an upper plate). As the actuator 510 is pressed down onto the PCB it will make contact with trace 540 through contact 545; as the actuator is pressed down with greater force, it will deform and a greater area of the conductive button will come into close proximity with the lower plate 550, thus increasing the capacitance between plate 550 and trace 540. A circuit on the board can be used to measure this capacitance. The output to be measured is a frequency that varies with capacitance. One example of such a circuit used to measure capacitance is a relaxation oscillator; this and other circuits for accurately measuring or detecting small changes in capacitance will be familiar to one skilled in the art. A processing element may read the output of this circuit and thus infer the force with which the button is being pressed.


The shape of the conductive trace 550 or the solder resist 520 can be varied while preserving the function of the invention. In order to maximize the capacitance between the actuator 510 and the trace 550, the trace 550 should generally cover the full area of contact of the actuator with the substrate when pressed with maximum force. In various configurations, the shape could be circle, square, rectangle, triangle, or any combination of these or other shapes. The shape could have 1, 2, 3, 4, 5, 6, 7, 8, 9, 10 or more sides, depending on how PCB layout software implements the conductive trace. PCB design/layout software may approximate a circular shape with a many sided shape, as true curves may be difficult to implement in PCB layout software. The conductive trace 550 may completely surround the contact 545, or may partially surround (such as a horseshoe shape) the contact 545. The conductive trace 550 may also be formed as a plurality of pieces (such as a pie chart shape) surrounding or partially surrounding the contact 545. The contact 545 may be located somewhere inside the limits of trace 520; generally the contact 545 should be located at or close to the point on the substrate where the actuator first touches the PCB, i.e. where the actuator touches when pressed with least force.


The improved solution operates in the following manner. In a first step when the actuator 510 is first touched by a user, it touches the sensor contact 545 which connects the actuator dome 510 to trace 540. In one example, trace 540 may be connected to electrical ground, such that dome 510 becomes grounded when it touches contact 545. This creates a small capacitance between the trace 550 and a ground voltage coupled to trace 540 and contact 545. In a second step when the actuator is pressed more firmly it deforms and approaches a wider surface of the trace 550 causing the capacitance between trace 550 and electrical ground to increase. In a third step, a circuit measures the capacitance. In a fourth step a microcontroller samples the circuit output and determines the capacitance value. In a fifth step, a digital representation of that capacitance value is generated. In one embodiment, this digital representation may be a six bit or eight bit value.



FIG. 7 shows an alternative embodiment 700 of the improved solution. In the embodiment 700 a first trace 710 is formed in close proximity to a second trace 720. Second trace 720 is coupled to ground. The traces 710 and 720 are electrically isolated, i.e. they are not shorted out. A layer of solder resist may be used to cover traces 710 and 720. The actuator 510 in combination with the first trace 710 and second trace 720 and solder resist 520 form a three plate capacitor, with two plates 710 and 720 side by side and the actuator acting as the third plate. In this embodiment the actuator does not make DC contact with either plates, allowing easier mechanical alignment during manufacturing, but may reduce the possible capacitance between the plates. Trace 710 is coupled to the measurement device 730.



FIG. 8 shows a further alternative embodiment 800 of the improved solution. In the embodiment 800, a first trace 810, a second trace 820 and a third trace 830 are formed. The first trace 810 is larger than either the second trace 820 or the third trace 830. The third trace 830 is coupled to ground. The second trace 820 is coupled to a logic input and the first trace 810 is coupled to the measurement device 730. A layer of solder resist is formed over plate 810, but plates 820 and 830 are not covered by solder resist.


The embodiment 800 operates in the following manner. When the actuator makes contact with the plates 820 and 830, the conductive actuator shorts them out and forms a DC connection to ground between the plates, which is detected by the logic input. Thus, the embodiment 800 forms both a combination switch and force sensing button.


In another alternative embodiment 900 shown in FIG. 9, plate 910 is fully covered with solder resist 520, and plate 920 is fully uncovered. When actuator 510 is pressed against the substrate, the actuator 510 is therefore grounded and, and a 2-plate capacitor is formed by 910 and 510 with solder resist acting as the dielectric.


Another alternative embodiment 1000 is shown in FIG. 10. The embodiment 1000 comprises a first plate 1010, a second plate 1020, and a grounded trace 1030 placed between the first plate and the second plate. First plate 1010 and second plate 1020 are covered in solder resist, but trace 1030 is exposed (i.e. no solder resist). This embodiment 1000 is well suited for implementation on a single side PCB board. In another embodiment, a further trace 1040 is present and located between the first plate 1010 and second plate 1020, where trace 1030 is grounded and trace 1040 is a logic output.


Embodiments of the present invention are well suited to performing various other steps or variations of the steps recited herein, and in a sequence other than that depicted and/or described herein. In one embodiment, such a process is carried out by processors and other electrical and electronic components, e.g., executing computer readable and computer executable instructions comprising code contained in a computer usable medium.


For purposes of clarity, many of the details of the improved force sensing actuator and the methods of designing and manufacturing the same that are widely known and are not relevant to the present invention have been omitted from the following description.


It should be appreciated that reference throughout this specification to “one embodiment” or “an embodiment” means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Therefore, it is emphasized and should be appreciated that two or more references to “an embodiment” or “one embodiment” or “an alternative embodiment” in various portions of this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures or characteristics may be combined as suitable in one or more embodiments of the invention.


Similarly, it should be appreciated that in the foregoing description of exemplary embodiments of the invention, various features of the invention are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure aiding in the understanding of one or more of the various inventive aspects. This method of disclosure, however, is not to be interpreted as reflecting an intention that the claimed invention requires more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive aspects lie in less than all features of a single foregoing disclosed embodiment. Thus, the claims following the detailed description are hereby expressly incorporated into this detailed description, with each claim standing on its own as a separate embodiment of this invention.

Claims
  • 1. A combination force-sensing button and switch, comprising: a first conductive plate having a first shape, wherein the first conductive plate is coupled to a capacitance measuring circuit,wherein an insulating layer is formed on a surface of the first conductive plate,wherein the capacitance measuring circuit is configured to measure a first capacitance value in response to a press on the surface by an actuator having a conductive deformable surface, andwherein a force of actuation is generated in accordance with the measured first capacitance value;a second conductive plate having a second shape, wherein the second conductive plate is coupled to a detection circuit; anda third conductive plate having a third shape, wherein the third conductive plate is coupled to a reference voltage,wherein the first, second, and third conductive plates are electrically isolated from each other and arranged in proximity to one another, andwherein the detection circuit is configured to detect an electrical connection between the second and third conductive plates to indicate a switch activation when the second and third conductive plates are pressed by the actuator,wherein the first shape is a substantially semicircular shape, and wherein the second and third shapes each are a substantially quadrant shape.
  • 2. The combination of claim 1, wherein the first, second, and third conductive plates are mounted on a substrate.
  • 3. The combination of claim 1, wherein the reference voltage comprises a ground.
  • 4. The combination of claim 1, wherein the arrangement of the first, second, and third shapes of the first, second, and third conductive plates, respectively, forms a substantially geometric shape.
  • 5. The combination of claim 4, wherein the geometric shape comprises a circle.
  • 6. The combination of claim 1, wherein an area of the first conductive plate is larger than areas of either the second or third conductive plates.
  • 7. The combination of claim 1, wherein the insulating layer comprises solder resist.
  • 8. The combination of claim 1, wherein the detection circuit is configured to determine whether the actuator is in contact with the second and third conductive plates, and wherein the capacitance measuring circuit is configured to measure capacitance when the actuator is detected as being in contact with the second and third conductive plates.
  • 9. A combination force-sensing button and switch, comprising: a first conductive plate having a first shape, wherein the first conductive plate is coupled to a capacitance measuring circuit,wherein an insulating layer is formed on a surface of the first conductive plate,wherein the capacitance measuring circuit is configured to measure a first capacitance value in response to a press on the surface by an actuator having a conductive deformable surface, andwherein a force of actuation is generated in accordance with the measured first capacitance value;a second conductive plate having a second shape, wherein the second conductive plate is coupled to detection circuit; anda third conductive plate having a third shape, wherein the third conductive plate is coupled to a reference voltage,wherein the first, second, and third conductive plates are electrically isolated from each other and arranged in proximity to one another, andwherein the detection circuit is configured to detect an electrical connection between the second and third conductive plates to indicate a switch activation when the second and third conductive plates are pressed by the actuator,wherein the arrangement of the first, second, and third shapes of the first, second, and third conductive plates, respectively, forms a substantially geometric shape, wherein the geometric shape comprises a circle,wherein the first shape is a substantially semicircular shape, andwherein the second and third shapes each are a substantially quadrant shape.
  • 10. A method of combining button force-sensing and switch activation, comprising: forming an insulating layer on a surface of a first conductive plate having a first shape,arranging the first conductive plate, a second conductive plate having a second shape, and a third conductive plate having a third shape in proximity to each other such that the arrangement of the first, second, and third shapes forms a substantially geometric shape, wherein no insulating layer is formed on the second and third conductive plates,wherein the first, second, and third conductive plates are electrically isolated from each other, andwherein the third conductive plate is coupled to a reference voltage;measuring a first capacitance value in response to a press on the surface of the first conductive plate by an actuator having a conductive deformable surface;determining a force of actuation in accordance with the measured first capacitance value;
  • 11. The method of claim 10, wherein the reference voltage comprises a ground.
  • 12. The method of claim 10, wherein the geometric shape comprises a circle.
  • 13. The method of claim 10, wherein an area of the first conductive plate is larger than areas of either the second or third conductive plates.
  • 14. The method of claim 10, wherein the insulating layer comprises solder resist.
  • 15. The method of claim 10, wherein the step of determining comprises: computing the force of actuation from a magnitude of the measured first capacitance value.
  • 16. The method of claim 10, comprising: determining whether the actuator is in contact with the second and third conductive plates, andmeasuring the first capacitance value when the actuator is determined to be in contact with the second and third conductive plates.
US Referenced Citations (300)
Number Name Date Kind
3922093 Dandliker et al. Nov 1975 A
4054881 Raab Oct 1977 A
4113378 Wirtz Sep 1978 A
4218623 Utagawa Aug 1980 A
4283713 Philipp Aug 1981 A
4438404 Philipp Mar 1984 A
4441123 Ochi Apr 1984 A
4475151 Philipp Oct 1984 A
4497575 Philipp Feb 1985 A
4546347 Kirsch Oct 1985 A
4605308 Hankel et al. Aug 1986 A
4736097 Philipp Apr 1988 A
4751380 Victor et al. Jun 1988 A
4754268 Mori Jun 1988 A
4773024 Faggin et al. Sep 1988 A
4799055 Nestler et al. Jan 1989 A
4802103 Faggin et al. Jan 1989 A
4812635 Kaufmann et al. Mar 1989 A
4814553 Joyce Mar 1989 A
4831325 Watson, Jr. May 1989 A
4876534 Mead et al. Oct 1989 A
4879461 Philipp Nov 1989 A
4920260 Victor et al. Apr 1990 A
4935702 Mead et al. Jun 1990 A
4945305 Blood Jul 1990 A
4953928 Anderson et al. Sep 1990 A
4962342 Mead et al. Oct 1990 A
4988981 Zimmerman et al. Jan 1991 A
5049758 Mead et al. Sep 1991 A
5055827 Philipp Oct 1991 A
5059920 Anderson et al. Oct 1991 A
5059959 Barry Oct 1991 A
5068622 Mead et al. Nov 1991 A
5073759 Mead et al. Dec 1991 A
5083044 Mead et al. Jan 1992 A
5095284 Mead Mar 1992 A
5097305 Mead et al. Mar 1992 A
5101669 Holm-Kennedy et al. Apr 1992 A
5107149 Platt et al. Apr 1992 A
5109261 Mead et al. Apr 1992 A
5119038 Anderson et al. Jun 1992 A
5120996 Mead et al. Jun 1992 A
5122800 Philipp Jun 1992 A
5126685 Platt et al. Jun 1992 A
5146106 Anderson et al. Sep 1992 A
5160899 Anderson et al. Nov 1992 A
5165054 Platt et al. Nov 1992 A
5166562 Allen et al. Nov 1992 A
5204549 Platt et al. Apr 1993 A
5243554 Allen et al. Sep 1993 A
5248873 Allen et al. Sep 1993 A
5260592 Mead et al. Nov 1993 A
5264856 Thurlow Nov 1993 A
5270963 Allen et al. Dec 1993 A
5276407 Mead et al. Jan 1994 A
5288993 Bidiville et al. Feb 1994 A
5289023 Mead Feb 1994 A
5303329 Mead et al. Apr 1994 A
5305017 Gerpheide Apr 1994 A
5324958 Mead et al. Jun 1994 A
5331215 Allen et al. Jul 1994 A
5336936 Allen et al. Aug 1994 A
5339213 O'Callaghan Aug 1994 A
5345527 Lebby et al. Sep 1994 A
5349303 Gerpheide Sep 1994 A
5374787 Miller et al. Dec 1994 A
5381515 Platt et al. Jan 1995 A
5384467 Plimon et al. Jan 1995 A
5391868 Vampola et al. Feb 1995 A
5408194 Steinbach et al. Apr 1995 A
5473344 Bacon et al. Dec 1995 A
5488204 Mead et al. Jan 1996 A
5495077 Miller et al. Feb 1996 A
5534693 Kondo et al. Jul 1996 A
5541878 LeMoncheck et al. Jul 1996 A
5543588 Bisset et al. Aug 1996 A
5543590 Gillespie et al. Aug 1996 A
5543591 Gillespie et al. Aug 1996 A
5555907 Philipp Sep 1996 A
5565658 Gerpheide et al. Oct 1996 A
5565887 McCambridge et al. Oct 1996 A
5566702 Philipp Oct 1996 A
5578813 Allen et al. Nov 1996 A
5606174 Yoshimura et al. Feb 1997 A
5629891 LeMoncheck et al. May 1997 A
5644139 Allen et al. Jul 1997 A
5648642 Miller et al. Jul 1997 A
D382550 Kaneko et al. Aug 1997 S
5661240 Kemp Aug 1997 A
5670915 Cooper et al. Sep 1997 A
D385542 Kaneko et al. Oct 1997 S
5682032 Philipp Oct 1997 A
5703356 Bidiville et al. Dec 1997 A
5729008 Blalock et al. Mar 1998 A
5729009 Dandliker et al. Mar 1998 A
5730165 Philipp Mar 1998 A
5757368 Gerpheide et al. May 1998 A
5760392 Hisamoto et al. Jun 1998 A
5763909 Mead et al. Jun 1998 A
5766829 Cathey, Jr. et al. Jun 1998 A
5767457 Gerpheide et al. Jun 1998 A
5781229 Zediker et al. Jul 1998 A
5786804 Gordon Jul 1998 A
5796183 Hourmand Aug 1998 A
5812698 Platt et al. Sep 1998 A
5825044 Allen et al. Oct 1998 A
5841078 Miller et al. Nov 1998 A
5844265 Mead et al. Dec 1998 A
5854482 Bidiville et al. Dec 1998 A
5854625 Frisch et al. Dec 1998 A
5861583 Schediwy et al. Jan 1999 A
5861875 Gerpheide Jan 1999 A
5864242 Allen et al. Jan 1999 A
5864392 Winklhofer et al. Jan 1999 A
5880411 Gillespie et al. Mar 1999 A
5889236 Gillespie et al. Mar 1999 A
5907152 Dandliker et al. May 1999 A
5914465 Allen et al. Jun 1999 A
5914708 LaGrange et al. Jun 1999 A
5917544 Sobotta et al. Jun 1999 A
5920310 Faggin et al. Jul 1999 A
5923757 Hocker et al. Jul 1999 A
5926566 Wang et al. Jul 1999 A
5942733 Allen et al. Aug 1999 A
5943052 Allen et al. Aug 1999 A
5963197 Bacon et al. Oct 1999 A
5969513 Clark Oct 1999 A
5994710 Knee et al. Nov 1999 A
6014602 Kithil et al. Jan 2000 A
6023422 Allen et al. Feb 2000 A
6028271 Gillespie et al. Feb 2000 A
6028959 Wang et al. Feb 2000 A
6031218 Piot et al. Feb 2000 A
6037643 Knee Mar 2000 A
6057540 Gordon et al. May 2000 A
6097371 Siddiqui et al. Aug 2000 A
6097432 Mead et al. Aug 2000 A
6148104 Wang et al. Nov 2000 A
6151015 Badyal et al. Nov 2000 A
6172354 Adan et al. Jan 2001 B1
6184871 Teres et al. Feb 2001 B1
6185450 Seguine et al. Feb 2001 B1
6188228 Philipp Feb 2001 B1
6188391 Seely et al. Feb 2001 B1
6222528 Gerpheide et al. Apr 2001 B1
6225617 Dandliker et al. May 2001 B1
6233368 Badyal et al. May 2001 B1
6239389 Allen et al. May 2001 B1
6249447 Boylan et al. Jun 2001 B1
6262717 Donohue et al. Jul 2001 B1
6270114 Mai et al. Aug 2001 B2
6280391 Olson et al. Aug 2001 B1
6281881 Siddiqui et al. Aug 2001 B1
6281882 Gordon et al. Aug 2001 B1
6288707 Philipp Sep 2001 B1
6304014 England et al. Oct 2001 B1
6320184 Winklhofer et al. Nov 2001 B1
6323846 Westerman et al. Nov 2001 B1
6326859 Goldman et al. Dec 2001 B1
6326950 Liu Dec 2001 B1
6330057 Lederer et al. Dec 2001 B1
6351257 Liu Feb 2002 B1
6356187 Jinno et al. Mar 2002 B2
6373265 Morimoto et al. Apr 2002 B1
6377009 Philipp Apr 2002 B1
6378381 Okada et al. Apr 2002 B1
6380929 Platt Apr 2002 B1
6380931 Gillespie et al. Apr 2002 B1
6384512 Maeda May 2002 B1
6396479 Gordon May 2002 B2
6414671 Gillespie et al. Jul 2002 B1
6421045 Venkat et al. Jul 2002 B1
6424407 Kinrot et al. Jul 2002 B1
6430305 Decker Aug 2002 B1
6433780 Gordon et al. Aug 2002 B1
6441073 Tanaka et al. Aug 2002 B1
6452514 Philipp Sep 2002 B1
6452683 Kinrot et al. Sep 2002 B1
6455840 Oliver et al. Sep 2002 B1
D464352 Kerestegian Oct 2002 S
6457355 Philipp Oct 2002 B1
6462330 Venkat et al. Oct 2002 B1
6466036 Philipp Oct 2002 B1
6473069 Gerpheide Oct 2002 B1
6476376 Biegelsen et al. Nov 2002 B1
6476970 Smith Nov 2002 B1
6489899 Ely et al. Dec 2002 B1
6498720 Glad Dec 2002 B2
6499359 Washeleski et al. Dec 2002 B1
6504115 Nakai Jan 2003 B2
6522128 Ely et al. Feb 2003 B1
6523416 Takagi et al. Feb 2003 B2
6529184 Julienne Mar 2003 B1
6534970 Ely et al. Mar 2003 B1
6535200 Philipp Mar 2003 B2
6552550 Karray et al. Apr 2003 B2
6570557 Westerman et al. May 2003 B1
6583632 Von Basse et al. Jun 2003 B2
6585158 Norskog Jul 2003 B2
6587093 Shaw et al. Jul 2003 B1
6603111 Dietz et al. Aug 2003 B2
6610936 Gillespie et al. Aug 2003 B2
6621483 Wallace et al. Sep 2003 B2
6624640 Lund et al. Sep 2003 B2
6639586 Gerpheide Oct 2003 B2
6642506 Nahum et al. Nov 2003 B1
6642857 Schediwy et al. Nov 2003 B1
6649924 Philipp et al. Nov 2003 B1
6664948 Crane et al. Dec 2003 B2
6667740 Ely et al. Dec 2003 B2
6673308 Hino et al. Jan 2004 B2
6674475 Anderson Jan 2004 B1
6677929 Gordon et al. Jan 2004 B2
6677932 Westerman Jan 2004 B1
6680731 Gerpheide et al. Jan 2004 B2
6683462 Shimizu Jan 2004 B2
6703599 Casebolt et al. Mar 2004 B1
6705511 Dames et al. Mar 2004 B1
6714817 Daynes et al. Mar 2004 B2
6730863 Gerpheide May 2004 B1
6737636 Dietz et al. May 2004 B2
6741335 Kinrot et al. May 2004 B2
6750852 Gillespie Jun 2004 B2
6774351 Black Aug 2004 B2
6774644 Eberlein Aug 2004 B2
6774915 Rensberger Aug 2004 B2
6781577 Shigetaka Aug 2004 B2
6788221 Ely et al. Sep 2004 B1
6788521 Nishi Sep 2004 B2
6795056 Norskog et al. Sep 2004 B2
6798218 Kasperkovitz Sep 2004 B2
6809275 Cheng et al. Oct 2004 B1
6809403 Gee Oct 2004 B2
6809723 Davis Oct 2004 B2
6819314 Black Nov 2004 B2
6823077 Dietz et al. Nov 2004 B2
6825765 Stanley et al. Nov 2004 B2
6850227 Takahashi et al. Feb 2005 B2
6856433 Hatano et al. Feb 2005 B2
6873203 Latham, II et al. Mar 2005 B1
6888538 Ely et al. May 2005 B2
6893724 Lin et al. May 2005 B2
6903402 Miyazawa Jun 2005 B2
6904570 Foote et al. Jun 2005 B2
6906700 Armstrong Jun 2005 B1
6922063 Heger Jul 2005 B2
6940495 Morimoto et al. Sep 2005 B2
6946853 Gifford et al. Sep 2005 B2
6949811 Miyazawa Sep 2005 B2
6950094 Gordon et al. Sep 2005 B2
6967321 Leong et al. Nov 2005 B2
6969978 Dening Nov 2005 B2
6975123 Malang et al. Dec 2005 B1
6977645 Brosnan Dec 2005 B2
6990867 Okada Jan 2006 B2
7006078 Kim Feb 2006 B2
7019733 Koay Mar 2006 B2
7030782 Ely et al. Apr 2006 B2
7042575 Carlisle et al. May 2006 B2
7050798 Ranta May 2006 B2
7075527 Takagi et al. Jul 2006 B2
7109978 Gillespie et al. Sep 2006 B2
7119550 Kitano et al. Oct 2006 B2
7119552 Morimoto et al. Oct 2006 B2
7122781 Rotzoll et al. Oct 2006 B2
7126585 Davis et al. Oct 2006 B2
7133140 Lukacs et al. Nov 2006 B2
7133793 Ely et al. Nov 2006 B2
7138620 Trisnadi et al. Nov 2006 B2
7141968 Hibbs et al. Nov 2006 B2
7141987 Hibbs et al. Nov 2006 B2
7151528 Taylor et al. Dec 2006 B2
7161682 Xie et al. Jan 2007 B2
7212189 Shaw et al May 2007 B2
7248345 Todoroff et al. Jul 2007 B2
7268341 Lehoty et al. Sep 2007 B2
7288977 Stanley Oct 2007 B2
7298124 Kan et al. Nov 2007 B2
7321359 Xie et al. Jan 2008 B2
7325723 Desjeux Feb 2008 B2
7466307 Trent, Jr. et al. Dec 2008 B2
7499020 Kurashima et al. Mar 2009 B2
20020063688 Shaw et al. May 2002 A1
20020191029 Gillespie et al. Dec 2002 A1
20030058506 Green et al. Mar 2003 A1
20030060218 Billerbeck et al. Mar 2003 A1
20030062889 Ely et al. Apr 2003 A1
20030080755 Kobayashi May 2003 A1
20030091220 Sato et al. May 2003 A1
20030222660 Morimoto Dec 2003 A1
20040160235 Okada et al. Aug 2004 A1
20040169638 Kaplan Sep 2004 A1
20050024341 Gillespie et al. Feb 2005 A1
20050031175 Hara et al. Feb 2005 A1
20050057266 Morimoto Mar 2005 A1
20050083303 Schroeder et al. Apr 2005 A1
20060032680 Elias et al. Feb 2006 A1
20060097991 Hotelling et al. May 2006 A1
20060273804 Delorme et al. Dec 2006 A1
20070126700 Wright Jun 2007 A1
Foreign Referenced Citations (1)
Number Date Country
WO 03003290 Aug 2003 WO
Related Publications (1)
Number Date Country
20070227256 A1 Oct 2007 US