Claims
- 1. A hydrogen detector comprising:
- a substrate;
- a thin film of PdTi metal alloy deposited on said substrate, wherein said PdTi alloy contains between 50 and 99 atomic % Pd and between 1 and 50% Ti, and wherein the PdTi alloy experiences a change in electrical resistance when exposed to hydrogen; and
- electrical circuitry connected to said PdTi thin film, wherein said change in resistance is detected by said electrical circuitry.
- 2. The hydrogen detector according to claim 1, wherein the PdTi alloy experiences a change in resistivity of at least about 5% when exposed to an environment of 10% hydrogen.
- 3. The hydrogen detector according to claim 1, wherein the PdTi alloy experiences a change in resistivity at least 10% when exposed to an environment of 100% hydrogen.
- 4. The hydrogen detector according to claim 1, wherein said thin film of PdTi forms a gate of a metal oxide semiconductor field effect transistor and said electrical circuitry is connected to said MOSFET.
- 5. The hydrogen detector according to claim 1, wherein said thin film of PdTi forms a gate of a Schottky diode structure and said electrical circuitry is connected to said Schottky diode.
- 6. A method of forming a hydrogen detector, comprising the steps of: providing a substrate;
- depositing a thin film of PdTi alloy on the substrate wherein the PdTi alloy contains between 50 and 99 atomic % Pd and between 1 and 50% Ti; and
- connecting electrical circuitry to said thin film of PdTi alloy, whereby change in the resistance in said thin film of PdTi alloy is detected by said electrical circuitry.
- 7. The method according to claim 6, wherein the PdTi alloy experiences a change in resistivity of at least about 5% when exposed to an environment of 10% hydrogen.
- 8. The method according to claim 6, wherein the PdTi alloy experiences a change in electrical resistance of at least 10% when exposed to an environment of 100% hydrogen.
- 9. The method according to claim 6, wherein the thin film of PdTi alloy is deposited by sputtering.
- 10. The method according to claim 9, wherein the PdTi alloy is deposited by separately sputtering Pd and Ti from separate targets.
- 11. The method according to claim 10, wherein the Ti is sputtered at a power of between 25 W and 250 W.
- 12. The method according to claim 11, wherein the Ti is sputtered at a power of between 50 W and 150 W.
- 13. The method according to claim 10, wherein the Pd is sputtered at a power of between 50 W and 450 W.
- 14. The method according to claim 13, wherein the Pd is sputtered at a power of between 75 W and 300 W.
- 15. The method according to claim 14, wherein the Pd is sputtered at a power of between 100 W and 200 W.
- 16. A method for detecting hydrogen and hydrocarbons, comprising the steps of:
- providing a substrate having a thin film of PdTi alloy thereon;
- connecting electrical circuitry to said thin film of PdTi alloy;
- detecting changes in electrical resistance in said PdTi alloy by means of said electrical circuitry to indicate the presence of hydrogen and hydrocarbons.
- 17. The method according to claim 16, wherein the PdTi structure and said electrical circuitry is connected to said Schottky diode.
- 18. The method according to claim 16, wherein the PdTi alloy experiences a change in electrical resistance of at least 5% when exposed to an environment of 10% hydrogen.
Parent Case Info
This is a divisional of application(s) Ser. No. 08/366,645 filed on Dec. 30, 1994, which is now U.S. Pat. No. 5,520,753.
US Referenced Citations (20)
Divisions (1)
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Number |
Date |
Country |
Parent |
366645 |
Dec 1994 |
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