METHOD AND APPARATUS FOR TRAINING MODEL FOR PREDICTING TEMPERATURE RISE OF HEATING ELEMENT IN SWITCHGEAR

Abstract

A method and an apparatus for training a model for predicting a temperature rise of a heating element in a switchgear. The method includes obtaining a model for predicting the temperature rise. The method also includes obtaining n+1 sets of physical quantities in relation to the heating element, each set of physical quantities being collected at a corresponding one of n+1 time points spaced apart from each other by a time step in a normal operation state of the heating element, each set of physical quantities comprising a current and an actual temperature of the heating element and an ambient temperature. The method includes converting the actual temperature in each set of physical quantities into an actual temperature rise based on the corresponding ambient temperature; and training the model with the current, the actual temperature rise and the ambient temperature to determine the several parameters.

Description

FIELD

Example embodiments of the present disclosure generally relate to the field of switchgears, and more specifically, to a method and an apparatus for training a model for predicting a temperature rise of a heating element in a switchgear, a method and an apparatus for determining a temperature rise of a heating element in a switchgear, a computer readable storage medium, and a computer program product.

BACKGROUND

A switchgear is an electrical device in a power system that can achieve on/off, control or protection function during the process of power generation, transmission, distribution, and power conversion. As the use time of the switchgear increases, the conductive connection (such as contacts) in a main circuit of the switchgear may increase its resistance due to mechanical vibration, wear and manufacturing process defects, thereby causing the temperature of the contacts to rise or even burning the contacts. It may cause a safety incident. Moreover, inadequate switchgear on-site installation and component damages are also the main factors that contribute to an anomaly temperature rise τn the switchgear.

A conventional way of detecting such an anomaly temperature rise τs to use a portable infrared device to detect the temperature of the contacts in the switchgear via a viewing window. Then, the detected temperature is compared with a temperature limit value of the contacts under a rating current to judge whether there is the anomaly temperature rise τn the contacts of the switchgear. However, such a detecting method is not always accurate and is inefficient. Recently, an online temperature monitoring system is applied in the switchgear. However, such an online temperature monitoring system mainly focuses on temperature collecting without effective anomaly temperature rise detection.

Thus, there is a need for an improved solution for temperature rise monitoring of the switchgear.

SUMMARY

In view of the foregoing problems, example embodiments of the present disclosure propose a real time regression model for predicting temperature rise of a heating element in the switchgear and a method for detecting anomaly temperature rise of the switchgear. Embodiments of the present disclosure are adaptive to different operating conditions and setups of the switchgear. Embodiments of the present disclosure can reduce the outage time of the switchgear and improve the reliability of the switchgear.

In a first aspect, example embodiments of the present disclosure provide a method for training a model for predicting a temperature rise of a heating element in a switchgear, comprising: obtaining a model for predicting the temperature rise, the model comprising a plurality of inputs, an output, and several parameters to be determined; obtaining n+1 sets of physical quantities in relation to the heating element, each set of physical quantities being collected at a corresponding one of n+1 time points spaced apart from each other by a time step in a normal operation state of the heating element, each set of physical quantities comprising a current and an actual temperature of the heating element and an ambient temperature; converting the actual temperature in each set of physical quantities into an actual temperature rise based on the corresponding ambient temperature; and training the model with the current, the actual temperature rise and the ambient temperature to determine the several parameters.

The proposed model is a modified transient heat balance equation with undetermined thermal and energy parameters. Time constant as a function of temperature rise and dynamic current loads are both taken into consideration when building the model. The model trained by the method according to the first aspect may be used to predict transient or steady state temperature rise under any current load. This model is designed with strong physical constraints and few parameters which could prevent over fitting on most switchgear workloads. With these embodiments, the outage time of the switchgear can be reduced and the reliability of the switchgear can be improved.

In some embodiments, training the model with the current, the actual temperature rise and the ambient temperature comprises: for each time step, creating an equation by using the current, the actual temperature rise and the ambient temperature corresponding to a starting time point of the time step as the inputs of the model and using the actual temperature rise corresponding to an ending time point of the time step as the output of the model, to obtain n equations; and solving the n equations to determine the several parameters. With these embodiments, through plugging the n+1 sets of physical quantities into the model, the n equations can be obtained and solved to determine the several parameters.

In some embodiments, each of the n equations is created by using a discrete approximate scheme or Runge-Kutta iterative method. With these embodiments, the n equations can be obtained reliably with the discrete approximate scheme or Runge-Kutta iterative method.

In some embodiments, the n equations are solved by a least square method. With these embodiments, the n equations can be solved by the least square method to determine the several parameters.

In some embodiments, the heating element comprises at least one of a busbar contact, a circuit breaker upper contact finger, a circuit breaker lower contact finger, and a cable contact. With these embodiments, the temperature rise of these contacts may be predicted reliably with the trained model.

In a second aspect, example embodiments of the present disclosure provide a method for determining a temperature rise of a heating element in a switchgear, comprising: predicting the temperature rise of the heating element in the switchgear with a model trained by using the method according to the first aspect. With these embodiments, the temperature rise of the heating element in the switchgear may be predicted reliably with the trained model.

In some embodiments, predicting the temperature rise of the heating element with the model comprises: obtaining a real-time current of the heating element and an ambient temperature collected in a first time step; and predicting the temperature rise of the heating element in the first time step through inputting the real-time current, the ambient temperature, and the predicted temperature rise τn a second time step prior to the first time step into the model. With these embodiments, the temperature rise τn the present time step can be predicted reliably by using the current, the ambient temperature, and the predicted temperature rise τn the previous time step.

In some embodiments, the method further comprises: obtaining a real-time temperature of the heating element collected in the first time step; converting the real-time temperature of the heating element into a real-time temperature rise based on the ambient temperature; and triggering an alarm in response to a difference between the real-time temperature rise and the predicted temperature rise exceeding a predetermined threshold. With these embodiments, the anomaly temperature rise τn the switchgear can be detected timely and thus corresponding maintenance may be performed on the switchgear.

In some embodiments, predicting the temperature rise of the heating element comprises predicting at least one of a transient temperature rise or a steady state temperature rise of the heating element. With these embodiments, the transient or steady state temperature rise of the heating element may be predicted under any current load.

In a third aspect, example embodiments of the present disclosure provide an apparatus for training a model for predicting a temperature rise of a heating element in a switchgear, comprising: at least one processor; and at least one memory comprising instructions stored thereon which, when executed by the at least one processor, cause the at least one processor to perform acts comprising: obtaining a model for predicting the temperature rise, the model comprising a plurality of inputs, an output, and several parameters to be determined; obtaining n+1 sets of physical quantities in relation to the heating element, each set of physical quantities being collected at a corresponding one of n+1 time points spaced apart from each other by a time step in a normal operation state of the heating element, each set of physical quantities comprising a current and an actual temperature of the heating element and an ambient temperature; converting the actual temperature in each set of physical quantities into an actual temperature rise based on the corresponding ambient temperature; and training the model with the current, the actual temperature rise and the ambient temperature to determine the several parameters.

In some embodiments, training the model with the current, the actual temperature rise and the ambient temperature comprises: for each time step, creating an equation by using the current, the actual temperature rise and the ambient temperature corresponding to a starting time point of the time step as the inputs of the model and using the actual temperature rise corresponding to an ending time point of the time step as the output of the model, to obtain n equations; and solving the n equations to determine the several parameters.

In some embodiments, each of the n equations is created by using a discrete approximate scheme or Runge-Kutta iterative method.

In some embodiments, the n equations are solved by a least square method.

In some embodiments, the heating element comprises at least one of a busbar contact, a circuit breaker upper contact finger, a circuit breaker lower contact finger, and a cable contact.

In a fourth aspect, example embodiments of the present disclosure provide an apparatus for determining a temperature rise of a heating element in a switchgear, comprising: at least one processor; and at least one memory comprising instructions stored thereon which, when executed by the at least one processor, cause the at least one processor to perform acts comprising: predicting the temperature rise of the heating element in the switchgear with a model trained by using the apparatus according to the third aspect.

In some embodiments, predicting the temperature rise of the heating element with the model comprises: obtaining a real-time current of the heating element and an ambient temperature collected in a first time step; and predicting the temperature rise of the heating element in the first time step through inputting the real-time current, the ambient temperature, and the predicted temperature rise τn a second time step prior to the first time step into the model.

In some embodiments, the acts further comprises: obtaining a real-time temperature of the heating element collected in the first time step; converting the real-time temperature of the heating element into a real-time temperature rise based on the ambient temperature; and triggering an alarm in response to a difference between the real-time temperature rise and the predicted temperature rise exceeding a predetermined threshold.

In some embodiments, predicting the temperature rise of the heating element comprises predicting at least one of a transient temperature rise or a steady state temperature rise of the heating element.

In some embodiments, the at least one processor comprises at least one of a local processor or a remote processor.

In some embodiments, wherein the remote processor comprises a cloud computing node.

In a fifth aspect, example embodiments of the present disclosure provide a computer readable storage medium having instructions stored thereon, the instructions, when executed by at least one processor, cause the at least one processor to perform the method according to the first and second aspect.

In a sixth aspect, example embodiments of the present disclosure provide a computer program product comprising instructions when executed by at least one processor, causing the at least one processor to perform the method according to the first and second aspect.

DESCRIPTION OF DRAWINGS

Drawings described herein are provided to further explain the present disclosure and constitute a part of the present disclosure. The example embodiments of the disclosure and the explanation thereof are used to explain the present disclosure, rather than to limit the present disclosure improperly.

FIG. 1 illustrates a schematic view of a switchgear in accordance with an embodiment of the present disclosure;

FIG. 2 illustrates a flowchart of a method for training a model for predicting a temperature rise of a heating element in a switchgear in accordance with an embodiment of the present disclosure;

FIG. 3 illustrates a flowchart of training the model with the current, the actual temperature rise and the ambient temperature in accordance with an embodiment of the present disclosure;

FIG. 4 illustrates a flowchart of a method for determining a temperature rise of a heating element in a switchgear in accordance with an embodiment of the present disclosure;

FIG. 5 illustrates a flowchart of predicting the temperature rise of the heating element with the model in accordance with an embodiment of the present disclosure;

FIG. 6 illustrates an example test arrangement of the switchgear in accordance with an embodiment of the present disclosure;

FIGS. 7-8 illustrate prediction results of the temperature rise of the heating element in the example test arrangement of FIG. 6; and

FIG. 9 illustrates a schematic diagram of an apparatus for training the model for predicting the temperature rise and/or determining the temperature rise τn accordance with embodiments of the present disclosure.

Throughout the drawings, the same or similar reference symbols are used to indicate the same or similar elements.

DETAILED DESCRIPTION OF EMBODIMENTS

Principles of the present disclosure will now be described with reference to several example embodiments shown in the drawings. Though example embodiments of the present disclosure are illustrated in the drawings, it is to be understood that the embodiments are described only to facilitate those skilled in the art in better understanding and thereby achieving the present disclosure, rather than to limit the scope of the disclosure in any manner.

The term “comprises” or “includes” and its variants are to be read as open terms that mean “includes, but is not limited to.” The term “or” is to be read as “and/or” unless the context clearly indicates otherwise. The term “based on” is to be read as “based at least in part on.” The term “being operable to” is to mean a function, an action, a motion or a state can be achieved by an operation induced by a user or an external mechanism. The term “one embodiment” and “an embodiment” are to be read as “at least one embodiment.” The term “another embodiment” is to be read as “at least one other embodiment.” The terms “first,” “second,” and the like may refer to different or same objects. Other definitions, explicit and implicit, may be included below. A definition of a term is consistent throughout the description unless the context clearly indicates otherwise.

As discussed above, the conventional way of detecting the anomaly temperature rise τs not always accurate and is inefficient, and the conventional online temperature monitoring system mainly focuses on temperature collecting without effective anomaly temperature rise detection. According to embodiments of the present disclosure, a real time regression model for predicting temperature rise of a heating element in the switchgear and a method for detecting anomaly temperature rise of the switchgear are proposed; and the time regression model and the anomaly temperature rise detecting method are adaptive to different operating conditions and setups of the switchgear. The above idea may be implemented in various manners, as will be described in detail in the following paragraphs.

Hereinafter, the principles of the present disclosure will be described in detail with reference to FIGS. 1-9.

Referring to FIG. 1 first, FIG. 1 illustrates a schematic view of a switchgear 100 in accordance with an embodiment of the present disclosure. As shown in FIG. 1, the switchgear 100 generally includes a busbar contact 101, a circuit breaker upper contact finger 102, a circuit breaker lower contact finger 103, and a cable contact 104. During operation of the switchgear 100, the temperature of the busbar contact 101, the circuit breaker upper contact finger 102, the circuit breaker lower contact finger 103, and the cable contact 104 may rise, which may adversely affect normal functions of the switchgear 100. In the context of the present disclosure, each of the busbar contact 101, the circuit breaker upper contact finger 102, the circuit breaker lower contact finger 103, and the cable contact 104 may be referred to as a heating element of the switchgear 100. It is to be understood that the present disclosure focuses on the temperature rise prediction of the heating element, and thus detailed introductions of other structures or operations of the switchgear 100 are omitted.

In order to predict the temperature rise of the heating element in the switchgear 100, embodiments of the present disclosure propose a model hypothesis. Since a part of the heat generated by the heating element during operation of the switchgear 100 is dissipated and the other part of the generated heat is absorbed by the heating element, it is supposed that a heat balance equation is satisfied for the heating element in the switchgear 100 during the time period dt, represented by an equation (1):

pdt=K _τ Aτdt+cmdτ  (1),

• • pdt represents the total heat generated by the heating element in the switchgear during dt;
  • K_τAτdt represents the heat dissipated by the heating element during dt;
  • cmdτ represents the heat absorbed by the heating element when the temperature of the heating element is raised by dτ during dt;
  • p represents the total heating power of the heating element;
  • K_T represents a heat dissipating coefficient of the heating element;
  • A represents an effective heat dissipating area of the heating element;
  • τ represents a temperature rise of the heating element;
  • c represents the specific heat of the heating element;
  • m represents the mass of the heating element.

In engineering, the forms of the heat dissipation include heat conduction, heat convection and heat radiation. For the sake of simplicity, the above three forms of the heat dissipation are combined, that is, K_τAT is used to represent the overall heat dissipation process. The selection of K_T and A typically depends on the specific application scenarios. K_T is simplified on the basis of the K_T expression obtained by a similarity theory, thereby obtaining an equation (2):

K _τ=λτ^γ  (2),

• • λ and γ are undetermined parameters.

In order to solve the equation (1), two example approaches are provided in the present disclosure.

Approach I

It is assumed that an integral calculation of the equation (1) is performed in a short time period from t₀ to t₁, with an initial condition of τ=τ₀ when t=t₀. Since the time period from t₀ to t₁ is short, the temperature rise of the heating element is small. Thus, the heat dissipating coefficient K_T may be regarded as a constant during this period and calculated by an equation (3):

K _T=λτ_o^γ  (3),

• • τ₀ represents the temperature rise of the heating element at t₀.

Then, an equation (4) is obtained by integration of the equation (1) with the initial condition of τ=τ₀ when t=t₀:

$\begin{array}{cc}\tau =\frac{p}{K_{T}A}\left(1-e^{-\frac{t}{\frac{\mathrm{cm}}{K_{T}A}}}\right)+{\tau }_0{e}^{-\frac{t}{\frac{\mathrm{cm}}{K_{T}A}}}.& \left(4\right)\end{array}$

A time constant T is defined by

$T=\frac{\mathrm{cm}}{K_{T}A}.$

Since the parameters c, m, A are undetermined, it is assumed that the time constant T is represented by an equation (5):

$\begin{array}{cc}T=\alpha *\frac{1}{K_T}+\beta ,& \left(5\right)\end{array}$

• • α, β are undetermined parameters.

The total heating power p of the heating element is related to the current, electrical resistance and other loss of the heating element. Thus, in some embodiments, it is assumed that total heating power p is represented by an equation (6):

p=η*I ²*[1+0.00381*(τ+T_amb)]*ρ₀  (6),

• • η is an undetermined parameter which may be associated to the skin effect or other factors of the heating element;
  • I represents the current in the heating element;
  • T_amb represents the ambient temperature;
  • ρ₀ represents the resistivity of the heating element at 0° C.

It is to be understood that in other embodiments, the total heating power p of the heating element may be represented by other equations. The scope of the present disclosure is not intended to be limited in this respect.

Then, through plugging the equations (3), (5), and (6) into the equation (4), an equation (7) is obtained:

$\begin{array}{cc}\tau =\frac{\eta *I^2*\left[1+0.00381*\left({\tau }_0+T_{\mathrm{amb}}\right)\right]*{\rho }_0}{{\mathrm{\lambda \tau }}_0{\gamma }_A}\left(1-e^{-\frac{t}{\alpha *\frac{1}{{\mathrm{\lambda \tau }}_0\gamma }+\beta }}\right)+{\tau }_0{e}^{-\frac{t}{\alpha *\frac{1}{{\mathrm{\lambda \tau }}_0\gamma }+\beta }}.& \left(7\right)\end{array}$

The equation (7) may be rewritten as an equation (8) through letting

$d=\frac{\eta *{\rho }_0}{\lambda A},a=\frac{\alpha }{\lambda },$

and b=β:

$\begin{array}{cc}\tau =d*\frac{I^2*\left[1+0.00381*\left({\tau }_0+T_{\mathrm{amb}}\right)\right]}{{\tau }_0\gamma }\left(1-e^{-\frac{t}{a*\frac{1}{{\tau }_0\gamma }+b}}\right)+{\tau }_0{e}^{-\frac{t}{a*\frac{1}{{\tau }_0\gamma }+b}}.& \left(8\right)\end{array}$

• • a, b, γ, and d are undetermined parameters.

The equation (8) is the result of the integral calculation of the equation (1) in the time period from t₀ to t₁ with the initial condition of τ=τ₀ when t=t₀.

In some embodiments, the constraints of the equation (8) may be set as α ∈ (0,1000], b ∈ [−1000,1000], γ∈ [0,0.45], d ∈ [0,1]. The constraints are approximate parameter ranges derived from multiple times of experiments. In other embodiments, the constraints of the equation (8) may be set to be other ranges. The scope of the present disclosure is not intended to be limited in this respect.

The equation (8) may be rewritten into a more general form, represented by equation (9):

$\begin{array}{cc}{\tau }_n=d*\frac{I_{n-1}^2*\left[1+0.00381*\left({\tau }_{n-1}+T_{\mathrm{ambn}-1}\right)\right]}{{\tau }_{n-1}\gamma }\left(1-e^{-\frac{\Delta t}{a*\frac{1}{{\tau }_{n-1}\gamma }+b}}\right)+{\tau }_{n-1}{e}^{-\frac{\Delta t}{a*\frac{1}{{\tau }_{n-1}\gamma }+b}},& \left(9\right)\end{array}$

• • τ_n represents the temperature rise of the heating element at t_n;
  • τ_{n_1} represents the temperature rise of the heating element at t_n−1;
  • I_n−1 represents the current in the heating element at t_n−1;
  • T_ambn−1 represents the ambient temperature at t_n−1;
  • Δt=t_n−t_n−1 represents an time interval between t_n and t_n−1.

The constraints of the equation (9) may be the same as those of the equation (8), i.e., α ∈ (0,1000], b ∈ [−1000,1000], γ ∈[0,0.45], d ∈ [0,1].

Since the parameters a, b, γ, and d are undetermined parameters, the above model needs to be trained in advance to determine these parameters. FIG. 2 illustrates a flowchart of a method 200 for training a model for predicting a temperature rise of a heating element in a switchgear in accordance with an embodiment of the present disclosure.

As shown in FIG. 2, the method 200 includes: at 210, obtaining the model for predicting the temperature rise. The model includes a plurality of inputs, an output, and several parameters to be determined. In an embodiment, the model is represented by the equation (9) as described above. In the equation (9), the output of the model includes the temperature rise τn, the inputs of the model include the temperature rise τ_n−1, the current I_n−1, and the ambient temperature T_ambn−1, and the several parameters to be determined include the parameters a, b, γ, and d.

In order to determine the parameters a, b, γ, and d, the model needs to be trained. To this end, the method 200 further includes: at 220, obtaining n+1 sets of physical quantities in relation to the heating element. Each set of physical quantities is collected at a corresponding one of n+1 time points t₀, t₁, . . . , t_n spaced apart from each other by a time step in a normal operation state of the heating element. Each set of physical quantities includes a current and an actual temperature of the heating element and an ambient temperature. Thus, the n+1 sets of physical quantities include the current I₀, I₁, . . . , I_n, the actual temperature T_act0, T_act1, . . . , T_actn of the heating element, and the ambient temperature T_amb0, T_amb1, . . . , T_ambn.

The method further includes: at 230, converting the actual temperature T_act0, T_act1, . . . , T_actn in each set of physical quantities into an actual temperature rise T_act0, T_act1, . . . , τ_actn based on the corresponding ambient temperature T_amb0, T_amb1, . . . , T_ambn. Specifically, the actual temperature rise τ_act0=T_act0−T_amb0, the actual temperature rise τ_act1=T_act1−T_amb1, . . . , and the actual temperature rise τ_actn=T_actn−T_ambn.

Then, at 240, the model may be trained with the current I₀, I₁, . . . , I_n, the actual temperature rise τ_act0, T_act1, . . . , T_actn, and the ambient temperature T_amb0, T_amb1, . . . , T_ambn, to determine the parameters a, b, γ, and d. FIG. 3 illustrates a flowchart of training the model with the current, the actual temperature rise and the ambient temperature in accordance with an embodiment of the present disclosure.

In some embodiments, as shown in FIG. 3, training the model with the current, the actual temperature rise and the ambient temperature comprises: at 2401, for each time step, creating an equation by using the current I₀, I₁, . . . , I_n−, the actual temperature rise τ_act0, T_act1, . . . , T_actn−1 and the ambient temperature T_amb0, T_amb1, . . . , T_ambn−1 corresponding to a starting time point of the time step as the inputs of the model represented by the equation (9) and using the actual temperature rise τ_act1, . . . , τ_actn corresponding to an ending time point of the time step as the output of the model, to obtain n equations; and at 2402, solving the n equations by a least square method to determine the parameters a, b, γ, and d.

In some embodiments, at 2401, each of the n equations is created by using a discrete approximate scheme. In some embodiments, at 2402, the n equations are solved by a least square method.

After the undetermined parameters a, b, γ, and d have been determined, the trained model represented by the equation (9) can be used to determine the temperature rise of the heating element step by step. FIG. 4 illustrates a flowchart of a method 400 for determining a temperature rise of a heating element in a switchgear in accordance with an embodiment of the present disclosure.

As shown in FIG. 4, the method 400 includes: predicting the temperature rise of the heating element in the switchgear with a model trained by using the method 200. During the prediction of the temperature rise, only a real-time current of the heating element, time intervals, and an ambient temperature need to be obtained, then the temperature rise of the heating element could be iteratively predicted by using the equation (9). FIG. 5 illustrates a flowchart of predicting the temperature rise of the heating element with the model in accordance with an embodiment of the present disclosure. As shown in FIG. 5, predicting the temperature rise of the heating element with the model includes: at 4101, obtaining a real-time current of the heating element and an ambient temperature collected in a first time step; and at 4102, predicting the temperature rise of the heating element in the first time step through inputting the real-time current, the ambient temperature, and the predicted temperature rise τn a second time step prior to the first time step into the model. With these embodiments, the temperature rise τn the present time step can be predicted reliably by using the current, the ambient temperature, and the predicted temperature rise τn the previous time step.

Specifically, at 4102, during the time period from t₀ to t₁, the temperature rise τ₁ can be calculated by using the equation (9) based on the real-time current I₀, the temperature rise τ₀ and the ambient temperature T_amb0; during the time period from t₁ to t₂, the temperature rise τ₂ can be calculated by using the equation (9) based on the real-time current I₁, the temperature rise τ₁ and the ambient temperature T_amb1; and during the time period from t_n−1 to t_n, the temperature rise τ_n can be calculated by using the equation (9) based on the real-time current I_n−1, the temperature rise τ₋₁ and the ambient temperature T_ambn−1. The temperature rises τ₁, τ₂, and τ_n can be represented by equations (10), (11), and (12) respectively:

$\begin{array}{cc}{\tau }_1=d*\frac{I_0^2*\left[1+0.00381*\left({\tau }_0+T_{\mathrm{amb}0}\right)\right]}{{\tau }_0\gamma }\left(1-e^{-\frac{\Delta t}{a*\frac{1}{{\tau }_0\gamma }+b}}\right)+{\tau }_0{e}^{-\frac{\Delta t}{a*\frac{1}{{\tau }_0\gamma }+b}},& \left(10\right)\\ {\tau }_2=d*\frac{I_1^2*\left[1+0.00381*\left({\tau }_1+T_{\mathrm{amb}1}\right)\right]}{{\tau }_1\gamma }\left(1-e^{-\frac{\Delta t}{a*\frac{1}{{\tau }_1\gamma }+b}}\right)+{\tau }_1{e}^{-\frac{\Delta t}{a*\frac{1}{{\tau }_1\gamma }+b}},& \left(11\right)\end{array}$ $\mathrm{\cdots \cdots }$ $\begin{array}{cc}{\tau }_n=d*\frac{I_n^2*\left[1+0.00381*\left({\tau }_n+T_{\mathrm{amb}n}\right)\right]}{{\tau }_n\gamma }\left(1-e^{-\frac{\Delta t}{a*\frac{1}{{\tau }_n\gamma }+b}}\right)+{\tau }_0{e}^{-\frac{\Delta t}{a*\frac{1}{{\tau }_n\gamma }+b}},& \left(12\right)\end{array}$

The model trained by the method 200 can be used not only to predict the transient temperature rise of the heating element at any time point, but also to predict the steady state temperature rise of the heating element at any current. According to the equation (1), when the temperature rise of the heating element becomes stable at any current, dτ will equal to 0. Thus, the steady state temperature rise τ_W at any current I may be represented by an equation (13):

$\begin{array}{cc}{\tau }_w=d*\frac{I^2*\left[1+0.00381*\left({\tau }_w+T_{\mathrm{amb}}\right)\right]}{{\tau }_w\gamma }& \left(13\right)\end{array}$

According to embodiments of the approach I, time constant as a function of temperature rise and dynamic current loads are both taken into consideration when building the model. The model trained by the method 200 may be used to predict transient or steady state temperature rise under any current load. The model is designed with strong physical constraints and few parameters which could prevent over fitting on most switchgear workloads. With these embodiments, the outage time of the switchgear can be reduced and the reliability of the switchgear can be improved.

Referring back to FIG. 4, in some embodiments, the method 400 further includes: at 420, obtaining a real-time temperature of the heating element collected in the first time step; at 430, converting the real-time temperature of the heating element into a real-time temperature rise based on the ambient temperature; and at 440, triggering an alarm in response to a difference between the real-time temperature rise and the predicted temperature rise exceeding a predetermined threshold. During the operation of the switchgear 100, the real-time temperature rise detected by sensors can be compared with the predicted temperature rise, so as to monitor whether the actual temperature rise of the heating element deviates away from the predicted temperature rise. With these embodiments, the anomaly temperature rise τn the switchgear 100 can be detected timely and thus corresponding maintenance may be performed on the switchgear.

FIG. 6 illustrates an example test arrangement of the switchgear 100 in accordance with an embodiment of the present disclosure. As shown in FIG. 6, a first feeder panel 610, a second feeder panel 620, and a third feeder panel 630 are arranged from left to right. The feeder panel 610 and the second feeder panel 620 are connected by double D bars 640, and the third feeder panel 630 is left alone without any connection. The current comes into the switchgear 100 from the second feeder panel 620 and out of the switchgear 100 from the first feeder panel 610. Thermocouples (not shown) are arranged on the contact points of the switchgear 100, such as the busbar contact 101, the circuit breaker upper contact finger 102, the circuit breaker lower contact finger 103, and the cable contact 104 as shown in FIG. 1, to collect the real-time temperature of the contact points.

Testing currents are listed in the following Table 1. In some embodiments, the currents of Flag 3 to Flag 16 except Flags 6, 7, 11, and 12 as shown in the Table 1 are selected as a training set, and the currents of Flag 17 to Flag 22 are selected as a validation set. There are 43% of the data in the training set and 57% in the validation set.

TABLE 1
Current (A)	Duration (min)	Flag
650	30	1
555	45	2
460	90	3
355	290	4
510	45	5
0	915	6
510	240	7
610	75	8
705	75	9
810	60	10
0	1050	11
810	175	12
710	30	13
560	60	14
760	135	15
810	90	16
810	360	17
710	540	18
905	45	19
1050	255	20
910	30	21
805	30	22

Based on the detected currents, the time intervals, and the ambient temperature, the prediction results of the temperature rise are as shown in FIGS. 7-8.

FIG. 7(a) illustrates the prediction result of the temperature rise of the busbar contact of phase A on the first feeder panel 610. The solid line of FIG. 7(a) indicates the measured temperature rise of the busbar contact of phase A. The dashed line of FIG. 7(a) indicates the predicted temperature rise of the busbar contact of phase A.

FIG. 7(b) illustrates the prediction result of the temperature rise of the circuit breaker upper contact finger of phase A on the first feeder panel 610. The solid line of FIG. 7(b) indicates the measured temperature rise of the circuit breaker upper contact finger of phase A. The dashed line of FIG. 7(b) indicates the predicted temperature rise of the circuit breaker upper contact finger of phase A.

FIG. 7(c) illustrates the prediction result of the temperature rise of the circuit breaker lower contact finger of phase A on the first feeder panel 610. The solid line of FIG. 7(c) indicates the measured temperature rise of the circuit breaker lower contact finger of phase A. The dashed line of FIG. 7(c) indicates the predicted temperature rise of the circuit breaker lower contact finger of phase A.

FIG. 7(d) illustrates the prediction result of the temperature rise of the cable contact of phase A on the first feeder panel 610. The solid line of FIG. 7(d) indicates the measured temperature rise of the cable contact of phase A. The dashed line of FIG. 7(d) indicates the predicted temperature rise of the cable contact of phase A.

FIG. 8(a) illustrates the prediction result of the temperature rise of the busbar contact of phase A on the first feeder panel 620. The solid line of FIG. 8(a) indicates the measured temperature rise of the busbar contact of phase A. The dashed line of FIG. 8(a) indicates the predicted temperature rise of the busbar contact of phase A.

FIG. 8(b) illustrates the prediction result of the temperature rise of the circuit breaker upper contact finger of phase A on the first feeder panel 620. The solid line of FIG. 8(b) indicates the measured temperature rise of the circuit breaker upper contact finger of phase A. The dashed line of FIG. 8(b) indicates the predicted temperature rise of the circuit breaker upper contact finger of phase A.

FIG. 8(c) illustrates the prediction result of the temperature rise of the circuit breaker lower contact finger of phase A on the first feeder panel 620. The solid line of FIG. 8(c) indicates the measured temperature rise of the circuit breaker lower contact finger of phase A. The dashed line of FIG. 8(c) indicates the predicted temperature rise of the circuit breaker lower contact finger of phase A.

FIG. 8(d) illustrates the prediction result of the temperature rise of the cable contact of phase A on the first feeder panel 620. The solid line of FIG. 8(d) indicates the measured temperature rise of the cable contact of phase A. The dashed line of FIG. 8(d) indicates the predicted temperature rise of the cable contact of phase A.

Table 2 illustrates prediction errors of the temperature rise of the busbar contact, the circuit breaker upper contact finger, the circuit breaker lower contact finger, and the cable contact of phases A, B, and C on the panels 610 and 620. As can be seen from table 2, the absolute prediction error is less than 2.90° C. in all cases. The overall mean prediction errors are 0.94° C. and 0.52° C. for the panel 610 and the panel 620 respectively. These errors are acceptable in practical applications.

	TABLE 2
	Panel 610	Panel 620
	max.	mean	max.	mean
	abs.	abs.	abs.	abs.
	error	error	error	error
	(° C.)	(° C.)	(° C.)	(° C.)
busbar contact A	0.69	0.18	1.30	0.74
busbar contact B	1.11	0.63	0.64	0.30
busbar contact C	1.11	0.64	0.40	0.14
circuit breaker upper contact finger A	1.69	0.90	1.40	0.80
circuit breaker upper contact finger B	2.04	0.97	0.74	0.37
circuit breaker upper contact finger C	2.35	1.42	0.70	0.38
circuit breaker lower contact finger A	1.96	1.20	0.54	0.29
circuit breaker lower contact finger B	2.11	1.20	0.51	0.16
circuit breaker lower contact finger C	2.89	1.46	1.25	0.77
cable contact A	1.64	0.89	1.18	0.79
cable contact B	1.47	0.81	1.04	0.72
cable contact C	1.68	0.89	1.07	0.75

Approach II

Approach II provides a different manner to solve the equation (1). Specifically, through plugging the equation (2) into the equation (1), an equation (14) is obtained:

pdt=λAτ ^1+γ dt+cmdτ  (14).

Then, through plugging the equation (6) into the equation (14), an equation (15) is obtained:

$\begin{array}{cc}\frac{d\tau }{\mathrm{dt}}=\frac{\eta *I^2*\left[1+0.00381*\left(\tau +T_{\mathrm{amb}}\right)\right]*{\rho }_0}{\mathrm{cm}}-\frac{\lambda A{\tau }^{1+\gamma }}{\mathrm{cm}}.& \left(15\right)\end{array}$

The equation (15) may be rewritten as an equation (16) through letting

$\begin{array}{cc}f=\frac{\eta *{\rho }_0}{\mathrm{cm}}\mathrm{and}g=\frac{\lambda A}{\mathrm{cm}}:\frac{d\tau }{\mathrm{dt}}=f*I^2*\left[1+0.00381*\left(\tau +T_{\mathrm{amb}}\right)\right]-g*{\tau }^{1+\gamma },& \left(16\right)\end{array}$

g, f, and γ are undetermined parameters.

The model represented by the equation (16) may be trained by the method 200 as shown in FIGS. 2 and 3 to determine the parameters g, f, and γ. The training process of the model represented by the equation (16) is similar to that of the model represented by the equation (9), except that each of the n equations is created by using Runge-Kutta iterative method. Thus, the specific training process of the model represented by the equation (16) would not be described in detail herein anymore.

After the undetermined parameters g, f, and γ have been determined, the trained model represented by the equation (16) can be used to determine the temperature rise of the heating element step by step, for example by using the method 400 as shown in FIGS. 4 and 5. The specific predicting process of the transient temperature rise of the heating element can be calculated using the Runge-Kutta iterative method.

Moreover, the model represented by the equation (16) can be used not only to predict the transient temperature rise of the heating element at any time point, but also to predict the steady state temperature rise of the heating element at any current. According to the equation (16), when the temperature rise of the heating element becomes stable at any current,

$\frac{d\tau }{\mathrm{dt}}$

will equal to 0. Thus, the steady state temperature rise Tw at any current I may be represented by an equation (17):

$\begin{array}{cc}{\tau }_w^{1+\gamma }=\frac{f}{g}*I^2*\left[1+0.00381*\left({\tau }_w+T_{\mathrm{amb}}\right)\right].& \left(17\right)\end{array}$

In some embodiments of the present disclosure, as shown in FIG. 9, an apparatus 900 for training the model for predicting the temperature rise and/or determining the temperature rise τn accordance with embodiments of the present disclosure is provided. The apparatus 900 may comprise a computer processor 910 coupled to a computer-readable memory unit 920, and the memory unit 920 comprises instructions 922. When executed by the computer processor 910, the instructions 922 may cause the computer processor 910 to implement the methods 200 and 400 as described in the preceding paragraphs, and details will be omitted hereinafter.

According to embodiments of the present disclosure, the methods 200 and 400 are not limited to be implemented by a local processor, but may be implemented by a remote processor. For example, the methods 200 and 400 may be implemented at a cloud computing node. Specifically, the data collected at site can be transferred to the cloud computing node and processed at the cloud computing node. Then, the calculation results can be returned to local devices or systems from the cloud computing node. In this way, there is no need to provide additional calculation devices at site.

In some embodiments, each of the methods 200 and 400 may be implemented by one processor, for example a MCU or a cloud computing node. In other embodiments, each of the methods 200 and 400 may be implemented by several processors. For example, some acts of the methods 200 and 400 may be implemented by the MCU locally, and other acts of the methods 200 and 400 may be implemented the cloud computing node remotely. The scope of the present disclosure is not intended to be limited in this respect.

In some embodiments of the present disclosure, a computer readable medium is provided. The computer readable medium has instructions stored thereon, and the instructions, when executed on at least one processor, may cause at least one processor to perform the methods 200 and 400 as described in the preceding paragraphs, and details will be omitted hereinafter.

In some embodiments of the present disclosure, a computer program product is provided. The computer program product comprises instructions which, when executed on at least one processor, may cause at least one processor to perform the methods 200 and 400 as described in the preceding paragraphs, and details will be omitted hereinafter.

Generally, various embodiments of the present disclosure may be implemented in hardware or special purpose circuits, software, logic or any combination thereof. Some aspects may be implemented in hardware, while other aspects may be implemented in firmware or software which may be executed by a controller, microprocessor or other computing device. While some aspects of embodiments of the present disclosure are illustrated and described as block diagrams, flowcharts, or using some other pictorial representation, it will be appreciated that the blocks, apparatus, systems, techniques or methods described herein may be implemented in, as non-limiting examples, hardware, software, firmware, special purpose circuits or logic, general purpose hardware or controller or other computing devices, or some combination thereof.

Program code for carrying out methods of the present disclosure may be written in any combination of one or more programming languages. These program codes may be provided to a processor or controller of a general purpose computer, special purpose computer, or other programmable data processing apparatus, such that the program codes, when executed by the processor or controller, cause the functions/operations specified in the flowcharts and/or block diagrams to be implemented. The program code may execute entirely on a machine, partly on the machine, as a stand-alone software package, partly on the machine and partly on a remote machine or entirely on the remote machine or server.

The above program code may be embodied on a machine readable medium, which may be any tangible medium that may contain, or store a program for use by or in connection with an instruction execution system, apparatus, or device. The machine readable medium may be a machine readable signal medium or a machine readable storage medium. A machine readable medium may include but not limited to an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any suitable combination of the foregoing. More specific examples of the machine readable storage medium would include an electrical connection having one or more wires, a portable computer diskette, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or Flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

Further, while operations are depicted in a particular order, this should not be understood as requiring that such operations be performed in the particular order shown or in sequential order, or that all illustrated operations be performed, to achieve desirable results. In certain circumstances, multitasking and parallel processing may be advantageous. Likewise, while several specific implementation details are contained in the above discussions, these should not be construed as limitations on the scope of the present disclosure, but rather as descriptions of features that may be specific to particular embodiments. Certain features that are described in the context of separate embodiments may also be implemented in combination in a single embodiment. On the other hand, various features that are described in the context of a single embodiment may also be implemented in multiple embodiments separately or in any suitable sub-combination.

Although the subject matter has been described in language specific to structural features and/or methodological acts, it is to be understood that the subject matter defined in the appended claims is not necessarily limited to the specific features or acts described above. Rather, the specific features and acts described above are disclosed as example forms of implementing the claims.

Claims

1. A method for training a model for predicting a temperature rise of a heating element in a switchgear, comprising: obtaining a model for predicting the temperature rise, the model comprising a plurality of inputs, an output, and several parameters to be determined;obtaining n+1 sets of physical quantities in relation to the heating element, each set of physical quantities being collected at a corresponding one of n+1 time points spaced apart from each other by a time step in a normal operation state of the heating element, each set of physical quantities comprising a current and an actual temperature of the heating element and an ambient temperature;converting the actual temperature in each set of physical quantities into an actual temperature rise based on the corresponding ambient temperature; andtraining the model with the current, the actual temperature rise and the ambient temperature to determine the several parameters.

2. The method according to claim 1, wherein training the model with the current, the actual temperature rise and the ambient temperature comprises: for each time step, creating an equation by using the current, the actual temperature rise and the ambient temperature corresponding to a starting time point of the time step as the inputs of the model and using the actual temperature rise corresponding to an ending time point of the time step as the output of the model, to obtain n equations; andsolving the n equations to determine the several parameters.

3. The method according to claim 2, wherein each of the n equations is created by using a discrete approximate scheme or Runge-Kutta iterative method, and/orwherein the n equations are solved by a least square method.

4. The method according to claim 1, wherein the heating element comprises at least one of a busbar contact, a circuit breaker upper contact finger, a circuit breaker lower contact finger, and a cable contact.

5. A method for determining a temperature rise of a heating element in a switchgear, comprising: predicting the temperature rise of the heating element in the switchgear with a model trained by using the method according to claim 1.

6. The method according to claim 5, wherein predicting the temperature rise of the heating element with the model comprises: obtaining a real-time current of the heating element and an ambient temperature collected in a first time step; andpredicting the temperature rise of the heating element in the first time step through inputting the real-time current, the ambient temperature, and the predicted temperature rise in a second time step prior to the first time step into the model.

7. The method according to claim 6, further comprising: obtaining a real-time temperature of the heating element collected in the first time step;converting the real-time temperature of the heating element into a real-time temperature rise based on the ambient temperature; andtriggering an alarm in response to a difference between the real-time temperature rise and the predicted temperature rise exceeding a predetermined threshold.

8. An apparatus for training a model for predicting a temperature rise of a heating element in a switchgear, comprising: at least one processor; andat least one memory comprising instructions stored thereon which, when executed by the at least one processor, cause the at least one processor to perform acts comprising:obtaining a model for predicting the temperature rise, the model comprising a plurality of inputs, an output, and several parameters to be determined;obtaining n+1 sets of physical quantities in relation to the heating element, each set of physical quantities being collected at a corresponding one of n+1 time points spaced apart from each other by a time step in a normal operation state of the heating element, each set of physical quantities comprising a current and an actual temperature of the heating element and an ambient temperature;converting the actual temperature in each set of physical quantities into an actual temperature rise based on the corresponding ambient temperature; andtraining the model with the current, the actual temperature rise and the ambient temperature to determine the several parameters.

9. The apparatus according to claim 8, wherein training the model with the current, the actual temperature rise and the ambient temperature comprises: for each time step, creating an equation by using the current, the actual temperature rise and the ambient temperature corresponding to a starting time point of the time step as the inputs of the model and using the actual temperature rise corresponding to an ending time point of the time step as the output of the model, to obtain n equations; andsolving the n equations to determine the several parameters.

10. The apparatus according to claim 9, wherein each of the n equations is created by using a discrete approximate scheme or Runge-Kutta iterative method, and/orwherein the n equations are solved by a least square method.

11. An apparatus for determining a temperature rise of a heating element in a switchgear, comprising: at least one processor; andat least one memory comprising instructions stored thereon which, when executed by the at least one processor, cause the at least one processor to perform acts comprising:predicting the temperature rise of the heating element in the switchgear with a model trained by using the apparatus according to claim 8.

12. The apparatus according to claim 11, wherein predicting the temperature rise of the heating element with the model comprises: obtaining a real-time current of the heating element and an ambient temperature collected in a first time step; andpredicting the temperature rise of the heating element in the first time step through inputting the real-time current, the ambient temperature, and the predicted temperature rise in a second time step prior to the first time step into the model.

13. The apparatus according to claim 12, wherein the acts further comprises: obtaining a real-time temperature of the heating element collected in the first time step;converting the real-time temperature of the heating element into a real-time temperature rise based on the ambient temperature; andtriggering an alarm in response to a difference between the real-time temperature rise and the predicted temperature rise exceeding a predetermined threshold.

14. The apparatus according to claim 8, wherein the at least one processor comprises at least one of a local processor or a remote processor, and wherein the remote processor comprises a cloud computing node.

15. A computer readable storage medium having instructions stored thereon, the instructions, when executed by at least one processor, cause the at least one processor to perform the method according to claim 1.