The present invention relates generally to a shoe insole or insert. More specifically, the present invention discloses a novel orthotic support insole which incorporates each of an uppermost anti-microbial lining, an intermediate foam layer, a rigid stabilizer insert and a bottom-most thermos-formable foam layer. The new design provides the combined features of achieving a non-standard thickness along an axial length of the insole during its formation, in combination with fusing of the edges of the multiple layers at least along the heel cup and sides which also prevents delamination of the multiple layers.
The prior art is documented with examples of orthotic insoles. A first example of this is the rigid insole depicted in
Brown, U.S. Pat. No. 6,101,743, teaches a thin orthotic insert having a rigid rearfoot plate and a flexible forefoot cushion which are joined together without requiring a separate top cover. A connection is formed by a slot at a forward edge of the plate which receives and holds a rearward edge of the cushion layer. The rearfoot plate may be formed as a laminate structure, with forward edges of the upper and lower laminate layers being separated to form the wall portions above and below the slot. A spacer is inserted between the edges of the layers and then withdrawn after molding/curing.
Davis, US 2020/0113277, teaches a systems and methods directed to footwear with adaptations for improved usability. The article includes a multi-layered midsole configured to provide improved support and comfort during use, while also providing anti-microbial protection to the user's foot.
U.S. Pat. No. 9,119,440, to Lagneau et al., teaches an insole article of footwear including a deformable cavity filled with a compressible, fluid-permeable member material to which are communicated each of fluid inlets and outlets. The thickness of the principal portion in its non-deformable state is substantially constant, with the possible exception of the perimeter of the cavity and/or the fluid inlet and outlet.
The present application discloses an orthotic support insole having a body including each of an uppermost anti-microbial lining, an intermediate foam layer, a rigid stabilizer insert and a bottom-most thermo-formable foam layer. An extending edge of the body, corresponding to at least a heel cup and intermediate sides, is fused along an outer perimeter edge to prevent delamination. The body includes a non-standard thickness along an axial length thereof and the fused perimeter edge extends to a location proximate a forward extending edge portion of the body.
A corresponding process for forming an orthotic support insole is provided and which includes the steps of forming a body including each of an upper layer, a rigid stabilizer insert and a bottom-most thermo-formable foam layer, along with pinching or fusing together an extending edge of the body corresponding to at least a heel cup and intermediate side locations to prevent delamination. Additional steps include the step of forming the upper layer further including forming, in combination, forming each of an upper lining and an intermediate foam layer.
Other steps include providing a die with right and left cavities for forming a pair of the bodies, with the step of forming the body further including heat molding the bottom thermoformable layer from an EVA material. Additional steps include adhesively securing the rigid stabilizer insert to the bottom EVA material and heating the upper layer prior to insertion into the die with the bottom EVA material and attached rigid insert. Also provided is the step of die cutting the finished bodies.
Reference will now be made to the attached drawings, when read in combination with the following detailed description, wherein like reference numerals refer to like parts throughout the several views, and in which:
With reference to the attached illustrations, in particular
As further described below, the novel design provides the combined features of achieving a non-standard thickness along an axial length of the insole during its formation (such as which is assisted by the corresponding formation process in which the mating dies (see as subsequently described in
In comparison,
Proceeding to
The present invention also provides a novel process for forming the rigid insole article utilizing the die template 28. Without limitation, any die slide or pick and place processes can be utilized with the die template according to any combination in order to create the finished rigid insole article.
Existing forming techniques for producing such as the prior art rigid insole of
Additional conventional steps include gluing the plastic rigid shell (also termed the rigid insert 16) to the EVA base polymer material 18. Subsequent steps include gluing a sectioned piece of 3-5 mm EVA sheet, such as corresponding to the uppermost lining 12 alone or in combination with the inner foam sheet or layer 14, following which a cold pressing mold technique is employed for reinforcing the lamination of the three layers together. Final steps include die-cutting the combination from the completed sheet.
The novel forming process, such as drawing from the die template of
Proceeding to
As with the initial variant of
Having described my invention, other and additional preferred embodiments will become apparent to those skilled in the art to which it pertains, and without deviating from the scope of the appended claims. This can include the provision of a corresponding method or process for creating the multi-layer rigid insole which can include formation of the pinched edges as shown in
The detailed description and drawings are further understood to be supportive of the disclosure, the scope of which being defined by the claims. While some of the best modes and other embodiments for carrying out the claimed teachings have been described in detail, various alternative designs and embodiments exist for practicing the disclosure defined in the appended claims.
The foregoing disclosure is further understood as not intended to limit the present disclosure to the precise forms or particular fields of use disclosed. As such, it is contemplated that various alternate embodiments and/or modifications to the present disclosure, whether explicitly described or implied herein, are possible in light of the disclosure. Having thus described embodiments of the present disclosure, a person of ordinary skill in the art will recognize that changes may be made in form and detail without departing from the scope of the present disclosure. Thus, the present disclosure is limited only by the claims.
In the foregoing specification, the disclosure has been described with reference to specific embodiments. However, as one skilled in the art will appreciate, various embodiments disclosed herein can be modified or otherwise implemented in various other ways without departing from the spirit and scope of the disclosure. Accordingly, this description is to be considered as illustrative and is for the purpose of teaching those skilled in the art the manner of making and using various embodiments of the disclosure. It is to be understood that the forms of disclosure herein shown and described are to be taken as representative embodiments. Equivalent elements, materials, processes or steps may be substituted for those representatively illustrated and described herein. Moreover, certain features of the disclosure may be utilized independently of the use of other features, all as would be apparent to one skilled in the art after having the benefit of this description of the disclosure. Expressions such as “including”, “comprising”, “incorporating”, “consisting of”, “have”, “is” used to describe and claim the present disclosure are intended to be construed in a non-exclusive manner, namely allowing for items, components or elements not explicitly described also to be present. Reference to the singular is also to be construed to relate to the plural.
Further, various embodiments disclosed herein are to be taken in the illustrative and explanatory sense, and should in no way be construed as limiting of the present disclosure. All joinder references (e.g., attached, affixed, coupled, connected, and the like) are only used to aid the reader's understanding of the present disclosure, and may not create limitations, particularly as to the position, orientation, or use of the systems and/or methods disclosed herein. Therefore, joinder references, if any, are to be construed broadly. Moreover, such joinder references do not necessarily infer that two elements are directly connected to each other.
Additionally, all numerical terms, such as, but not limited to, “first”, “second”, “third”, “primary”, “secondary”, “main” or any other ordinary and/or numerical terms, should also be taken only as identifiers, to assist the reader's understanding of the various elements, embodiments, variations and/or modifications of the present disclosure, and may not create any limitations, particularly as to the order, or preference, of any element, embodiment, variation and/or modification relative to, or over, another element, embodiment, variation and/or modification.
It will also be appreciated that one or more of the elements depicted in the drawings/figures can also be implemented in a more separated or integrated manner, or even removed or rendered as inoperable in certain cases, as is useful in accordance with a particular application. Additionally, any signal hatches in the drawings/figures should be considered only as exemplary, and not limiting, unless otherwise specifically specified.
The present application claims the priority of U.S. Ser. No. 63/151,870 filed Feb. 22, 2021.
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Number | Date | Country | |
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20220264991 A1 | Aug 2022 | US |
Number | Date | Country | |
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63151870 | Feb 2021 | US |