BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a schematic elevation view of a first embodiment of an assembly configured according to the prior art.
FIG. 2 is a schematic elevation view of a second embodiment of an assembly configured according to the prior art.
FIG. 3 is a schematic elevation view of a first step in effecting a diffusion bonding of two gold interfaces.
FIG. 4 is a schematic elevation view of a second step in effecting a diffusion bonding of two gold interfaces.
FIG. 5 is a schematic elevation view of a third step in effecting a diffusion bonding of two gold interfaces.
FIG. 6 is a schematic elevation view of a fourth step in effecting a diffusion bonding of two gold interfaces.
FIG. 7 is a schematic section view of an assembly configured according to the present invention.
FIG. 8 is a flow chart illustrating the method of the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
The present invention advantageously employs the phenomenon of gold diffusion to create an electrical and mechanical bond at the interface between parts of an assembly, such as by way of example and not by way of limitation a header-to-housing interface of an RF (radio frequency) microwave integrated circuit (MIC) module. An advantageous result is that intermittent electrical contact between parts at the header-to-housing interface is substantially reduced or eliminated, even in environments presenting temperature cycling or vibration.
FIG. 1 is a schematic elevation view of a first embodiment of an assembly configured according to the prior art. In FIG. 1, an assembly 10 includes a first part 12 and a second part 14. First part 12 has a substantially planar upper face 20. Second part 14 has a generally concave lower face 22 in facing relation with respect to face 20 when assembly 10 is in an assembled orientation, as illustrated in FIG. 1. In the assembled orientation illustrated in FIG. 1, faces 20, 22 cooperate to establish a gap Δ1 at widest separation between faces 20, 22. A ribbon structure 24 is installed between faces 20, 22 to at least partially fill gap Δ1. Preferably, ribbon structure 24 is gold material, and when faces 20, 22 are urged together an improved electrical interface is provided to an interface between faces 20, 22 by ribbon structure 24 compared with an interface between faces 20, 22 without ribbon structure 24 situated therebetween.
FIG. 2 is a schematic elevation view of a second embodiment of an assembly configured according to the prior art. In FIG. 2, an assembly 30 includes a first part 32 and a second part 34. First part 32 has a substantially planar upper face 40. Second part 34 has a generally convex lower face 42 in facing relation with respect to face 40 when assembly 30 is in an assembled orientation, as illustrated in FIG. 2. In the assembled orientation illustrated in FIG. 2, faces 40, 42 cooperate to establish a gap Δ2 at widest separations between faces 40, 42 substantially at ends 36, 38 of assembly 30. Ribbon structures 44, 46 are installed between faces 40, 42 to at least partially fill gap Δ2 at ends 36, 38. Preferably, ribbon structures 44, 46 are gold material, and when faces 40, 42 are urged together an improved electrical interface is provided to an interface between faces 40, 42 by ribbon structures 44, 46 compared with an interface between faces 40, 42 without ribbon structures 44, 46 situated therebetween.
Prior art practice illustrated in FIGS. 1-2 provides for plating faces 20, 22 or 40, 42 using Type 2 (99.0% purity) gold plating on all mating portions of faces 20, 22 or 40, 42. Prior art practice also provides for ribbon structure to use Type 2 (99.0% purity) gold material. Prior art assemblies 10, 30 purposely employed lesser purity gold material (e.g., Type 2 (99.0% purity) gold material) for establishing electrical contact at an interface such as an interface between faces 20, 22 or 40, 42 in order to avoid occurrence of diffusion bonding by gold diffusion.
When mating gold surfaces are placed under pressure at an elevated temperature, the process of diffusion bonding starts to occur. Gold material is particularly susceptible to diffusion bonding, especially in structures involving substantially pure gold material. The process of diffusion bonding may be alternately referred to as “gold diffusion” elsewhere in this disclosure. This process of gold diffusion, also referred to as cold welding, can result in a strong bond between parts 12, 14 or 32, 34. Assembly designers have sought to avoid the occurrence of gold diffusion or cold welding in the past because the strong bond established by that process makes parts difficult to position and difficult to move once installed, such as when removal may be required for replacement or repair of an assembly.
When mating gold surfaces are placed in facing relationship under pressure at an elevated temperature, the process of gold diffusion starts to occur. The higher the elevated temperature (and pressure) the faster will be the diffusion rate. After a period of time, the diffusion is complete at the interface establishing a robust electrical contact and structural joint. Gold has the property of being able to diffuse and join to itself under a relatively low temperature and pressure.
FIG. 3 is a schematic elevation view of a first step in effecting a diffusion bonding of two gold interfaces. FIG. 4 is a schematic elevation view of a second step in effecting a diffusion bonding of two gold interfaces. FIG. 5 is a schematic elevation view of a third step in effecting a diffusion bonding of two gold interfaces. FIG. 6 is a schematic elevation view of a fourth step in effecting a diffusion bonding of two gold interfaces. Regarding FIGS. 3-6 together, an assembly 50 includes a first part 52 and a second part 54. First part 52 has an upper face 60. Second part 54 has a lower face 62 in facing relation with respect to face 60 when assembly 50 is in an assembled orientation, as illustrated in FIGS. 3-6. Faces 60, 62 present gold material toward each other (not shown in detail in FIGS. 3-6). The gold material may be plated on or otherwise adhered with parts 52, 54.
In the first assembly step illustrated in FIG. 3, faces 60, 62 cooperate to establish a first gap (represented in FIG. 3 by gap Δ3) between faces 60, 62. Applying a force F (indicated by arrows 64, 66 in FIGS. 3-6) and elevating temperature of assembly 50 urges parts 52, 54 together and promotes gold diffusion or cold welding.
In the second assembly step illustrated in FIG. 4, application of force F and elevation of temperature result in faces 60, 62 establishing a second gap (represented in FIG. 4 by gap Δ4) between faces 60, 62 that is a lesser gap than first gap Δ3 (FIG. 3).
In the third assembly step illustrated in FIG. 5, application of force F and elevation of temperature result in faces 60, 62 establishing a third gap (represented in FIG. 5 by gap Δ5) between faces 60, 62 that is a lesser gap than second gap Δ4 (FIG. 4). The gap between faces 60, 62 is substantially zero in some localities, such as locality 68, as gold diffusion has substantially occurred in those localities.
In the fourth assembly step illustrated in FIG. 6, application of force F and elevation of temperature result in faces 60, 62 establishing a fourth gap (represented in FIG. 6 by gap Δ6) between faces 60, 62 that is a lesser gap than second gap Δ5 (FIG. 5). Fourth gap Δ6 is substantially zero wherever faces 60, 62 abut as gold diffusion has substantially occurred across the full interface of faces 60, 62, thereby establishing a cold welded junction having substantially continuous electrical properties and strong physical properties resistant to breaking the bond between parts 52, 54.
The present invention advantageously employs the phenomenon of gold diffusion bonding or cold welding between two gold surfaces to establish electrical and structural bond of sufficient quality and continuity to substantially eliminate intermittent contact between parts of an assembly. By way of example and not by way of limitation, the present invention advantageously employs the phenomenon of gold diffusion bonding or cold welding between two gold plated surfaces to establish an electrical and structural contact that substantially ensures a continuous electrical interface under a microstrip transmission line.
Cold welding of gold surfaces is a phenomenon that has been avoided by assembly designers for many years. Cold welding of gold surfaces has long been regarded as a problem to be avoided because it made parts difficult to move or position with respect to each other and for other assembly-related reasons. However, the present invention takes advantage of the phenomenon of cold welding of gold surfaces to solve the “ground jump” anomaly described above.
FIG. 7 is a schematic section view of an assembly configured according to the present invention. In FIG. 7, an assembly 70 includes a first part 72 and a second part 74. First part 72 is preferably plated with a layer 80 of gold material and has an upper face 82. Second part 74 is preferably plated with a layer 84 of gold material and has a lower face 86 in facing relation with respect to face 82 when assembly 70 is in an assembled orientation, as illustrated in FIG. 7. Faces 82, 86 are in facing relation with each other. The gold material may be plated on or otherwise adhered with parts 72, 74.
A microwave transmission line 88 is carried upon a substrate 89 on an upper surface 83 of part 74. Screw fasteners 90, 92 cooperate with parts 72, 74 to urge parts 72, 74 with a pressure force P indicated by an arrow 94. Elevating temperature of assembly 70 while screwing screw fasteners 90, 92 to apply pressure force P between parts 72, 74 applies a compression force between faces 82, 86 sufficient to affect gold diffusion or cold welding as described earlier herein in connection with FIGS. 3-6 where faces 82, 86 abut. An alternate embodiment of assembly 70 may provide for a gold ribbon member 98 situated between faces 82, 86.
Assembly 70 advantageously employs the phenomenon of gold diffusion or cold welding for establishing a substantially continuous electrical interface between faces 82, 86 with strong physical properties resisting separation of parts 72, 74. An alternate embodiment of assembly 70 (using ribbon member 98) employs the previously avoided prior art practice of placing gold ribbons between parts, such as between a carrier-to-housing interface (FIGS. 1-2) to advantageously enhance electrical and physical properties of a bond between the parts.
Assembly 70 employs a high purity gold plating (e.g., AMS B 488 Type 3; purity=99.90%) for gold layers 80, 82. Prior art practice preferred using gold plating having a lesser purity (e.g., AMS B 488 Type 2; purity=99.0%) in order to avoid the occurrence of gold diffusion or cold welding. Type 3 gold is a high purity gold plating having substantially no brighteners or additives. When employed, ribbon member 98 is preferably a high purity gold ribbon (e.g., AMS B 488 Type 3; purity=99.90%). A preferred thickness for ribbon member 98 is generally in the range of 0.001 to 0.0005 inches. This preferred combination of materials for configuring assembly 70 encourages occurrence of gold diffusion or cold welding when the parts 82, 84 and (if employed) ribbon member 94 are joined I an interface structure during a bolting down process, such as by tightening screw fasteners 90, 92. Performing temperature cycling or providing elevated temperature while effecting a bolting down process will assist or accelerate the gold diffusion or cold welding process. Once gold diffusion or cold welding has occurred, the interface between parts 72, 74 will not have significant intermittent contact as temperature changes or vibration occur, thereby establishing a robust microwave ground interface connection.
In an alternate embodiment of assembly 70, lesser purity gold plating (e.g., Type 2) may be plated on one or more of parts 82, 86 so long as ribbon member 98 is configured using high purity gold ribbon (e.g., Type 3) is gap welded to the surface of the part or parts 82, 86 plated with lesser purity gold. Ribbon member 98 used in assembly 70 may be in a fully annealed condition (preferred), an intermediately annealed condition or a full hard condition.
Surface preparation of faces 82, 86 (and when used, ribbon member 98) prior to the diffusion bonding process is preferred in order to clean off contaminating material that may be present at the interface between parts 72, 74 that is to be diffusion bonded. Contaminants may act as diffusion barriers and reduce the effectiveness or completeness of the diffusion bonding or cold welding process.
Once assembly 70 is bolted down to apply pressure P to the interface between parts 72, 74, assembly 70 is preferably allowed to thermally age at an elevated temperature to allow gold diffusion or cold welding to take place.
FIG. 8 is a flow chart illustrating the method of the present invention. In FIG. 8, a method 100 for establishing a substantially continuous electrical interface between a first expanse of a first electrical part and a second expanse of a second electrical part begins at a START locus 102. Method 100 continues with the step of, in no particular order: (1) adhering a first layer of substantially pure gold material to at least a portion of the first expanse, as indicated by a block 104; and (2) adhering a second layer of substantially pure gold material to at least a portion of the second expanse, as indicated by a block 106. Method 100 continues by urging the first expanse and the second expanse together, as indicated by a block 108. Method 100 terminates at an END locus 110.
It is to be understood that, while the detailed drawings and specific examples given describe preferred embodiments of the invention, they are for the purpose of illustration only, that the apparatus and method of the invention are not limited to the precise details and conditions disclosed and that various changes may be made therein without departing from the spirit of the invention which is defined by the following claims: