Number | Name | Date | Kind |
---|---|---|---|
2694245 | Rogers et al. | Nov 1954 | |
2817886 | Tobler et al. | Dec 1957 | |
2939199 | Strivens | Jun 1960 | |
3266893 | Duddy | Aug 1966 | |
4196011 | Koike | Apr 1980 | |
4197118 | Wiech | Apr 1980 | |
4283360 | Henmi | Aug 1981 | |
4554218 | Gardner et al. | Nov 1985 | |
4661315 | Wiech, Jr. | Apr 1987 | |
4765950 | Johnson | Aug 1988 | |
4783297 | Ito et al. | Nov 1988 | |
4948426 | Kato et al. | Aug 1990 | |
4968460 | Thompson | Nov 1990 | |
4983354 | Reeder et al. | Jan 1991 | |
5014763 | Frank | May 1991 | |
5043014 | Flochel | Aug 1991 | |
5047182 | Sundback et al. | Sep 1991 | |
5059388 | Kihara et al. | Oct 1991 | |
5080846 | Kim et al. | Jan 1992 |
Number | Date | Country |
---|---|---|
61-10050 | Jan 1986 | JPX |
Entry |
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Cowan, Epoxy Resins as Temporary Binders for Ceramics Ceramic Bulletin, vol. 45, May 1966, pp. 535-538. |
Congress Guide 1992 Powder Metallurgy; Powder Injection Molding Symposium Abstracts; A New Solid Polymer Solution Binder for Powder Injection Molding; M. Y. Cao, C. I. Chung, J. W. O'Connor Rensselaer Polytechnical Institute. |
A New Water Soluble Solid Polymer Solution Binder For Powder Injection Molding, M. Y. Cao, J. W. O'Connor and C. I. Chung Material Engineering Department; Rensselaer Polytechnic Institute Troy, N.Y. Publication date unknown. |