Claims
- 1. A process for catalytically oxidizing the H.sub.2 S present at a low concentration in a gas to sulphur, which comprises subjecting, prior to the oxidation of the H.sub.2 S, a catalyst for selectively oxidizing H.sub.2 S to sulphur comprised of a support based on silicon carbide associated with the catalytically active phase containing at least one metal existing in the oxide form or in the elemental state or both to an activation treatment and contacting said gas containing H.sub.2 S with a gas containing free oxygen, in a quantity such as to provide an O.sub.2 :H.sub.2 S molar ratio ranging from 0.05 to 10, with the catalyst, wherein said contacting occurs below 500.degree. C., the activation treatment being carried out by contacting the oxidation catalyst with a gas mixture containing H.sub.2 S and an inert gas, while operating at temperatures between 250.degree. C. and 400.degree. C. and for a period of time of between 1 hour and 15 hours, to provide maximum sulphurization of the metal of the active phase of the catalyst.
- 2. The process according to claim 1, wherein the active phase of the oxidation catalyst comprises at least one transition metal, wherein the metal is in the oxide, and/or in the elemental state.
- 3. The process according to claim 2 wherein the transition metal is selected from the group consisting of nickel, cobalt, iron, copper, silver, manganese, molybdenum, chromium, titanium, tungsten and vanadium.
- 4. The process according to claim 1, wherein the silicon carbide support of the oxidation catalyst forms at least 40% by weight of the catalyst.
- 5. The process according to claim 4 wherein the silicon carbide support of the oxidation catalyst forms at least 50% by weight of the catalyst.
- 6. The process according to claim 5 wherein the active phase of the catalyst is between 0.2 to 7% of the weight of the catalyst.
- 7. The process according to claim 1, wherein the active phase of the oxidation catalyst, expressed as weight of metal, represents 0.1 to 20% of the weight of the catalyst.
- 8. The process according to claim 7 wherein the active phase of the oxidation catalyst, expressed as weight of metal, represents 0.2 to 15% of the weight of the catalyst.
- 9. The process according to claim 1, wherein the specific surface of the catalyst, determined by the BET nitrogen adsorption method, has a value ranging from 2 m.sup.2 /g to 600 m.sup.2 /g .
- 10. The process according to claim 1, wherein the gas containing free oxygen is in a quantity such as to provide an O.sub.2 :H.sub.2 S molar ratio ranging from 0.1 to 7.
- 11. The process according to claim 10 wherein the gas containing free oxygen is in a quantity such as to provide an O.sub.2 :H.sub.2 S molar ratio ranging from 0.2 to 4.
- 12. The process according to claim 1, wherein the contact time of the gaseous reaction mixture with the oxidation catalyst, ranges from 0.5 second to 20 seconds.
- 13. The process according to claim 12 wherein the contact time is between 1 second and 12 seconds.
- 14. The process according to claim 1, wherein the oxidation of H.sub.2 S in contact with the catalyst is carried out at a temperature between 30.degree. C. and 500.degree. C.
- 15. The process according to claim 14, wherein the oxidation of H.sub.2 S in contact with the catalyst is carried out at a temperature between 180.degree. C. and 500.degree. C.
- 16. The process according to claim 15 wherein the oxidation is carried out at a temperature between 200.degree. C. and 900.degree. C.
- 17. The process according to claim 14, wherein the oxidation of H.sub.2 S in contact with the catalyst is carried out at a temperature below the dew point of the sulphur formed by the oxidation, the temperature being in the range of 30.degree. C. to 180.degree. C.
- 18. The process according to claim 17, wherein the sulphur-laden oxidation catalyst is periodically subjected to regeneration by purging with a gas, the operation being carried out at a temperature between 200.degree. C. and 500.degree. C., to vaporize the sulphur retained on the catalyst, and the regenerated catalyst is then cooled to a temperature below the dew point of the sulphur for a new implementation of the oxidation of H.sub.2 S, the cooling being carried out with a gas which is at a temperature below 180.degree. C.
- 19. The process according to claim 18 wherein the regeneration temperature is between 230.degree. C. and 450.degree. C.
- 20. The process according to claim 17 wherein the oxidation is carried out a temperature between 80.degree. C. to 160.degree. C.
- 21. The process according to claim 1, wherein the H.sub.2 S content of the gas to be treated is between 0.001% and 25% by volume.
- 22. The process according to claim 21 wherein the H.sub.2 S content of the gas to be treated is between 0.01% to 20% by volume.
- 23. The process according to claim 1, wherein the reaction for oxidizing H.sub.2 S is implemented in Claus stoichiometry by bringing the gas to be treated containing H.sub.2 S into contact, in the presence of the oxidation catalyst containing a silicon carbide support and at temperature between 200.degree. C. and 500.degree. C., with a controlled quantity of the gas containing free oxygen, in order to form a gaseous effluent containing H.sub.2 S and SO.sub.2 in an H.sub.2 S:SO.sub.2 molar ratio which is substantially equal to 2:1 and a quantity of sulphur, and bringing the gaseous effluent, after cooling, into contact with a Claus catalyst in order to form a new quantity of sulphur.
- 24. The process according to claim 23 wherein the temperature of contact is between 350.degree. C. and 500.degree. C.
- 25. A process for catalytically oxidizing the H.sub.2 S present at a low concentration in a gas to sulphur, which comprises contacting the said gas containing H.sub.2 S with a gas containing free oxygen, in a quantity such as to provide an O.sub.2 :H.sub.2 S molar ratio ranging from 0.05 to 10, with a catalyst for selectively oxidizing H.sub.2 S to sulphur comprised of a support based on silicon carbide in association with a catalytically active phase containing at least one metal existing in the form of a metal oxide in the elemental state or both, the oxidation of the H.sub.2 S in contact with the catalyst being carried out at a temperature ranging from 90.degree. C. to 140.degree. C. the sulphur formed by said oxidation being deposited on the catalyst.
- 26. The process according to claim 25, wherein the metal of the active phase of the oxidation catalyst is a transition metal selected from the group consisting of nickel, cobalt, iron, copper, silver, manganese, molybdenum, chromium, titanium, tungsten and vanadium.
- 27. The process according to claim 25, wherein the silicon carbide support of the oxidation catalyst forms at least 40% by weight of the catalyst.
- 28. The process according to claim 27, wherein the silicon carbide support of the oxidation catalyst forms at least 50% by weight of the catalyst.
- 29. The process according to claim 25, wherein the active phase of the oxidation catalyst forms at least 20% of the weight of the catalyst.
- 30. The process according to claim 29, wherein the active phase of the oxidation catalyst forms at least 15% of the weight of the catalyst.
- 31. The process according to claim 29, wherein the active phase of the oxidation catalyst forms at least 7% of the weight of the catalyst.
- 32. The process according to claim 25, wherein the specific surface of the oxidation catalyst, determined by the BET nitrogen adsorption method, has a value ranging from 2 m.sup.2 /g to 600 m.sup.2 /g.
- 33. The process according to claim 25, wherein the gas containing free oxygen is in a quantity such as to provide an O.sub.2 :H.sub.2 S molar ratio ranging from 0.1 to 7.
- 34. The process according to claim 33, wherein the gas containing free oxygen is in a quantity such as to provide an O.sub.2 :H.sub.2 S molar ratio ranging from 0.2 to 4.
- 35. The process according to claim 25, wherein the contact time of the gaseous reaction mixture with the oxidation catalyst ranges from 0.5 second to 20 seconds.
- 36. The process according to claim 35, wherein the contact time is between 1 second and 12 seconds.
- 37. The process according to claim 25, wherein the sulphur-laden oxidation catalyst is periodically subjected to regeneration by purging with a gas, the operation being carried out at a temperature between 200.degree. C. and 500.degree. C., to vaporize the sulphur retained on the catalyst, and the regenerated catalyst is then cooled to a temperature below the dew point of sulphur for a new implementation of the oxidation of H.sub.2 S, the cooling being carried out at a temperature below 180.degree. C.
- 38. The process according to claim 37, wherein the regeneration temperature is between 230.degree. C. and 450.degree. C.
- 39. The process according to claim 25, wherein the H.sub.2 S content of the gas to be treated is between 0.001% and 25% by volume.
- 40. The process according to claim 39, wherein the H.sub.2 S content of the gas to be treated is between 0.001% and 20% by volume.
- 41. A process for catalytically oxidizing the H.sub.2 S present at a low concentration in a gas to sulphur, which comprises passing the said gas containing H.sub.2 S with a gas containing free oxygen, in a quantity such as to provide an O.sub.2 :H.sub.2 S molar ratio ranging from 0.05 to 10, in contact with a catalyst for selectively oxidizing H.sub.2 S to sulphur comprised of a support based on silicon carbide in association with a catalytically active phase containing at least one metal existing in the form of a metal compound and/or in the elemental state and selected from the group consisting of copper, silver, manganese and tungsten, and wherein the oxidation of the H.sub.2 S in contact with the catalyst is carried out at temperatures between 200.degree. C. and 500.degree. C.
- 42. The process according to claim 41, wherein the silicon carbide support of the oxidation catalyst forms at least 40% by weight of the catalyst.
- 43. The process according to claim 42, wherein the silicon carbide support of the oxidation catalyst forms at least 50% by weight of the catalyst.
- 44. The process according to claim 41, wherein the active phase of the oxidation catalyst forms at least 20% of the weight of the catalyst.
- 45. The process according to claim 44, wherein the active phase of the oxidation catalyst forms at least 15% of the weight of the catalyst.
- 46. The process according to claim 44, wherein the active phase of the oxidation catalyst forms at least 7% of the weight of the catalyst.
- 47. The process according to claim 41, wherein the specific surface of the oxidation catalyst forms at least 600 m.sup.2 /g.
- 48. The process according to claim 41, wherein the gas containing free oxygen is in a quantity such as to provide an O.sub.2 :H.sub.2 S molar ratio ranging from 0.1 to 7.
- 49. The process according to claim 48, wherein the gas containing free oxygen is in a quantity such as to provide an O.sub.2 :H.sub.2 S molar ratio ranging from 0.2 to 4.
- 50. The process according to claim 41, wherein the contact time of the gaseous reaction mixture with the oxidation catalyst ranges from 0.5 second to 20 seconds.
- 51. The process according to claim 50, wherein the contact time is between 1 second and 12 seconds.
- 52. The process according to claim 41, wherein the H.sub.2 S content of the gas to be treated is between 0.001% and 25% by volume.
- 53. The process according to claim 52, wherein the H.sub.2 S content of the gas to be treated is between 0.001% and 20% by volume.
- 54. The process according to claim 41, wherein the reaction for oxidizing H.sub.2 S is implemented in Claus stoichiometry by bringing the gas to be treated containing H.sub.2 S into contact, in the presence of the oxidation catalyst containing a silicon carbide support and at a temperature between 350.degree. C. and 500.degree. C., with a controlled H.sub.2 S quantity of the gas containing free oxygen, in order to form a gaseous effluent containing H.sub.2 S and SO.sub.2 in an H.sub.2 S:SO.sub.2 molar ratio which is substantially equal to 2:1 and a quantity of sulphur, and bringing the gaseous effluent, after cooling, into contact with a Claus catalyst in order to form a new quantity of sulphur.
- 55. A catalyst for selectively oxidizing H.sub.2 S to sulphur, comprising a catalytically active phase in combination with a support comprised of silicon carbide, said supporting representing at least 40% of the weight of the catalyst and the active phase containing at least one metal existing in the form of a metal oxide and/or in the elemental state and selected from the group consisting of copper, silver, manganese and tungsten, which catalyst has been activated by loading the metal of the active phase of the catalyst with sulphur at a temperature between 250.degree. C. and 400.degree. C. and under an inert atmosphere to produce its maximum sulphurization.
- 56. The activated catalyst of claim 55 where the loading of the metal of the active phase results from the exposure of the catalyst to elemental sulphur or a H.sub.2 S-containing gas mixture.
- 57. A process for catalytically oxidizing H.sub.2 S present at a low concentration in a gas to sulphur, which comprises subjecting, prior to the oxidation of H.sub.2 S, a catalyst for selectively oxidizing H.sub.2 S to sulphur comprised of a support based on silicon carbide associated with a catalytically active phase containing at least one metal existing in the oxide form or in the elemental state or both and selected from the group consisting of nickel, cobalt, copper, silver, manganese, molybdenum, chromium, titanium, tungsten and vanadium, to an activation treatment, and contacting the said gas containing H.sub.2 S with a gas containing free oxygen, in a quantity such as to provide an O.sub.2 :H.sub.2 S molar ratio ranging from 0.05 to 10, with the catalyst, the activation treatment being carried out by contacting the oxidation catalyst with sulphur, in a quantity representing up to 300 mol % excess of the quantity corresponding to the maximum sulphurization of the metal of the active phase of the catalyst, the said contacting being performed under an inert atmosphere and at temperatures of between 250.degree. C. and 400.degree. C.
Parent Case Info
This application is a national stage filing under 35 U.S.C. 371 of PCT/FR95/01524, filed Nov. 20, 1995.
PCT Information
Filing Document |
Filing Date |
Country |
Kind |
102e Date |
371c Date |
PCT/FR95/01524 |
11/20/1995 |
|
|
11/19/1997 |
11/19/1997 |
Publishing Document |
Publishing Date |
Country |
Kind |
WO97/19019 |
5/29/1997 |
|
|
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