This invention relates generally to temperature variation compensation in electrical circuits.
Patents and Published Applications
Most electrical components implemented in integrated circuits (ICs), and in particular in analog ICs, change their electrical characteristic in response to temperature changes. That is, changes in the temperature increase the uncertainties at electrical interfaces performance that result from the current and voltage relationship that varies with respect to the temperature.
In the related art the principles of the relationship between temperature and current/voltage are well understood. However, techniques for compensating for temperature variations are not well implemented in electrical components other than transistors or diodes junctions. Components requiring better temperature compensation solutions include, for example, laser diodes, oscillators, limited amplifiers, operation amplifiers, buffers, and the likes. These components are generally integrated in ICs that are designed to operate over a wide range of temperatures, extending from −40° C. to 120° C. Temperature compensation becomes even more important in circuits requiring a high level of integration or low cost and highly reproducible implementation.
Compensating for temperature allows the stable operation of electronic components over variations in temperature and is typically achieved by means of temperature compensation circuits. One of the problems associated with such circuits is that temperature compensation circuits themselves are subject to temperature related performance changes. Furthermore, many conventional temperature compensation circuits depend on the adjustment of on-chip resistors to achieve the proper variation in the temperature coefficient of a current. These circuits are often used for circuit biasing rather than as reference current that can stabilize the operation of electric components such as those mentioned above.
It would be therefore advantageous to provide a solution that overcomes the limitations of conventional temperature compensation circuits.
The present invention provides a temperature compensation circuit implementing a temperature programmable dependency current source. One of the objectives of the disclosed circuit is compensating for temperature in analog electric components including, but not limited to, oscillators, limiter amplifiers, operational amplifiers, output buffers, laser diodes, analog-to-digital converters, sample-and-hold devices, and the likes.
Thus according to a first aspect of the invention there is provided a programmable temperature compensation circuit for providing a temperature dependent current source, said circuit comprising:
a bandgap circuit for generating a first voltage reference signal, VREF that is independent of temperature and a second voltage signal, VTEMP that is temperature-dependent;
a buffer amplifier having a pair of inputs coupled to the bandgap circuit for effecting impedance transformation between said inputs and respective outputs thereof;
a temperature dependent difference current (TDDC) coupled to the outputs of the buffer amplifier and being responsive to a first voltage signal and a second voltage signal at the respective outputs of the buffer amplifier for producing a temperature dependent current that is a function of a difference between the first voltage signal and the second voltage signal; and
a current amplifier coupled to the TDDC for adjusting a baseline current at room temperature and the temperature dependency slope of the temperature dependent current.
According to a second aspect of the invention there is provided a method for providing a programmable temperature dependent current source, the method comprising:
generating a first voltage signal independent of temperature;
generating a second voltage signal dependent on temperature;
converting the first voltage signal to a first current signal;
converting the second voltage signal to a second current signal; and
creating a temperature dependent current by subtracting the second current signal from the first current signal.
In order to understand the invention and to see how it may be carried out in practice, an embodiment will now be described, by way of non-limiting example only, with reference to the accompanying drawings, in which:
a to 3c are graphs depicting the adjustment of a temperature dependency slope;
The bandgap circuit 110 generates two voltage signals VREF and VTEMP provided at outputs 101 and 102 respectively. VREF is a stable voltage reference with regard to temperature, power supply and process corners. Process corners describe worst case variations in terms of temperature, voltage, pMOS speed and nMOS speed. If a design properly operates in all corners, it will probably work for any variation. Bandgap circuit 110 is typically adapted to use the temperature coefficients associated with physical properties of the semiconductor devices disposed therein to generate a nearly temperature-independent reference voltage. Bandgap circuit 110 operates on the principle of compensating the negative temperature coefficient of the base-emitter voltage (VBE) of a bipolar transistor with the positive temperature coefficient of the thermal voltage (VT). In its most basic form, the VBE voltage is added to a scaled VT voltage using a temperature-independent scale factor to supply the reference voltage VREF. VTEMP is a voltage signal proportional to an absolute temperature but immune to variation in power supply and process corners. The bandgap circuit 110 generates the temperature-dependent voltage, VTEMP, using a temperature sensor (not shown) having the desired temperature-voltage dependency.
The VREF and VTEMP signals are fed to a buffer amplifier 120 which provides impedance transformation from high to low between the bandgap circuit 110 and the TDDC 130. The buffer amplifier 120 prevents the TDDC 130 from loading the bandgap circuit 110 unacceptably and interfering with its desired operation. In circuit 100 the VREF and VTEMP signals are transferred unchanged and the buffer amplifier 120 acts as a unity gain buffer. In accordance with one embodiment of the present invention the buffer amplifier 120 includes two operational amplifiers (Op-Amps), each of which is configured to operate as an integrator and is connected to one of the input voltage signals.
The TDDC 130 receives, at input 103, a voltage signal (VTI) independent of the temperature and at input 104 receives a voltage signal (VTD) dependent of the temperature and generates a current signal that is proportional to the difference between the signals VTI and VTD. The TDDC 130 includes voltage-to-current converters 132 and 134 which are respectively connected to the inputs 103 and 104 and are coupled to a subtractor 136. The converters 132 and 134 convert the voltage signals VTI and VTD into respective current signals ITI and ITD. The subtractor 136 subtracts the current signal ITD from the current signal ITI. The resulting difference current determines the work point, at room temperature, of an electrical component connected to an output 106 of the temperature compensation circuit 100. In other words, the difference current is a baseline current at room temperature of the component. The output of the subtractor 136 expresses the temperature dependency slope, ΔI/ΔT, at which the temperature dependent current (I) changes with respect to a change in the temperature (T). This is due to the fact that the subtractor 136 subtracts a constant current independent of the temperature with a current dependent on the temperature and having a negative slope. The electrical component connected to the output 106 includes, but is not limited to, oscillators, limiter amplifiers, operational amplifiers, output buffers, laser diodes, analog-to-digital converters, sample-and-hold circuits, and the likes.
Several non-limiting embodiments will be now be described to control the baseline current at room temperature and the temperature dependency slope ΔI/ΔT of this current. In a first embodiment, the temperature dependency slope ΔI/ΔT can be programmable by changing the resistance of the resistors 150 and 160. The resistance of each of the resistors 150 and 160 determines the value of a voltage signal (Vin) at an input 105 to the current amplifier 140. The current amplifier 140 generates an output current signal (Iout) proportional to the product of the input voltage signal (Vin) and the gain (Gm), i.e.,
Iout=Gm*Vin (1)
Therefore, by changing the value of Vin, the output current signal Iout is also changed.
In a second embodiment the temperature dependency slope ΔI/ΔT can be programmed by controlling the gain Gm of the current amplifier 140. As can be understood from equation (1), changing the gain Gm results in a different value of Iout. The gain may be externally controlled by a microcontroller or a dedicated circuit. In a third embodiment, the temperature dependency slope ΔI/ΔT can be programmed to a new value by performing asymmetrical current subtraction by means of the subtractor 136.
As a non-limiting example,
For example,
In accordance with another embodiment of the present invention the temperature compensation circuit can be designed to produce a plurality of compensation current signals (i.e., temperature dependency slopes). As shown in
In accordance with one embodiment of the present invention the temperature compensation circuits disclosed herein are implemented using a mixed signal CMOS process. In accordance with another embodiment of the present invention, the temperature compensation circuits can be integrated in an optical line terminal (OLT) or an optical network unit (ONU) of a passive optical network (PON).
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