Claims
- 1. a method for not contributing to an elevated glycemic index after consumption of a food product, wherein said method consists of:
(a) forming a food product comprising an amount of grain, wherein between 50% and 90% by weight of said food product used to form the product is a Prowashonupana barley flour constituent, whereby said food product is formed by extruding and cooking said grain at a temperature high enough to cook said grain; and, (b) consuming such food product.
- 2. The method of claim 1, wherein said Prowashonupana barley constituent comprises between 80% and 90% by weight of said food product.
- 3. The method of claim 1, wherein said food product comprises at least 50% of all food product consumed during a sitting.
- 4. The method of claim 1, wherein said method lowers RAG by at least 5%.
- 5. The method of claim 1, wherein a secondary grain is mixed with said Prowashonupana barley, whereby said secondary grain is selected from the group consisting of corn, wheat, barley, high amylose corn starch, potato, and soy.
- 6. A method for using Prowashonupana barley, whereby said method comprises:
(a) obtaining an amount of Prowashonupana barley and mixing said barley with grain constituents; and, (b) extruding and cooking said barley and grain constituent mixture at a temperature high enough to cook said mixture to form a ready-to-eat food product, which does not contribute to an elevated glycemic index.
- 7. The method of claim 6, wherein said Prowashonupana barley constituent comprises between 80% and 90% by weight of said food product.
- 8. A method of using a Prowashonupana barley constituent to produce a food product having a lower glycemic index, whereby said method comprises substituting said Prowashonupana barley constituent for flour used to form said food product, with said Prowashonupana substituted in an amount equal to at least 50% by weight of said food product and extruding said food product at temperatures high enough to cook said food product.
- 9. The method of claim 1, wherein said extrusion takes place at temperatures between about 66° C. to about 120° C.
- 10. The method of claim 6, wherein said extrusion takes place at temperatures between about 66° C. to about 120° C.
- 11. The method of claim 8, wherein said extrusion takes place at temperatures between about 66° C. to about 120° C.
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] The present application is a continuation-in-part of U.S. patent application Ser. No. 09/613,664, which was filed on Jul. 11, 2000.
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
09613664 |
Jul 2000 |
US |
Child |
10064312 |
Jul 2002 |
US |