Claims
- 1. A method for manufacturing a green compact, comprising:a step of filling material powder into a cavity formed of a die having in a vertical direction a die hole in a shape matching a contour of said green compact including a through-hole at a part connected continuously to a base part and a lower punch inserted from an underside of said die into said die hole; a step of obtaining a preform by temporarily compressing the material powder filled in said cavity by means of an upper punch inserted from an upside of said die into said die hole and said lower punch; a step of punching out a shape of said through-hole by inserting a punch-out pin having a shape corresponding to a cross-section of said through-hole into said preform; a step of obtaining said green compact by pressurizing and compressing said preform by means of both of said upper and lower punches in a state in which said punch-out pin is being inserted; a step of pulling out said punch-out pin from said green compact; and a step of taking out said green compact from said cavity.
- 2. A method for manufacturing a green compact according to claim 1, further comprising:a step of sintering said green compact taken out from said cavity; and a step of forming a pair of leg parts connected continuously at said base part and an undercut part formed between both of said leg parts by cutting off a part of a peripheral wall forming said through-hole of said sintered compact.
- 3. A method for manufacturing a green compact according to claim 2,wherein said through-hole includes a pair of parallel parts extending from said base part, said step of forming a pair of parallel leg parts connected continuously at said base part and an undercut part formed between both of said leg parts is performed by cutting off a part facing said base part from the peripheral wall which forms said through-hole.
- 4. A method for manufacturing a green compact according to any one of claim 1 to claim 3, further comprising:a step of retracting and storing the material powder, which is punched out in said step of punching out a shape of said through-hole by inserting a punch-out pin into said preform, outward of the cavity; a step of refilling the stored material powder into said through-hole from which said punch-out pin has been pulled out in said step of pulling out the punch-out pin from the green compact; and a step of removing the material powder refilled into said through-hole after said step of taking out said green compact from said cavity.
- 5. A device for manufacturing a green compact, comprising:a die having in a vertical direction a die hole in a shape matching a contour of the green compact including a through-hole at a part connected continuously to abase part; a lower punch inserted from an underside of said die into said die hole and forming a cavity to be filled with material powder together with said die, an upper punch inserted from an upside of said die into said die hole and pressurizing and compressing the material powder filled in said cavity together with said lower punch; a punch-out pin having a sectional shape corresponding to a cross-section of said through-hole, provided in said die to face said cavity, and inserted into a preform formed by temporarily compressing the material powder by means of both of said upper and lower punches to punch out a shape of said through-hole; and a refill pin having a sectional shape corresponding to the cross-section of said through-hole, provided in said die to face said cavity and to face said punch-out pin, moving backward in synchronization with forward movement of said punch-out pin when said punch-out pin is inserted into the preform, and moving forward in synchronization with backward movement of said punch-out pin when said punch-out pin is pulled out from the preform to refill the material powder into said through-hole.
Priority Claims (1)
Number |
Date |
Country |
Kind |
11/205144 |
Jul 1999 |
JP |
|
Parent Case Info
This application is the national phase under 35 U.S.C. §371 of PCT International Application No. PCT/JP00/04825 which has an International filing date of Jul. 18, 2000, which designated the United States of America.
PCT Information
Filing Document |
Filing Date |
Country |
Kind |
PCT/JP00/04825 |
|
WO |
00 |
Publishing Document |
Publishing Date |
Country |
Kind |
WO01/05541 |
1/25/2001 |
WO |
A |
US Referenced Citations (1)
Number |
Name |
Date |
Kind |
5403373 |
Kitagawa et al. |
Apr 1995 |
A |
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FR |
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GB |
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JP |
2-16879 |
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JP |
7-40094 |
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7-80695 |
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2000-71099 |
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