The present disclosure relates to a method and a device for piercing a workpiece by means of a laser beam and in particular to a method and a device for controlling a piercing process in laser material machining.
In a device for material machining using a laser, e.g. in a laser machining head for laser cutting, the laser beam emerging from a laser light source or one end of a laser optical fiber is focused or collimated on the workpiece to be machined by means of beam guiding and focusing optics. Typically, a laser machining head with collimation optics and focusing optics is used, with the laser light being supplied via an optical fiber, also referred to as a laser source.
Within the framework of laser material machining, in particular within the framework of laser cutting, a piercing process may be carried out on the workpiece by means of the laser beam. The piercing process takes place prior to the actual cutting process in laser cutting. In this process, an initial hole or puncture which serves as the starting point for the cutting process is created in the workpiece. The piercing process or piercing into the workpiece may therefore also be referred to as a penetrating process or penetrating through the workpiece. Since, for example, a subsequent laser cutting process cannot be started without piercing, successfully piercing through the workpiece plays an important role for laser cutting. The duration, quality and stability of the piercing process depend on a variety of process parameters. Above all, the duration of the piercing process, i.e. the time between the activation of the machining beam and the piercing breakthrough through the material or workpiece (also called breakthrough time or piercing duration), is a critical factor for the efficiency of the machining process. The duration of the piercing process depends on the rate of change of the piercing depth over time. The rate of change of the piercing depth over time is referred to as the piercing rate below and also reflects the process efficiency.
The prior art describes different piercing methods wherein the pulse frequency or the mean laser power within a piercing process is increased up to the piercing breakthrough in order to minimize the piercing duration or the breakthrough time for a given material thickness. U.S. Pat. No. 5,434,383 A describes a piercing method with shortened duration wherein the pulse frequency and relative pulse duty cycle are increased step by step during piercing. DE 11 2009 001 200 B4 also describes a laser machining method for piercing and subsequent cutting, starting with a first frequency for piercing and continuing with piercing at a second frequency greater than the first frequency. In U.S. Pat. No. 6,693,256 B2, on the other hand, the maximum laser power is increased step by step during piercing.
Trends towards higher laser power and greater sheet thicknesses or workpiece thicknesses make the piercing process more difficult and not only result in longer breakthrough times, but also more often in a piercing stop where the piercing rate approaches zero and, therefore, no piercing is possible.
It is an object of the present invention to provide a method and a device for piercing a workpiece by means of a laser beam (also called machining beam), by means of which a piercing process can be optimized, in particular for piercing thicker material or thick workpieces, for example with a thickness greater than 10 mm or even greater than 20 mm.
It is a further object of the present invention to provide a method and a device for piercing a workpiece by means of a laser beam, by means of which a piercing duration can be minimized or a piercing rate can be maximized.
It is a further object of the present invention to provide a method and a device for piercing a workpiece by means of a laser beam, by means of which reliable piercing can be ensured and a piercing stop can be prevented.
These objects are achieved by the features described herein. Features of preferred embodiments are described herein.
The present invention is based on the finding that a piercing process can be optimized by a targeted or controlled energy input of the laser beam into the machining zone, and in particular by the targeted or controlled reduction of a mean pulse power of the laser beam radiated into the machining zone during the piercing process. The energy input may be controlled as a function of at least one of the following process parameters and boundary conditions: material thickness, material type, instantaneous or current piercing time, instantaneous or current piercing depth, process gas type, process gas pressure, focal position, image scale of the optical system, nozzle type, nozzle diameter, intensity distribution of the laser beam, focus diameter and nozzle distance to the top of the workpiece. Based on the parameters mentioned, the energy input in the piercing hole or in the machining zone can be adjusted by the pulse on-time, pulse off-time and/or the pulse peak power depending on the current piercing time and/or piercing depth.
According to one aspect, a method for piercing a workpiece by means of a laser beam (also referred to as a machining beam) is specified. The method comprises: radiating a pulsed laser beam onto a workpiece to form a piercing breakthrough, wherein a radiated mean pulse power of the pulsed laser beam is reduced during the piercing or during a breakthrough time, e.g. at least once. The breakthrough time may refer to the duration of the piercing or the piercing process, i.e. a period of time from turning on or radiating the laser beam for the first time to a breakthrough though the workpiece. In other words, a method for piercing a workpiece by means of a pulsed laser beam comprises: a first piercing step, in which a pulsed laser beam with a first mean pulse power is directed or radiated onto a workpiece; and a second piercing step, in which the pulsed laser beam is directed or radiated onto the workpiece with a second mean pulse power, said first mean pulse power being greater than said second mean pulse power. The radiated mean pulse power is preferably reduced at least once during the piercing or during the breakthrough time. The radiated mean pulse power may be reduced discretely, i.e. in steps, or continuously, or in any combination of discrete and continuous changes. The radiated mean pulse power may be reduced several times during piercing or during the breakthrough time. Thus, more than two piercing steps may be carried out, each with different mean pulse powers, which are each lower than a mean pulse power in a preceding piercing step. The radiated mean pulse power may be constant during a piercing step. The radiated mean pulse power of the pulsed laser beam may be reduced monotonically or strictly monotonically during piercing. The radiated mean pulse power of the pulsed laser beam at the beginning of piercing or the piercing time may be greater than the radiated mean pulse power at breakthrough, i.e. at the end of piercing or the breakthrough time. A line of best fit or regression for the radiated mean pulse power preferably has a negative gradient during the breakthrough time, i.e. from the start of piercing to breakthrough. The radiated mean pulse power of the pulsed laser beam may be reduced by at least one of the following settings or changes: lengthening a pulse off-time, reducing a pulse peak power, shortening a pulse on-time, reducing a pulse frequency, and reducing a relative pulse duty cycle. In particular, the radiated mean pulse power may be reduced by varying the pulse on-time and the pulse off-time: For example, the pulse off-time and the pulse on-time may be lengthened when the pulse on-time is lengthened less than the pulse off-time. In another example, the pulse off-time and the pulse on-time may be shortened when the pulse on-time is shortened more than the pulse off-time. In another example, the pulse off-time may remain constant when the pulse on-time is shortened. When the radiated mean pulse power is reduced by lengthening the pulse off-time, the pulse peak power and/or pulse on-time and/or pulse-energy may be kept constant during the piercing or during the breakthrough time. In one embodiment, the method may have at least two piercing steps, the first mean pulse power in the first piercing step being greater than or equal to a mean limit pulse power and the second mean pulse power in the second piercing step being less than the first mean pulse power and/or than the mean limit pulse power. Optionally, the method may comprise a third piercing step in which a third mean pulse power is less than the second mean pulse power. The mean limit pulse power may refer to a mean pulse power from which on the piercing rate approaches zero or from which on a piercing stop occurs or from which on saturation during piercing occurs. The mean limit pulse power may be predetermined as a function of a material and/or a thickness of the workpiece.
According to a further aspect, a method for piercing a workpiece by means of a laser beam (also referred to as a machining beam) is provided. The method comprises: radiating a pulsed laser beam onto a workpiece to form a piercing breakthrough, wherein a pulse off-time of the pulsed laser beam is lengthened during piercing or during a breakthrough time, e.g. at least once. The breakthrough time may refer to the duration of the piercing or the piercing process, i.e. a period of time from when the laser beam is first turned on until breakthrough through the workpiece. In other words, a method for piercing a workpiece by means of a pulsed laser beam comprises: a first piercing step in which a pulsed laser beam with a first pulse off-time is directed or radiated onto a workpiece; and a second piercing step in which the pulsed laser beam with a second pulse off-time is directed onto the workpiece, the first pulse off-time being smaller than the second pulse off-time. The pulse off-time is preferably lengthened at least once during the piercing or during the breakthrough time. The pulse off-time of the pulsed laser beam may be lengthened discretely, i.e. step by step, or continuously, or also in any combination of discrete and continuous changes. The pulse off-time may be reduced several times during piercing or during the breakthrough time. Thus, more than two piercing steps may be performed, each with different pulse off-times, which are each longer than a pulse off-time in a previous piercing step. The pulse off-time may be constant during a piercing step. The pulse off-time may be increased monotonically or strictly monotonically during piercing. The pulse off-time of the pulsed laser beam at the start of the piercing or the breakthrough time may be less than the pulse off-time at breakthrough, i.e. at the end of the piercing or the breakthrough time. A line of best fit or regression for the pulse off-time during the breakthrough time, i.e. from the start of piercing to breakthrough, preferably has a positive slope. The pulse off-time of the pulsed laser beam may be lengthened by reducing a pulse frequency and/or reducing a relative pulse duty cycle. A pulse peak power and/or pulse on-time and/or pulse energy may be kept constant during piercing or during the breakthrough time. In one embodiment, the method may include at least two piercing steps, with the first pulse off-time in the first piercing step being less than or equal to a limit pulse off-time and the second pulse off-time in the second piercing step being greater than the first pulse off-time and/or the limit pulse off-time. Optionally, the method may include a third piercing step in which a third pulse off-time is greater than the second pulse off-time. The limit pulse off-time may refer to a pulse off-time below which the piercing rate approaches zero or a piercing stop occurs or saturation during piercing occurs. The limit pulse off-time may be predetermined as a function of a material and/or a thickness of the workpiece.
According to another further aspect, a method for piercing a workpiece by means of a laser beam (also called machining beam) is provided. The method comprises: radiating a pulsed laser beam onto a workpiece to form a piercing breakthrough, wherein a pulse frequency of the pulsed laser beam is reduced during piercing or during a breakthrough time, e.g. at least once. The breakthrough time may refer to the duration of the piercing or the piercing process, i.e. a period of time from when the laser beam is first turned on until breakthrough through the workpiece. In other words, a method for piercing a workpiece by means of a pulsed laser beam comprises: a first piercing step in which a pulsed laser beam with a first pulse frequency is directed or radiated onto a workpiece; and a second piercing step in which the pulsed laser beam with a second pulse frequency is directed onto the workpiece, the first pulse frequency being greater than the second pulse frequency. The pulse frequency is preferably reduced at least once during piercing or during the breakthrough time. The pulse frequency of the pulsed laser beam may be increased discretely, i.e. step by step, or continuously, or also in any combination of discrete and continuous changes. The pulse frequency may be reduced several times during piercing or during the breakthrough time. Thus, more than two piercing steps may be carried out, each with different pulse frequencies, each of which is lower than a pulse frequency in a preceding piercing step. The pulse frequency may be constant during a piercing step. The pulse frequency may be reduced monotonically or strictly monotonically during piercing. The pulse frequency of the pulsed laser beam at the start of piercing or the breakthrough time may be greater than the pulse frequency at breakthrough, i.e. at the end of piercing or the breakthrough time. A line of best fit or regression for the pulse frequency during the breakthrough time, i.e. from the start of piercing to breakthrough, preferably has a negative slope. The pulse frequency of the pulsed laser beam may be reduced by lengthening a pulse off-time. A pulse peak power and/or pulse on-time and/or pulse energy may be kept constant during piercing or during the breakthrough time. In one embodiment, the method may include at least two piercing steps, with the first pulse frequency in the first piercing step being greater than or equal to a limit pulse frequency and the second pulse frequency in the second piercing step being less than the first pulse frequency and/or the limit pulse frequency. Optionally, the method may include a third piercing step in which a third pulse frequency is less than the second pulse frequency. The limit pulse frequency may refer to a pulse frequency from which on the piercing rate approaches zero or from which on piercing stops or from which on saturation during piercing occurs. The limit pulse frequency may be predetermined as a function of a material and/or a thickness of the workpiece.
Each of these aspects may have one or more of the following characteristics:
Pulse parameters can include the radiated mean pulse power, the pulse off-time, the pulse on-time, the pulse frequency, the pulse period, the relative pulse duty cycle and/or the pulse peak power. At least one of the pulse parameters, selected from the group comprising the radiated mean pulse power, the pulse off-time, the pulse on-time, the pulse frequency, the relative pulse duty cycle and the pulse peak power, may be adjusted based on on a material and/or a thickness of the workpiece (also called material thickness) and/or on a current piercing time and/or on a current piercing depth. In particular, a first pulse frequency, a first mean pulse power and/or a first pulse off-time may be selected depending on the material and/or the thickness of the workpiece. A pulse frequency, a mean pulse power and/or a pulse off-time, in particular in a piercing step following the first piercing step, may be adjusted as a function of a current piercing time and/or a current piercing depth. In particular, at least one of the pulse parameters, selected from the group comprising the radiated mean pulse power, the pulse off-time, the pulse on-time, the pulse frequency, the relative pulse duty cycle and the pulse peak power, may be changed based on at least one of the thickness of the workpiece, the material of the workpiece, a type of process gas, a process gas pressure, a focal position, an imaging ratio of the optical system or the laser machining head, a focus diameter and a nozzle distance from the top of the workpiece, and as a function of the current piercing time and/or piercing depth.
The pulse on-time is preferably constant during piercing or during the breakthrough time. The pulse on-time may be adjusted based on a material or a thickness of the workpiece.
The pulse peak power is preferably constant during piercing or during the breakthrough time. The pulse peak power may be adjusted based on a material or a thickness of the workpiece.
A pulse energy is preferably constant during piercing or during the breakthrough time. In other words, the product of pulse peak power and pulse on-time may be set to be constant. The pulse energy may be adjusted based on a material or a thickness of the workpiece. Optionally, a minimum value for the pulse energy may be adjusted based on a material or a thickness of the workpiece.
Preferably, the duration of the individual piercing steps has different lengths. For example, a duration of a first piercing step may be longer than that of a subsequent, e.g., second or third, piercing step. Moreover, in the case of a discrete or stepwise change in the mean pulse power, the pulse off-time and/or the pulse frequency, a first change, i.e. a change from the first to the second piercing step, may be greater than a second change, i.e. a change from the second piercing step to a third piercing step.
In one embodiment, a pulse frequency used at the start of piercing and/or in the first piercing step may be greater than or equal to a limit pulse frequency. The limit pulse frequency may be predetermined based on the material and/or the thickness of the workpiece.
In one embodiment, a pulse off-time used at the start of piercing and/or in the first piercing step may be greater than or equal to a limit pulse off-time. The limit pulse off-time may be predetermined depending on the material and/or the thickness of the workpiece.
The pulse on-time, e.g. during the breakthrough duration, is preferably in a range between 0.01 ms and 100 ms (0.01 ms≤tan≤100 ms), in particular between 0.1 ms and 10 ms (0.1 ms≤tan≤10 ms). The pulse off-time, e.g. during the breakthrough duration, is preferably in a range between 0.01 ms and 100 ms (0.01 ms≤taus≤100 ms), in particular between 0.1 ms and 10 ms (0.1 ms≤taus≤10 ms).
Preferably, a pulse on-time or a pulse period of the pulsed laser beam, e.g., during the breakthrough duration, is in the range of microseconds or milliseconds. In this case, piercing may be achieved primarily by melting the workpiece. A fiber, disk or direct diode laser may be used. A wavelength of the pulsed laser beam is preferably in the range of 800 nm to 1300 nm.
The pulse frequency is preferably adjusted based on the thickness of the workpiece. With a workpiece thickness of 10 mm to 15 mm, the pulse frequency, e.g. during the breakthrough duration, may be in a range between 400 Hz and 3000 Hz (400 Hz≤f≤3000 Hz), in particular between 600 Hz and 1500 Hz (600 Hz≤f≤1500 Hz). Here the pulse frequency may be changed at least once during piercing. When the workpiece is thicker than 15 mm to 20 mm, the pulse frequency, e.g. during the breakthrough duration, may be in a range between 300 Hz and 2000 Hz (300 Hz≤f≤2000 Hz), in particular between 400 Hz and 900 Hz (400 Hz≤f≤900 Hz). Here the pulse frequency may be changed at least once during piercing. When the workpiece is thicker than 20 mm to 25 mm, the pulse frequency, e.g. during the breakthrough duration, may be in a range between 300 Hz and 1500 Hz (300 Hz≤f≤1500 Hz), in particular between 400 Hz and 800 Hz (400 Hz≤f≤800 Hz). Here the pulse frequency may be changed at least twice during piercing. When the workpiece is thicker than 25 mm, the pulse frequency, e.g. during the breakthrough duration, may be in a range between 200 Hz and 1000 Hz (200 Hz≤f≤1000 Hz), in particular between 400 Hz and 700 Hz (400 Hz≤f≤700 Hz). Here the pulse frequency may be changed at least twice during piercing.
The method may be used for piercing workpieces with a thickness of at least 10 mm, in particular with a thickness of at least 20 mm, for example with a thickness of 30 mm. A pulse peak power of the pulsed laser beam during piercing is preferably at least 4 kW and may in particular be greater than or equal to 6 kW.
The material can be a metallic workpiece. The workpiece may be made of metal or may include metal. The workpiece may comprise or be a metal sheet. Furthermore, a material of the workpiece or sheet metal may comprise or be at least one of a mild steel alloy, a stainless steel alloy, an aluminum alloy, a copper alloy, a brass alloy, mild steel, stainless steel, aluminum, copper and brass.
An inert process gas, e.g. nitrogen, argon or the like, is preferably directed at the workpiece during piercing. The process gas may hit the workpiece coaxially to the laser beam.
The method for piercing may be used for preparation of a laser cutting process. In other words, the method may further comprise: cutting the work piece by means of the laser, starting from the piercing breakthrough. Hence, according to an embodiment of the present invention, a method for laser cutting is further provided, comprising the method for piercing according to one of the embodiments described in this disclosure; and cutting by means of the laser beam, starting from the piercing breakthrough. During the (entire) method for piercing or during the (entire) piercing, the laser beam (also called machining beam) may be pulsed. During laser cutting, the laser beam is preferably used continuously. Of course, the same laser beam may be used for laser cutting and piercing, possibly with different parameters. In other words, the laser beam for piercing and the laser beam for laser cutting may come from the same laser source.
According to a further aspect, a device for laser material machining of a workpiece is provided. The device comprises a laser source for generating a laser beam; a laser machining head for radiating the laser beam onto a workpiece; and a control device configured to control the device, in particular the laser source and/or the laser machining head, in order to carry out a method for piercing according to one of the embodiments described herein.
Within the scope of this disclosure, the pulse off-time may be defined as the time of a pulse period in which the radiated power is below a predetermined threshold value, for example below 30% or 20% or 10% of a maximum laser power or a pulse peak power. In other words, within the scope of this disclosure, the pulse on-time may be defined as the time of a pulse period in which the radiated power is above a predetermined threshold value, for example above 30%, or 20%, or 10% of a maximum laser power or a pulse peak power.
Furthermore, within the scope of this disclosure, a pulse parameter, for example the radiated mean pulse power, a pulse peak power, a pulse frequency, a pulse period, a pulse off-time, a pulse on-time, a relative pulse duty cycle and/or a pulse energy, may be in a range of ±0.2 or ±0.1 times the mean value of this pulse parameter, rather than being constant.
Exemplary embodiments of the disclosure are shown in the figures and are described in more detail below. In the figures:
Unless otherwise stated, the same reference symbols are used in the following for the same elements and elements with equivalent effect.
The laser source 200 emits a laser beam 10, also called a machining beam, which is guided and focused onto the workpiece 1 by machining optics. The machining optics and/or the laser source 200 are connected to the control device 300. In addition to the control function, the control device 300 may also have an evaluation and/or calculation function. The machining optics may have transmitting and/or reflecting optical elements for beam guidance and beam shaping. Furthermore, the device for laser material machining may include a gas supply for supplying a process gas into a machining zone on the workpiece 1.
During piercing, the laser beam 10 is directed onto the workpiece 1 in a pulsed manner. A schematic overview of the pulse parameters is shown in
T=t
an
+t
aus
The pulse on-time tan denotes the time period of the laser pulse during which energy is radiated onto the workpiece 1. Correspondingly, the pulse off-time taus denotes the time span during which no or virtually no energy is radiated onto the workpiece 1. The reciprocal of the pulse period T is called the pulse frequency: f=1/T. The pulse frequency is therefore a function of both the pulse on-time and the pulse off-time. The relationship between pulse on-time and pulse period is referred to as the relative pulse duty cycle R: R=tan/T. The pulse peak power Ppeak may correspond to the maximum laser power provided by the laser source 200, hereinafter maximum laser power, Pmax. The radiated energy during a pulse, i.e. the so-called pulse energy, is calculated from the product of pulse peak power and pulse on-time:
E
Puls
=P
peak
×t
an.
Accordingly, the radiated mean pulse power is calculated from the product of the relative duty cycle and the pulse peak power or from the product of the pulse peak power and the pulse on-time and pulse frequency:
P
mittel
=P
peak
×R=P
peak
×t
an
×f=P
peak×(1−taus/(tan+taus)).
For the purposes of the present disclosure, not only the time of the pulse period during which no energy is radiated may be regarded as a pulse off-time, but also a time of the pulse period during which the radiated energy or the radiated power remains below a threshold value. Such a threshold value for the radiated power is shown in
According to the present disclosure, the control device 300 is configured to control an energy input into the machining zone or onto the workpiece 1 as a function of one or more of the following process parameters and boundary conditions: material thickness or workpiece thickness, material of the workpiece, current piercing time, current piercing depth, process gas type, process gas pressure, focal position, imaging ratio of the optical system, focus diameter and nozzle distance to the top of the workpiece. Based on at least one of the parameters mentioned, the energy input may be controlled by the pulse on-time (tan), pulse off-time (taus) and/or the pulse peak power (Ppeak) as a function of the current piercing time or piercing depth. By knowing the causal relationships in the process zone, it is possible to adjust the process parameters in a targeted manner and thus to increase process efficiency.
As a rule, the piercing rate (change in piercing depth over time) decreases with increasing piercing depth, and the breakthrough time, i.e. the time from the first radiation of the laser beam onto the workpiece until the breakthrough, increases with increasing piercing depth s.
In
According to the invention, in order to avoid a piercing stop while shortening the breakthrough time, the mean pulse power radiated onto the workpiece during piercing is reduced. In this way, the piercing rate can be maximized along the piercing depth and, at the same time, a breakthrough can be ensured. Several embodiments of the method for piercing according to the present disclosure are described below.
In the following, according to embodiments, a method for piercing a workpiece and a device for laser material machining with a control device configured to carry out this method are provided. According to embodiments, the mean pulse power radiated is reduced by lowering the pulse frequency during piercing. However, the present invention is not limited thereto. Alternatively, the mean pulse power radiated may be reduced, for example, by lengthening the pulse off-time and/or shortening the pulse on-time and/or reducing a relative duty cycle.
In the embodiment illustrated in
As an alternative to a stepwise or discrete decrease, the pulse frequency may be reduced in any combination of discrete and continuous decreases during the breakthrough time (see also
With regard to
In one embodiment, piercing at variable pulse frequency may occur with two changes in pulse frequency. The pulse frequency at the start of piercing and/or in the first piercing step is preferably greater than or equal to the limit pulse frequency for this workpiece, which may depend on the workpiece thickness and the workpiece material.
A further embodiment is shown schematically in
The value for the pulse on-time tan is preferably selected as a function of the workpiece thickness. In this case, the mean pulse power or the pulse frequency is reduced by increasing the pulse off-time taus, for example as a function of the piercing time (
In the embodiment shown in
In a further embodiment illustrated in
As mentioned above, the mean pulse power or the pulse frequency does not have to be decreased monotonically or strictly monotonically. Instead, the mean pulse power or the pulse frequency may be decreased in steps or stages, wherein the mean pulse power or the pulse frequency may move within a power band or pulse frequency band in each step. That is, during each step the mean pulse power or the pulse frequency lies within a band with a specified minimum value and a specified maximum value. The power band may be defined by a deviation of ±20%, in particular ±10%, of the average mean pulse power during the piercing step, step n. Similarly, the pulse frequency band may be defined by a deviation of ±20%, in particular ±10%, of the average pulse frequency fn during the piercing step, step n.
Likewise, the mean pulse power or the pulse frequency may be reduced continuously or quasi-continuously. It may be sufficient that the mean pulse power or the pulse frequency vary in a band which, on average, decreases over time (cf.
According to the embodiments of this disclosure, a method and a device for piercing a workpiece by means of a laser beam are provided, which minimize a breakthrough time or maximize a piercing rate while ensuring reliable piercing and preventing a piercing stop.
Number | Date | Country | Kind |
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10 2020 106 734.8 | Mar 2020 | DE | national |
This application is the U.S. National Stage of PCT/EP2021/055900 filed on Mar. 9, 2021, which claims priority to German Patent Application 102020106734.8 filed on Mar. 12, 2020, the entire content of both are incorporated herein by reference in their entirety.
Filing Document | Filing Date | Country | Kind |
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PCT/EP2021/055900 | 3/9/2021 | WO |