The present invention relates to improved method for welding thermoplastic resin articles, and more particularly relates to improvement in a method for welding thermoplastic resin articles via irradiation of infrared beam.
For welding of thermoplastic resin articles, ultrasonic welding and, high frequency welding have been known generally and used in practice.
In the case of ultrasonic welding, ultrasonic energy generated by ultrasonic oscillator is converted into friction heat due to mechanical vibration of a welding surface and the vicinity of the welding surface selectively generates heat for welding. In the case when the welding material is a soft resin, however, ultrasonic energy is much attenuated before arrival at the welding surface and, thereby, welding cannot be carried out easily in most cases.
In the case of high frequency welding, a resin film sandwiched between a metallic high frequency die and a support is instantly molded via dielectric loss in an alternate electric field to which high frequency is applied. In this case, the high frequency die is a metal having high thermal conductivity, heat on the thermoplastic film surface is effectively removed to keep the film surface at a low temperature and welding with small change in the surface configuration can be carried out. In this process, however, is in most cases unsuited for welding of low dielectric loss resin such as polyethylene resins, polypropylene resins, polystyrene resins, polyester resins and fluorine resins.
Infrared transparent welding has been proposed as a substitute for these processes. In the case of this process, infrared is used for irradiation source, two or more thermoplastic resin articles and an infrared transparent solid are superimposed to form a superimposed body and infrared beam is irradiated to the superimposed body from the side of the infrared transparent solid.
In the case of conventional infrared transparent welding, however, CO2 laser of 10 μm band has been used for the irradiation source but such irradiation source is unsuited for good welding of thick poly olefin resins (PE and PP) and, poly-fluoride hydro carbon resins (PFA, PTF etc).
Thermoplastic resin articles generally present high. absorption for infrared beams of 2 μm wavelengths and high transparency for wavelength lower than that. As a consequence, inorganic pigments such as carbon black or an organic colors of cyanine typed is added in order to increase absorption.
When infrared beam is irradiated in such a case, thermoplastic resin articles absorbs laser energy through the irradiated surface layer. The energy is attenuated in the internal regions of the superimposed body of thermoplastic resin articles. That is to say, it is necessary to raise the temperature of the infrared irradiating surface layer higher than the temperature of the interface temperature of the thermoplastic articles but this high temperature significantly degrades the surface configuration of the infrared irradiating surface of the thermoplastic article after welding due to melting deformation.
For improvement of such defects, the invention of the patent application 2003-541714 was proposed by the applicant of this application. This conventional art has a construction such as shown in
In the arrangement, a superimposed body against the infrared irradiation source 9 is formed by superimposition of infrared transparent solid 5, the first and second thermoplastic articles 3 and the support 1 and the superimposed body is compressed in the direction 7.
Temperature rise accompanying high infrared absorption in the infrared irradiating side surface layer of the first layer of the thermoplastic resin articles 3 is suppressed through high heat discharge to the infrared transparent solid 5 and high temperature region is developed near the interface between the thermoplastic articles 3. This maintains good surface configuration in the infrared irradiating side surface layer and interface welding can be performed within a vary short time.
It is one object of the present invention to provide infrared welding which assures good welding effects even in the case of thick ploy olefin resins (PE and PP) and, poly-fluoride hydro carbon resins (PFA, PTF etc).
It is another object of the present invention to avoid degradation of the surface configuration through thermal damages in the first surface layer of the superimposed body of the thermoplastic articles by infrared irradiation.
In accordance with one concept of the present invention, a support is provided, two or more thermoplastic resin. articles are superimposed on the support, an infrared transparent solid is further superimposed to form a superimpose body, and infrared beam is irradiated to the superimpose body from a irradiation source.
In accordance with another aspect of the present invention, a plurality of thermoplastic articles are superimposed against a support, an infrared transparent solid is superimposed to form a superimposed body and infrared is irradiated to the superimposed body from the side of the infrared transparent solid. For the irradiation source, an Er: YAG laser or fiber laser is used. The interface temperature of the thermoplastic article becomes relatively lower and a high temperature region can be developed within the superimposed body due to the infiltration of laser energy. As a result, degradation of the surface configuration due to thermal damages in the infrared irradiation side surface layer of the thermoplastic articles can be suppressed.
In one preferred embodiment, CO laser is used for the irradiation source.
The interface temperature of the thermoplastic resin articles in contact with infrared transparent solid becomes relatively high and higher temperature internal region is developed due to transmitted infrared energy. As a result, degradation of the surface configuration due to thermal damages on the infrared irradiating side surface of the thermoplastic resin articles is controlled and a welding layer can be developed with short time heating and cooling.
The basic construction of the system for implementation of the welding method in accordance with the present invention is shown in
The support 1 used for the present invention is expected to maintain stable contact of the infrared transparent solid 5, the thermoplastic resin articles 3 and the molting surfaces. Any materials of any configurations can be used for the support 1 as long as it has such a function. For example, metallic blocks and plates of aluminum, aluminum alloys and copper alloys with little plastic deformation by application of compression, and moderate hardness.
Further, the support 1 may have an infrared irradiating side surface made of a rubber buffer layer. There are cases in which defects such as voids, breakages and significant shrinkages develop in the welding region due to insufficient physical contact (contact surface area and pressure) between the infrared transparent solid 5, thermoplastic resin articles 3 and welding surfaces. In such cases, presence of the rubber buffer layer on the infrared irradiating side surface of the support 1 improves physical contact between the infrared transparent solid, 5, thermoplastic resin articles 3 and the welding surfaces and suppresses development of defects such a voids, breakages and significant shrinkages after welding.
The infrared transparent solid 5 is preferably made of infrared crystal materials having a thermal conductivity of 15 w/m·K or higher such as zinc selenide (ZnSe), zinc sulfide (ZnS), silicon (Si), germanium (Ge), sapphire (Al2O3) and gallium arsenide (GaAs).
The thermoplastic resin articles suited for infrared welding in accordance with the present invention includes thermoplastic resin articles difficult to be molded by the conventional welding processes, i.e. thermoplastic articles unsuited for high frequency welding and ultrasonic welding due to low dielectric loss and softness and thermoplastic articles with low dielectric loss in high frequency band and high in melting point. Such thermoplastic articles include olefin type thermoplastic elastomers as the former and fluorine type resins and liquid crystal polymers as the latter.
When CO laser is used for infrared irradiation source, the temperature distribution assumes low value at the interface between the infrared transparent solid 5 and the thermoplastic resin articles 3 and the highest value at the interface of the both thermoplastic resin casings (weldings surface). That is, a high temperature internal region can be developed due to transmitted infrared energy.
As a result, while surface degradation such as significant shrinkages, breakages, and thermal decomposition is much suppressed, welding layer with short time heating and cooling can be obtained. In the illustration, the nicking temperature of the welding surface is indicated with 15.
When the thermoplastic resin articles 3 on the infrared irradiation side is thick as shown in
So, the wavelength of the CO laser is set to 5μ band. As a result, the temperature distribution in the thermoplastic resin articles assumes the condition shown with a solid line in the illustration, a high temperature region is developed inside near the welding surface 13a and welding of a thick thermoplastic resin article surface layer becomes possible.
The interface temperature of the thermoplastic resin article in contact with infrared transparent solid lowers relatively, high temperature region. can be developed within the superimposed body by the transmitted energy. As a result, surface degradation caused by thermal, damages on the infrared irradiated surface of the thermoplastic resin article.
As shown with an arrow 7, the superimposed body is compressed to make close contact with the elements 1, 3 and 5 forming the superimposed body. Next, the superimposed body is irradiated with infrared beam from a source on the infrared transparent solid 5.
In the present invention, the support 1 is used for maintaining stable contact of the infrared transparent solid 5, the thermoplastic resin article 3 and welding thermoplastic resin. A support 1 of any configuration and materials can be employed as long as the function is developed. For example, a metallic block or plate of steel, aluminum alloys and copper alloys, which develop little plastic deformation and have proper rigidity, can be employed.
Further, the support 1 may be provided with a rubber buffer layer on the infrared irradiated surface. There is a case which develops defects such as significant shrinkage when. the thermoplastic resin articles 3 are in sufficient physical contact. In such a case, the physical contact is improved by use of the rubber buffer for the infrared irradiated surface of the support 1. This suppresses development of defects such as void breakage and significant shrinkage.
For the infrared transparent solid 5, zinc selenide (ZnSe), zinc sulfide (ZnS), silicon (Si), germanium (Ge), sapphire (Al2O3) and arsenic kalium, which have thermal conductivity of 15 w/m·k or higher, can be used.
The thermoplastic resin articles suited for welding of the present invention includes thermoplastic resins unsuited for the conventional welding. They are thermoplastic resin articles which are low in dielectric loss in high frequency region and soft. They are unsuited for high frequency ultra sonic weldings. For example, olefin type thermoplastic elastomers, fluoride resins, liquid crystal polymers, poly carbonate and polyamides.
That is, surface degradation by thermal damages on said surface can be avoided.
When thick in configuration, infiltration of infrared energy into the superimposed body is small. and the temperature at the thermoplastic resin article surface does not rise. In addition, infiltration in 3 μm band is by far larger than the case of 10.6 μm. Moderate absorption is also exhibited. In the case of Er:YG laser employed by the present invention, oscillating wavelength is present near 3 μm band. Infrared energy infiltration into the superimposed body can be maintained. This raised the temperature of the thermoplastic resin article border.
This can be broadly utilized in welding of thermoplastic resin article.
Number | Date | Country | Kind |
---|---|---|---|
2008-24716 | Feb 2008 | JP | national |
2008-179709 | Jul 2008 | JP | national |
Number | Date | Country | |
---|---|---|---|
Parent | 12361565 | Jan 2009 | US |
Child | 14163138 | US |