The present invention relates generally to photovoltaic device and manufacturing method. More particularly, the present invention provides a method and device structure for a bifacial thin film photovoltaic cell. Embodiments of the present invention include a method for forming a bifacial thin film photovoltaic device utilizing strain field in anode and Fermi level pinning to modify internal electric field for enhancing cell efficiency. One application for the invention is a device utilizing a strained AZO layer as an interface between a PV absorber and an anode layer for enhancing hole collection.
From the beginning of time, mankind has been challenged to find ways of harnessing energy. Energy comes in forms such as petrochemical, hydroelectric, nuclear, wind, biomass, solar, wood and coal. Over the past century, modern civilization has relied upon petrochemical energy as an important energy source. Petrochemical energy includes gas and oil. This includes lighter forms such as butane and propane, commonly used to heat homes and serve as fuel for cooking, as well as gasoline, diesel, and jet fuel, commonly used for transportation purposes. Heavier forms of petrochemicals can also be used to heat homes. Unfortunately, the supply of petrochemical fuel is limited and essentially fixed based upon the amount available on earth. As more people use petroleum products in growing amounts, it is rapidly becoming a scarce resource.
Environmentally clean and renewable energy is desirable. An example of a clean source of energy is hydroelectric power. Hydroelectric power is derived from electric generators driven by the flow of water produced by dams. Clean and renewable sources of energy also include wind, waves, biomass, and the like. Windmills convert wind energy into more useful forms of energy such as electricity. Still other types of clean energy include solar energy.
Solar energy technology generally converts electromagnetic radiation from the sun to other useful forms of energy. These other forms of energy include thermal energy and electrical power. For electrical power applications, solar cells are often used. Although solar energy is environmentally clean and has been successful to a point, many limitations remain to be resolved before it becomes widely used. As an example, one type of solar cell uses crystalline materials, which are derived from semiconductor material ingots. These crystalline materials can be used to fabricate optoelectronic devices that include photovoltaic and photodiode devices that convert electromagnetic radiation to electrical power. However, crystalline materials are often costly and difficult to make on a large scale. Other types of solar cells use “thin film” technology to form a thin film of photosensitive material to be used to convert electromagnetic radiation into electrical power. Similar limitations exist with the use of thin film technology in making solar cells. That is, efficiencies are often poor. Additionally, film reliability is often poor and cannot be used for extensive periods of time in conventional environmental applications. Often, thin films are difficult to mechanically integrate with each other. These and other limitations of these conventional technologies can be found throughout the present specification and more particularly below.
As an effort to improve cell efficiency of the thin film solar cell, processes for improving relative band alignment at the heterojunctions of the cell play important roles in enhancing final performance of the solar cells. There are various manufacturing challenges in choosing proper materials and structures for forming the thin film PV cell junction interfaces with proper electric field strength and direction. In particular, the band lineup between an absorber and an anode or between a window layer and a cathode through respective interfaces affects the carrier collection efficiency and build-in voltage of the cells. While conventional techniques in the past have addressed some of these issues, they are often inadequate in various situations. Therefore, it is desirable to have improved method and structure for designing the cell junction interface for the thin film photovoltaic devices.
This invention provides a method for forming a bifacial thin film photovoltaic cell. The method includes providing a glass substrate having a surface region covered by an intermediate layer and forming a thin film photovoltaic cell on the surface region. The thin film photovoltaic cell includes an anode overlying the intermediate layer, and an absorber layer over the anode. Furthermore, the cell includes a window layer and cathode over the absorber mediated by a buffer layer. The anode includes an aluminum doped zinc oxide (AZO) layer forming a first interface with the intermediate layer and a second interface with the absorber. The AZO layer is configured to induce Fermi level pinning at the first interface and a strain field from the first interface to the second interface.
In an alternative embodiment of the present invention, a thin film solar device utilizing a strained AZO layer for anode-absorber interface is provided. The device includes an optical transparent substrate and an intermediate layer overlying the transparent substrate. Additionally, the device includes an anode layer comprising an aluminum doped zinc oxide (AZO) layer forming a first interface with the intermediate layer. The device further includes an absorber comprising copper indium gallium diselenide with p-type dopant forming a second interface with the AZO layer. Furthermore, the device includes a buffer layer followed by a window layer overlying the absorber. Moreover, the device includes a cathode layer overlying the window layer. In a specific embodiment, the AZO layer utilized by the device induces a strain field in the anode layer and Fermi level pinning at the first interface for changing an internal electric field at the second interface.
Some embodiments of the present invention provide a method for modifying an internal electric field around anode-absorber interface using a combination of strain in anode and Fermi level pinning at the interface to diminish electric field strength or even flipping the internal electric field direction. The reduced internal electric field strength lowers the barrier for easier tunneling through by the carrier holes from the absorber to the anode. The flipped direction of the internal electric field at the interface between the absorber and the back electrode directly aids the hole collection by the n+-type anode from the p-type absorber.
An intermediate layer is placed between an AZO layer and the surface region of the substrate. The lattice mismatch between the AZO layer and the intermediate layer causes a strain in the anode, which changes the electric field at the interface between the anode and the absorber. At the interfaces between AZO layer and the intermediate layer or between AZO layer and the absorber, the electron band is modified by surface states and aligned via Fermi level pinning across the interfaces. Both the strain in the anode and Fermi level pinning can cause the internal electric field at the back electrode to diminish or even flip direction, which aid in the collection of holes at the back contact and thus improve cell efficiency.
Embodiments of the present invention provide a method and device structure for a bifacial thin film photovoltaic cell. They include a method for forming a bifacial thin film photovoltaic device utilizing a strain field in the anode layer and interface Fermi level pinning to modify the internal electric field at the anode-absorber interface, enhancing cell efficiency. A device utilizing an AZO layer as an interface between a PV absorber and an anode layer for enhancing hole collection is provided.
In another specific embodiment, the intermediate layer 105 is optically transparent to sunlight for facilitating the absorption from the back side of the cell. The intermediate layer 105 is preferably a transparent oxide layer made by materials selected from flourine doped tin oxide (TFO), indium tin oxide (ITO), and silicon dioxide (SiO2) or silicon nitride. In another specific embodiment, the intermediate layer 105 can become part of the back electrode of the cell 100 if a conductive material is selected and configured to form an electric contact for the anode of the cell. For example, thin films of transparent conductive oxide and/or metal (such as molybdenum) can be included in the intermediate layer 105. Additionally, the intermediate layer 105 can serve as a structural base layer for controlling strain field in a layer grown overlying itself by setting one side of interface with a lattice constant in a predetermined range. The layer formed on top of it may be formed under strain in a controllable manner due to lattice mismatch.
As shown in
Referring to
More detail descriptions about the thermal treatment process for forming the CIGS photovoltaic film stack of thin film solar cells can be found in U.S. Patent Application No. 61/178,459 titled “Method and System for Selenization in Fabricating CIGS/CIS Solar Cells” filed on May 14, 2009 by Robert Wieting, commonly assigned to Stion Corporation of San Jose and hereby incorporated by reference. In certain embodiments, the absorber 115 can be made of cadmium tellurium compound semiconductor with a p-type dopant. Of course, there can be other variations, modifications, and alternatives. For example, here the absorber is illustrated as a single junction structure, while it can be alternatively formed or variably repeated in cells with two or more junctions.
Over the absorber 115, the cell 100 includes a window layer 125. In a specific embodiment, a buffer layer 120 can be inserted between the window layer 125 and the absorber 115. The buffer layer 120 is n-type in electric characteristic while the window layer 125 is n+ type in electric characteristic. In an embodiment, the buffer layer 120 can be made of cadmium sulfide compound using chemical bath deposition (CBD) method. In another embodiment, the buffer layer can be made by zinc oxide using MOCVD method. The MOCVD method is used, instead of sputtering, to form the zinc oxide buffer layer so that possible structural damage of the second interface caused by sputtering technique can be substantially reduced. In a preferred embodiment, the window layer 125 is an AZO layer, with a thickness thinner than absorber 115. In certain embodiments, the window layer 125 can be used to form a cathode contact of the solar cell. Alternatively, an additional layer made of boron doped zinc oxide can be added using MOCVD method to form a front electric contact with n+ electric characteristic.
To configure the thin film solar cell, bifacial cell structure has been used with an intention for enhancing photon absorption from both sides of the absorber.
The present invention provides a method of modifying internal electric field using a back electrode structure comprising AZO material overlying an intermediate layer placed firstly on an surface region of a (transparent) substrate. The method includes utilizing lattice mismatch strain to modify the internal electric field across the anode-absorber interface.
The properties of thin films under stress are altered from their native unstressed state. For example, energy band alignment, carrier mobility, recombination rate of minority carrier, density of states, piezoelectric fields, etc. are changed by the strain within the film. By properly configuring the interface structures, the alternation of the above physical properties can be controlled as a function of the interface structures. This offers a basis for build a multi-layer thin film based photovoltaic junction that caters to desired solar device performance requirement. In particular, the carrier collection efficiency of thin film based solar cell can be enhanced by utilizing the strain in the anode to reduce the tunneling barrier for collecting holes from the absorber, according to an embodiment of the present invention. As shown in
The other effect that influences the choice of the materials and structures of the anode-absorber interface include a phenomena of Fermi-level pinning at the interface. The pinned surface can lower the diode and hence photovoltaic response of the cell, improving cell performance. Most semiconductors have broken dangling bonds at the surface that are chemically active. The non-symmetrical break in the crystal potential leads to the formation of mid-gap defect-like energy states that act as recombination centers. These surface states can be the determining factor in the position of the Fermi level (instead of the intrinsic carrier levels). The extent to which the Fermi level pins is determined by the density of such surface states, their capture cross sections and their position within the energy band. During the sequential formation of the thin film stack, the surface states substantially retained at the interfaces as upper layers overlay the under layer. Pinning of Fermi level by the interface states “freezes” the bands in the space charge region across the interface, i.e. it predetermines the band alignment and bending from the absorber to the anode regardless of the doping level of the either layer across the interface.
Secondly, the intermediate layer 105 formed over the glass substrate 101 sets a base layer for forming AZO layer 110, which can be utilized for better controlling lattice mismatch strain in the subsequently formed AZO layer 110 than directly placing the AZO layer over the glass substrate 101. In an embodiment, the material and thickness of the intermediate layer 105 are used as engineering parameters for tuning the strain field within the AZO layer 110. For example, an intermediate layer may include a material with an (average) lattice constant smaller than that of the AZO layer so that the overlying AZO layer is controlled to be in compression. The intermediate layer may include a material with a greater lattice constant so that the strain field in the overlying AZO layer may be turned into a tensile characteristic. The AZO layer can be formed by a sputtering technique using a zinc or zinc oxide target doped with aluminum. Alternatively, the AZO layer can be formed using an MOCVD method. The AZO layer 110 may include a heavily doped Al species ranging from 5×1019 cm−3 to 1×1021 cm−3.
Referring to
In an alternative embodiment, the internal electric field of anode layer can be altered by changing relative Zn and Oxygen composition near the second interface within the AZO layer. For example, when forming the zinc oxide or specifically AZO layer, the oxygen content in the sputtering work gas can be reduced or increased so that the sputtering formed ZnO or ZnO:Al can be Zn-rich or O-rich. In atomic level, the Zn atoms in Zn atom plane can be replaced by excessive Oxygen or the other way around. This can change the intrinsic strain, piezoelectric property, interface energy states and Fermi level pinning, and ultimately the internal electric field.
While the present invention has been described using specific embodiments, it should be understood that various changes, modifications, and variations to the method utilized in the present invention may be effected without departing from the spirit and scope of the present invention as defined in the appended claims. For example, utilizing AZO layer for back electric contact layer is illustrated as an example. Other transparent conductive layer that can be tuned in one way or other to change anode-absorber interface internal electric field and subsequently the carrier collection at the back electric contact for improving photo-electric conversion efficiency. Due to the nature of bifacial photovoltaic cell, it is important to have a control of the interface internal electric field by one or more material or structural parameters to enhance charge separation and improve carrier collection efficiency at both front and back electrode of the cell. Additionally, although the above embodiments described have been applied to absorber made by CdTe, or CIS and/or CIGS and capped by AZO layer for front and back electric contact in a film stack, other thin film based bifacial solar cell with single, double, or more junctions, certainly can also be benefited from the embodiments, without departing from the invention described by the claims herein.
This application claims priority to U.S. Provisional Application No. 61/319,557, filed Mar. 31, 2010, commonly assigned, and hereby incorporated by reference in its entirety herein for all purpose.
Number | Date | Country | |
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61319557 | Mar 2010 | US |