Patent Application
20130034213
The subject matter disclosed herein relates to X-ray imaging systems, and particularly to monitoring of mishandling of a digital X-ray detector of such systems.
The advent of digital X-ray detectors has brought enhanced workflow and high image quality to medical imaging. In the current state of the art medical imaging environments, X-ray imaging systems include an imaging subsystem and a detector. The imaging subsystem may be fixed or mobile and may use a detachable or wireless detector. The detachable or wireless X-ray detector makes the detector more portable for even greater versatility. However, with increased portability of the digital X-ray detectors comes a greater opportunity for mishandling of the detectors, potential damage to the detectors resulting from mishandling, and increased costs to warrantees of the detectors. Thus, there is a need for a system to monitor and report mishandling incidents that may result in damage to the detectors.
In accordance with one embodiment, a digital X-ray detector includes a shock monitoring system configured to monitor for an occurrence of a shock event via at least one shock sensor. The detector also includes a processor configured to receive information related to the shock event from the shock monitoring system and to report the shock event to an X-ray system communicatively coupled to the detector.
In accordance with another embodiment, an X-ray system includes an X-ray detector that includes a shock monitoring system configured to monitor for an occurrence of a shock event to the detector via at least one shock sensor and a main processor configured to receive information related to the shock event from the shock monitoring system and to report the shock event to an imaging system communicatively coupled to the detector. The X-ray system also includes the imaging system that includes a processor configured to receive the information related to the shock event and a display configured to provide a user-viewable warning of the shock event.
In accordance with a further embodiment, a method for analyzing mishandling of a digital X-ray detector includes detecting a shock event to the detector via a shock monitoring system. The method also includes analyzing the shock event to determine a severity of the shock event and reporting the shock event to an X-ray system communicatively coupled to the detector. The method further includes providing a user-viewable warning of the shock event to an operator of the X-ray system.
These and other features, aspects, and advantages of the present invention will become better understood when the following detailed description is read with reference to the accompanying drawings in which like characters represent like parts throughout the drawings, wherein:
Turning now to the drawings,
In the embodiment illustrated in
The imaging system 12 includes a source 16 of X-ray radiation positioned adjacent to a collimator 18. The collimator 18 permits a stream of radiation 20 to pass into a region in which an object or subject, such as a patient 22, is positioned. A portion of the radiation 24 passes through or around the subject and impacts the digital X-ray detector 14. As will be appreciated by those skilled in the art, the detector 14 may convert the X-ray photons received on its surface to lower energy photons, and subsequently to electric signals, which are acquired and processed to reconstruct an image of the features within the subject.
The radiation source 14 is controlled by a power supply/control circuit 26 which supplies both power and control signals for examination sequences. Moreover, the detector 14 is communicatively coupled to a detector controller 28 which commands acquisition of the signals generated in the detector 14. The detector controller 28 may also execute various signal processing and filtration functions, such as for initial adjustment of dynamic ranges, interleaving of digital image data, and so forth. The detector controller 28 is responsive to signals from a processor 30 communicated via a multi-conductor cable or tether via a wired communication interface 32 or communicate wirelessly via a wireless communication interface 34.
Both the power supply/control circuit 26 and the detector controller 28 are responsive to signals from the processor 30. In general, the processor 30 commands operation of the imaging system 12 to execute examination protocols and to process acquired image data. In addition, the processor 30 is configured to receive information related to the shock event from the detector 14 and to log the information in a log file. Further, the processor 30 is configured to perform the QAP to analyze the detector 14 for potential damage. In certain embodiments, the processor 30 is configured to inhibit an exposure from the source 16 (via the power supply/control circuit 26) in response to a high-level shock event (e.g., 150 G or greater) reported from the detector 14 until performance of the QAP verifies that the detector 14 is free of damage. Yet further, the processor 30 may report the high-level shock event to a warrantee service system and/or the condition (e.g., damage) of the detector 14 to a service system. In mobile imaging systems, the processor 30 also commands operation of a mobile drive unit 36 of a wheeled base. In the present context, the processor 30 also includes signal processing circuitry, typically based upon a programmed general purpose or application-specific digital computer; and associated memory circuitry, such as optical memory devices, magnetic memory devices, or solid-state memory devices. The memory circuitry allows for storing programs and routines executed by a processor of the computer to carry out various functionalities, as well as for storing configuration parameters and image data; interface circuits; and so forth.
In the embodiment illustrated in
The detector controller 28 is linked to a processor 48 (e.g., main processor). The processor 48, the detector controller 28, the shock monitoring system 42, and all of the circuitry receive power from a power source 50. The power source 50 may include a battery (e.g., rechargeable battery). Alternatively, the detector 14, including the power source 50, may receive power from a power supply of the imaging system 12 when tethered. The power source 50 is coupled to a power regulator 52 which determines the power state (e.g., active state and/or sleep state) of the processor 48 and components of the shock monitoring system 42 (e.g., microcontroller).
Also, the processor 48 is linked to detector interface circuitry 54. The detector 14 converts X-ray photons received on its surface to lower energy photons. The detector 14 includes a detector array 56 that includes an array of photodetectors to convert the light photons to electrical signals. Alternatively, the detector 14 may convert the X-ray photons directly to electrical signals. These electrical signals are converted to digital values by the detector interface circuitry 54 which provides the values to the processor 48 to be converted to imaging data and sent to the X-ray system 10 (e.g., imaging system 12) to reconstruct an image of the features within a subject. Alternatively, the imaging data may be sent from the detector 14 to a server to process the imaging data.
The processor 48 is also linked to an illumination circuit 58 and display 60. The processor 48, in response to information received from the shock monitoring system 42, may signal the illumination circuit 58 to illuminate a light 62 (e.g., light emitting diode (LED)) of the detector 14 to indicate a status of the detector 14. The detector controller 28, in response to a signal from the X-ray system 10 (e.g., imaging system 12) indicating damage to the detector 14, may send a signal to the processor 48 to signal the illumination circuit 58 to illuminate the light 62 to indicate the status of the detector 14. For example, the status may indicate the occurrence of the shock event and/or damage to the detector 14. Also, the light 62 may illuminate different colors representative of the severity of the shock event and/or the damage to the detector 14. Thus, the illumination of the light 62 may act a user-viewable warning. In certain embodiments, the processor 48 may also provide the status of the detector 14 (e.g., user-viewable warning) via the display 60 (e.g., LCD display). Examples of warnings displayed on the display 60 are discussed in greater detail below.
Further, the processor 48 is linked to a memory 64. The memory 64 may store various configuration parameters, calibration files, and detector identification data. The memory 64 may also store information received from the shock monitoring system 42 such as peak shock values and a timestamp associated with each shock event. In addition, the memory 64 may store predetermined thresholds for classifying the severity of each shock event and/or determining whether the shock event is to be recorded and/or reported. For example, the memory 64 may store a threshold for determining whether the shock event should be recorded or ignored (e.g., 50 G). In addition, the memory 64 may store thresholds to determine if the shock event should only be recorded (e.g., 50 G to 100 G) or a warning also given to the operator (e.g., 100 G or above). Further, the memory 64 may store thresholds to distinguish between a low-level shock event (e.g., 100 G to 150 G) or a high-level shock event (e.g., greater than 150 G). The thresholds given are only examples and may vary depending on various factors such as the type and design of the detector 14.
Yet further, the processor 48 is linked to the shock monitoring system 42 via a microcontroller 66. The shock monitoring system 42 comprises the microcontroller 66 (e.g., low power microcontroller), a real-time clock 68, a nonvolatile memory 70, and a plurality of shock sensors 72. The shock monitoring system 42 monitors for an occurrence of the shock event to the detector 14 via the plurality of shock sensors 72. In particular, the microcontroller 44 monitors the plurality of shock sensors 72. The plurality of shock sensors 72 include 3-axis (e.g., x-, y-, and z-axes) shock sensors configured to measure shock values along each axis. The plurality of shock sensors 72 includes at least one small-range vibration sensor 74 and at least one large-range shock sensor 76. In certain embodiments, the plurality of sensors 72 may include more than two shock sensors 72, more than one small-range vibration sensor 74, and/or more than one large-range shock sensor 76. The small-range vibration sensor 74 is more sensitive to the beginning of the shock event. For example, the small-range vibration sensor 74 may sense vibrations or shock events up to 16 G. The large-range shock sensor 76 may sense shock events ranging from 300 G to 500 G.
In order to save power, the detector 14 maintains, via the power regulator 52, the microcontroller 66 in a sleep mode. In response to sensing vibrations or the beginning of the shock event, the microcontroller 66 is awoken from the sleep mode to an active state (e.g., full monitoring mode). The microcontroller 66 monitors 3-D peak shock values (i.e., peak shock values along the x-, y-, and z-axes) of the large-range shock sensor 76 and compares the peak shock values to predetermined thresholds stored in the nonvolatile memory 70. The thresholds stored are similar to those stored in the memory 64. The microcontroller 66 records information related to the shock event if a single shock value exceeds a predetermined threshold (e.g., 50 G) for recording the shock event (e.g., 50 G). The microcontroller 66 may not record shock events below the predetermined threshold for recording. The microcontroller 66 records 3-D peak shock values (i.e., peaks shock values for each axis) and a timestamp in the nonvolatile memory 70. The microcontroller 66 acquires the timestamp from the real-time clock 68 and includes a year, month, data and time of the shock event. The X-ray system 10 updates the real-time clock 68 each time the detector 14 establishes communication with the X-ray system 10 (e.g., imaging system 12). Updating the real-time clock 68 enables adjustment of the clock 68 for time zone differences.
If the processor 48 is active when the shock event occurs, the microcontroller 66 reports the information related to the shock event to the processor 48 immediately and the microcontroller 66 returns to sleep mode. If the processor 48 is inactive, the microcontroller 66 flags the information related to the shock event in the nonvolatile memory 70 for reporting to the processor 48. Once the processor 48 shifts from an inactive state to an active state and communication is established between the detector 14 and X-ray system 10 (e.g., imaging system 12), the processor 48 shifts the microcontroller 66 from the sleep mode to the active state via the power regulator 52. The microcontroller 66, upon activation, checks the nonvolatile memory 70, reports any shock event related information flagged for reporting, clears the flag associated with the information, and then returns to sleep mode.
The processor 48 compares the information (e.g., peak shock values) related to the shock event from the microcontroller 66 to thresholds stored in the memory 64 or provided by the nonvolatile memory 70. In particular, the processor 48 is configured to analyze the received information related to the shock event and assign a warning level based on the received information. As mentioned above, the thresholds given are only examples and may vary depending on various factors such as the type and design of detector 14. For example, the processor 48 compares the peak shock values to a predetermined threshold (e.g., 100 G) for issuing a warning of the occurrence of the shock event. If the peak shock values fall below 100 G, no warning is assigned to the shock event. If the peak shock values are equal to or greater than 100 G than a warning level is assigned to the shock event. Also, the processor 48 compares the peak shock values to a predetermined threshold (e.g., 150 G) for classifying the shock event as a low-level shock event (e.g., 100 G to less than 150 G) or high-level shock event (e.g., 150 G or greater). High-level shock events are associated with potential damage to the detector 14 (e.g., damage to the detector array 56). The processor 48 reports the information related to the shock events (e.g., timestamp, peak shock values, associated warning level) to the X-ray system 10 (e.g., imaging system 12) communicatively coupled to the detector 14. As mentioned above, high-level shock events trigger the inhibition of exposure from the source 16 of the imaging system 12, while the detector 14 is analyzed for potential damage via the QAP.
The method 78 also includes reporting the shock event to the X-ray system 10 (e.g., imaging system) communicatively coupled to the detector 14 (block 88). The reported shock event is recorded by the processor of the imaging system 12 into the log file. In the case of high-level shock events (e.g., 150 G or greater), the X-ray system 10 (e.g., imaging system 12) reports the shock event to a warrantee service system (block 90). The warrantee service system may track the shock event related information for the detector 14 as well shock event information gathered from other detectors 14. Also, in the case of high-level shock events, the imaging system 12 may inhibit the exposure from the source 16 of X-ray radiation (block 92). For both low- and high-level shock events, the method 78 includes providing a warning (e.g., user-viewable warning) of the shock event to the operator (block 94) via the light 62 or display 60 on the detector 14 or via the display 38 on the imaging system 12. In the case of high level shock events, the warning may provide an indication to an operator to perform the QAP to assess damage to the detector 14 (block 96). Upon performing the QAP (block 96), the method 78 includes determining whether the detector 14 is damaged (block 98). If the QAP finds the detector 14 did not acquire damage, then the imaging system 12 stops inhibiting the X-ray exposure (block 100) and the detector 14 may be used. However, if the QAP finds the detector 14 acquired damage, the X-ray system 10 reports the shock event and detector damage to a service system (block 102). In certain embodiments, the X-ray system 10 prompts the operator to also contact a service engineer to repair the detector 14.
Upon being communicatively coupled to the X-ray system 10 (e.g., imaging system 12), the method 104 includes reporting the shock event 108 to the X-ray system 10 (block 120). After reporting the shock event 108 (block 120), the X-ray system 10 records the shock event 108 in the log file. If the shock event 108 is classified as a low-level shock event, the method 104 includes providing only a user-viewable warning of the shock event 108 to an operator of the X-ray system 10. FIG. 5 illustrates an example of a screen 124 having a warning message 126 of a low-level shock event that occurred while the detector 14 is communicatively coupled to the X-ray system 10 (e.g., imaging system 12). The warning message 126 includes a prompt 128 (e.g., “OK” button) for the operator to acknowledge the message 126.
If the shock event 108 is classified as a high-level shock event, the method 104 includes providing a user-viewable warning of the shock event 108 to an operator of the X-ray system 10 along with an indication to perform the QAP on the detector 14 to assess the potential damage (block 136). The method 104 also includes inhibiting an exposure from the source 16 of X-ray radiation of the imaging system 12 until performance of the QAP verifies the detector 14 is free of damage (block 138). Further, the method 104 also includes reporting the high-level shock event to the warrantee service system (block 140).
Technical effects of the disclosed embodiments include providing a system and method for monitoring the mishandling of the digital X-ray detectors 14. In particular, the detector 14 includes the shock monitoring system 42 to monitor for and detect shock events 108 to the detector 14. The shock monitoring system 42 records significant shock events 108. The detector 14 also determines if the shock event 108 is severe enough (e.g., low-level and high-level shock events) to report the shock event 108 to the X-ray system 10 (e.g., imaging system) along with a warning level associated with the shock event 108. The X-ray system 10 and/or detector 14 may prompt the operator to assess any potential damage to the detector 14. Also, the X-ray system 10 may report the shock event 108 to the warrantee service system.
This written description uses examples to disclose the invention, including the best mode, and also to enable any person skilled in the art to practice the invention, including making and using any devices or systems and performing any incorporated methods. The patentable scope of the invention is defined by the claims, and may include other examples that occur to those skilled in the art. Such other examples are intended to be within the scope of the claims if they have structural elements that do not differ from the literal language of the claims, or if they include equivalent structural elements with insubstantial differences from the literal languages of the claims.
