Method and system for providing an antiferromagnetically coupled writer

Information

  • Patent Grant
  • 9368134
  • Patent Number
    9,368,134
  • Date Filed
    Tuesday, February 19, 2013
    11 years ago
  • Date Issued
    Tuesday, June 14, 2016
    8 years ago
Abstract
A method and system for fabricating a magnetic transducer are described. The magnetic transducer includes a pole and a nonmagnetic intermediate layer adjacent to the pole. The pole has a paddle and a pole tip including a plurality of sidewalls. The pole includes a first magnetic pole layer, at least one antiferromagnetic coupling (AFC) structure on the first magnetic pole layer, and a second magnetic pole layer on the AFC structure(s). At least a portion of the first magnetic pole layer resides on the sidewalls of the pole tip. The paddle has a paddle width in a track width direction. The pole tip has a pole tip width in a track width direction that is less than the paddle width.
Description
BACKGROUND


FIG. 1 is a flow chart depicting a conventional method 10 for fabricating a conventional magnetic recording write transducer. For simplicity, some steps are omitted. The conventional method 10 is used for providing a magnetic write pole in an aluminum oxide layer. A trench is formed in the aluminum oxide layer, via step 12. The top of the trench is wider than the trench bottom in the region close to the ABS. As a result, the pole tip formed therein will have its top surface wider than its bottom. A seed layer is deposited, via step 14. The seed layer may be ferromagnetic or nonmagnetic. The conventional pole materials are plated, via step 16. Step 16 may include plating ferromagnetic pole materials. A chemical mechanical planarization (CMP) is then performed, via step 18. The write gap and top shield may then be deposited, via steps 20 and 22, respectively.



FIG. 2 depicts air-bearing surface (ABS) and plan views of a portion of a conventional transducer 50 formed using the conventional method 10. The conventional transducer 50 includes an underlayer 52, seed layer 54 which is deposited in the trench (not shown). The side material(s) 56 and 58 are also shown. The side material(s) 56 and 58 may be insulating, conductive, ferromagnetic and/or nonmagnetic. The pole 60, write gap 70 and top shield 80 are also shown. Thus, using the conventional method 10, the pole 60 may be formed.


Although the conventional method 10 may provide the conventional transducer 50, there may be drawbacks. The conventional pole 60 is typically formed of plated FeCo or CoFeZ, where Z is a material such as Ni, Rh, Cr, or Ru. The practical upper limit of the moment for such plated materials is approximately 2.4 T with a lower coercivity. In general, the anisotropy field for such materials is low, on the order of ten through thirty-five Oersted. As a result, such conventional poles 50 are likely to suffer from issues such as adjacent track interference (ATI), wide area track erasure (WATE), and domain lock-up (DLU). Accordingly, what is needed is an improved method for fabricating a transducer.


SUMMARY

A method and system for fabricating a magnetic transducer are described. The magnetic transducer includes a pole and a nonmagnetic intermediate layer adjacent to the pole. The pole has a paddle and a pole tip including a plurality of sidewalls. The pole includes a first magnetic pole layer, at least one antiferromagnetic coupling (AFC) structure on the first magnetic pole layer, and a second magnetic pole layer on the AFC structure(s). At least a portion of the first magnetic pole layer resides on the sidewalls of the pole tip. The paddle has a paddle width in a track width direction. The pole tip has a pole tip width in a track width direction that is less than the paddle width.





BRIEF DESCRIPTION OF SEVERAL VIEWS OF THE DRAWINGS


FIG. 1 is a flow chart depicting a conventional method for fabricating a write transducer.



FIG. 2 is a diagram depicting plan and ABS views of a conventional write transducer.



FIG. 3 is a diagram depicting an exemplary embodiment of a portion of a write transducer.



FIG. 4 is a diagram depicting another exemplary embodiment of a portion of a write transducer.



FIG. 5 is a diagram depicting another exemplary embodiment of a portion of a write transducer.



FIG. 6 is a diagram depicting another exemplary embodiment of a portion of a write transducer.



FIG. 7 is a flow chart depicting an exemplary embodiment of a method for fabricating a write transducer.



FIG. 8 is a flow chart depicting an exemplary embodiment of a method for fabricating an antiferromagnetic coupling structure.



FIG. 9 is a flow chart depicting another exemplary embodiment of a method for fabricating a write transducer.



FIGS. 10-15 are diagrams depicting an exemplary embodiment of a magnetic recording transducer during fabrication.





DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS


FIG. 3 is a diagram depicting an exemplary embodiment of a portion of a write transducer 100. For clarity, FIG. 3 is not to scale. FIG. 3 depicts plan, ABS, and side views of the transducer 100. The transducer 100 shown includes underlayer 102 and intermediate layer 104. The intermediate layer 104 may be removed later in processing the transducer 100. The magnetic transducer 100 also includes pole 110 residing on optional seed layer 106. In the embodiment shown, the pole 110 includes pole tip portion 112, paddle portion 114, and bevels 116 and 118. However, in other embodiments, leading edge bevel 118 and/or trailing edge bevel 116 may be omitted. As can be seen in the plan view, the pole tip portion 112 has a width in the track width direction that is less than width of the paddle portion 114.


The pole 110 includes magnetic pole layers 120 and 140 separated by antiferromagnetic coupling (AFC) structure 130. The magnetic pole layers 120 and 140 may have a high saturation magnetization and thus may include at least one of Co, Ni, and Fe. In some embodiments, the magnetic pole layers 120 and 140 may have a low anisotropy, for example not over 50 Oe. In some such embodiments, the anisotropy field is in the range of 10-35 Oe. A low coercivity may also be desired. In some embodiments, the materials used for the magnetic layers 120 and 140 are the same. However, in other embodiments, the materials used for the layers 120 and 140 may be different. In some embodiments, the ferromagnetic layers 120 and 140 may be plated. However, in other embodiments, other deposition techniques may be used. Further, the layers 120 and 140 may include sublayers. Because of the presence of AFC structure 130, the layers 120 and 140 are antiferromagnetically coupled. This can be seen in the side and plan views of FIG. 3. In some embodiments, more than two high moment layers 120 and 140 and more than one AFC structure 130 may be used. For example, two AFC structures may be interleaved with three magnetic pole layers. However, fewer AFC structure(s) 130 are generally desired so as to not dilute the moment of the pole 110. The AFC structure 130 may be used to increase the anisotropy of the layers 120 and 140. In addition, the seed layer 106 may be configured to increase the anisotropy or otherwise tailor the properties of the magnetic layers 120 and 140. In the embodiment shown, the magnetic layers 120 and 140 have substantially the same thickness. Thus, the AFC structure 130 resides in the middle of the pole 110. However, in other embodiments, the magnetic layers 120 and 140 may have different thicknesses. For example, the top magnetic layer 140 may be thinner or thicker than the bottom magnetic pole layer 120.


AFC structure 130 is used to ensure that the layers 120 and 140 are antiferromagnetically coupled. In some embodiments, the AFC structure 130 may be a simple nonmagnetic layer, such as a Ru, NiCr, or Cr layer. In some embodiments, the Ru layer is on the order of 4-10 Angstroms. In some such embodiments, the Ru layer may be 8-9 Angstroms thick. Further, other materials such as Cu and alumina may also be used as the AFC structure 130. In other embodiments, the AFC structure 130 may be a multilayer. For example, the AFC structure may include two layers of ferromagnetic material sandwiching a thin layer of nonmagnetic material. The ferromagnetic material may include materials such as at least one of Co1-xFex and Co1-x-y-ZyFex, where x is at least 0.55 and not more than 0.75, y is less than or equal to 0.05, and Z is at least one of Ni, Cu, Cr, Mo, B, Pt, P, Rh and Pd. The nonmagnetic layer may include materials such as Ru, NiCr, and/or Cr. In other embodiments, the AFC structure 130 may include more ferromagnetic layers interleaved with nonmagnetic material(s). In general, a thinner AFC structure 130 having fewer layers is desired so as to not dilute the moment of the pole 110. By judicious selection of the materials for the ferromagnetic layers of the AFC structure 130, the AFC structure 130 may be used to increase the anisotropy of the pole 110. For example, the CoFe/Ru/CoFe multilayer described above may have an anisotropy field on the order of two thousand Oe or more. Further, the AFC structure 130 may be sputtered. In other embodiments, some or all of the AFC structure may be fabricated using other deposition technique(s).


As discussed above, the pole tip portion 112 of the pole 110 is thinner in the track width direction (left-right in the plan view) than the paddle 114. In addition, a sufficient thickness of the first magnetic pole layer 120 is provided such that the pole tip region 112 is filled by the first magnetic pole layer 120. For example, in some embodiments, the pole width in the pole tip region 110 is less than half of the paddle thickness. In addition, deposition of the first magnetic pole layer 120 may be conformal. Such a deposition also fills the pole tip region 112 from the sides as well as the bottom. As a result, the pole tip region 112 may be filled when the paddle region 114 is less than half full. In such an embodiment, a first magnetic layer 120 having a thickness of approximately half of the paddle thickness fills the pole tip region 112. Such an embodiment is depicted in FIG. 3. As is also shown in FIG. 3, in such an embodiment, the AFC structure 130 and second magnetic pole layer 140 do not reside at the ABS or in the pole tip region 112. However, layers 120, 130, and 140 all reside in the paddle 114 of the pole 110.


The pole 110 and thus the transducer 100 may have improved performance. When the pole 110 is energized, for example by write coils (not shown in FIG. 3), the narrow pole tip region 110 may be fully saturated. Further, as a high saturation magnetization material(s) of the layer 120 fill the pole, this saturation magnetization may be high. In contrast, in much of the flat region of the paddle 114 a strong antiferromagnetic coupling in the plane of the layers may be achieved. These regions may thus have a higher anisotropy, a lower coercivity and a lower saturation magnetization. Consequently, the paddle region 114 may not fully saturate. Further, when the pole 110 is not energized, the antiferromagnetic coupling between the layers 120 and 140 may dominate. Thus, the layers 120 and 140 may be antiferromagnetically coupled and have their magnetizations as shown, substantially parallel to the ABS. As a result, there may be less stray field, reduced side track erasure, reduced ATI, reduced WATE, and reduced DLU. Further, the thicknesses and materials used for the layers 120, 130, and 140 may be tailored in order to optimize various aspects of performance. Consequently, performance of the transducer 100 may be improved.



FIG. 4 depicts another exemplary embodiment of a portion of a write transducer 100′. For clarity, FIG. 4 is not to scale. FIG. 4 depicts plan, ABS, and side views of the transducer 100′. The transducer 100′ is analogous to the transducer 100. Consequently, the transducer 100′ shown includes underlayer 102′, intermediate layer 104′, optional seed layer 106′, and pole 110′ including pole tip portion 112′, paddle portion 114′, and optional bevels 116′ and 118′ corresponding to underlayer 102, intermediate layer 104, optional seed layer 106, and pole 110 including pole tip portion 112, paddle portion 114, and bevels 116 and 118, respectively. Further, pole 110′ includes layer 120′, AFC structure 130′, and layer 140′ corresponding to the layer 120, AFC structure 130, and layer 140, respectively. The function, materials, and structure of the components 102′, 104′, 106′, 110′, 112′, 114′, 116′, 118′, 120′, 130′, and 140′ are thus analogous to the components 102, 104, 106, 110, 112, 114, 116, 118, 120, 130, and 140, respectively. Thus, the pole 110′ and magnetic write transducer 100′ may share the benefits of the pole 110 and magnetic write transducer 100, respectively.


In addition, for the pole 110′ depicted in FIG. 4, a portion of the AFC structure 130′ and second magnetic pole layer 140′ resides in the pole tip 112′. Thus, portions of the pole tip 112′ may also be antiferromagnetically coupled.



FIG. 5 depicts another exemplary embodiment of a portion of a write transducer 100″. For clarity, FIG. 5 is not to scale. FIG. 5 depicts plan, ABS, and side views of the transducer 100″. The transducer 100″ is analogous to the transducer 100. Consequently, the transducer 100″ shown includes underlayer 102″, intermediate layer 104″, optional seed layer 106″, and pole 110″ including pole tip portion 112″, paddle portion 114″, and optional bevels 116″ and 118″ corresponding to underlayer 102, intermediate layer 104, optional seed layer 106, and pole 110 including pole tip portion 112, paddle portion 114, and bevels 116 and 118, respectively. Further, pole 110″ includes layer 120″, AFC structure 130″, and layer 140″ corresponding to the layer 120, AFC structure 130, and layer 140, respectively. The function, materials, and structure of the components 102″, 104″, 106″, 110″, 112″, 114″, 116″, 118″, 120″, 130″, and 140″ are thus analogous to the components 102, 104, 106, 110, 112, 114, 116, 118, 120, 130, and 140, respectively.


In addition, the pole 110″ also includes an additional AFC structure 150 and magnetic layer(s) 160. The AFC structure 150 is analogous to the AFC structure 130′/130. Thus the AFC structure 150 may include a single nonmagnetic layer or a multilayer. Similarly, the magnetic pole layer 160 may include the same or different materials as the magnetic pole layers 120″ and 140″. In general, high saturation magnetization, low coercivity materials are desired. In the embodiment shown, the first magnetic pole layer 120″ fills the pole tip 112″. However, in other embodiments, a portion of one or more of the remaining pole component(s) 130″, 140″, 150, and 160 may reside in the pole tip 112″. The layers 120″, 140″ and 160 are antiferromagnetically coupled in the paddle 114″ due at least in part to the AFC structures 130″ and 150. Further, the pole tip 112″ may be filled by high saturation magnetization layer 120″. Thus, the pole 110″ and magnetic write transducer 100″ may share the benefits of the pole 110 and magnetic write transducer 100, respectively.



FIG. 6 depicts another exemplary embodiment of a portion of a write transducer 100′″. For clarity, FIG. 6 is not to scale. FIG. 6 depicts plan, ABS, and side views of the transducer 100′″. The transducer 100′″ is analogous to the transducers 100, 100′, and 100″. Consequently, the transducer 100′″ includes underlayer 102′″, intermediate layer 104′″, optional seed layer 106′″, and pole 110′″ including pole tip portion 112′″, paddle portion 114′″, and optional bevels 116′″ and 118′″ corresponding to underlayer 102, intermediate layer 104, optional seed layer 106, and pole 110 including pole tip portion 112, paddle portion 114, and bevels 116 and 118, respectively. Further, pole 110′″ includes layer 120′″, AFC structure 130′″, and layer 140′″ corresponding to the layer 120, AFC structure 130, and layer 140, respectively. The function, materials, and structure of the components 102′″, 104′″, 106′″, 110′″, 112′″, 114′″, 116′″, 118′″, 120′″, 130′″, and 140′″ are thus analogous to the components 102, 104, 106, 110, 112, 114, 116, 118, 120, 130, and 140, respectively. Although not shown, the pole 110′″ may also include additional AFC structure(s) (not shown) interleaved with magnetic layer(s) (not shown) in a manner analogous to the pole 110″. Further, although the first magnetic layer 120′″ is shown as filling the pole tip 112′″, in another embodiment, a portion of one or more of the additional structure(s) 130′″ and 140′″ could reside in the pole tip 112′″.


In the pole 110′″, the AFC structure 130′″ is explicitly shown as including a multilayer. In the embodiment shown, ferromagnetic layers 132 and 136 sandwich a nonmagnetic layer 134. In some embodiments, the ferromagnetic layers 132 and 136 have a high anisotropy. For example, the ferromagnetic materials used for layers 132 and 136 may include materials such as at least one of Co1-xFex and Co1-x-y-ZyFex, where x is at least 0.55 and not more than 0.75, y is less than or equal to 0.05, and Z is at least one of Ni, Cu, Cr, Mo, B, Pt, P, Rh and Pd. In some embodiments, the layers 132 and 136 are composed of the same materials. However, in other embodiments, the layers 132 and 136 may differ. Further, although shown as having substantially the same thickness, the layers 132 and 136 may have different thicknesses in other embodiments. The nonmagnetic layer 134 may include materials such as Ru, NiCr, and/or Cr. The nonmagnetic layer 134 is generally desired to be thin to support an antiferromagnetic coupling between the layers 132 and 136. For example, in some embodiments, the layer 132 is a Ru layer is on the order of 4-10 Angstroms thick. In some such embodiments, the Ru layer may be 8-9 Angstroms thick. However, in other embodiments, other materials and other thicknesses may be used.


Thus, the pole 110′″ also includes analogous structures to the poles 110, 110′, and 110″. As a result, the pole 110′″ and magnetic transducer 100′″ may share the benefits of the magnetic pole(s) 110/110′/110″ and magnetic transducer(s) 100/100′/100″.



FIG. 7 is a flow chart depicting an exemplary embodiment of a method 200 for fabricating a transducer, such as the magnetic transducer 100, 100′, 100″, and/or 100′″. For clarity, the method 200 is described in the context of the magnetic transducer 100. For simplicity, some steps may be omitted and/or combined. The transducer being fabricated may be part of a merged head that also includes a read head (not shown) and resides on a slider (not shown) in a disk drive. The method 200 also may commence after formation of other portions of the transducer. The method 200 is also described in the context of providing a single pole and its associated structures in a single magnetic recording transducer 100. However, the method 200 may be used to fabricate multiple transducers at substantially the same time. The method 200 and system are also described in the context of particular layers. However, in some embodiments, such layers may include multiple sub-layers. In one embodiment, the method 200 commences after formation of the underlayer(s) 102 on which the pole 110 is to reside as well as a nonmagnetic intermediate layer 104. In some embodiments, the intermediate layer 104 is an aluminum oxide layer. In addition, the underlayer 102 may include an etch stop layer. Further, in some embodiments, a leading edge shield is desired. In such embodiments, the leading edge shield may be provided under the underlayer. The leading edge shield is generally ferromagnetic, magnetically soft, and may include materials such as NiFe.


A trench is formed in a portion of the intermediate layer, via step 202. Trench formation may include a reactive ion etch (RIE). The RIE may terminate in the stop layer. Thus, the trench bottom may be formed by a portion of the stop layer. However, in alternate embodiments, the trench may terminate in other layers including but not limited to the intermediate layer and an underlying shield layer. The RIE used in step 202 may be an aluminum oxide RIE. The trench has a profile and a location that correspond to the pole being formed. Thus, the trench may have a top wider than its bottom and is located where the pole is to be formed. Further, the trench has portions corresponding to the pole tip 112 and paddle 114.


The first magnetic pole layer 120 is provided, via step 204. In some embodiments, step 204 may include depositing a conductive seed layer. The seed layer may be magnetic or nonmagnetic. The first magnetic pole layer 120 may be deposited in a number of ways. In some embodiments, the first magnetic pole layer 120 is plated. In addition, step 204 may terminate after the pole tip 112 has been filled.


An AFC structure 130 is provided on the first magnetic pole layer 120, via step 206. In some embodiments, step 206 includes sputtering the AFC structure 130. Sputtering the AFC structure 130 may ensure that the interfaces in the AFC structure are smoother. This may improve the antiferromagnetic coupling desired. However, in other embodiments, other deposition methods such as plating may be used. Step 206 may include depositing a nonmagnetic layer or a multilayer that may include ferromagnetic layers. In some embodiments, the AFC structure provided in step 206 may only reside in the paddle portion once fabrication is completed. However, in other embodiments, the AFC structure provided in step 206 may also reside in the pole tip region.


The second magnetic pole layer 140 is provided, via step 208. The second magnetic pole layer 140 may be deposited in a number of ways. In some embodiments, the second magnetic pole layer 140 is plated.


Step 206-208 may optionally be repeated, via step 210. In such embodiments, the pole 110 provided would have more than the layers depicted in FIG. 3. Referring back to FIG. 7, once the layers for the pole 110 have been provided, the transducer is planarized, via step 212. In some embodiments, step 212 includes performing a chemical mechanical planarization (CMP). Fabrication of the transducer 100 may then be completed, via step 214. For example, bevel 118 may be formed and/or additional structures such as write gaps, shield(s) and coil(s) may be provided.


Using the method 200, pole 110 having the desired geometry and coupling between the layers 120 and 140 may be fabricated. The benefits of the magnetic transducer 100 and pole 110 may be achieved. Performance of the magnetic transducer 100 may thus be enhanced.



FIG. 8 is a flow chart depicting an exemplary embodiment of a method 220 for fabricating an AFC structure, such as the AFC structure 130′″. The method 220 may be used in methods for fabricating a pole and/or transducer. For example, the method 220 may be used in the step(s) 206 and/or 210. For clarity, the method 220 is described in the context of the AFC structure 130′″. For simplicity, some steps may be omitted and/or combined. The method 220 is also described in the context of providing a single AFC structure 130′″. However, the method 220 may be used to fabricate multiple AFC structures at substantially the same time. The method 220 and system are also described in the context of particular layers. However, in some embodiments, such layers may include multiple sub-layers.


A high anisotropy ferromagnetic layer 132 is deposited, via step 222. In some embodiments, step 222 occurs after an optional ion mill is performed on the underlying magnetic layer 120′″. Such an ion mill may be performed to preclean the top surface of the magnetic layer 120′″. In some embodiments, step 222 includes sputtering a layer including materials such as at least one of Co1-xFex and Co1-x-y-ZyFex, where x is at least 0.55 and not more than 0.75, y is less than or equal to 0.05, and Z is at least one of Ni, Cu, Cr, Mo, B, Pt, P, Rh and Pd.


A nonmagnetic layer 134 is deposited to a desired thickness, via step 224. The thickness selected in step 224 is such that the desired magnetic coupling is provided between the layers 132 and 136. In some embodiments, step 224 includes sputtering a Ru layer However, in other embodiments, other processes and/or other materials may be used.


Another high anisotropy ferromagnetic layer 136 is deposited, via step 226. In some embodiments, step 226 includes sputtering a layer including materials such as at least one of Co1-xFex and Co1-x-y-ZyFex, where x is at least 0.55 and not more than 0.75, y is less than or equal to 0.05, and Z is at least one of Ni, Cu, Cr, Mo, B, Pt, P, Rh and Pd.


Using the method 220, a high anisotropy AFC coupling structure 130′″ may be provided. Thus, the performance of a pole 110′″ and magnetic transducer 100′″ using such a structure may be enhanced.



FIG. 9 is a flow chart depicting another exemplary embodiment of a method 250 for fabricating a magnetic write transducer. For simplicity, some steps may be omitted. FIGS. 10-15 are diagrams depicting side, ABS, and plan views of an exemplary embodiment of a portion of a transducer during 300 fabrication. For clarity, FIGS. 10-15 are not to scale. The side views in FIGS. 10-15 are taken in the middle of the location at which the pole is formed. Further, although FIGS. 10-15 depict the ABS location (location at which the ABS is to be formed) and ABS at a particular point in the pole, other embodiments may have other locations for the ABS. Referring to FIGS. 9-15, the method 250 is described in the context of the transducer 300. However, the method 250 may be used to form another device (not shown). The transducer 300 being fabricated may be part of a merged head that also includes a read head (not shown in FIG. 10-15) and resides on a slider (not shown) in a disk drive. The method 250 also may commence after formation of other portions of the transducer 300. The method 250 is also described in the context of providing a single transducer 300. However, the method 250 may be used to fabricate multiple transducers at substantially the same time. The method 250 and device 300 are also described in the context of particular layers. However, in some embodiments, such layers may include multiple sublayers.


In one embodiment, the method 200 commences after formation of the leading shield 302 and underlayer(s) 304 on which the pole is to reside as well as a nonmagnetic intermediate layer 306. In some embodiments, the intermediate layer 306 is an aluminum oxide layer. In addition, the underlayer 304 may include an etch stop layer. The leading shield 302 is generally ferromagnetic, magnetically soft, and may include materials such as NiFe.


A trench is formed in a portion of the intermediate layer, via step 252. Trench formation may include a RIE that may terminate in the stop layer. Thus, the trench bottom may be formed by a portion of the stop layer. However, in alternate embodiments, the trench may terminate in other layers including but not limited to the intermediate layer and an underlying shield layer. The RIE used in step 252 may be an aluminum oxide RIE. The trench has a profile and a location that correspond to the pole being formed.



FIG. 10 depicts the transducer 300 after step 252 is performed. Thus, a leading shield 302 and stop layer/underlayer 304 are shown. Intermediate layer 306 having trench 308 therein are also shown. The trench 308 has a top wider than its bottom and is located where the pole is to be formed. Further, the trench has a pole tip portion 307 and a paddle portion 309 corresponding to the pole tip and paddle. In the embodiment shown, the trench 308 terminates at the underlayer 304. However, in other embodiments, the trench 308 may terminate in the leading shield 302.


A conductive seed layer is deposited, via step 254. The first magnetic pole layer is plated, via step 256. FIG. 11 depicts the transducer 300 during step 256. Thus, seed layer 310 and a portion of the first magnetic pole layer 320 are shown. As can be seen in the ABS view, the pole tip portion 307 of the trench proximate to the ABS location fills faster than the paddle portion 309 distal from the ABS. FIG. 12 depicts the transducer 300 after step 256 is completed. Step 256 has been terminated after the pole tip portion 307 of the trench 308 has been filled. Thus, the first magnetic layer 320 has been provided. In the embodiment shown, no leading edge bevel is formed. However, in another embodiment, a leading edge bevel is provided, for example by shaping the trench 308.


The first magnetic layer 320 is optionally milled or otherwise precleaned, via step 258. An AFC structure is sputtered on the first magnetic pole layer 320, via step 260. In some embodiments, step 260 includes sputtering high anisotropy magnetic layers sandwiching a nonmagnetic conductive layer. FIG. 13 depicts the transducer 300 after step 260 is performed. Thus, AFC structure 330 including layers 332, 334, and 336 has been formed. The laser 332 and 336 are ferromagnetic layers that may have a high anisotropy. Thus, layers 332 and 336 may include at least one of Co1-xFex and Co1-x-y-ZyFex, where x is at least 0.55 and not more than 0.75, y is less than or equal to 0.05, and Z is at least one of Ni, Cu, Cr, Mo, B, Pt, P, Rh and Pd. Layer 334 is a conductive, nonmagnetic layer such as Ru.


The second magnetic pole layer is plated, via step 262. FIG. 14 depicts the transducer 300 after step 262 is performed. Thus, a second magnetic layer 340 is shown. The transducer is planarized, via step 264. In some embodiments, step 264 includes performing a CMP. A trailing edge bevel may be formed, via step 266. FIG. 15 depicts the transducer 300 after step 266 is performed. Thus, bevel 350 is shown. Fabrication of the transducer 300 may then be completed.


Using the method 250, the magnetic transducer 300 analogous to the transducers 100, 100′, 100″, and 100′″ may be formed. The benefits of the magnetic transducers 100, 100′, 100″, and 100′″ may be achieved. Performance of the magnetic transducer 300 may thus be enhanced.

Claims
  • 1. A method for fabricating a magnetic write transducer having an intermediate layer, the intermediate layer being nonmagnetic, the method comprising: providing a trench in the intermediate layer, the trench having a paddle region, a pole tip region, a profile, and a location corresponding to a pole of the magnetic transducer, the paddle region having a paddle width in a track width direction, pole tip region having a pole tip width in a track width direction that is less than the paddle width;providing a first magnetic pole layer in the trench, the first magnetic pole layer covering the sidewalls of the pole tip region;providing at least one antiferromagnetic coupling (AFC) structure on the first magnetic pole layer; andproviding a second magnetic layer on the at least one AFC structure;planarizing the magnetic transducer, a remaining portion of the first magnetic pole layer, a remaining portion of the at least one AFC structure, and a remaining portion of the second magnetic pole layer forming the pole, the remaining portion of the at least one AFC structure residing only in the paddle of the pole, and the remaining portion of the first magnetic pole layer substantially filling the pole tip such that the pole tip is ferromagnetic.
  • 2. The method of claim 1 wherein the step of providing each of the at least one AFC structure further includes: depositing a nonmagnetic layer.
  • 3. The method of claim 2 wherein the step of depositing the nonmagnetic layer further includes: sputtering the nonmagnetic layer.
  • 4. The method of claim 3 wherein the nonmagnetic layer includes at least one of Ru, NiCr, and Cr.
  • 5. The method of claim 3 wherein the step of providing each of the at least one AFC structure further includes: depositing a first ferromagnetic layer; anddepositing a second ferromagnetic layer, the nonmagnetic layer residing between the first ferromagnetic layer and the second ferromagnetic layer.
  • 6. The method of claim 5 wherein the step of depositing the first ferromagnetic layer further includes: sputtering the first ferromagnetic layer; andwherein the step of depositing the second ferromagnetic layer further includes sputtering the second ferromagnetic layer.
  • 7. The method of claim 1 wherein the first magnetic pole layer has a first thickness and a second magnetic pole layer has a second thickness less than the first thickness.
  • 8. The method of claim 1 wherein the first magnetic pole layer has a first thickness and a second magnetic pole layer has a second thickness greater than the first thickness.
  • 9. The method of claim 1 wherein the first magnetic pole layer has a first thickness and a second magnetic pole layer has a second thickness substantially equal to the first thickness.
  • 10. A method for fabricating a magnetic transducer having an intermediate layer, the intermediate layer being nonmagnetic, the method comprising: providing a trench in the intermediate layer, the trench having a paddle region, a pole tip region, a profile, and a location corresponding to a pole of the magnetic transducer, the paddle region having a paddle width in a track width direction, pole tip region having a pole tip width in a track width direction that is less than the paddle width;plating a first magnetic pole layer in the trench, the first magnetic pole layer substantially filling the pole tip region;sputtering at least one antiferromagnetic coupling (AFC) structure on the first magnetic pole layer, each of the at least one AFC structure including at least a first ferromagnetic layer, a second ferromagnetic layer, and a nonmagnetic layer between the first ferromagnetic layer and the second ferromagnetic layer, the nonmagnetic layer including Ru, the first ferromagnetic layer and the second ferromagnetic layer including at least one of Co1-xFex and Co1-x-y-ZyFex, where x is at least 0.55 and not more than 0.75, y is less than or equal to 0.05, and Z is at least one of Ni, Cu, Cr, Mo, B, Pt, P, Rh and Pd;plating a second magnetic layer on the at least one AFC structure;planarizing the magnetic transducer, a remaining portion of the first magnetic pole layer, a remaining portion of the at least one AFC structure, and a remaining portion of the second magnetic pole layer forming the pole, the remaining portion of the at least one AFC structure residing only in the paddle of the pole, and the remaining portion of the first magnetic pole layer substantially filling the pole tip such that the pole tip is ferromagnetic.
CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of co-pending U.S. patent application Ser. No. 12/970,423, filed Dec. 16, 2010, entitled “Method and System for Providing an Antiferromagnetically Coupled Writer” assigned to the assignee of the present application and incorporated herein by reference.

US Referenced Citations (653)
Number Name Date Kind
5621592 Gill et al. Apr 1997 A
5750275 Katz et al. May 1998 A
5838521 Ravipati Nov 1998 A
6016290 Chen et al. Jan 2000 A
6018441 Wu et al. Jan 2000 A
6025978 Hoshi et al. Feb 2000 A
6025988 Yan Feb 2000 A
6032353 Hiner et al. Mar 2000 A
6033532 Minami Mar 2000 A
6034851 Zarouri et al. Mar 2000 A
6043959 Crue et al. Mar 2000 A
6046885 Aimonetti et al. Apr 2000 A
6049650 Jerman et al. Apr 2000 A
6055138 Shi Apr 2000 A
6058094 Davis et al. May 2000 A
6073338 Liu et al. Jun 2000 A
6078479 Nepela et al. Jun 2000 A
6081499 Berger et al. Jun 2000 A
6087027 Hoshiya et al. Jul 2000 A
6094803 Carlson et al. Aug 2000 A
6099362 Viches et al. Aug 2000 A
6103073 Thayamballi Aug 2000 A
6108166 Lederman Aug 2000 A
6118629 Huai et al. Sep 2000 A
6118638 Knapp et al. Sep 2000 A
6125018 Takagishi et al. Sep 2000 A
6130779 Carlson et al. Oct 2000 A
6134089 Barr et al. Oct 2000 A
6136166 Shen et al. Oct 2000 A
6137661 Shi et al. Oct 2000 A
6137662 Huai et al. Oct 2000 A
6160684 Heist et al. Dec 2000 A
6163426 Nepela et al. Dec 2000 A
6166891 Lederman et al. Dec 2000 A
6173486 Hsiao et al. Jan 2001 B1
6175476 Huai et al. Jan 2001 B1
6178066 Barr Jan 2001 B1
6178070 Hong et al. Jan 2001 B1
6178150 Davis Jan 2001 B1
6181485 He Jan 2001 B1
6181525 Carlson Jan 2001 B1
6185051 Chen et al. Feb 2001 B1
6185077 Tong et al. Feb 2001 B1
6185081 Simion et al. Feb 2001 B1
6188549 Wiitala Feb 2001 B1
6190764 Shi et al. Feb 2001 B1
6193584 Rudy et al. Feb 2001 B1
6195229 Shen et al. Feb 2001 B1
6198608 Hong et al. Mar 2001 B1
6198609 Barr et al. Mar 2001 B1
6201673 Rottmayer et al. Mar 2001 B1
6204998 Katz Mar 2001 B1
6204999 Crue et al. Mar 2001 B1
6212153 Chen et al. Apr 2001 B1
6215625 Carlson Apr 2001 B1
6219205 Yuan et al. Apr 2001 B1
6221218 Shi et al. Apr 2001 B1
6222707 Huai et al. Apr 2001 B1
6229782 Wang et al. May 2001 B1
6230959 Heist et al. May 2001 B1
6233116 Chen et al. May 2001 B1
6233125 Knapp et al. May 2001 B1
6237215 Hunsaker et al. May 2001 B1
6252743 Bozorgi Jun 2001 B1
6255721 Roberts Jul 2001 B1
6258468 Mahvan et al. Jul 2001 B1
6259583 Fontana, Jr. et al. Jul 2001 B1
6266216 Hikami et al. Jul 2001 B1
6271604 Frank, Jr. et al. Aug 2001 B1
6275354 Huai et al. Aug 2001 B1
6277505 Shi et al. Aug 2001 B1
6282056 Feng et al. Aug 2001 B1
6292334 Koike et al. Sep 2001 B1
6296955 Hossain et al. Oct 2001 B1
6297955 Frank, Jr. et al. Oct 2001 B1
6304414 Crue, Jr. et al. Oct 2001 B1
6307715 Berding et al. Oct 2001 B1
6310746 Hawwa et al. Oct 2001 B1
6310750 Hawwa et al. Oct 2001 B1
6317290 Wang et al. Nov 2001 B1
6317297 Tong et al. Nov 2001 B1
6322911 Fukagawa et al. Nov 2001 B1
6330136 Wang et al. Dec 2001 B1
6330137 Knapp et al. Dec 2001 B1
6333830 Rose et al. Dec 2001 B2
6340533 Ueno et al. Jan 2002 B1
6349014 Crue, Jr. et al. Feb 2002 B1
6351355 Min et al. Feb 2002 B1
6353318 Sin et al. Mar 2002 B1
6353511 Shi et al. Mar 2002 B1
6356412 Levi et al. Mar 2002 B1
6358635 Min et al. Mar 2002 B1
6359779 Frank, Jr. et al. Mar 2002 B1
6369983 Hong Apr 2002 B1
6373667 Han et al. Apr 2002 B1
6376964 Young et al. Apr 2002 B1
6377535 Chen et al. Apr 2002 B1
6381095 Sin et al. Apr 2002 B1
6381105 Huai et al. Apr 2002 B1
6389499 Frank, Jr. et al. May 2002 B1
6392850 Tong et al. May 2002 B1
6396660 Jensen et al. May 2002 B1
6399179 Hanrahan et al. Jun 2002 B1
6400526 Crue, Jr. et al. Jun 2002 B2
6404600 Hawwa et al. Jun 2002 B1
6404601 Rottmayer et al. Jun 2002 B1
6404706 Stovall et al. Jun 2002 B1
6410170 Chen et al. Jun 2002 B1
6411522 Frank, Jr. et al. Jun 2002 B1
6417998 Crue, Jr. et al. Jul 2002 B1
6417999 Knapp et al. Jul 2002 B1
6418000 Gibbons et al. Jul 2002 B1
6418048 Sin et al. Jul 2002 B1
6421211 Hawwa et al. Jul 2002 B1
6421212 Gibbons et al. Jul 2002 B1
6424505 Lam et al. Jul 2002 B1
6424507 Lederman et al. Jul 2002 B1
6430009 Komaki et al. Aug 2002 B1
6430806 Chen et al. Aug 2002 B1
6433965 Gopinathan et al. Aug 2002 B1
6433968 Shi et al. Aug 2002 B1
6433970 Knapp et al. Aug 2002 B1
6437945 Hawwa et al. Aug 2002 B1
6437949 Macken et al. Aug 2002 B1
6445536 Rudy et al. Sep 2002 B1
6445542 Levi et al. Sep 2002 B1
6445553 Barr et al. Sep 2002 B2
6445554 Dong et al. Sep 2002 B1
6447935 Zhang et al. Sep 2002 B1
6448765 Chen et al. Sep 2002 B1
6451514 Iitsuka Sep 2002 B1
6452742 Crue et al. Sep 2002 B1
6452765 Mahvan et al. Sep 2002 B1
6456465 Louis et al. Sep 2002 B1
6456467 Mao et al. Sep 2002 B1
6459552 Liu et al. Oct 2002 B1
6462920 Karimi Oct 2002 B1
6466401 Hong et al. Oct 2002 B1
6466402 Crue, Jr. et al. Oct 2002 B1
6466404 Crue, Jr. et al. Oct 2002 B1
6468436 Shi et al. Oct 2002 B1
6469877 Knapp et al. Oct 2002 B1
6477019 Matono et al. Nov 2002 B2
6479096 Shi et al. Nov 2002 B1
6483662 Thomas et al. Nov 2002 B1
6487040 Hsiao et al. Nov 2002 B1
6487056 Gibbons et al. Nov 2002 B1
6490125 Barr Dec 2002 B1
6496330 Crue, Jr. et al. Dec 2002 B1
6496334 Pang et al. Dec 2002 B1
6496335 Gill Dec 2002 B2
6504676 Hiner et al. Jan 2003 B1
6512657 Heist et al. Jan 2003 B2
6512659 Hawwa et al. Jan 2003 B1
6512661 Louis Jan 2003 B1
6512690 Qi et al. Jan 2003 B1
6515573 Dong et al. Feb 2003 B1
6515791 Hawwa et al. Feb 2003 B1
6532823 Knapp et al. Mar 2003 B1
6535363 Hosomi et al. Mar 2003 B1
6552874 Chen et al. Apr 2003 B1
6552928 Qi et al. Apr 2003 B1
6577470 Rumpler Jun 2003 B1
6583961 Levi et al. Jun 2003 B2
6583968 Scura et al. Jun 2003 B1
6597548 Yamanaka et al. Jul 2003 B1
6611398 Rumpler et al. Aug 2003 B1
6618223 Chen et al. Sep 2003 B1
6628478 Gill Sep 2003 B2
6629357 Akoh Oct 2003 B1
6633464 Lai et al. Oct 2003 B2
6636394 Fukagawa et al. Oct 2003 B1
6639291 Sin et al. Oct 2003 B1
6650503 Chen et al. Nov 2003 B1
6650506 Risse Nov 2003 B1
6654195 Frank, Jr. et al. Nov 2003 B1
6657816 Barr et al. Dec 2003 B1
6661621 Iitsuka Dec 2003 B1
6661625 Sin et al. Dec 2003 B1
6674610 Thomas et al. Jan 2004 B1
6680863 Shi et al. Jan 2004 B1
6683763 Hiner et al. Jan 2004 B1
6687098 Huai Feb 2004 B1
6687178 Qi et al. Feb 2004 B1
6687977 Knapp et al. Feb 2004 B2
6691226 Frank, Jr. et al. Feb 2004 B1
6697294 Qi et al. Feb 2004 B1
6700738 Sin et al. Mar 2004 B1
6700759 Knapp et al. Mar 2004 B1
6704158 Hawwa et al. Mar 2004 B2
6707083 Hiner et al. Mar 2004 B1
6713801 Sin et al. Mar 2004 B1
6721138 Chen et al. Apr 2004 B1
6721149 Shi et al. Apr 2004 B1
6721203 Qi et al. Apr 2004 B1
6724569 Chen et al. Apr 2004 B1
6724572 Stoev et al. Apr 2004 B1
6729015 Matono et al. May 2004 B2
6735850 Gibbons et al. May 2004 B1
6737281 Dang et al. May 2004 B1
6744608 Sin et al. Jun 2004 B1
6747301 Hiner et al. Jun 2004 B1
6751055 Alfoqaha et al. Jun 2004 B1
6754049 Seagle et al. Jun 2004 B1
6756071 Shi et al. Jun 2004 B1
6757140 Hawwa Jun 2004 B1
6760196 Niu et al. Jul 2004 B1
6762910 Knapp et al. Jul 2004 B1
6765756 Hong et al. Jul 2004 B1
6775902 Huai et al. Aug 2004 B1
6778358 Jiang et al. Aug 2004 B1
6781927 Heanuc et al. Aug 2004 B1
6785955 Chen et al. Sep 2004 B1
6791793 Chen et al. Sep 2004 B1
6791796 Shukh et al. Sep 2004 B2
6791807 Hikami et al. Sep 2004 B1
6798616 Seagle et al. Sep 2004 B1
6798625 Ueno et al. Sep 2004 B1
6801408 Chen et al. Oct 2004 B1
6801411 Lederman et al. Oct 2004 B1
6803615 Sin et al. Oct 2004 B1
6806035 Atireklapvarodom et al. Oct 2004 B1
6807030 Hawwa et al. Oct 2004 B1
6807332 Hawwa Oct 2004 B1
6809899 Chen et al. Oct 2004 B1
6816345 Knapp et al. Nov 2004 B1
6818330 Shukh et al. Nov 2004 B2
6828897 Nepela Dec 2004 B1
6829160 Qi et al. Dec 2004 B1
6829819 Crue, Jr. et al. Dec 2004 B1
6833979 Knapp et al. Dec 2004 B1
6834010 Qi et al. Dec 2004 B1
6859343 Alfoqaha et al. Feb 2005 B1
6859997 Tong et al. Mar 2005 B1
6861937 Feng et al. Mar 2005 B1
6870712 Chen et al. Mar 2005 B2
6873494 Chen et al. Mar 2005 B2
6873547 Shi et al. Mar 2005 B1
6879464 Sun et al. Apr 2005 B2
6888184 Shi et al. May 2005 B1
6888704 Diao et al. May 2005 B1
6891702 Tang May 2005 B1
6894871 Alfoqaha et al. May 2005 B2
6894877 Crue, Jr. et al. May 2005 B1
6906894 Chen et al. Jun 2005 B2
6909578 Missell et al. Jun 2005 B1
6912106 Chen et al. Jun 2005 B1
6927952 Shimizu et al. Aug 2005 B2
6934113 Chen Aug 2005 B1
6934129 Zhang et al. Aug 2005 B1
6940688 Jiang et al. Sep 2005 B2
6942824 Li Sep 2005 B1
6943993 Chang et al. Sep 2005 B2
6944938 Crue, Jr. et al. Sep 2005 B1
6947258 Li Sep 2005 B1
6950266 McCaslin et al. Sep 2005 B1
6954332 Hong et al. Oct 2005 B1
6958885 Chen et al. Oct 2005 B1
6961221 Niu et al. Nov 2005 B1
6967823 Nakamoto et al. Nov 2005 B2
6969989 Mei Nov 2005 B1
6975486 Chen et al. Dec 2005 B2
6980403 Hasegawa Dec 2005 B2
6987643 Seagle Jan 2006 B1
6989962 Dong et al. Jan 2006 B1
6989972 Stoev et al. Jan 2006 B1
7006327 Krounbi et al. Feb 2006 B2
7007372 Chen et al. Mar 2006 B1
7012832 Sin et al. Mar 2006 B1
7023658 Knapp et al. Apr 2006 B1
7026063 Ueno et al. Apr 2006 B2
7027268 Zhu et al. Apr 2006 B1
7027274 Sin et al. Apr 2006 B1
7035046 Young et al. Apr 2006 B1
7041985 Wang et al. May 2006 B1
7046487 Terunuma May 2006 B2
7046490 Ueno et al. May 2006 B1
7054113 Seagle et al. May 2006 B1
7057853 Okada et al. Jun 2006 B2
7057857 Niu et al. Jun 2006 B1
7059868 Yan Jun 2006 B1
7092195 Liu et al. Aug 2006 B1
7110289 Sin et al. Sep 2006 B1
7111382 Knapp et al. Sep 2006 B1
7113366 Wang et al. Sep 2006 B1
7114241 Kubota et al. Oct 2006 B2
7116517 He et al. Oct 2006 B1
7124654 Davies et al. Oct 2006 B1
7126788 Liu et al. Oct 2006 B1
7126790 Liu et al. Oct 2006 B1
7131346 Buttar et al. Nov 2006 B1
7133253 Seagle et al. Nov 2006 B1
7134185 Knapp et al. Nov 2006 B1
7154715 Yamanaka et al. Dec 2006 B2
7170723 Taguchi Jan 2007 B2
7170725 Zhou et al. Jan 2007 B1
7177117 Jiang et al. Feb 2007 B1
7180712 Li et al. Feb 2007 B1
7193815 Stoev et al. Mar 2007 B1
7196880 Anderson et al. Mar 2007 B1
7199974 Alfoqaha Apr 2007 B1
7199975 Pan Apr 2007 B1
7211339 Seagle et al. May 2007 B1
7212384 Stoev et al. May 2007 B1
7238292 He et al. Jul 2007 B1
7239478 Sin et al. Jul 2007 B1
7248431 Liu et al. Jul 2007 B1
7248433 Stoev et al. Jul 2007 B1
7248449 Seagle Jul 2007 B1
7280325 Pan Oct 2007 B1
7283327 Liu et al. Oct 2007 B1
7284316 Huai et al. Oct 2007 B1
7286329 Chen et al. Oct 2007 B1
7289303 Sin et al. Oct 2007 B1
7292409 Stoev et al. Nov 2007 B1
7295401 Jayasekara et al. Nov 2007 B2
7296339 Yang et al. Nov 2007 B1
7307814 Seagle et al. Dec 2007 B1
7307818 Park et al. Dec 2007 B1
7310204 Stoev et al. Dec 2007 B1
7318947 Park et al. Jan 2008 B1
7324309 Wiesen et al. Jan 2008 B1
7333295 Medina et al. Feb 2008 B1
7337530 Stoev et al. Mar 2008 B1
7342752 Zhang et al. Mar 2008 B1
7349170 Rudman et al. Mar 2008 B1
7349179 He et al. Mar 2008 B1
7354664 Jiang et al. Apr 2008 B1
7363697 Dunn et al. Apr 2008 B1
7371152 Newman May 2008 B1
7372665 Stoev et al. May 2008 B1
7375926 Stoev et al. May 2008 B1
7379269 Krounbi et al. May 2008 B1
7382574 Li et al. Jun 2008 B2
7386933 Krounbi et al. Jun 2008 B1
7389577 Shang et al. Jun 2008 B1
7417832 Erickson et al. Aug 2008 B1
7419891 Chen et al. Sep 2008 B1
7426091 Okada et al. Sep 2008 B2
7428124 Song et al. Sep 2008 B1
7430098 Song et al. Sep 2008 B1
7436620 Kang et al. Oct 2008 B1
7436638 Pan Oct 2008 B1
7440220 Kang et al. Oct 2008 B1
7443632 Stoev et al. Oct 2008 B1
7444740 Chung et al. Nov 2008 B1
7446979 Jayasekara Nov 2008 B2
7457080 Watabe et al. Nov 2008 B2
7493688 Wang et al. Feb 2009 B1
7508627 Zhang et al. Mar 2009 B1
7522377 Jiang et al. Apr 2009 B1
7522379 Krounbi et al. Apr 2009 B1
7522382 Pan Apr 2009 B1
7542246 Song et al. Jun 2009 B1
7551394 Sasaki et al. Jun 2009 B2
7551406 Thomas et al. Jun 2009 B1
7552523 He et al. Jun 2009 B1
7554765 Shukh et al. Jun 2009 B2
7554767 Hu et al. Jun 2009 B1
7583466 Kermiche et al. Sep 2009 B2
7595967 Moon et al. Sep 2009 B1
7606007 Gill Oct 2009 B2
7639457 Chen et al. Dec 2009 B1
7660080 Liu et al. Feb 2010 B1
7672080 Tang et al. Mar 2010 B1
7672086 Jiang Mar 2010 B1
7684160 Erickson et al. Mar 2010 B1
7688546 Bai et al. Mar 2010 B1
7691434 Zhang et al. Apr 2010 B1
7695761 Shen et al. Apr 2010 B1
7719795 Hu et al. May 2010 B2
7726009 Liu et al. Jun 2010 B1
7729086 Song et al. Jun 2010 B1
7729087 Stoev et al. Jun 2010 B1
7736823 Wang et al. Jun 2010 B1
7773341 Zhang et al. Aug 2010 B2
7785666 Sun et al. Aug 2010 B1
7796356 Fowler et al. Sep 2010 B1
7800858 Bajikar et al. Sep 2010 B1
7819979 Chen et al. Oct 2010 B1
7829264 Wang et al. Nov 2010 B1
7846643 Sun et al. Dec 2010 B1
7855854 Hu et al. Dec 2010 B2
7869160 Pan et al. Jan 2011 B1
7872824 Macchioni et al. Jan 2011 B1
7872833 Hu et al. Jan 2011 B2
7910267 Zeng et al. Mar 2011 B1
7911735 Sin et al. Mar 2011 B1
7911737 Jiang et al. Mar 2011 B1
7916426 Hu et al. Mar 2011 B2
7918013 Dunn et al. Apr 2011 B1
7968219 Jiang et al. Jun 2011 B1
7982989 Shi et al. Jul 2011 B1
8008912 Shang Aug 2011 B1
8012804 Wang et al. Sep 2011 B1
8015692 Zhang et al. Sep 2011 B1
8018677 Chung et al. Sep 2011 B1
8018678 Zhang et al. Sep 2011 B1
8024748 Moravec et al. Sep 2011 B1
8072705 Wang et al. Dec 2011 B1
8074345 Anguelouch et al. Dec 2011 B1
8077418 Hu et al. Dec 2011 B1
8077434 Shen et al. Dec 2011 B1
8077435 Liu et al. Dec 2011 B1
8077557 Hu et al. Dec 2011 B1
8079135 Shen et al. Dec 2011 B1
8081403 Chen et al. Dec 2011 B1
8091210 Sasaki et al. Jan 2012 B1
8097846 Anguelouch et al. Jan 2012 B1
8104166 Zhang et al. Jan 2012 B1
8116043 Leng et al. Feb 2012 B2
8116171 Lee Feb 2012 B1
8125856 Li et al. Feb 2012 B1
8134794 Wang Mar 2012 B1
8136224 Sun et al. Mar 2012 B1
8136225 Zhang et al. Mar 2012 B1
8136805 Lee Mar 2012 B1
8141235 Zhang Mar 2012 B1
8146236 Luo et al. Apr 2012 B1
8149536 Yang et al. Apr 2012 B1
8151441 Rudy et al. Apr 2012 B1
8163185 Sun et al. Apr 2012 B1
8164760 Willis Apr 2012 B2
8164855 Gibbons et al. Apr 2012 B1
8164864 Kaiser et al. Apr 2012 B2
8165709 Rudy Apr 2012 B1
8166631 Tran et al. May 2012 B1
8166632 Zhang et al. May 2012 B1
8169473 Yu et al. May 2012 B1
8171618 Wang et al. May 2012 B1
8179636 Bai et al. May 2012 B1
8191237 Luo et al. Jun 2012 B1
8194365 Leng et al. Jun 2012 B1
8194366 Li et al. Jun 2012 B1
8196285 Zhang et al. Jun 2012 B1
8200054 Li et al. Jun 2012 B1
8203800 Li et al. Jun 2012 B2
8208350 Hu et al. Jun 2012 B1
8220140 Wang et al. Jul 2012 B1
8222599 Chien Jul 2012 B1
8225488 Zhang et al. Jul 2012 B1
8227023 Liu et al. Jul 2012 B1
8228633 Tran et al. Jul 2012 B1
8231796 Li et al. Jul 2012 B1
8233248 Li et al. Jul 2012 B1
8248896 Yuan et al. Aug 2012 B1
8254060 Shi et al. Aug 2012 B1
8257597 Guan et al. Sep 2012 B1
8259410 Bai et al. Sep 2012 B1
8259539 Hu et al. Sep 2012 B1
8262918 Li et al. Sep 2012 B1
8262919 Luo et al. Sep 2012 B1
8264797 Emley Sep 2012 B2
8264798 Guan et al. Sep 2012 B1
8270126 Roy et al. Sep 2012 B1
8276258 Tran et al. Oct 2012 B1
8277669 Chen et al. Oct 2012 B1
8279719 Hu et al. Oct 2012 B1
8284517 Sun et al. Oct 2012 B1
8288204 Wang et al. Oct 2012 B1
8289821 Huber Oct 2012 B1
8291743 Shi et al. Oct 2012 B1
8307539 Rudy et al. Nov 2012 B1
8307540 Tran et al. Nov 2012 B1
8308921 Hiner et al. Nov 2012 B1
8310785 Zhang et al. Nov 2012 B1
8310901 Batra et al. Nov 2012 B1
8315019 Mao et al. Nov 2012 B1
8316527 Hong et al. Nov 2012 B2
8320076 Shen et al. Nov 2012 B1
8320077 Tang et al. Nov 2012 B1
8320219 Wolf et al. Nov 2012 B1
8320220 Yuan et al. Nov 2012 B1
8320722 Yuan et al. Nov 2012 B1
8322022 Yi et al. Dec 2012 B1
8322023 Zeng et al. Dec 2012 B1
8325569 Shi et al. Dec 2012 B1
8333008 Sin et al. Dec 2012 B1
8334093 Zhang et al. Dec 2012 B2
8336194 Yuan et al. Dec 2012 B2
8339738 Tran et al. Dec 2012 B1
8341826 Jiang et al. Jan 2013 B1
8343319 Li et al. Jan 2013 B1
8343364 Gao et al. Jan 2013 B1
8349195 Si et al. Jan 2013 B1
8351307 Wolf et al. Jan 2013 B1
8357244 Zhao et al. Jan 2013 B1
8373945 Luo et al. Feb 2013 B1
8375564 Luo et al. Feb 2013 B1
8375565 Hu et al. Feb 2013 B2
8381391 Park et al. Feb 2013 B2
8385157 Champion et al. Feb 2013 B1
8385158 Hu et al. Feb 2013 B1
8394280 Wan et al. Mar 2013 B1
8400731 Li et al. Mar 2013 B1
8402635 Degawa et al. Mar 2013 B2
8404128 Zhang et al. Mar 2013 B1
8404129 Luo et al. Mar 2013 B1
8405930 Li et al. Mar 2013 B1
8409453 Jiang et al. Apr 2013 B1
8413317 Wan et al. Apr 2013 B1
8416540 Li et al. Apr 2013 B1
8419953 Su et al. Apr 2013 B1
8419954 Chen et al. Apr 2013 B1
8422176 Leng et al. Apr 2013 B1
8422342 Lee Apr 2013 B1
8422841 Shi et al. Apr 2013 B1
8424192 Yang et al. Apr 2013 B1
8441756 Sun et al. May 2013 B1
8443510 Shi et al. May 2013 B1
8444866 Guan et al. May 2013 B1
8449948 Medina et al. May 2013 B2
8451556 Wang et al. May 2013 B1
8451563 Zhang et al. May 2013 B1
8454846 Zhou et al. Jun 2013 B1
8455119 Jiang et al. Jun 2013 B1
8456961 Wang et al. Jun 2013 B1
8456963 Hu et al. Jun 2013 B1
8456964 Yuan et al. Jun 2013 B1
8456966 Shi et al. Jun 2013 B1
8456967 Mallary Jun 2013 B1
8458892 Si et al. Jun 2013 B2
8462592 Wolf et al. Jun 2013 B1
8468682 Zhang Jun 2013 B1
8472288 Wolf et al. Jun 2013 B1
8480911 Osugi et al. Jul 2013 B1
8486285 Zhou et al. Jul 2013 B2
8486286 Gao et al. Jul 2013 B1
8488272 Tran et al. Jul 2013 B1
8491801 Tanner et al. Jul 2013 B1
8491802 Gao et al. Jul 2013 B1
8493693 Zheng et al. Jul 2013 B1
8493695 Kaiser et al. Jul 2013 B1
8495813 Hu et al. Jul 2013 B1
8498084 Leng et al. Jul 2013 B1
8506828 Osugi et al. Aug 2013 B1
8514517 Batra et al. Aug 2013 B1
8518279 Wang et al. Aug 2013 B1
8518832 Yang et al. Aug 2013 B1
8520336 Liu et al. Aug 2013 B1
8520337 Liu et al. Aug 2013 B1
8524068 Medina et al. Sep 2013 B2
8526275 Yuan et al. Sep 2013 B1
8531801 Xiao et al. Sep 2013 B1
8532450 Wang et al. Sep 2013 B1
8533937 Wang et al. Sep 2013 B1
8537494 Pan et al. Sep 2013 B1
8537495 Luo et al. Sep 2013 B1
8537502 Park et al. Sep 2013 B1
8545999 Leng et al. Oct 2013 B1
8547659 Bai et al. Oct 2013 B1
8547667 Roy et al. Oct 2013 B1
8547730 Shen et al. Oct 2013 B1
8555486 Medina et al. Oct 2013 B1
8559141 Pakala et al. Oct 2013 B1
8563146 Zhang et al. Oct 2013 B1
8565049 Tanner et al. Oct 2013 B1
8576517 Tran et al. Nov 2013 B1
8578594 Jiang et al. Nov 2013 B2
8582238 Liu et al. Nov 2013 B1
8582241 Yu et al. Nov 2013 B1
8582253 Zheng et al. Nov 2013 B1
8588039 Shi et al. Nov 2013 B1
8593914 Wang et al. Nov 2013 B2
8597528 Roy et al. Dec 2013 B1
8599520 Liu et al. Dec 2013 B1
8599657 Lee Dec 2013 B1
8603593 Roy et al. Dec 2013 B1
8607438 Gao et al. Dec 2013 B1
8607439 Wang et al. Dec 2013 B1
8611035 Bajikar et al. Dec 2013 B1
8611054 Shang et al. Dec 2013 B1
8611055 Pakala et al. Dec 2013 B1
8614864 Hong et al. Dec 2013 B1
8619512 Yuan et al. Dec 2013 B1
8625233 Ji et al. Jan 2014 B1
8625941 Shi et al. Jan 2014 B1
8628672 Si et al. Jan 2014 B1
8630068 Mauri et al. Jan 2014 B1
8634280 Wang et al. Jan 2014 B1
8638529 Leng et al. Jan 2014 B1
8643980 Fowler et al. Feb 2014 B1
8649123 Zhang et al. Feb 2014 B1
8665561 Knutson et al. Mar 2014 B1
8670211 Sun et al. Mar 2014 B1
8670213 Zeng et al. Mar 2014 B1
8670214 Knutson et al. Mar 2014 B1
8670294 Shi et al. Mar 2014 B1
8670295 Hu et al. Mar 2014 B1
8675318 Ho et al. Mar 2014 B1
8675455 Krichevsky et al. Mar 2014 B1
8681594 Shi et al. Mar 2014 B1
8689430 Chen et al. Apr 2014 B1
8693141 Elliott et al. Apr 2014 B1
8703397 Zeng et al. Apr 2014 B1
8705205 Li et al. Apr 2014 B1
8711518 Zeng et al. Apr 2014 B1
8711528 Xiao et al. Apr 2014 B1
8717709 Shi et al. May 2014 B1
8720044 Tran et al. May 2014 B1
8721902 Wang et al. May 2014 B1
8724259 Liu et al. May 2014 B1
8749790 Tanner et al. Jun 2014 B1
8749920 Knutson et al. Jun 2014 B1
8753903 Tanner et al. Jun 2014 B1
8760807 Zhang et al. Jun 2014 B1
8760818 Diao et al. Jun 2014 B1
8760819 Liu et al. Jun 2014 B1
8760822 Li et al. Jun 2014 B1
8760823 Chen et al. Jun 2014 B1
8763235 Wang et al. Jul 2014 B1
8780498 Jiang et al. Jul 2014 B1
8780505 Xiao Jul 2014 B1
8786983 Liu et al. Jul 2014 B1
8790524 Luo et al. Jul 2014 B1
8790527 Luo et al. Jul 2014 B1
8792208 Liu et al. Jul 2014 B1
8792312 Wang et al. Jul 2014 B1
8793866 Zhang et al. Aug 2014 B1
8797680 Luo et al. Aug 2014 B1
8797684 Tran et al. Aug 2014 B1
8797686 Bai et al. Aug 2014 B1
8797692 Guo et al. Aug 2014 B1
8813324 Emley et al. Aug 2014 B2
20010043446 Barlow et al. Nov 2001 A1
20020149886 Gill Oct 2002 A1
20040120074 Okada et al. Jun 2004 A1
20050013044 Hirata et al. Jan 2005 A1
20060044682 Le et al. Mar 2006 A1
20060109592 Watanabe et al. May 2006 A1
20060119981 Li et al. Jun 2006 A1
20070019341 Mizuno et al. Jan 2007 A1
20080013221 Ohta et al. Jan 2008 A1
20090052092 Zhou et al. Feb 2009 A1
20090168240 Hsiao et al. Jul 2009 A1
20090174971 Tsuchiya et al. Jul 2009 A1
20090279213 Wu et al. Nov 2009 A1
20100079917 Miyauchi et al. Apr 2010 A1
20100290157 Zhang et al. Nov 2010 A1
20110086240 Xiang et al. Apr 2011 A1
20110097601 Bai et al. Apr 2011 A1
20110273802 Zhou et al. Nov 2011 A1
20120087046 Yanagisawa et al. Apr 2012 A1
20120111826 Chen et al. May 2012 A1
20120134057 Song et al. May 2012 A1
20120216378 Emley et al. Aug 2012 A1
20120237878 Zeng et al. Sep 2012 A1
20120298621 Gao Nov 2012 A1
20130216702 Kaiser et al. Aug 2013 A1
20130216863 Li et al. Aug 2013 A1
20130257421 Shang et al. Oct 2013 A1
20140154529 Yang et al. Jun 2014 A1
20140175050 Zhang et al. Jun 2014 A1
Non-Patent Literature Citations (6)
Entry
Final Office Action dated Oct. 3, 2014 from U.S. Appl. No. 12/976,916, 100 pages.
Dehua Han, et al., U.S. Appl. No. 12/976,916, filed Dec. 22, 2010, 44 pages.
Office Action dated Apr. 3, 2012 from U.S. Appl. No. 12/970,423, 7 pages.
Notice of Allowance dated Jul. 25, 2012 from U.S. Appl. No. 12/970,423, 7 pages.
Notice of Allowance dated Oct. 25, 2012 from U.S. Appl. No. 12/970,423, 11 pages.
Supplemental Allowance dated Apr. 15, 2013 from U.S. Appl. No. 12/970,423, 6 pages.
Divisions (1)
Number Date Country
Parent 12970423 Dec 2010 US
Child 13769951 US