BACKGROUND
Heat leak is a common problem associated with the process of heating or cooling. One of the most prolific solutions to heat leak is insulation, which generally addresses heat leak throughout a system. Issues of heat leak are often exacerbated during a power loss where electrical control of a system is not possible. In those cases, passive insulation may be the only mitigating factor for the heat loss. By the time power is restored to a system, the temperature within the heater or cooler may be outside an acceptable threshold range. For example, a loss of power may cause objects in a freezer to melt.
Heat leak related to coolers and heaters for temperature-sensitive objects is a larger concern, where a difference of mere degrees may cause damage. Again, the most common solution is to add insulation, such as a vacuum jacket. Back-up power sources, such as generators, are another common solution to issues associated with power loss. Heat leak caused by backflow of heat or cold is particularly significant in systems that rely on the transfer of heat against a thermal gradient.
These issues are exacerbated the further removed one is from certain environmental conditions, such as gravity or the natural heat of the Earth. Due to the extreme temperatures cause by the sun (or lack thereof) encountered outside of Earth's ozone, it is difficult to regulate normal temperatures, much less extreme cold or extreme heat as needed for in-space processes. If power is lost for any amount of time, the extreme temperature inside the cryocooler is continually gaining heat, which could disrupt any heat-dependent processes. Space stations likely do not have multiple sources that can produce the same extreme temperature. The process cannot be quickly transferred to another cryocooler or machine since there may not be alternatives available. This may cause irreparable equipment damage and loss of what material is held in a container, such as science or sensitive matter or substances.
SUMMARY OF THE DISCLOSURE
What is needed is a way to limit a heat leak during power loss of a temperature control system, particularly for systems that rely on heating or cooling against a thermal gradient. Heating or cooling against a thermal gradient generally requires a power source, and when the power source is removed, the temperatures naturally try to establish equilibrium with the surrounding environment, which can result in significant loss of temperature control. In some aspects, a loss of power in a temperature control system may cause a heat leak that may place the temperature of the load outside a target range, potentially causing damage to the load.
Accordingly, the present disclosure relates to issues that may arise from power loss in temperature control systems, such as a heat pump or thermal engine. The present disclosure addresses this problem by breaking the thermal path between the cooler and load during power loss. The system may comprise a series of energy storage devices such as capacitors that may store enough energy to electromechanically actuate or displace the thermal connection to the Stirling engine when the system input voltage drops below a critical threshold. In some embodiments, the movement of the Stirling cooler may stretch the edge-welded bellows between it and the vacuum jacket, which may break the thermal path.
In this condition, particularly where the conductive interface is located within a vacuum jacket, heat transfer back into the system may be limited to radiation across the gap, which yields heat losses that are dramatically reduced from traditional stationary installations. Without a vacuum jacket, the heat transfer may occur through convection in addition to radiation, which would still be significantly less than if the thermal path remained intact.
In some implementations, a cooler may be electro-mechanically actuated along its axis, wherein the physical movement may break the conductive interface, breaking thermal conductive contact with the rest of the structure. This may reduce heat leak during a power loss condition. In some embodiments, actuation of a cooler may be practical where a flexible edge-welded bellow is welded between the cooler and vacuum jacket structure, which may allow for limited extension and compression.
In some aspects, a mechanism to break a thermal path may be utilized in conjunction with other power loss solutions, such as battery backups and generators. In contrast to traditional solutions that attempt to continue power supply or add insulation, breaking a thermal path may add minimal mass to the system.
The present disclosure relates to a temperature control system. In some embodiments, the temperature control system may comprise a temperature-controlled unit; a temperature controlling device configured to control a temperature of the temperature-controlled unit, where the temperature controlling device may be connectable to a power source; a thermal path connector; an actuatable connector; a first thermal interface connectable to the temperature-controlled unit; a second end; a second thermal interface connectable to the temperature-controlling device; and an actuation mechanism configured to actuate the actuatable connector based on predefined parameters. In some implementations, actuation of the actuatable connector may control connection of one or both the first thermal interface to the temperature-controlled unit and the second thermal interface and the temperature-controlling device, and where, when connected, a thermal path between the temperature-controlled unit and the temperature-controlling device may be continuous, and where, when one or both the first thermal interface and the second thermal interface may be disconnected, the thermal path may be broken.
In some embodiments, actuation of the thermal path connector may occur with power loss. In some implementations, the temperature control system may comprise a power detector configured to detect power loss, where the power detector prompts actuation of the thermal path connector. In some aspects, the temperature-controlled unit may comprise a plurality of zones, where temperature of each zone may be independently controllable.
In some embodiments, the temperature-controlling device may comprise a thermodynamic engine. In some implementations, the temperature-controlled unit may comprise: a containing portion that may comprise a cavity may comprise at least a first containing wall to contain a load, where the temperature-controlling device directly or indirectly controls a load temperature when the load may be located within the cavity, an opening configured to receive the load into the cavity; and a lid may comprise a movable cover configured to control access to the opening, where a closed position of the lid limits passive temperature change within the cavity.
In some embodiments, one or both the lid and the opening further may comprise rigid bellows configured to limit passive temperature change within the cavity. In some implementations, the temperature-controlled unit further may comprise a second containing wall, where the second containing wall surrounds the first containing wall. In some aspects, a space between the first containing wall and the second containing wall may comprise a vacuum jacket. In some embodiments, the temperature control system may be configured to operate in one or both microgravity or zero gravity conditions.
In some implementations, the actuatable connector may comprise a thermal strap. In some aspects, the thermal path connector may comprise a pivot mechanism connected to the actuatable connector, where actuation of the actuatable connector occurs by pivoting the thermal path connector and where pivoting disconnects one or both the first thermal interface and the second thermal interface. In some embodiments, breaking the thermal path may limit passive temperature change of the temperature-controlled unit.
In some implementations, actuation of the actuatable connector may occur with power loss. In some aspects, a resting state of the thermal path connector disconnects one or both the first thermal interface to the temperature-controlled unit and the second thermal interface and the temperature-controlling device. In some embodiments, actuation of the actuatable connector may control connection of one or both the third thermal interface and the fourth thermal interface, and where when both the second thermal interface and the fourth thermal interface are connected a thermal path between the temperature-controlled unit and at least the second portion of temperature-controlling devices may be continuous, and where when one or both the third thermal interface and the fourth thermal interface may be disconnected, the thermal path may be broken.
In some implementations, breaking the thermal path may limit passive temperature change of the temperature-controlled unit. In some aspects, the actuatable connector may comprise a thermal strap. Implementations of the described techniques may comprise hardware, a method or process, or computer software on a computer-accessible medium.
The present disclosure relates to a thermal path connector. In some embodiments, the thermal path connector may comprise an actuatable connector may comprise a first end may comprise a first thermal interface connectable to a temperature-controlled unit; a second end may comprise a second thermal interface connectable to a temperature-controlling device; and an actuation mechanism configured to actuate the actuatable connector based on predefined parameters, where actuation of the actuatable connector controls connection of one or both the first thermal interface to the temperature-controlled unit and the second thermal interface and the temperature-controlling device, and where when connected a thermal path between the temperature-controlled unit and the temperature-controlling device may be continuous, and where when one or both the first thermal interface and the second thermal interface may be disconnected, the thermal path may be broken.
The present disclosure relates to a temperature control system. In some embodiments, a temperature control system may comprise a temperature-controlled unit; a plurality of temperature-controlling devices connectable to a power source, wherein each of the plurality of temperature-controlling devices is configured to control temperature of the temperature-controlled unit when connected to the power source; and a first thermal path connector.
In some implementations, the first thermal path connector may comprise a first actuatable connector that may comprise a first end comprising a first thermal interface connectable to the temperature-controlled unit, a second end comprising a second thermal interface connectable to at least a first portion of the plurality of temperature-controlling devices, and a first actuation mechanism configured to actuate the first actuatable connector based on predefined parameters, wherein actuation of the first actuatable connector controls connection of one or both the first thermal interface and the second thermal interface, and wherein when both the first thermal interface and the second thermal interface are connected a thermal path between the temperature-controlled unit and at least the first portion of temperature-controlling devices is continuous, and wherein when one or both the first thermal interface and the second thermal interface is disconnected, the thermal path is broken.
In some embodiments, the system may further comprise a second thermal path connector comprising a second actuatable connector comprising a third end comprising a first thermal interface connectable to the temperature-controlled unit, a second end comprising a second thermal interface connectable to at least a second portion of the plurality of temperature-controlling devices, and a second actuation mechanism configured to actuate the second actuatable connector based on predefined parameters, wherein actuation of the actuatable connector controls connection of one or both the third thermal interface and the fourth thermal interface, and wherein when both the second thermal interface and the fourth thermal interface are connected a thermal path between the temperature-controlled unit and at least the second portion of temperature-controlling devices is continuous, and wherein when one or both the third thermal interface and the fourth thermal interface is disconnected, the thermal path is broken. In some implementations, breaking the thermal path may limit passive temperature change of the temperature-controlled unit.
BRIEF DESCRIPTION OF THE DRAWINGS
The accompanying drawings that are incorporated in and constitute a part of this specification illustrate several embodiments of the disclosure and, together with the description, serve to explain the principles of the disclosure:
FIG. 1A illustrates an exemplary temperature control system according to some embodiments of the present disclosure.
FIG. 1B illustrates an exemplary temperature control system according to some embodiments of the present disclosure.
FIG. 2A illustrates an exemplary temperature control system with an open thermal path, according to some embodiments of the present disclosure.
FIG. 2B illustrates a segment of an exemplary temperature control system with a closed thermal path, according to some embodiments of the present disclosure.
FIG. 2C illustrates a segment of an exemplary temperature control system with an open thermal path, according to some embodiments of the present disclosure.
FIG. 3A illustrates an exemplary temperature control system, according to some embodiments of the present disclosure.
FIG. 3B illustrates an exemplary temperature control system, according to some embodiments of the present disclosure.
FIG. 4A illustrates an exemplary temperature control system with an open thermal path, according to some embodiments of the present disclosure.
FIG. 4B illustrates a segment of an exemplary temperature control system with a closed thermal path, according to some embodiments of the present disclosure.
FIG. 4C illustrates an exemplary embodiment of a thermal path connector, according to some embodiments of the present disclosure.
FIG. 5A illustrates an exemplary temperature control system with an open thermal path, according to some embodiments of the present disclosure.
FIG. 5B illustrates a segment of an exemplary temperature control system with a closed thermal path, according to some embodiments of the present disclosure.
FIG. 6A illustrates a portion of an exemplary temperature control system with an open thermal path, according to some embodiments of the present disclosure.
FIG. 6B illustrates a portion of an exemplary temperature control system with a closed thermal path, according to some embodiments of the present disclosure.
FIG. 7 illustrates an exemplary temperature control system with an actuation mechanism, wherein actuation shifts temperature-controlled unit, according to some embodiments of the present disclosure.
FIG. 8A illustrates an exemplary temperature control system with a closed thermal path, wherein a rigid conductive bar provides a thermal path between heat sinks, according to some embodiments of the present disclosure.
FIG. 8B illustrates an exemplary temperature control system with an open thermal path, wherein a rigid conductive bar provides a thermal path between heat sinks, according to some embodiments of the present disclosure.
FIG. 9A illustrates an exemplary temperature control system with a closed thermal path, according to some embodiments of the present disclosure.
FIG. 9B illustrates an exemplary temperature control system with an open thermal path, according to some embodiments of the present disclosure.
FIG. 10A illustrates a portion of an exemplary temperature control system with an open thermal path, wherein control of the thermal path occurs electromagnetically, according to some embodiments of the present disclosure.
FIG. 10B illustrates a portion of an exemplary temperature control system with a closed thermal path, wherein control of the thermal path occurs electromagnetically, according to some embodiments of the present disclosure.
FIG. 11A illustrates a portion of an exemplary temperature control system with an open thermal path, wherein the thermal path comprises a normally open configuration, according to some embodiments of the present disclosure.
FIG. 11B illustrates a portion of an exemplary temperature control system with a closed thermal path, wherein the thermal path comprises a normally open configuration, according to some embodiments of the present disclosure.
FIG. 12A illustrates an exemplary embodiment of a container within the temperature-controlled unit, according to some embodiments of the present disclosure.
FIG. 12B illustrates an exemplary embodiment of a container within the temperature-controlled unit, according to some embodiments of the present disclosure.
FIG. 13A illustrates an exemplary cut-view of an embodiment of a temperature-controlled unit with rigid bellows, a vacuum jacket, and convective properties, according to some embodiments of the present disclosure.
FIG. 13B illustrates an exemplary cut-view of an embodiment of a temperature-controlled unit with rigid bellows, a vacuum jacket, and convective properties, according to some embodiments of the present disclosure.
FIG. 13C illustrates an exemplary temperature-controlled unit comprising a container, wherein the container is in an open position.
FIG. 13D illustrates exemplary rigid bellows, according to some embodiments of the present disclosure.
FIG. 13E illustrates exemplary rigid bellows, according to some embodiments of the present disclosure.
FIG. 14A illustrates an exemplary insulated vacuum jacket, rigid bellows, and a plurality of conductive surfaces within the temperature-controlled unit, according to some embodiments of the present disclosure.
FIG. 14B illustrates an exemplary insulated vacuum jacket, rigid bellows, and a plurality of conductive surfaces within the temperature controlled unit, according to some embodiments of the present disclosure.
FIG. 15A illustrates an exemplary thermal path that connects to the lid within the temperature-controlled unit, according to some embodiments of the present disclosure.
FIG. 15B illustrates an exemplary thermal path that connects to the lid within the temperature-controlled unit, according to some embodiments of the present disclosure.
FIG. 16A illustrates an exemplary visual temperature indicator, according to some embodiments of the present disclosure.
FIG. 16B illustrates an exemplary visual temperature indicator, according to some embodiments of the present disclosure.
FIG. 17A illustrates an exemplary rotating external temperature control system, according to some embodiments of the present disclosure.
FIG. 17B illustrates an exemplary rotating external temperature control system, according to some embodiments of the present disclosure.
FIG. 18 illustrates an exemplary temperature control system comprising a plurality of temperature-controlled unit, according to some embodiments of the present disclosure.
FIG. 19 illustrates an exemplary cycle of connecting and breaking a thermal path within a thermal system, according to some embodiments of the present disclosure.
FIG. 20 illustrates exemplary method steps for breaking a thermal path in response to a detected loss in power, wherein the thermal path comprises a normally closed configuration, according to some embodiments of the present disclosure.
FIG. 21 illustrates exemplary method steps for engaging a thermal path upon receipt of power, wherein the thermal path comprises a normally open configuration, according to some embodiments of the present disclosure.
DETAILED DESCRIPTION
In the following sections, detailed descriptions of examples and methods of the disclosure will be given. The description of both preferred and alternative examples, though thorough, are exemplary only, and it is understood to those skilled in the art that variations, modifications, and alterations may be apparent. It is therefore to be understood that the examples do not limit the broadness of the aspects of the underlying disclosure as defined by the claims.
Glossary
- Temperature-Controlled Unit: as used herein refers to the portion of the temperature control system that is targeted for temperature control. In some embodiments, the temperature-controlled unit may operate without power. The temperature-controlled unit may slow heat transfer sufficient to allow for controlled temperature retention within the temperature threshold. In some implementations, the temperature-controlled unit may transmit information indicating the expiration period of the integrity of the temperature within the temperature-controlled unit after a disconnection with a power source. In some aspects, a temperature-controlled unit may comprise a container configured to hold a load, wherein the container may comprise an opening, lid, and cavity. The opening may accept a load into the cavity, and the lid may control access to the opening and cavity.
- Temperature Controlling Device: as used herein refers to a device directly or indirectly thermally connectable to a temperature-controlled unit such as through the thermal path connector. When the thermal path is continuous, a temperature-controlling device may heat or cool the temperature-controlled unit. As non-limiting examples, a temperature control system may comprise a Stirling engine cryocooler, a heat pump, a thermal engine, thermoelectric plates, or a solid-state cooler.
- Flexible Bellows: as used herein refers to a connector mechanism that may change in length or orientation when subjected to outside force.
- Rigid Bellows: as used herein refers to a pleated edge that limits leak of heat or cold. In some embodiments, rigid bellows may comprise edge-welded bellows. In some aspects, rigid bellows may be located on a perimeter of one or both a lid of a temperature-controlled unit and an opening of a temperature-controlled unit. The lid and opening of a temperature-controlled unit may be particularly susceptible to temperature leak.
- Temperature Control System: as used herein refers to a system configured to control a temperature of a load. In some aspects, a temperature control system may comprise a temperature-controlling device thermally connectable to a temperature-controlled unit, wherein connection may be controlled at least in part by a thermal path connector. In some embodiments, a temperature control system may comprise a power source. In some implementations, a temperature control system may be connected to an external power source, such as power from a space station, manufacturing plant, or space craft, as non-limiting examples.
- Temperature Leak: as used herein refers to a loss of temperature control. For example, where a temperature-controlling device may cool a temperature-controlled unit, a temperature leak may comprise heat gain. Where a temperature-controlling device may heat a temperature-controlling device, a temperature leak may comprise heat loss. Temperature leak may occur passively with or without power, such as at connection points within a TCS. Temperature leak may occur during loss of power when temperature equilibrium may naturally shift temperature from a temperature-controlled unit back to a temperature-controlling device.
- Heat or heating: as used herein refers to a temperature warmer than another temperature in the temperature control system. The term heat is used relative to the term cold. For example, heat may comprise −70 degrees C. and cold may comprise −80 degrees C.
- Cold or cooling: as used herein refers to a temperature cooler than another temperature in the temperature control system. The term cold is used relative to the term heat. For example, cold may comprise 75 degrees C. and heat may comprise 80 degrees C.
- Conductive Interface: as used herein refers to a connection point along a thermal path. In some embodiments, a conductive interface may occur in one or more locations along the thermal path. As non-limiting examples, conductive interfaces may be located at the junction between a thermal strap and a cryocooler finger, at the junction between a heat sink and a thermal bar.
- Thermal Path: as used herein refers to a path that allows for a thermal connection between a temperature-controlling device and temperature-controlled unit. In some aspects, a thermal path connector controls continuity of the thermal path.
- Thermal Path Connector (thermal path connector): as used herein refers to a moveable conductive piece that connects the thermal path between the temperature-controlling device and the temperature-controlled unit. In some embodiments, the thermal path connector may disconnect or be disconnectable from the temperature-controlling device or temperature-controlled unit at a conductive interface wherein disconnecting breaks the thermal path between the temperature-controlling device and the temperature-controlled unit. In some aspects, the conductive interface may be located at one or more locations such as between the thermal path connector and the temperature-controlling device, between the thermal path connector and the temperature-controlled unit, within the thermal path connector, or any combination thereof. In some aspects, such as with a Stirling engine, a thermal path connector may be continuous through a thermal strap of flexible material between a heat sink and cryocooler finger. In some embodiments, a thermal path connector may comprise a rigid bar with limited flexibility. In some implementations, such as with thermoelectric plates, a thermal path connector may comprise semiconductor pillars.
- Load: as used herein refers to an object or container that may be directly or indirectly temperature controlled by a temperature control system. In some aspects, a load may be directly connected to the temperature control system. In some embodiments, a load may be indirectly controlled by placing it in a container directly controlled by the temperature control system. A load may be indirectly controlled by a temperature-controlled unit that is directly or indirectly connected by a thermal path connector to a temperature-controlling device. In some implementations, a temperature-controlled unit may comprise a container that may accept a load.
Referring now to FIGS. 1A-1B, an exemplary embodiment of a temperature control system 100 is illustrated. In some embodiments, the temperature-controlled unit 110 may be connected to a temperature-controlling device 105 via a thermal path connector 130. In some implementations, the temperature-controlling device 105 may be external to the temperature control system 100. In some aspects, the temperature-controlling device may receive thermal energy from an external source. For example, in environments of extreme temperature such as outer space, the temperature control system may utilize the ambient temperature of space to cool the temperature-controlled unit 110. This may be helpful when radiance from the sun causes dramatic increases in temperature that can be negated by utilizing and focusing the existing temperature of space to cool an exposed element.
In some embodiments, a power supply may exist as a live connection to a larger source of energy. In some implementations, the power supply may be portable. For example, a removeable battery with insertable prongs may be attached to the top of the temperature control system 100. This may be useful in applications where connections may impede the use of the temperature control system in aspects of motion, such as rotation around the outside of a satellite.
Referring now to FIG. 2A, an exemplary temperature control system 200 is illustrated. In some aspects, a temperature control system 200 may comprise a temperature-controlling device 205 connected to a temperature-controlled unit 210, wherein the temperature control system 200 may control the temperature of loads placed in the temperature-controlled unit 210. In some embodiments, the temperature control system 200 may comprise a temperature-controlling device 205 with a passive heat exchanger 215 and a temperature-controlling device connector 220. In some implementations, the temperature-controlling device connector 220 may connect to the temperature-controlled unit 210 via a thermal path connector 230. For example, a thermal strap may facilitate heat transfer between the temperature-controlled unit 210 and the temperature-controlling device connector 220.
In some aspects, where the object may be cooled, the heat input side may occur at a conductive interface, and the heat output side may occur through the temperature-controlled unit 210. In some embodiments, where the object may be heated, the heat output side may occur into temperature-controlled unit 210, and the heat input side may occur at a conductive interface, wherein the thermal path connector 230 and the passive heat exchanger 215 may be reversed in location. In some aspects, the temperature-controlled unit 210 may be surrounded by a vacuum jacket 255, which may provide insulation. In some embodiments, the temperature-controlled unit 210 may be surround by phase change material, which may act as a thermal energy battery. In some implementations, a thermal energy battery may store and release thermal energy, which may allow for more efficient storage and release of energy than if no thermal energy battery was in place.
In some embodiments, a power sensor may discern between intentional and expected power loss. For example, if the power source is removed intentionally, the intended result may be to return to ambient temperature, and a break in the thermal path may delay that process. In some implementations, power loss intended to allow for a temperature leak may maintain continuity of the thermal path. Power loss that is unintentional or power loss that is still intended to maintain a temperature may trigger actuation of a thermal path connector.
In some aspects, terminating power may occur at a different rate, which may allow the power sensor to distinguish between intentional and unintentional power loss. In some embodiments, manual power loss may provide an option to prevent the actuator power sources from providing power to the actuator. As non-limiting examples, a temperature control system 200 may be used to maintain temperatures for space flight hardware, heat exchangers, and cold trap condensers.
Referring now to FIG. 2B, a segment of an exemplary temperature control system 200 with a closed thermal path is illustrated. In some aspects, the temperature-controlling device 205 may comprise bellows 225, which may allowing for limited movement of the temperature-controlled unit 210 based on extension and compression of the bellows 225. In some embodiments, a conductive interface 235 may occur between a thermal path connector 230 and temperature-controlling device connector 220.
Referring now to FIG. 2C, a segment of an exemplary temperature control system 200 with an open thermal path is illustrated. In some embodiments, the temperature-controlling device 205 may be shifted away from the thermal path connector 230, which may separate the conductive interface 235, breaking the thermal path between the temperature-controlled unit 210 and temperature-controlling device 205. Actuating the temperature-controlling device 205 away from the conductive surface 235 may compress the bellows 225. The gap formed at the conductive surface 235 may contain surrounding atmosphere. In some embodiments, the gap may contain a vacuum. In some implementations, an insulative liquid or other material may be inserted between the thermal path connector 230 and temperature-controlling device connector 220. A temperature control system 200 may comprise elements to provide vacuum or the insulative or liquid or other material when the temperature-controlled unit 210 is physically disengaged from the temperature-controlling device connector 220.
In some embodiments, the bellows 225 may affect the power requirements for actuation. For example, the resting state of the bellows may be in the compressed configuration for breaking the conductive surface 235, which may lower the power requirements to actuate the thermal path connector 230, as the bellows 225 may act as a spring. As non-limiting examples, actuation may be performed by linear or rotary actuators, solenoids, stepper, servo, DC motor, or BLDC driven. In some embodiments, other elements (e.g., actuating pins) are utilized to lock or hold the temperature-controlling device connector 220 in a position where it does not contact thermal path connector 230 or otherwise contact the temperature-controlled unit 210.
Referring now to FIGS. 3A and 3B, an exemplary embodiment of a temperature control system 300 is illustrated. In some embodiments, the thermal energy may be created in the temperature-controlling device 305. In some implementations, the temperature-controlling device 305 may connect directly or indirectly to the temperature-controlled unit 310 via the thermal path connector 330. In some aspects, the thermal path connector 330 may enter the container 350 of the temperature-controlled unit 310. The thermal path connector 330 may connect the temperature-controlling device 305 to the temperature-controlled unit 310 through a conductive surface 335 that may transfer heat throughout the temperature-controlled unit.
In some embodiments, the temperature-controlled unit 310 may comprise a container 350, which may be surrounded by a vacuum jacket 355. The container portion may comprise a cavity and an opening configured to accept a load into the cavity. The container 350 may comprise a lid that is a movable cover configured to control access to the opening. One or both the lid and opening may comprise material and features that may limit temperature leak, such as rigid bellows 365, insulation, or temperature-specific materials.
In some implementations, the thermal path connector 330 may penetrate the vacuum jacket 355 as it connects to the temperature-controlled unit 310. In some aspects, a plurality of conductive surfaces may connect to the thermal path connector 330 to disseminate the transferred thermal energy into the temperature-controlled unit 310. In some embodiments, the dispersion of this thermal energy may be supplemented by a convection device 340. This convection device 340 may assist in circulating radiated thermal energy emitting from the surfaces within the temperature-controlled unit 310. In some implementations, the conductive surfaces may come in contact with fluids comprising predefined thermophysical properties. These thermophysical properties may allow the fluid to store thermal energy to allow for energy dissipation over time without requiring a thermal source or power connection to supply thermal energy.
Referring now to FIG. 4A-4B, an exemplary temperature control system 400 with a thermal path is illustrated. In some embodiments, the thermal path connector 430 may be actuatable, wherein actuation may break the thermal path. In some implementations, the thermal path connector may operate as a actuation mechanism 418 that moves with the rotation axis at the base of the thermal path connector. In some aspects, the actuation mechanism 418 may be activated when the temperature control system 400 loses power.
For example, as a power sensor detects a loss of power, the temperature control system 400 may utilize the final traces of power stored as capacitance to activate the actuation mechanism 418. The actuation mechanism 418 may adjust the position of the thermal path connector 430 to disrupt the thermal path. In some embodiments, the actuation mechanism 418 may actuate the thermal path connector back to the connected position, reestablishing continuity of the thermal path when power is reconnected to the temperature control system 400.
Referring now to FIG. 4C, an exemplary embodiment of a thermal path connector 430 is illustrated. In some embodiments, the pivot mechanism 422 may dictate the movement of the thermal path connector 430. For example, the pivot mechanism 422 may possess a torsional spring that controls movement in conjunction with a mechanical clasp that releases the thermal path connector 430 when power is lost. As another example, the pivot mechanism may be connected to a small motor that controls the degree of separation of the thermal path connector 430 from the temperature-controlling device connector.
Referring now to FIG. 5A-5B, an exemplary temperature control system with a disruptable thermal path is illustrated. In some embodiments, the temperature-controlling device 505 may possess a passive heat exchanger 515. This may allow for the dissipation of excess thermal energy from the temperature control system. In some implementations, the temperature-controlling device connector 520 may retract from the thermal path connector 530 when the thermal path is disrupted. In some aspects, the conductive surface 535 of the thermal path connector may remain immobile as the temperature-controlling device connector 520 is removed from the conductive surface 535 upon retraction.
Referring now to FIG. 6A, a portion of an exemplary temperature control system with an open thermal path is illustrated. In some embodiments, during power loss, a temperature-controlled unit 610 may be actuated away from a thermal path connector 630, breaking a thermal path at a conductive surface 635. In some implementations, the separation between the conductive surface 635 may limit heat leak to radiative heat exchange, particularly where the thermal path is insulated in a vacuum jacket. In some aspects, where the thermal path is subjected to gravity, temperature leak may further occur by convection. In some implementations, power loss may be detected, and as the temperature control system loses power, an independent low power source may actuate the thermal path connector 630.
Referring now to FIG. 6B, a portion of an exemplary temperature control system with a closed thermal path is illustrated. In some aspects, once power is regained, the thermal path connector 630 may be actuated back toward the temperature-controlled unit 610, reconnecting at the conductive surface 635. In some embodiments, an actuator may receive a portion of the regained power, which may trigger actuation. Power to the temperature control system may recharge the independent low power source of the actuator. In some embodiments, actuation of the thermal path connector 630 may occur through centrifugal force, such as by spinning at least a portion of the temperature control system.
Referring now to FIG. 7, an exemplary temperature control system with an actuator mechanism 718 is illustrated, wherein actuation shifts a temperature-controlled unit 710. In some aspects, an actuator mechanism 718 may be installed on the exterior of the temperature control system. Installation of an exterior actuator mechanism 718 may be preferable particularly where a portion of the temperature control system may be contained within a vacuum jacket 755, which may be a more difficult environment to design for. In some implementations, a motor of the actuator mechanism 718 may be installed around the flexible bellows 725 of the temperature-controlled unit 710, and an extendable arm may attach to the body of the temperature-controlled unit 710. Extending and retracting the arm may actuate the temperature-controlled unit 710, engaging and disengaging the conductive interface.
In some aspects, actuation of the temperature-controlled unit 710 may be performed with linear steppers or servo actuators. For example, one or more linear solenoids, electromagnets, and similar may be used. In some implementations, separating the conductive interface may not be linear. For example, the gap may occur by rotating one or both the thermal path connector and the temperature-controlled unit 710, wherein 2-axis displacement plus rotation off-axis may further limit radiative transfer by changing the view factor between the two faces.
In some embodiments, a temperature control system may utilize an array of temperature-controlled unit 710 that may allow for more precise temperature control of a load. For example, a plurality of temperature-controlled unit 710 may be thermally connected to a load at various positions. The different positions may require different temperatures or may have different temperature sensitivity. In some aspects, the array may be arranged based on the unique cooling or heating needs of a system.
As an illustrative example, a satellite may be built to spin at a predefined speed, wherein the spin may limit exposure of any one portion of the satellite to solar radiation. An array of temperature-controlled unit 710 may be arranged around the satellite, wherein the conductive interfaces of each temperature-controlled unit 710 may engage when the portion of the satellite it controls is exposed to a threshold level of solar radiation and disengage when the exposure falls below the threshold level.
Referring now to FIG. 8A, an exemplary temperature control system 800 with a closed thermal path is illustrated, wherein a rigid conductive bar thermal path connector 830 provides a thermal path between the passive heat exchanger 815 and a temperature-controlled unit 810. In some aspects, a thermal path connector 830 may provide two conductive surfaces 835, 836 along a thermal path. In some embodiments, the thermal path connector 830 may actuate around a pivot mechanism 822, which may allow for control of the connections at the conductive surfaces 835, 836. For example, a rigid conductive bar may serve this purpose of facilitating this connection as a thermal path connector 830.
The temperature control system 800 may comprise a power sensor 860, which may monitor power levels. The power sensor 860 may detect when a power level falls below a predefined threshold level, wherein detection may cause activation of the pivot mechanism 822. In some implementations, the power sensor 860 may be configured to detect unexpected loss of power, wherein intentional disconnection of the temperature control system 800 may not trigger activation of the pivot mechanism 822.
Referring now to FIG. 8B, an exemplary temperature control system 800 with an open thermal path is illustrated, wherein a thermal path connector 830 provides a thermal path between a temperature-controlled unit 810 and a passive heat exchanger 815. In some embodiments, a pivot mechanism 822 may actuate the thermal path connector 830. In some aspects, pivoting a thermal path connector 830 may break the thermal path, and disengage conductive surfaces 835, 836 in a non-linear orientation.
Referring now to FIG. 9A, an exemplary temperature control system 900 with a closed thermal path is illustrated. In some embodiments, the thermal path between a temperature-controlling device 905 and a temperature-controlled unit 910 may comprise a thermal path connector 930. In some implementations, the temperature control system 900 may comprise multiple conductive surfaces 935, 936 which may further reduce heat leak during power loss. In some aspects, the conductive interfaces 935, 936 may be located between the temperature-controlling device 905 and the thermal path connector 930 and between the thermal path connector 930 and the temperature-controlled unit 910. In some implementations, an actuation mechanism 918 may shift the thermal path connector 930, wherein the actuator mechanism 918 may be activated when power loss is detected.
Referring now to FIG. 9B, an exemplary temperature control system 900 with an open thermal path is illustrated. In some embodiments, power loss may be detected, which may activate an actuator mechanism 918. The actuator mechanism 918 may pull the thermal path connector 930, breaking the thermal path at the conductive interfaces 935, 936 and a thermal path connector 930 conductive interface that is located between the segments. Though shown in two segments, different types of segmentation may be beneficial. As the number of conductive interfaces increase, the potential inefficiencies associated with contact resistance may also increase, which requires a balance between the two opposing factors.
Referring now to FIG. 10A, a portion of an exemplary temperature control system with an open thermal path is illustrated, wherein control of the thermal path occurs electromagnetically. In some embodiments, a normally open configuration for the thermal path may limit the need for power to break the thermal path during power loss. In some aspects, a temperature-controlling device 1005 may comprise a magnet 1053, and a temperature-controlled unit may comprise a magnet 1052. Without power, the thermal path connector 1030 may not be attracted to the magnet 1053, which may allow for a normally open configuration with a disengaged conductive surface 1035.
Referring now to FIG. 10B, a portion of an exemplary temperature control system with a closed thermal path is illustrated, wherein control of the thermal path occurs electromagnetically. In some aspects, when the temperature control system receives power, the magnet 1052 on the thermal path connector 1030 may be activated and attract the magnet 1053 on the temperature-controlling device 1005. In some embodiments, the attraction may connect the conductive surface 1035 and close the thermal path. In some implementations, a thermal path connector 1030 is shown as an illustrative example, as a thermal strap, which may be flexible to allow for movement during engagement and disengagement of the magnet 1052. Though not shown, a thermal path may be provided by other conductive mechanisms, such as a rigid bar, plates, semiconductors. Where the conductive mechanism may not be flexible, the temperature control system may comprise a mechanism that allows for at least limited movement of the conductive mechanism.
Referring now to FIG. 11A, a portion of an exemplary temperature control system with an open thermal path is illustrated, wherein the thermal path comprises a normally open configuration. In some aspects, an actuator mechanism 1118 may actuate a thermal path connector 1130, wherein actuation may control a conductive surface 1135. In some embodiments, the thermal path connector 1130 may be contained in a vacuum jacket 1155, wherein the actuator mechanism 1118 may be completely contained within the vacuum jacket 1155 or may operate outside the vacuum jacket 1155.
As shown, the actuator mechanism 1118 may be located outside the vacuum jacket 1155. In some embodiments, flexible bellows 1125 may attach the thermal path connector 1130 to the actuator mechanism 1118. Though shown within the flexible bellows 1125, a vacuum jacket 1155 may be more inclusive and may surround one or more of the thermal path connector 1130, the actuator mechanism 1118, or temperature-controlling device 1105. In some implementations, the flexible bellows 1125 may act as a spring, wherein the resting position allows for a normally open configuration.
Referring now to FIG. 11B, a portion of an exemplary temperature control system with a closed thermal path is illustrated, wherein the thermal path comprises a normally open configuration. In some embodiments, an actuator mechanism 1118 may actuate the thermal path connector 1130 to connect the conductive surface 1135 and close the thermal path. In some aspects, actuating the thermal path connector 1130 may compress the flexible bellows 1125, wherein actuation may require power input. In some embodiments, the power source may be the same or different than for the temperature-controlling device 1105 or other components of the temperature control system. In some implementations, the compression of the flexible bellows 1125 may store sufficient energy so during power loss, the bellows 1125 may cause separation of the conductive surface 1135.
Referring now to FIG. 12A-12B, a portion of an exemplary temperature control system 1200 with a container 1250 within a temperature-controlled unit 1210 is illustrated. In some embodiments, the container 1250 may contain phase change material that may retain thermal energy. In some implementations, the phase change material may continue to maintain a predefined temperature without power for an extended period of time.
For example, the phase change material may be cooled to a predefined temperature, such as −70° C., 230° C., or 0° C., as non-limiting examples. When the power is disconnected, the phase change material may maintain a predefined temperature within the temperature-controlled unit 1210 for a predetermined amount of time, such as 2 hours, 4 days, or 36 hours, as non-limiting examples. In some aspects, the phase change material may be located within smaller containers, sleeves, or sacs within the container 1250 of the temperature-controlled unit 1210.
In some implementations, the phase change material may be removeable. For example, a composite material may be more conducive to maintaining a lower temperature within the temperature-controlled unit 1210. A viscous liquid may be substituted for the composite material as a different load is introduced into the temperature-controlled unit 1210 and the temperature requirements change. In some embodiments, the walls of the container 1250 may be hollow. In some implementations, hollow walls within the container 1250 may allow for the presence of phase change material. In some aspects, the walls of the container 1250 may enclose the phase change material to prevent interaction with the load inserted within the temperature-controlled unit 1210.
Referring now to FIG. 13A-13B, an exemplary embodiment of a temperature-controlled unit 1310 with rigid bellows 1365, a vacuum jacket 1355, convective device is illustrated. In some embodiments, the temperature-controlled unit may utilize a vacuum jacket 1355 to insulate the temperature within the temperature-controlled unit 1310. In some implementations, rigid bellows 1365 may be utilized to reduce heat loss as the ambient temperature comes to equilibrium with the predefined temperature within the temperature-controlled unit 1310. Rigid bellows may apply to any surface that encounters the ambient temperature outside of the temperature-controlled unit 1310. In some aspects, equal distribution of the predefined temperature throughout the temperature-controlled unit may be assisted by a convective device. For example, a convective fan may be positioned in the center of the base of the temperature-controlled unit 1310 to ensure the top of the temperature-controlled unit 1310 has adequate cold air due to the increased density of cold air.
Referring now to FIG. 13C, an exemplary temperature-controlled unit 1310 comprising a container 1315 is illustrated, wherein the container 1315 comprises a lid 1367 in an open position. In some aspects, a container 1315 may comprise an opening 1317 that may receive a load into a cavity 1319 of the container 1315. In some embodiments, a lid 1367 may comprise a movable panel that may control access to the opening 1317. In some implementations, one or both the opening 1317 and the lid 1367 may comprise rigid bellows 1365 along the perimeter, which may limit temperature leak when the lid is in a closed position.
Referring now to FIGS. 13D and 13E, exemplary rigid bellows 1365 are illustrated. In some embodiments, one or more of a temperature-controlled unit, temperature-controlling device, or thermal path connector may comprise rigid bellows 1365, which may limit temperature leak. In some aspects, the thinner the material and the more pleating, the more effective the rigid bellows 1365 may be at limiting temperature. In some embodiments, actuation of a thermal path connector may shift rigid bellows 1365 to the open thermal interfaces between the thermal path connector and one or both the temperature-controlled unit or temperature-controlling device. The rigid bellows 1365 may further limit temperature leak by increasing the effectiveness of disconnecting a thermal path between the temperature-controlled unit and temperature-controlling device.
Referring now to FIG. 14A-14B, a portion of an exemplary temperature control system 1400 with a temperature-controlled unit 1410 is illustrated. In some embodiments, the temperature-controlled unit may comprise an insulated vacuum jacket 1455. In some aspects, the vacuum jacket 1455 may contain a medium to assist in providing additional insulation. For example, glass microspheres may fill the cavity of the vacuum jacket 1455 due to insulative properties of glass. This may impede the transference of heat dissipation through the vacuum jacket 1455.
In some implementations, the temperature-controlled unit may utilize rigid bellows 1465 to reduce heat loss from the temperature-controlled unit 1410 interacting with the ambient temperature. In some aspects, the temperature-controlled unit may comprise a plurality of conductive surfaces 1435 to bring phase change material to the predefined temperature. In some embodiments, the temperature-controlled unit may comprise a continuous conductive surface 1435 that extends to the placement of the phase change material to facilitate equal thermal energy distribution. In some implementations, the conductive surface 1435 may extend to a vertical orientation to increase the efficiency of distributing thermal energy to the phase change material.
Referring now to FIG. 15A-15B, an exemplary embodiment of a temperature-controlled unit 1500 with a conductive interface 1535 is illustrated. In some embodiments, the conductive interface 1535 may extend from the thermal path connector to the hinges of the lid. This may allow thermal energy transference to phase change material stored within the lid of the temperature-controlled unit 1510.
Referring now to FIG. 16A-16B, an exemplary embodiment of a visual indicator 1670 is illustrated. In some embodiments, a disconnection from power may release a signal displayed on a visual indicator 1670. In some implementations, the visual indicator 1670 may provide information about when the power was disconnected. For example, the visual indicator 1670 may show a temperature, time of power loss, and amount of time for the temperature-controlled unit to begin loss of temperature control. As non-limiting examples, when power is supplied, the visual indicator 1670 may indicate the current temperature of the temperature-controlled unit, the target temperature of the temperature-controlled unit, status of the temperature-controlling device, power status, or maintenance indicators.
In some aspects, the visual indicator 1670 may provide information detailing the estimated time until the temperature threshold within the temperature-controlled unit is compromised. In some embodiments, this visual indicator 1670 may utilize low quantities of energy to inscribe an energy independent message on the visual indicator 1670. For example, the visual indicator 1670 may utilize electronic ink that retains a form memory after its initial creation via electrical impulse. In some implementations, the visual indicator 1670 may possess lights to indicate power connection and power loss.
Referring now to FIG. 17A-17B, an exemplary embodiment of a rotating external temperature control system is illustrated. In some embodiments, a temperature control system 1700 may utilize an array of temperature-controlled unit 1710 that may allow for more precise temperature control of a load. For example, a plurality of temperature-controlled unit 1710 may be thermally connected to a load at various positions. The different positions may require different temperatures or may have different temperature sensitivity. In some aspects, the array may be arranged based on the unique cooling or heating needs of a system.
As an illustrative example, a satellite may be built to spin at a predefined speed, wherein the spin may limit exposure of any one portion of the satellite to solar radiation. An array of temperature-controlled unit 1710 may be arranged around the satellite, wherein the conductive interfaces of each temperature-controlled unit 1710 may engage when the portion of the satellite it controls is exposed to a threshold level of solar radiation and disengage when the exposure falls below the threshold level.
Referring now to FIG. 18, an exemplary embodiment of a temperature control system 1800 comprising a plurality of zones 1810 within a temperature-controlled unit is illustrated. In some embodiments, a temperature control system 1800 may utilize a plurality of zones 1810 that may allow for varied temperature control of a plurality of loads. For example, one zone 1810 may maintain a load at a temperature of −70° C. while an adjacent zone 1811 may maintain a separate load at a temperature of 170° C. The temperature-controlled unit zones 1810,1811 may require different temperatures or may have different temperature sensitivity. In some aspects, the array may be arranged based on the unique cooling or heating needs of a system. In some embodiments, an insulation medium may exist between the temperature-controlled unit zones 1810,1811 to reduce heat transference.
In some implementations, separate temperature-controlling devices may independently control each temperature-controlled unit zone 1810, 1811. In some aspects, a temperature-controlling device may control multiple temperature-controlled unit zones 1810, 1811. A temperature-controlling device may cycle through temperature control states, such as heating, cooling, and off states, depending on the predefined target temperatures of the temperature-controlled unit and temperature-controlled unit zones 1810, 1811.
Referring now to FIG. 19, an exemplary cycle of connecting and breaking a thermal path within a thermal system is illustrated. At 1905, power loss may be detected, such as based on predefined thresholds. At 1910, actuators may break a thermal path. At 1915, heat leak may be limited to radiative transfer. In some aspects, power loss may be detected by a sensor, which may trigger actuation at 1910. In some embodiments, power loss may occur without a sensor, wherein loss of power electromechanically causes an actuation. At 1920, power may be resupplied. At 1925, actuators may reorient and reconnect the thermal path. At 1930, cooling operations may resume.
Referring now to FIG. 20, exemplary method steps for breaking a thermal path in response to a detected loss in power are illustrated, wherein the thermal path comprises a normally closed configuration. At 2005, power may be monitored. At 2010, power loss may be sensed. In some embodiments, the monitoring and sensing may occur directly, such as through a sensor. In some aspects, portions of the system may be programmed to operate when power levels fall below a threshold. At 2015, at least one conductive interface may be disengaged, wherein disengagement may break a thermal path. At 2020, power restoration may be detected. At 2025, the conductive interface may be re-engaged, wherein re-engagement may close the thermal path.
Referring now to FIG. 21, exemplary method steps for engaging a thermal path upon receipt of power are illustrated, wherein the thermal path comprises a normally open configuration. At 2105, power may be received. In some aspects, the power received may be for the cooling system in general. In some implementations, the power received may be specifically to control the thermal path. At 2110 at least one conductive interface may be engaged, wherein engagement may close a thermal path. In some aspects, at 2115, power loss may be detected. At 2120, the conductive interface may be disengaged, wherein disengagement may break the thermal path. In some embodiments, the disengagement may occur passively due to the loss of power.
CONCLUSION
A number of embodiments of the present disclosure have been described. While this specification contains many specific implementation details, these should not be construed as limitations on the scope of any disclosures or of what may be claimed, but rather as descriptions of features specific to particular embodiments of the present disclosure.
Certain features that are described in this specification in the context of separate embodiments can also be implemented in combination or in a single embodiment. Conversely, various features that are described in the context of a single embodiment can also be implemented in combination in multiple embodiments separately or in any suitable sub-combination. Moreover, although features may be described above as acting in certain combinations and even initially claimed as such, one or more features from a claimed combination can in some cases be excised from the combination, and the claimed combination may be directed to a sub-combination or variation of a sub-combination.
Similarly, while operations are depicted in the drawings in a particular order, this should not be understood as requiring that such operations be performed in the particular order shown or in sequential order, or that all illustrated operations be performed, to achieve desirable results. In certain circumstances, multitasking and parallel processing may be advantageous.
Moreover, the separation of various system components in the embodiments described above should not be understood as requiring such separation in all embodiments, and it should be understood that the described program components and systems can generally be integrated together in a single software product or packaged into multiple software products.
Thus, particular embodiments of the subject matter have been described. Other embodiments are within the scope of the following claims. In some cases, the actions recited in the claims can be performed in a different order and still achieve desirable results. In addition, the processes depicted in the accompanying figures do not necessarily require the particular order show, or sequential order, to achieve desirable results. In certain implementations, multitasking and parallel processing may be advantageous. Nevertheless, it will be understood that various modifications may be made without departing from the spirit and scope of the claimed disclosure.
Patent Application
20210199372
