Patent Application
20250091292
Many printed circuit boards (PCBs) have electronic traces that are integrally manufactured within the PCB. Electronic components may be soldered on top of the PCB or addition connections or traces may be added. It has been challenging to create electrical connections on a PCB.
The present disclosure provides a method of additive manufacturing. The method comprises disposing a nozzle of a print head of an additive manufacturing system over a first location on a substrate. An ink composition from the nozzle is deposited onto the first location of the substrate while moving the nozzle away from the substrate to increase a first distance therebetween, thereby forming a first portion of a structure on the first location. The method comprises repeatedly, as necessary to increase a second distance the first portion of the structure protrudes from the substrate, performing the following over the first location: moving the nozzle away from the substrate while not depositing the ink composition to increase the first distance, moving the nozzle towards the substrate to decrease the first distance, and dispensing the ink composition from the nozzle onto the structure while moving the nozzle away from the substrate to increase the first distance therebetween.
The present disclosure also provides a method of additive manufacturing. The method comprises disposing a nozzle of a print head of an additive manufacturing system over a first location on a substrate. An ink composition from the nozzle is deposited onto the first location of the substrate while moving the nozzle away from the substrate to increase a first distance therebetween, thereby forming a first portion of a structure on the first location. The method comprises repeatedly as necessary to increase a third distance the structure extends along the substrate, performing the following: disposing the nozzle over a subsequent location on the substrate, the subsequent location adjacent to the structure; and dispensing an ink composition from the nozzle onto the subsequent location of the substrate while moving the nozzle away from the substrate to increase the first distance therebetween, thereby forming an additional portion of the structure on the subsequent location and extending the third distance the structure extends along the substrate.
The present disclosure also provides an apparatus for additive manufacturing. The apparatus comprises a stage, a print head, a positioning system, and a controller. The stage is configured to support a substrate. The print head comprises a nozzle. The print head is configured to dispense an ink composition through the nozzle. The positioning system is configured to move the print head relative to the substrate. The controller is in electrical communication with the positioning system. The controller is configured to deposit an ink composition from the nozzle onto a first location of the substrate while moving the nozzle away from the substrate to increase a first distance therebetween, thereby forming a first portion of a structure on the first location. The controller is configured to repeatedly, as necessary to increase a second distance the first portion of the structure protrudes from the substrate, perform the following over the first location: move the nozzle away from the structure while not depositing the ink composition to form a gap between the nozzle and the structure, move the nozzle towards the structure to decrease the gap, and deposit the ink composition from the nozzle onto the structure while moving the nozzle away from the substrate to increase the first distance therebetween.
It is understood that the inventions described in this specification are not limited to the examples summarized in this Summary. Various other aspects are described and exemplified herein.
The features and advantages of the examples, and the manner of attaining them, will become more apparent, and the examples will be better understood, by reference to the following description taken in conjunction with the accompanying drawings, wherein:
Corresponding reference characters indicate corresponding parts throughout the several views. The exemplifications set out herein illustrate certain embodiments, in one form, and such exemplifications are not to be construed as limiting the scope of the appended claims in any manner.
Certain exemplary aspects of the present disclosure will now be described to provide an overall understanding of the principles of the structure, function, manufacture, and use of the compositions, methods, and products disclosed herein. One or more examples of these aspects are illustrated in the accompanying drawings. Those of ordinary skill in the art will understand that the devices and methods specifically described herein and illustrated in the accompanying drawings are non-limiting exemplary aspects and that the scope of the various examples of the present disclosure is defined solely by the claims. The features illustrated or described in connection with one exemplary aspect may be combined with the features of other aspects. Such modifications and variations are intended to be included within the scope of the present disclosure.
Any references herein to “various examples,” “some examples,” “one example,” “an example,” similar references to “aspects,” or the like, means that a particular feature, structure, or characteristic described in connection with the example is included in at least one example. Thus, appearances of the phrases “in various examples,” “in some examples,” “in one example,” “in an example,” similar references to “aspects,” or the like, in places throughout the specification are not necessarily all referring to the same example. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more examples. Thus, the particular features, structures, or characteristics illustrated or described in connection with one example may be combined, in whole or in part, with the features, structures, or characteristics of one or more other examples without limitation. Such modifications and variations are intended to be included within the scope of the present examples.
The present disclosure provides a method for additive manufacturing and additive manufacturing system configured to perform the method. For example, the method can comprise printing electrically conductive traces on a substrate. Referring to
As used herein, the term “controller” may refer to, for example, hardwired circuitry, programmable circuitry (e.g., a computer processor comprising one or more individual instruction processing cores, processing unit, processor, microcontroller, microcontroller unit, controller, digital signal processor (DSP), programmable logic device (PLD), programmable logic array (PLA), or FPGA), state machine circuitry, firmware that stores instructions executed by programmable circuitry, and any combination thereof. The controller may, collectively or individually, be embodied as circuitry that forms part of a larger system, for example, an IC, an ASIC, a SoC, desktop computers, laptop computers, tablet computers, servers, smart phones, etc. Accordingly, as used herein, a “controller” can comprise electrical circuitry having at least one discrete electrical circuit, electrical circuitry having at least one IC, electrical circuitry having at least one application-specific IC, electrical circuitry forming a general-purpose computing device configured by a computer program (e.g., a general-purpose computer configured by a computer program that at least partially carries out processes and/or devices described herein or a microprocessor configured by a computer program that at least partially carries out processes and/or devices described herein), electrical circuitry forming a memory device (e.g., forms of RAM), and/or electrical circuitry forming a communications device (e.g., a modem, communications switch, or optical-electrical equipment). The subject matter described herein may be implemented in an analog or digital fashion or some combination thereof.
The additive manufacturing system 102 can be similar to the fluid printing apparatus described in International Patent Application Publication No. WO 2020/157547, titled FLUID PRINTING APPARATUS, published Aug. 6, 2020, which is herein incorporated by reference in its entirety.
Referring to
As used herein, a referenced element or region that is “intermediate” two other elements or regions means that the referenced element/region is disposed between, but is not necessarily in contact with, the two other elements/regions. Accordingly, for example, a referenced element that is “intermediate” a first element and a second element may or may not be immediately adjacent to or in contact with the first and/or second elements, and other elements may be disposed between the referenced element and the first and/or second elements.
As illustrated, the print head 120 comprises the nozzle 108. The print head 120 is configured to dispense an ink composition through the nozzle 108. For example, the feed system 132 can be configured to apply a pressure in a range of 200 mbar to 10,000 mbar to the ink composition in the nozzle 108 to extrude the ink composition through the nozzle 108 and onto the substrate 104. For example, dispensing the ink composition through the nozzle 108 can comprise applying a pressure in a range of 100 mbar to 10,000 mbar to the ink composition in the nozzle 108 to extrude the ink composition through the nozzle 108, such as, for example, a pressure in a range of 200 mbar to 10,000 mbar, 1,000 mbar to 10,000 mbar, 2,000 mbar to 9,000 mbar, 2,000 mbar to 8,000 mbar, or 3,000 mbar to 7,000 mbar. Pressures as used herein refer to gauge pressure unless stated to the contrary.
The nozzle 108 can comprise a capillary tube. The capillary tube can comprise an internal diameter in a range of 0.1 μm to 10 μm, such as, for example, 1 μm to 10 μm or 1 μm to 3 μm. The capillary tube can comprise an outer diameter in a range of 0.2 μm to 20 μm, such as, for example, 1 μm to 10 μm or 0.7 μm to 8 μm.
The nozzle 108 can define a longitudinal axis, a1, and the substrate can define a plane, Π. An angle, α, of a longitudinal axis, a1, relative to the plane, Π, of the substrate can be a range of 40 degrees to 90 degrees, such as, for example, 50 degrees to 90 degrees, 60 degrees to 90 degrees, 70 degrees to 90 degrees, or 80 to 90 degrees. As used herein, the angle, α, is the smaller of the two angles formed by an intersection of the longitudinal axis, a1, and the plane, Π, unless both angles are equal and then the angle, α, can be either angle formed. The angle, α, can affect the structure built by the additive manufacturing system 102 as the ink composition can wet the exterior of the nozzle 108 and thus, the angle, α, can determine an approach angle of the ink composition to the surface and/or a structure built thereon. As illustrated in
The nozzle 108 can be treated (e.g., coated) with a hydrophobic layer or a hydrophilic layer. As illustrated in
Referring again to
As illustrated in
As used herein, the terms “on,” “dispensed over,” “dispensed onto,” “formed over,” “formed onto, “deposited over,” “deposited onto,” “overlay,” “provided over,” “provided onto,” and the like, mean formed, overlaid, dispensed, deposited, or provided on but not necessarily in contact with the surface. For example, a composition “deposited onto” a substrate layer does not preclude the presence of one or more other layers of the same or different composition located between the composition and the substrate layer.
As illustrated in
The curing at step 220 can change as the method progresses. For example, portions of the structure 130 can be cured during the method by photonic sintering prior to deposition of additional portions and after the last portion of the structure 130 is deposited the entire structure can be sintered in an oven.
As used herein, the terms “cure” and “curing” refer to the chemical crosslinking of components in an ink applied as a layer over a substrate and/or the physical drying of an ink through solvent or carrier evaporation.
After curing at step 220, if performed, the method can comprise determining whether or not the structure 130 should be extended (e.g., increased in size) at step 206. If the determination at step 206 is negative, the method stops. If the determination at step 206 is positive, the method proceed to step 208.
At step 208, the method can comprise determining which region of the structure 130 should be extended. For example, the method can determine if a distance, d2, the portion 130a of the structure 130 protrudes from the substrate 104 needs to be extended (e.g., an increase in height) or a distance, d3, the structure 130 extends along the substrate 104 needs to be extended (e.g., an increase in length).
To increase the distance, d2, steps 210, 212, and 214 can be performed over the first location 110a. At step 210, the nozzle 108 may be moved away from the substrate 104 and/or structure 130 while not depositing the ink composition to increase the distance, d1, therebetween. Moving the nozzle 108 away from the substrate 104 while not depositing the ink composition can comprise at least moving the nozzle 108 vertically relative to the substrate 104. Moving the nozzle 108 while not depositing the ink composition can change the shape of the structure by elongating and/or stretching the structure 130 in the direction of movement of the nozzle 108. The movement can enhance the aspect ratio of the structure 130.
As used herein “while not depositing the ink composition” refers to interrupting the deposition of ink onto the substrate 104. Ink composition may be accumulated in the nozzle 108 and/or on a surface of the nozzle 108 and can be inhibited from deposition onto the substrate. Reducing the pressure applied to the nozzle 108 by the feed system 132 compared to the pressure used to deposit the ink composition onto the substrate 104 can inhibit dispensing of ink composition from the nozzle and thereby inhibit deposition of the ink composition. Increasing the speed of movement of the nozzle 108 compared to the speed of movement of the nozzle 108 during deposition can inhibit deposition of the ink composition (e.g., the nozzle 108 can move vertically rapidly).
Referring to
Optionally, the nozzle 108 can apply a vacuum while moving to enhance elongation of the ink composition and/or maintain contact between the nozzle 108 and the structure 130. “Vacuum” relative to a pressure applied by the nozzle 108 as used herein refers to a pressure within the nozzle 108 that is less than the environmental pressure outside of the nozzle 108. The vacuum can be from 1 mbar of vacuum to 10,000 mbar of vacuum, such as, for example, 5 mbar of vacuum to 10,000 mbar of vacuum, 10 mbar of vacuum to 10,000 mbar of vacuum, or 100 mbar to 10,000 mbar of vacuum. The vacuum can be formed in the nozzle 108 by the feed system 132.
Referring to
The movement of the nozzle 108 to increase the distance, d1, while not depositing the ink composition can be based on at least one parameter selected from the group consisting of a wetability of the substrate 104, a viscosity of the ink composition, a surface tension of the ink composition, and a contact angle between the ink composition and the substrate 104. The movement of the nozzle 108 can be based on the ability of the ink composition to hold a suitable shape and/or a desired aspect ratio on the substrate 104.
Referring again to
Referring again to
Referring again to
To increase the distance, d3, steps 216 and 218 can be performed. For example, at step 216, the nozzle 108 can be disposed over a subsequent location 110b on the substrate 104 as illustrated in
Referring again to
The structure 130 can be formed in various shapes and sizes. For example, the structure 130 can comprise a line width of no greater than 100 μm, such as, for example, no greater than 10 μm. The structure 130 can comprise a line width in a range of 1 μm to 100 μm, such as, for example, 5 μm to 75 μm, 5 μm to 50 μm, 10 μm to 50 μm, 10 μm to 40 μm, 1 μm to 20 μm, or 1 μm to 10 μm. The structure 130 can comprise a height (e.g., distance, d2) in a range of 1 μm to 50 μm, such as, for example, 5 μm to 50 μm. The structure 130 can comprise a line length as necessary to form an electrical connection.
The structure 130 can comprise a pillar, a trace, or a combination thereof. The structure 130 can be an electrically conductive feature, such as, an electrically conductive trace, an electrically conductive pillar, or a combination thereof.
The structure 130 can comprise an aspect ratio of at least 1, such as, for example, at least 1.1, at least 1.5, or at least 2. The structure 130 can comprise an aspect ratio in a range of 1 to 10, such as, for example, 1.1 to 10, 1.1 to 5, 1.5 to 5, 2 to 10, or 2 to 5. As used herein, an “aspect ratio” is a ratio of the height to the width of a structure. The height is measured from a base of the structure to a highest point of the structure. The width is measured at the base of the structure. The aspect ratio can be measured from a cross-section of the structure. Obtaining an desirable aspect ratio can enhance the electrical conductivity of a structure and/enhance the mechanical stability of a structure. For example, covering a high step on a substrate can be difficult with a low aspect ratio. The desirable aspect ratio can enable the formation of unique geometries, such as, for example, those required for antennas, micropumps, and/or the like.
The ink composition can comprise various conductive components, such as, for example, a metal, a metal alloy, a conductive carbon, or a combination thereof. For example, the ink composition can comprise metal nanoparticles, such as, for example, copper (e.g., elemental, an alloy, a compound) nanoparticles, gold (e.g., elemental, an alloy, a compound) nanoparticles, silver (e.g., elemental, an alloy, a compound) nanoparticles, or a combination thereof. The metal nanoparticles can have a mean average particle size of no greater than 500 nanometers, as measured with transmission electron microscopy, such as, for example no greater than 150 nanometer or no greater than 100 nanometers. The metal nanoparticles can comprise a metal bound to a polymer, such as, for example, polyvinylpyrrolidone.
The ink composition can comprise other components, such as, for example, a solvent (e.g., a polar protic solvent), a resin, or other compound. For example, the ink composition can comprise metal nanoparticles and a solvent. The ink composition can comprise at least 40% by weight metal nanoparticles based on the total weight of the ink composition, such as, for example, at least 50% by weight or at least 60% by weight metal nanoparticles all based on the total weight of the ink composition.
The ink composition can comprise a viscosity in a range of 100,000 cP to 10,000,000 cP as measured at 25 degrees Celsius with a rheometer with a 25 mm parallel plate spindle and a shear rate in a range of 0.1 s−1 to 100 s−1.
The present disclosure will be more fully understood by reference to the following examples, which provide illustrative non-limiting aspects of the invention. It is understood that the invention described in this specification is not necessarily limited to the examples described in this section.
Structures were printed using the method according to the present disclosure. As illustrated in
As illustrated in
Various aspects of the invention include, but are not limited to, the aspects listed in the following numbered clauses.
Clause 1. A method of additive manufacturing, the method comprising: disposing a nozzle of a print head of an additive manufacturing system over a first location on a substrate; dispensing an ink composition from the nozzle onto the first location of the substrate while moving the nozzle away from the substrate to increase a first distance therebetween, thereby forming a first portion of a structure on the first location; and repeatedly, as necessary to increase a second distance the first portion of the structure protrudes from the substrate, performing the following over the first location: moving the nozzle away from the substrate while not depositing the ink composition to increase the first distance, moving the nozzle towards the substrate to decrease the first distance, and dispensing the ink composition from the nozzle onto the structure while moving the nozzle away from the substrate to increase the first distance therebetween.
Clause 2. The method of clause 1, further comprising repeatedly, as necessary to increase a third distance the structure extends along the substrate, performing the following: disposing the nozzle over a subsequent location on the substrate, the subsequent location adjacent to the structure; and dispensing an ink composition from the nozzle onto the subsequent location of the substrate while moving the nozzle away from the substrate to increase the first distance therebetween, thereby forming an additional portion of the structure on the subsequent location and extending a distance the structure extends along the substrate.
Clause 3. The method of clause 2, further comprising forming at least two additional portions of the structure, including the additional portion, on at least two subsequent locations, including the subsequent location.
Clause 4. The method of clause 3, further comprising repeatedly, as necessary, to increase a fourth distance each additional portion of the structure protrudes from the substrate, performing the following over each additional portion: moving the nozzle away from the substrate while not depositing the ink composition to increase the first distance, moving the nozzle towards the substrate to decrease the first distance, and dispensing the ink composition from the nozzle onto the structure while moving the nozzle away from the substrate to increase the first distance therebetween.
Clause 5. The method of any of clauses 2-4, wherein disposing the nozzle of the print head of the additive manufacturing system over the subsequent location on the substrate comprises at least moving the nozzle horizontally relative to the substrate from the first location.
Clause 6. The method of any of clauses 2-5, wherein moving the nozzle away from the substrate while not depositing the ink composition comprises at least moving the nozzle vertically relative to the substrate.
Clause 7. The method of any of clauses 1-6, wherein the ink composition is not dispensed from the nozzle while moving the nozzle towards the substrate to decrease the first distance.
Clause 8. The method of any of clauses 1-7, wherein the structure comprises an aspect ratio of at least 1.
Clause 9. The method of any of clauses 1-8, moving the nozzle away from the substrate while not depositing the ink composition further comprises forming a gap between the nozzle and the structure, wherein the gap inhibits contact between the structure and the nozzle.
Clause 10. The method of clause 9, wherein the structure rebounds elastically after forming the gap.
Clause 11. The method of any of clauses 1-10, wherein the structure comprises a pillar, a trace, or a combination thereof.
Clause 12. The method of any of clauses 1-11, wherein an angle of a longitudinal axis of the nozzle relative to a plane of the substrate is in a range of 90 degrees to 40 degrees.
Clause 13. The method of any of clauses 1-12, wherein the second distance is in a range of 1 μm to 50 μm.
Clause 14. The method of any of clauses 1-13, wherein a width of the structure is in a range of 1 μm to 10 μm.
Clause 15. The method of any of clauses 1-14, wherein the increase in the first distance by moving the nozzle away from the substrate while not depositing the ink composition is based on at least one parameter selected from the group consisting of a wetability of the substrate, a viscosity of the ink composition, a surface tension of the ink composition, and a contact angle between the ink composition and the substrate.
Clause 16. The method of any of clauses 1-15, further comprising curing the ink composition.
Clause 17. The method of clause 16, wherein curing the ink composition comprising applying at least one stimulus selected from the group consisting of light and heat.
Clause 18. The method of any of clauses 1-17, wherein dispensing an ink composition from the nozzle onto the first location comprises applying a pressure in a range of 100 mbar to 10000 mbar to the ink composition in the nozzle to extrude the ink composition through the nozzle and onto the first location on the substrate.
Clause 19. The method of any of clauses 1-18, wherein the ink composition comprises a viscosity in a range of 100,000 cP to 10,000,000 cP as measured at 25 degrees Celsius with a rheometer with a 25 mm parallel plate spindle and a shear rate in a range of 0.1 s−1 to 100 s−1.
Clause 20. The method of any of clauses 1-19, wherein the nozzle comprises a capillary tube having an outer diameter in a range of 0.7 μm to 8 μm.
Clause 21. The method of any of clauses 1-20, further comprising applying a vacuum with the nozzle while moving the nozzle away from the substrate to increase the first distance therebetween.
Clause 22. A method of additive manufacturing, the method comprising: disposing a nozzle of a print head of an additive manufacturing system over a first location on a substrate; dispensing an ink composition from the nozzle onto the first location of the substrate while moving the nozzle away from the substrate to increase a first distance therebetween, thereby forming a first portion of a structure on the first location; and repeatedly, as necessary to increase a third distance the structure extends along the substrate, performing the following: disposing the nozzle over a subsequent location on the substrate, the subsequent location adjacent to the structure; and dispensing an ink composition from the nozzle onto the subsequent location of the substrate while moving the nozzle away from the substrate to increase the first distance therebetween, thereby forming an additional portion of the structure on the subsequent location and extending the third distance the structure extends along the substrate.
Clause 23. An apparatus for additive manufacturing, the apparatus comprising: a stage configured to support a substrate; a print head comprising a nozzle, wherein the print head is configured to dispense an ink composition through the nozzle; a positioning system configured to move the print head relative to the substrate; and a controller in electrical communication with the positioning system, wherein the controller is configured to perform the method according to any one of clauses 1-22.
Clause 24. An apparatus for additive manufacturing, the apparatus comprising: a stage configured to support a substrate; a print head comprising a nozzle, wherein the print head is configured to dispense an ink composition through the nozzle; a positioning system configured to move the print head relative to the substrate; and a controller in electrical communication with the positioning system, wherein the controller is configured to deposit an ink composition from the nozzle onto a first location of the substrate while moving the nozzle away from the substrate to increase a first distance therebetween, thereby forming a first portion of a structure on the first location, and repeatedly, as necessary to increase a second distance the first portion of the structure protrudes from the substrate, perform the following over the first location move the nozzle away from the substrate while not depositing the ink composition to form a gap between the nozzle and the structure, move the nozzle towards the substrate to decrease the gap, and deposit the ink composition from the nozzle onto the structure while moving the nozzle away from the substrate to increase the first distance therebetween.
Clause 25. The apparatus of clause 24 further comprising a feed system configured to apply a pressure in a range of 100 mbar to 10,000 mbar to the ink composition in the nozzle to extrude the ink composition through the nozzle and onto the substrate.
Clause 26. The apparatus of any of clauses 24-25, wherein the ink composition comprises a viscosity in a range of 100,000 cP to 10,000,000 cP as measured at 25 degrees Celsius with a rheometer with a 25 mm parallel plate spindle and a shear rate in a range of 0.1 s−1 to 100 s−1.
Clause 27. The apparatus of any of clauses 24-26, wherein the nozzle comprises a capillary tube having an outer diameter in a range of 0.7 μm to 8 μm.
In this specification, unless otherwise indicated, all numerical parameters are to be understood as being prefaced and modified in all instances by the term “about”, in which the numerical parameters possess the inherent variability characteristic of the underlying measurement techniques used to determine the numerical value of the parameter. At the very least, and not as an attempt to limit the application of the doctrine of equivalents to the scope of the claims, each numerical parameter described herein should at least be construed in light of the number of reported significant digits and by applying ordinary rounding techniques.
Also, any numerical range recited herein includes all sub-ranges subsumed within the recited range. For example, a range of “1 to 10” includes all sub-ranges between (and including) the recited minimum value of 1 and the recited maximum value of 10, that is, having a minimum value equal to or greater than 1 and a maximum value equal to or less than 10. Any maximum numerical limitation recited in this specification is intended to include all lower numerical limitations subsumed therein, and any minimum numerical limitation recited in this specification is intended to include all higher numerical limitations subsumed therein. Accordingly, Applicant reserves the right to amend this specification, including the claims, to expressly recite any sub-range subsumed within the ranges expressly recited.
The grammatical articles “a,” “an,” and “the,” as used herein, are intended to include “at least one” or “one or more,” unless otherwise indicated, even if “at least one” or “one or more” is expressly used in certain instances. Thus, the articles are used herein to refer to one or more than one (i.e., to “at least one”) of the grammatical objects of the article. Further, the use of a singular noun includes the plural, and the use of a plural noun includes the singular, unless the context of the usage requires otherwise.
Any patent, publication, or other disclosure material identified herein is incorporated by reference into this specification in its entirety unless otherwise indicated, but only to the extent that the incorporated material does not conflict with existing descriptions, definitions, statements, or other disclosure material expressly set forth in this specification. As such, and to the extent necessary, the express disclosure as set forth in this specification supersedes any conflicting material incorporated by reference. Any material, or portion thereof, that is said to be incorporated by reference into this specification, but which conflicts with existing definitions, statements, or other disclosure material set forth herein, is only incorporated to the extent that no conflict arises between that incorporated material and the existing disclosure material. Applicants reserve the right to amend this specification to expressly recite any subject matter, or portion thereof, incorporated by reference herein.
One skilled in the art will recognize that the herein described components (e.g., operations), devices, objects, and the discussion accompanying them are used as examples for the sake of conceptual clarity and that various configuration modifications are contemplated. Consequently, as used herein, the specific exemplars set forth and the accompanying discussion are intended to be representative of their more general classes. In general, use of any specific exemplar is intended to be representative of its class, and the non-inclusion of specific components (e.g., operations), devices, and objects should not be taken limiting.
With respect to the appended claims, those skilled in the art will appreciate that recited operations therein may generally be performed in any order. Also, although various operational flows are presented in a sequence(s), it should be understood that the various operations may be performed in other orders than those which are illustrated, or may be performed concurrently. Examples of such alternate orderings may include overlapping, interleaved, interrupted, reordered, incremental, preparatory, supplemental, simultaneous, reverse, or other variant orderings, unless context dictates otherwise. Furthermore, terms like “responsive to,” “related to,” or other past-tense adjectives are generally not intended to exclude such variants, unless context dictates otherwise.
One skilled in the art will recognize that the herein-described components, devices, operations/actions, and objects, and the discussion accompanying them, are used as examples for the sake of conceptual clarity and that various configuration modifications are contemplated. Consequently, as used herein, the specific examples/embodiments set forth and the accompanying discussion are intended to be representative of their more general classes. In general, use of any specific exemplar is intended to be representative of its class, and the non-inclusion of specific components, devices, operations/actions, and objects should not be taken limiting. While the present disclosure provides descriptions of various specific aspects for the purpose of illustrating various aspects of the present disclosure and/or its potential applications, it is understood that variations and modifications will occur to those skilled in the art. Accordingly, the invention or inventions described herein should be understood to be at least as broad as they are claimed and not as more narrowly defined by particular illustrative aspects provided herein.
