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5717287 | Amrine et al. | Feb 1998 |
Number | Date | Country |
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0616354 | Feb 1994 | EPX |
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Cathryn E. Goodman et al., "A Novel Multichip Module Assembly Approach Using Gold Ball Flip-Chip Bonding", IEEE Transactions On Components, Hybrids, And Manufacturing Technology, vol. 15, No. 4, Aug. 1992, pp. 457-464. |