| Number | Name | Date | Kind |
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| 5232549 | Cathey et al. | Aug 1993 | |
| 5717287 | Amrine et al. | Feb 1998 |
| Number | Date | Country |
|---|---|---|
| 0616354 | Feb 1994 | EPX |
| Entry |
|---|
| Cathryn E. Goodman et al., "A Novel Multichip Module Assembly Approach Using Gold Ball Flip-Chip Bonding", IEEE Transactions On Components, Hybrids, And Manufacturing Technology, vol. 15, No. 4, Aug. 1992, pp. 457-464. |