1. Field of the Invention
The present invention relates to a method for assembling an antenna in an electronic device, and in particular to a method for assembling an antenna onto a plastic base of a handheld electronic device.
2. Description of the Prior Art
PIFA (planar inverted-F antenna) antennas have been introduced as internal antennas for handheld electronic devices such as mobile phones. Most of these PIFA antennas formed in metal sheets cover plastic bases to fabricate plastic antenna assemblies mounted into the electronic devices. Now shot molding is a popular method in manufacturing a plastic antenna assembly. For instance, U.S. Pat. No. 6,333,716 discloses a two-shot molding process comprising molding a dielectric base structure with a first and second plastic materials and a plating process. The first plastic material forming a mounting base is not plateable. The second plateable plastic material forms a plateable base mounted on the mounting base. Then a metal-sheet antenna is plated on the plateable base in the plating process. However, this process requires a high precision in manufacturing which results in a high cost.
Furthermore, U.S. Pat. No. 6,486,837 discloses a single-shot-molding process and an electro-plating process. A plateable base is formed in the single-shot-molding process. Then the plateable base is put into an electro-plating bath that is electrically coupled. In the electro-plating process, a copper or nickel alloy is covered to the plateable base. However, the electro-plating process is also complex for assembling the antenna on the plastic base.
Hence, an improved method for manufacturing a plastic antenna assembly is desired to overcome the above-mentioned shortcomings of existing method.
A primary object, therefore, of the present invention is to provide a heat-melt process to assemble an antenna onto a plastic base.
A method according to the present invention for assembling an antenna body onto a plastic base comprises forming the plastic base with a plurality of posts protruding thereon, punching a plurality of pinholes on the antenna body corresponding to the posts, conjoining the plastic base and the antenna body to have the posts get through the pinholes and thermal deforming the posts to engage edges of the pinholes. Then the holes will firmly retain the antenna on the plastic base.
Other objects, advantages and novel features of the invention will become more apparent from the following detailed description of a preferred embodiment when taken in conjunction with the accompanying drawings.
Reference will now be made in detail to a preferred embodiment of the present invention.
Referring to
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In assembling process, the plastic base 30 is conjoined with the PIFA antenna 20 with the posts 35 aligned with the pinholes 215. Then the posts 35 are heated and transfigured into flat-shape configuration. The thermal deforming process may be implemented by blowing high temperature air or other known preferred art in this field. Then the flat-shape posts 35 will cover around edges of the pinholes 215 and firmly retain the PIFA antenna 20 on the plastic base 30 after the flat-shape posts 35 are cooled.
It is to be understood, however, that even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
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5929813 | Eggleston | Jul 1999 | A |
6271794 | Geeraert | Aug 2001 | B1 |
6333716 | Pontoppidan | Dec 2001 | B1 |
6437747 | Stoiljkovic et al. | Aug 2002 | B1 |
6448932 | Stoiljkovic et al. | Sep 2002 | B1 |
6486837 | Spiegel et al. | Nov 2002 | B2 |
6639560 | Kadambi et al. | Oct 2003 | B1 |
6741214 | Kadambi et al. | May 2004 | B1 |
Number | Date | Country | |
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20050024270 A1 | Feb 2005 | US |