This application claims the priority benefit of Taiwan application serial no. 101141030, filed on Nov. 5, 2012. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.
1. Field of the Invention
The invention relates to a method for assembling a housing and a housing assembly thereof. More particularly, the invention relates to a method for assembling a housing of an electronic device and a housing assembly thereof.
2. Description of Related Art
Currently, general public communications have slowly entered an era of wireless communication, and therefore, utilization rates of electronic devices, such as notebook computer, smart phone and tablet PC, in various occasions have also become increasingly high and more diversified. Under a circumstance of increasing popularity in wireless network, a user, in addition to using a network cable to gain the Internet access, may also connect to the Internet via the wireless network.
In order to let the user to obtain a better signal quality, the electronic device is often required to be disposed with an antenna therein for receiving signals emitted from a wireless network station. In general, a conventional electronic device due to a strength factor of a housing has often adopted a metal as the material of the housing. However, the reception of the antenna would be affected by the shielding effect of the metal. Therefore, on an housing of a conventional notebook computer, in addition to the metal material, an additional spot corresponded to the antenna is bound to be reserved and replaced with a plastic material in order to not affect the reception of the antenna. As a result, a cost for producing and assembling the plastic parts must be additionally added when manufacturing the housing.
Another conventional method for assembling the antenna is to adopt glass as the material of the housing, whereas the antenna is locked at a frame of the electronic device while the glass housing and the frame of electronic device are combined together via a double-sided adhesive. Nevertheless, this method not only is time-consuming but also restricts a configuration space the antenna.
The invention provides a method for assembling a housing of an electronic device configured to solve a problem produced when attaching an antenna pattern layer while not limiting a configuration space of the antenna pattern layer.
The invention provides a housing assembly of an electronic device capable of enhancing a space utilization rate of an antenna pattern layer.
The invention provides a method for assembling a housing of an electronic device including the following steps. An antenna pattern layer and an adhesive layer are provides, wherein the antenna pattern layer has a first surface opposite a second surface, and the adhesive layer is disposed on the first surface of the antenna pattern layer. Next, a plastic frame is formed on the second surface of the antenna pattern layer by injection molding. The antenna pattern layer and the plastic frame are attached on a substrate via the adhesive layer.
The invention also provided a housing assembly of an electronic device. The housing assembly of the electronic device includes an antenna pattern layer, an adhesive layer, a plastic frame and a substrate. The antenna pattern layer has a first surface opposite a second surface. The adhesive layer is disposed on the second surface of the antenna pattern layer. The plastic frame is assembled on the second surface of the antenna pattern layer. The substrate is attached to the antenna pattern layer via the adhesive layer.
According to the foregoing, as compared to a conventional method for assembling the housing of the electronic device and a housing assembly thereof, the antenna pattern layer and the adhesive layer of the invention are integrated together, the plastic frame is firstly formed on the antenna pattern layer, and the antenna pattern layer and the plastic frame are then attached on the substrate via the adhesive layer without using of an additional double-sided adhesive or spot glue.
In order to make the aforementioned and other features and advantages of the invention more comprehensible, several embodiments accompanied with figures are described in detail below.
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.
It is to be explained that, in the present embodiment, a heat resistant temperature of the adhesive layer 120 is greater than 230 degrees C., and an adhesive layer 120 is produced by adopting materials of high heat resistant temperature, such as acrylic adhesive, acrylic foam, polyolefin adhesive, polyolefin foam or a combination of adhesive and foam. In detail, the adhesive layer 120, for example, has the top and bottom layers being the acrylic adhesive, and then the acrylic foam may be added between the top and bottom layers so as to provide the adhesive layer 120 with flexibility. In addition, a thickness of the adhesive layer 120 is, for example, 20 um to 2.0 mm.
The step S110 of providing the antenna pattern layer 110 and the adhesive layer 120 includes the following steps. Firstly, a release layer 130 is disposed on the adhesive layer 120, as shown in
Next, referring to
Referring to
As compared to a conventional method for assembling the housing of the electronic device, the antenna pattern layer 110 and the adhesive layer 120 of the present embodiment are integrated together, the plastic frame 150 is firstly formed on the antenna pattern layer 110, and the antenna pattern layer 110 and the plastic frame 150 are then attached on the substrate 160 via the adhesive layer 120 without using of an additional double-sided adhesive or spot glue. In addition, the plastic frame 150 of the present embodiment is formed on the antenna pattern layer 110 by a means of in-mold injection, so that the antenna pattern layer 110 is transformed from a plane shape to a three-dimensional shape in order to produce an antenna pattern layer 110 with curved surface (three-dimensional) or antenna pattern layer 110 with plane. Therefore, this antenna pattern layer 110 with curved surface (three-dimensional) or antenna pattern layer 110 with plane can be free from a shape restriction of the substrate 160, and may arbitrarily be attached to any appropriate position on the substrate 160; and thus, a configuration space of the antenna pattern layer 110 may be enhanced.
Specifically, referring to
In the present embodiment, an assembly of a housing of an electronic device 100 may be adopted to execute the method for assembling the housing of the electronic device. Referring to
The adhesive layer 120 is disposed on the first surface 112 of the antenna pattern layer 110, and a thickness of the adhesive layer 120 is, for example, 16 to 250 um. The plastic frame 150 is assembled on the second surface 114 of the antenna pattern layer 110. The assembly of the housing of the electronic device 100 further includes a protective layer 140. The protective layer 140 is disposed between the plastic frame 150 and the second surface 114 of the antenna pattern layer 110. A material of the protective layer 140 includes polyester adhesive, acrylic adhesive and polyolefin adhesive, and a thickness of the protective layer 140 is, for example, 5 to 20 um.
The substrate 160 is attached to the antenna pattern layer 110 via the adhesive layer 120. In addition, the assembly of the housing of the electronic device 100 further includes a decorative ink layer 170. The decorative ink layer 170 is disposed between the adhesive layer 120 and the substrate 160, and the invention does not limit the color and structure of the decorative ink layer 170.
Under this configuration, as compared to the conventional assembly of the housing of the electronic device, the antenna pattern layer 110 of the present embodiment is attached to the substrate 160 via the adhesive layer 120 without using of an additional double-sided adhesive or spot glue, thereby enhancing a space utilization rate of the antenna pattern layer 110. In addition, the plastic frame 150 is, for example, assembled on the second surface 114 of the antenna pattern layer 110 by injection molding, and the adhesive layer 120 is produced by adopting materials of high heat resistant temperature, such as acrylic adhesive, acrylic foam, polyolefin adhesive, polyolefin foam and so forth. Accordingly, the material of the adhesive layer 120 adopted in the present embodiment has a heat resistant temperature greater than 230 degrees C., and thus, may withstand a higher temperature of heat. Therefore, even if an injection molding is being performed, an adhesion of the adhesive layer 120 is not going to be lost due to the high temperature.
In summary, as compared to the conventional method for assembling the housing of the electronic device and the conventional assembly of the housing of the electronic device, the antenna pattern layer and the adhesive layer of the invention is integrated together, the plastic frame is firstly formed on the antenna pattern layer, and the antenna pattern layer and the plastic frame are then attached on the substrate the via the adhesive layer without using of an additional double-sided adhesive or spot glue.
In addition, the plastic frame of the present embodiment is formed on the antenna pattern layer by the means of in-mold injection molding, so as to produce the antenna pattern layer with curved surface (three-dimensional) or plane. As a result, this antenna pattern layer with curved surface (three-dimensional) or antenna pattern layer with plane can be free from the shape restriction of the substrate, and may arbitrarily be attached to any appropriate position on the substrate; and thus, the configuration space of the antenna pattern layer may be enhanced.
Moreover, the material of the adhesive layer adopted in the invention has the heat resistant temperature greater than 230 degrees C., and thus, may withstand the higher temperature of heat. As such, when performing the step of injection molding, the adhesion of the adhesive layer is not going to be lost due to the high temperature, so as to ensure that the adhesive layer may be attached to the substrate.
It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the invention cover modifications and variations of this invention provided they fall within the scope of the following claims and their equivalents.
Number | Date | Country | Kind |
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101141030 | Nov 2012 | TW | national |