This application is a National Phase Application of PCT/FR2013/052185, filed on Sep. 20, 2013, which in turn claims the benefit of priority from French Patent Application No. 58940 filed on Sep. 24, 2012, the entirety of which are incorporated herein by reference.
The subject of the present invention is a method for assessing the depth of a crack near the surface of a material, in particular of a metallic material. Also the subject of the invention is a method that makes it possible, in addition to assessing the depth of the crack, to locate said crack.
The detection of defects on the surface of metallic parts, such as, for example, cracks, and their qualification and the estimation of their dimensions, is done typically using the dye penetration technique.
However, this technique is polluting and is subject to human assessment, which generates problems of repeatability and means that it cannot be automated. It therefore seems important to find an objective and robust technique that makes it possible to detect and provide reliable information on the depth of the cracks, in the context of a non-destructive inspection on an industrial scale.
The present invention makes it possible to achieve these objectives.
Thus, the subject of the invention is a method for assessing the depth of a crack near the surface of a material.
The method according to the invention comprises the following steps:
the value of the heat diffusion length being given By the relationship:
μ=a·(D/f)1/2
in which:
μ designates the heat diffusion length, a designates a real constant, D designates the thermal diffusivity of the material in m2/s, and f designates the modulation frequency of the periodic heat source in Hz,
In the case of a sinusoidal modulation of the heat flux, the value of the heat diffusion length can be given by the relationship:
The set of points can comprise one or preferably several points so as to more accurately determine the trend of the function.
The trend of the function can be obtained by producing an average or applying a mathematical treatment to the trends of the function obtained for the set of points.
The distance between the heated zone and the crack can be estimated by any value representative of this distance, for example by the shortest distance between the heated zone and the crack, or even by the distance between the barycenter of the heated zone and the crack.
Said function can be the Laplacian applied to the amplitude of the sinusoidal component of the temperature at the modulation frequency.
The intersection length can, for example, be obtained by applying a criterion dependent on the place of slope change. It is possible, for example, to determine the point of intersection of the trend curve of the function and of a selected curve secant to the function in its slope change zone. It is also possible to adjust the trend curve of the function by a mathematical function of which one of the parameters makes it possible to obtain the intersection length. At least one of the parameters of said mathematical function can, for example, be determined from, the trend as a function of the heat diffusion length, of a function (which can be based on at least one derivative, relative to a space variable) of the phase of the sinusoidal component of the temperature on the surface of the material and at the modulation frequency.
The depth of the crack can be estimated using the following relationship:
h*=(μ22−d2)1/2
in which μ2 designates the intersection length and d designates the distance between a given point of the crack and the closest point of the heat source.
The heat source can be created by the absorption on the surface of the material of a light flux from a light source, or by a component using the Peltier effect or the Joule effect.
The light source can be a laser source or an arc lamp, or a filament lamp.
The heating zone located in proximity to the crack can be located at a distance from the edge of the crack of between 0.5 and 2 mm.
The frequency can vary between 0.1 Hz and 20 Hz.
The method can use a thermal camera.
The method can further comprise a step of detection of the crack.
The detection of the crack can be obtained by implementing, at different points of a zone surrounding the crack, a temporal Fourier transform of the temperature at each point, followed by a calculation of the Laplacian (or of another function using at least one spatial derivative) of the amplitude of the sinusoidal component of the temperature at the modulation frequency.
Other features and advantages of the present invention will become more clearly apparent on reading the following description given as an illustrative and nonlimiting example and done so with reference to the following figures in which:
As illustrated in
To locate the cracks of the sample 1, a digital processing operation is applied to the image of the amplitude. It is possible for example:
The sample 1 is heated by the heat source 2 with an excitation modulated at modulation frequencies from 0.1 to 20 Hz and generally focused on a zone of a few mm in diameter. The heat source 2 is placed in such a way as to excite the face of the sample 1 to be inspected.
The infrared signal is detected by the infrared camera 3 in synchronous detection mode. The measurement time depends on the number of cycles averaged. It is generally a few seconds.
The next part of the description is devoted to assessing the depth of a crack near the surface of the sample 1.
When a material is heated locally on the surface, the heat diffuses on the surface and depthwise. If the heat stimulus is periodic, the sinusoidal component of the heat flux at the modulation frequency extends over a heat diffusion length which depends on the thermal diffusivity of the material and on the modulation frequency. When there is a crack, the heat flux is locally disturbed. A temperature rise then occurs upstream of the crack.
The next part of the description relates to modulations, therefore ideal and simple configurations, but which largely apply to more realistic and complex cases.
The case of an emerging crack, normal to the surface, of width lfiss, of length Lfiss and of depth h, is considered,
The cracked sample is heated on the surface by a heat flux modulated at the frequency fi. The distance between the heat source and the crack is given by d. At the modulation frequency fi, the sinusoidal component of the heat flux extends on the surface and in the thickness of the sample over a heat diffusion length μi such that:
For a fairly low modulation frequency, the sinusoidal component of the heat flux extends over a greater length than if the modulation frequency is high.
The following are thus observed, as illustrated in
The presence of a crack disturbs the heat flux. The Laplacian of the amplitude of the temperature T on the surface L=∇2(T) is chosen as parameter revealing the crack. Unlike the gradient for example, it includes any direction on the surface if direction is not to be prioritized.
Schematically, for a point of the crack, the trend of L as a function of μ can be plotted, as illustrated in
The change of slope of the curve of the trend of the Laplacian of the amplitude of the sinusoidal component of the temperature at the modulation frequency as a function of μ (here for μ which is situated, in a region close to μ2) constitutes an indicator of the value h of the depth of the crack. If d designates the distance between the point considered on the crack and the closest point of the heat source, then the estimated value h* of the depth of the crack is given by the relationship:
h*=√{square root over (μ22−d2)}
The idea, which is to assess the depth of a crack from the curve of the trend of the Laplacian of the amplitude of the sinusoidal component of the temperature at the modulation frequency as a function of the frequency, is easy to transpose from the experimental point of view by using measurements obtained at different heating frequencies.
Number | Date | Country | Kind |
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12 58940 | Sep 2012 | FR | national |
Filing Document | Filing Date | Country | Kind |
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PCT/FR2013/052185 | 9/20/2013 | WO | 00 |
Publishing Document | Publishing Date | Country | Kind |
---|---|---|---|
WO2014/044986 | 3/27/2014 | WO | A |
Number | Name | Date | Kind |
---|---|---|---|
5136172 | Nakata | Aug 1992 | A |
5376793 | Lesniak | Dec 1994 | A |
5479259 | Nakata | Dec 1995 | A |
7060971 | Zombo | Jun 2006 | B2 |
20040041096 | Sun | Mar 2004 | A1 |
Entry |
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Schlichting et al: “Crack sizing by laser excited thermography” (Sep. 23, 2011). |
Nakata et al: “Simulation of photoacoustic imaging of microcracks in silicon wafers using a structure-changeable multi layered thermal diffusion model” (Mar. 1, 2007). |
Lahiri et al: “Quantification of defects in composites and rubber materials using active thermography” (Jan. 21, 2012). |
Search Reported dated 2013. |
“Depth estimation of surface cracks on metallic components by means of lock-in thermography” Streza et al. dated 2013. |
Number | Date | Country | |
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20150241212 A1 | Aug 2015 | US |