Claims
- 1. A method for attaching a porous metal structure to a metal substrate, the method comprising:
providing a metal substrate; providing a binding mixture; providing the porous metal structure; applying the binding mixture to the porous structure by means selected from the group consisting of spraying, and dipping; placing the porous structure against the substrate such that the binding mixture is disposed between the metal component and the porous structure, thereby forming an assembly; and heating the assembly to metallugically bond the porous structure and the substrate.
- 2. The method of claim 1, wherein the metal substrate comprises a metal selected from the group consisting of cobalt, cobalt alloy, titanium and titanium alloy.
- 3. The method of claim 1, wherein the binding mixture comprises a suspending additive selected from the group consisting of gelatin, glycerin, PVA and water, and wherein the binding mixture further comprises a powdered metal.
- 4. The method of claim 3, wherein the metal powder is selected from the group consisting of cobalt, cobalt alloy, hafnium, molybdenum, palladium, niobium, zirconium, zirconium alloy, titanium, and titanium alloy.
- 5. The method of claim 4, wherein the binding mixture comprises above about 10% by volume powdered metal.
- 6. The method of claim 4, wherein the binding mixture comprises above about 30% by volume powder.
- 7. The method of claim 4, wherein the binding mixture comprises above about 68% by volume powdered metal.
- 8. The method of claim 4, wherein the binding mixture comprises about 95% by volume powdered metal.
- 9. The method of claim 1, wherein the heating step comprises: heating the assembly at about 100° C. to 600° C. for about 1 to 4 hours; and further heating the assembly at about 800° C. to 1600° C. for about 1 hour to about 4 hours.
- 10. The method of claim 9, wherein the heating step is performed in an inert environment comprising a gas selected from the group consisting of argon and helium.
- 11. The method of claim 9, wherein the heating step is performed in an at least partial vacuum.
- 12. A method for attaching a porous metal structure to a metal substrate, the method comprising:
providing a metal substrate; providing a binding mixture; providing the porous metal structure; applying the binding mixture to the porous structure by means selected from the group consisting of spraying, and dipping; placing the porous structure against the substrate such that the binding mixture is disposed between the metal component and the porous structure, thereby forming an assembly; and applying heat and pressure to the assembly to metallugically bond the porous structure and the substrate.
- 13. The method of claim 12, wherein the metal substrate comprises a metal selected from the group consisting of cobalt, cobalt alloys, titanium and titanium alloys.
- 14. The method of claim 12, wherein the binding mixture comprises a suspending additive selected from the group consisting of gelatin, glycerin, PVA and water, and wherein the binding mixture further comprises a powdered metal.
- 15. The method of claim 14, wherein the powdered metal is selected from the group consisting of cobalt, cobalt alloy, hafnium, molybdenum, palladium, niobium, zirconium, zirconium alloy, titanium, and titanium alloy.
- 16. The method of claim 15, wherein the binding mixture comprises above about 10% by volume powdered metal.
- 17. The method of claim 15, wherein the binding mixture comprises above about 30% by volume powdered metal.
- 18. The method of claim 15, wherein the binding mixture comprises above about 68% by volume powdered metal.
- 19. The method of claim 15, wherein the binding mixture comprises about 95% by volume powdered metal.
- 20. The method of claim 12, wherein the step of applying heat and pressure comprises: heating the assembly to about 800° C. to 1600° C. for about 1 hour to about 4 hours, at a clamping pressure of between about 200 p.s.i. and 1200 p.s.i.
- 21. The method of claim 20, wherein the step of applying heat and pressure is performed in an inert environment comprising a gas selected from the group consisting of argon and helium.
- 22. The method of claim 20, wherein the step of applying heat and pressure is performed in an at least partial vacuum.
- 23. A method for attaching a porous metal structure to a metal substrate, the method comprising:
providing a metal substrate; providing the porous metal structure; contouring a surface of the porous metal structure; placing the porous structure against the substrate such that the contoured surface of the porous structure is in contact with the substrate, thereby forming an assembly; and heating the assembly to metallugically bond the porous structure and the substrate.
- 24. The method of claim 23, wherein the metal substrate comprises a metal selected from the group consisting of cobalt, cobalt alloys, titanium and titanium alloys.
- 25. The method of claim 23, wherein the contouring step comprises machining the surface of the porous metal structure.
- 26. The method of claim 23, wherein the contouring step comprises electro-discharge machining the surface of the porous metal structure.
- 27. The method of claim 23, wherein the heating step comprises: heating the assembly at about 100° C. to 600° C. for about 1 to 4 hours; and further heating the assembly at about 800° C. to 1600° C. for about one hour to about four hours.
- 28. The method of claim 23, wherein the heating step is performed in an inert environment comprising a gas selected from the group consisting of argon and helium.
- 29. The method of claim 23, wherein the heating step is performed in an at least partial vacuum.
- 30. A method for attaching a porous metal structure to a metal substrate, the method comprising:
providing a metal substrate; providing the porous metal structure; contouring a surface of the porous metal structure; placing the porous structure against the substrate such that the contoured surface of the porous metal structure is disposed against the substrate, thereby forming an assembly; and applying heat and pressure to the assembly to metallugically bond the porous structure and the substrate.
- 31. The method of claim 30, wherein the metal substrate comprises a metal selected from the group consisting of cobalt, cobalt alloys, titanium and titanium alloys.
- 32. The method of claim 30, wherein the contouring step comprises machining the surface of the porous metal structure.
- 33. The method of claim 30, wherein the contouring step comprises electro-discharge machining the surface of the porous metal structure.
- 34. The method of claim 30, wherein the heating step comprises: heating the assembly to about 800° C. to 1600° C. for about one hour to about four hours, under a clamping pressure of between about 200 p.s.i. and about 1200 p.s.i.
- 35. The method of claim 30, wherein the step of applying heat and pressure is in an inert environment comprising a gas selected from the group consisting of argon and helium.
- 36. The method of claim 30, wherein the step of applying heat and pressure is performed in an at least partial vacuum.
- 37. A method for attaching a porous metal structure to a metal component of an orthopedic implant, the method comprising:
providing a metal component, having a desired shape and a bone contacting surface; providing a binding mixture; providing the porous metal structure in a desired shape; applying the binding mixture to the porous structure by means selected from the group consisting of spraying, and dipping; placing the porous structure against the bone contacting surface of the metal component such that the binding mixture is disposed between the metal component and the porous structure, thereby forming an assembly; and heating the assembly to metallugically bond the porous structure and the metal component.
- 38. A method for attaching a porous metal structure to a metal component of an orthopedic implant, the method comprising:
providing a metal component, having a desired shape and a bone contacting surface; providing a binding mixture; providing the porous metal structure in a desired shape; applying the binding mixture to the porous structure by means selected from the group consisting of spraying, and dipping; placing the porous structure against the bone contacting surface of the metal component such that the binding mixture is disposed between the metal component and the porous metal structure, thereby forming an assembly; and applying heat and pressure to the assembly to metallugically bond the porous structure and the metal component.
- 39. A method for attaching a porous metal structure to a metal component of an orthopedic implant, the method comprising:
providing a metal component, having a desired shape and a bone contacting surface; providing the porous metal structure in a desired shape; contouring a surface of the porous metal structure; placing the porous structure against the bone contacting surface of the metal component such that the contoured surface of the porous structure is in contact with the metal component, thereby forming an assembly; and heating the assembly to metallugically bond the porous structure and the substrate.
- 40. A method for attaching a porous metal structure to a metal component of an orthopedic implant, the method comprising:
providing a metal component, having a desired shape and a bone contacting surface; providing the porous metal structure in a desired shape; contouring a surface of the porous metal structure; placing the porous structure against the bone contacting surface of the metal component such that the contoured surface of the porous structure is in contact with the metal component, thereby forming an assembly; and applying heat and pressure to the assembly to metallugically bond the porous structure and the substrate.
- 41. The method of any one of claims 1-22, 37 or 38, wherein the step of applying the binding mixture comprises applying the binding mixture to the metal substrate but not to the porous metal layer.
- 42. The method of any one of claims 1-22, 37 or 38, wherein the step of applying the binding mixture comprises applying the binding mixture to the metal substrate and to the porous metal layer.
Parent Case Info
[0001] This application is a non-provisional patent application that claims the benefit of U. S. provisional patent application No. 60/389,615.
Provisional Applications (1)
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Number |
Date |
Country |
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60389615 |
Jun 2002 |
US |