This invention relates generally to orthopedic implants, and more particularly relates to a method for bonding a porous tantalum structure to cobalt or a cobalt-alloy orthopedic implant.
Orthopedic implants are often utilized to help their recipients recover from injury or disease. To promote quick recovery, orthopedic implants are designed to cooperate with the body's natural inclination to heal itself. Some orthopedic implants are designed to foster osseointegration. As is known in the art, osseointegration is the integration of living bone within a man-made material, usually a porous structure. Cells in the recipient form new bone within the pores of the porous structure. Thus, the porous structure and the bone tissue become intermingled as the bone grows into the pores. Accordingly, orthopedic implants may include a porous surface to enhance fixation between the orthopedic implant and adjacent tissue. Of course, the faster the surrounding tissue grows into the porous surface, the sooner the patient may begin to resume normal activities. However, the manufacture of the orthopedic implants with porous structures is not without difficulty.
Orthopedic implants are usually made from various metals. One difficulty encountered during manufacturing is bonding separate components, each made of a different metal, together. For example, cobalt is a popular metal used to make orthopedic implants, and other popular metals include alloys of cobalt with other metals, such as chromium. The porous structure may be made from an entirely different metal, such as tantalum. In this case, bonding the porous metal to the orthopedic implant involves bonding tantalum to cobalt or to cobalt-chromium alloys. Bonding these two metals together has proved to be particularly problematic.
Thus, there is a need for an improved method of bonding of porous structures, specifically tantalum, to cobalt and cobalt-alloy implants such that the bond has sufficient strength while the corrosion resistance of the metals in the resulting implant are maintained.
The present invention provides a method for bonding a porous tantalum structure to a substrate. In one embodiment, the method comprises providing (i) a substrate comprising cobalt or a cobalt-chromium alloy; (ii) an interlayer consisting essentially of at least one of hafnium, manganese, niobium, palladium, zirconium, titanium, or alloys or combinations thereof; and (iii) a porous tantalum structure, and applying heat and pressure for a time sufficient to achieve solid-state diffusion between the substrate and the interlayer and solid-state diffusion between the interlayer and the porous tantalum structure.
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and, together with a general description of the invention given above, and the detailed description given below, serve to explain the invention.
In accordance with the present invention and with reference to
The porous tantalum structure 10 may be TRABECULAR METAL®, available from Zimmer Inc., Warsaw, Ind. The porous tantalum structure 10 is configured to facilitate osseointegration. The porous tantalum structure 10 may have a pore size, pore continuity, and other features for facilitating bone tissue growth into the pores, as is known in the art.
The substrate 12 may be a cast or a wrought cobalt or cobalt chromium alloy fabricated in a shape according to the requirements for the specific orthopedic application. For example, the substrate 12 may be cast of cobalt in the shape of a total hip replacement implant. Other implants may include implants for the ankle, elbow, shoulder, knee, wrist, finger, and toe joints or other portions of the body that may benefit from a substrate 12 having a porous tantalum structure 10 bonded thereto.
With no intent to be bound by theory, tantalum and cobalt metals are not readily soluble, that is, the documented solid solubility of tantalum into cobalt is insufficient to form the necessary bond strength demanded by applications within the human body. In fact, certain stoichiometries of tantalum with cobalt may prevent solid-state diffusion of tantalum into cobalt and vice versa. Therefore, in accordance with the method of the present disclosure, the interlayer 16 comprises a metal that readily forms solid solutions with both tantalum and cobalt or cobalt-chromium alloys. For example, the interlayer 16 may be any one or an alloy of metals, such as, hafnium, manganese, niobium, palladium, zirconium, titanium, or other metals or alloys that exhibit solid solubility with tantalum at temperatures less than the melting temperature of the substrate 12, the interlayer 16, or the porous tantalum structure 10.
The assembly 14, as shown in
With continued reference to
Heat and pressure are applied to the assembly 14 sufficient for solid-state diffusion to take place between the substrate 12 and the interlayer 16 and between the interlayer 16 and the porous tantalum structure 10. As is known to those skilled in the art, solid-state diffusion is the movement and transport of atoms in solid phases. Solid-state diffusion bonding forms a monolithic joint through formation of bonds at an atomic level due to transport of atoms between two or more metal surfaces. Heat and pressure may be supplied to the assembly 14 with a variety of methods known in the art. For example, the assembly 14 may be heated electrically, radiantly, optically, by induction, by combustion, by microwave, or other means known in the art. Pressure may be applied mechanically by clamping the assembly 14 together prior to insertion of the assembly 14 into a furnace, or pressure may be applied via a hot pressing system capable of applying pressure once the assembly 14 reaches a target temperature, as is known in the art. Furthermore, hot pressing may include hot isostatic pressing, also known in the art.
Referring now to
In one embodiment, the assembly 14 is clamped together by applying a pressure of at least approximately 200 pounds per square inch (psi) (approximately 1.38 MPa). However, pressures greater than approximately 200 psi may be applied up to the compressive yield strength of the any of the substrate 12, the interlayer 16, or the porous tantalum structure 10. Ordinarily, the porous tantalum structure 10 has the lowest compressive yield strength, for example, 5,800 psi for TRABECULAR METAL®.
The clamped assembly 14 is then heated to at least about 540° C. (about 1004 degree Fahrenheit) in vacuum or in another sub-atmospheric pressure of an inert atmosphere. In any case, the clamped assembly 14 is heated to less than the melting temperature of any of the components 10, 12, 16 and, in most cases, is at least about 800° C. (about 1472 degree Fahrenheit) but less than about 1000° C. (about 1832 degree Fahrenheit) in vacuum. One skilled in the art will observe that the higher the temperature, the less time it will take to achieve solid-state diffusion bonding. The time required to achieve solid-state diffusion bonding may be as little as less than 1 hour to as long as 48 hours and will depend on the metals involved, the temperatures, atmosphere, and the pressures applied.
Once heated to temperature, and after a time sufficient to achieve solid-state diffusion between the porous tantalum structure 10 and the interlayer 16 and between the interlayer 16 and the substrate 12, a construct is formed. The construct may comprise the substrate 12 bonded to the interlayer 16 and the interlayer 16 bonded to the porous tantalum structure 10.
With reference now to
In one exemplary embodiment, a construct comprising a porous tantalum structure 10 of TRABECULAR METAL® bonded to a titanium interlayer 16 bonded to a cobalt-chromium substrate 12 was characterized by tensile strength testing. Nearly all failure separations occurred in the porous tantalum structure 10. Tensile stresses measured at separation on constructs formed according to the previously described embodiments were routinely above 2,900 psi.
One skilled in the art will observe that heating and applying pressure may include multiple heating and pressurizing processes. For example, the porous tantalum structure 10 may be assembled with the interlayer 16 and bonded thereto, according to one embodiment of the method, to form a subassembly. That subassembly may then be bonded to the substrate 12 according to another embodiment of the method. The reverse procedure may also be used. That is, the interlayer 16 may be bonded to the substrate 12 to form a subassembly with subsequent bonding of the porous tantalum structure 10 to the interlayer portion of the subassembly. Therefore, embodiments of the method may account for different diffusion coefficients between the components 10, 12, 16 which may allow for more consistent, higher strength bonds between the substrate 12 and interlayer 16 and between the interlayer 16 and the porous tantalum structure 10. By way of further example and not limitation, diffusion bonding of a titanium interlayer 16 to a cobalt-chromium substrate 12 at an elevated temperature and pressure may take longer than diffusion bonding of the titanium interlayer 16 to a porous tantalum structure 10 at similar pressures and temperatures. Thus, by diffusion bonding the titanium interlayer 16 to the cobalt-chromium substrate 12 to form a subassembly and then diffusion bonding the porous tantalum structure 10 to the subassembly, a diffusion bond depth between the titanium interlayer 16 and the cobalt-chromium substrate 12 may be substantially the same as a diffusion bond depth between the titanium interlayer 16 and the porous tantalum structure 10. In contrast, if the porous tantalum structure 10, the titanium interlayer 16, and the cobalt-chromium substrate 12 are bonded with a single application of heat and pressure, the diffusion bond depths between the titanium interlayer 16 and the porous tantalum structure 10 and between the titanium interlayer 16 and the cobalt-chromium substrate 12 may be different.
While the present invention has been illustrated by the description of one or more embodiments thereof, and while the embodiments have been described in considerable detail, they are not intended to restrict or in any way limit the scope of the appended claims to such detail. Additional advantages and modifications will readily appear to those skilled in the art. The invention in its broader aspects is therefore not limited to the specific details, representative apparatus and method and illustrative examples shown and described. Accordingly, departures may be made from such details without departing from the scope of the general inventive concept.
Number | Name | Date | Kind |
---|---|---|---|
3353259 | Kirkpatrick | Nov 1967 | A |
3605123 | Hahn | Sep 1971 | A |
3643658 | Steinemenan | Feb 1972 | A |
3852045 | Wheeler et al. | Dec 1974 | A |
3855638 | Pilliar | Dec 1974 | A |
4004064 | Kessler | Jan 1977 | A |
4005988 | Paulonis et al. | Feb 1977 | A |
4479271 | Bolesky et al. | Oct 1984 | A |
4563489 | Urist | Jan 1986 | A |
4570271 | Sump | Feb 1986 | A |
4673409 | Van Kampen | Jun 1987 | A |
4713076 | Draenert | Dec 1987 | A |
4923471 | Morgan | May 1990 | A |
5013324 | Zolman et al. | May 1991 | A |
5084050 | Draenert | Jan 1992 | A |
5198308 | Shetty et al. | Mar 1993 | A |
5282861 | Kaplan | Feb 1994 | A |
5302414 | Alkhimov | Apr 1994 | A |
5323954 | Shetty et al. | Jun 1994 | A |
5363554 | Partridge et al. | Nov 1994 | A |
5383934 | Armini | Jan 1995 | A |
5397796 | Zoller | Mar 1995 | A |
5447724 | Helmus | Sep 1995 | A |
5458653 | Davidson | Oct 1995 | A |
5470829 | Prisell | Nov 1995 | A |
5492697 | Boyan | Feb 1996 | A |
5529914 | Hubbell | Jun 1996 | A |
5534524 | Bonewald | Jul 1996 | A |
5535810 | Compton | Jul 1996 | A |
5543441 | Rhee | Aug 1996 | A |
5550178 | Desai | Aug 1996 | A |
5554594 | Zoller | Sep 1996 | A |
5565407 | Southard | Oct 1996 | A |
5569463 | Helmus | Oct 1996 | A |
5573934 | Hubbell | Nov 1996 | A |
5631011 | Wadstrom | May 1997 | A |
5658334 | Caldarise | Aug 1997 | A |
5658935 | Kingler | Aug 1997 | A |
5665118 | LaSalle | Sep 1997 | A |
5688855 | Stoy | Nov 1997 | A |
5713410 | LaSalle | Feb 1998 | A |
5736160 | Ringeisen | Apr 1998 | A |
5788979 | Alt | Aug 1998 | A |
5801033 | Hubbell | Sep 1998 | A |
5824651 | Nanci | Oct 1998 | A |
5834274 | Hubbell | Nov 1998 | A |
5843743 | Hubbell | Dec 1998 | A |
5866113 | Hendriks | Feb 1999 | A |
5893846 | Bales | Apr 1999 | A |
5925552 | Keogh | Jul 1999 | A |
5928916 | Keogh | Jul 1999 | A |
5932299 | Katoot | Aug 1999 | A |
5947893 | Agrawal | Sep 1999 | A |
6004943 | Shi | Dec 1999 | A |
6099562 | Ding | Aug 2000 | A |
6120536 | Ding | Sep 2000 | A |
6121027 | Clapper | Sep 2000 | A |
6153252 | Hossainy | Nov 2000 | A |
6166173 | Mao | Dec 2000 | A |
6177095 | Swahney | Jan 2001 | B1 |
6179817 | Zhong | Jan 2001 | B1 |
6197051 | Zhong | Mar 2001 | B1 |
6238687 | Mao | May 2001 | B1 |
6254634 | Anderson | Jul 2001 | B1 |
6258121 | Yang | Jul 2001 | B1 |
6284305 | Ding | Sep 2001 | B1 |
6309660 | Hsu | Oct 2001 | B1 |
6313119 | Peyman | Nov 2001 | B1 |
6316522 | Loomis | Nov 2001 | B1 |
6322797 | Mao | Nov 2001 | B1 |
6368658 | Schwarz | Apr 2002 | B1 |
6395023 | Summers | May 2002 | B1 |
6395029 | Levy | May 2002 | B1 |
6419806 | Holcomb et al. | Jul 2002 | B1 |
6451373 | Hossainy | Sep 2002 | B1 |
6455541 | Bonewald | Sep 2002 | B1 |
6461631 | Dunn | Oct 2002 | B1 |
6486232 | Wise | Nov 2002 | B1 |
6492356 | Peyman | Dec 2002 | B1 |
6500481 | Vanderlaan | Dec 2002 | B1 |
6506437 | Harish | Jan 2003 | B1 |
6514515 | Williams | Feb 2003 | B1 |
6514734 | Clapper | Feb 2003 | B1 |
6527938 | Bales et al. | Mar 2003 | B2 |
6528080 | Dunn | Mar 2003 | B2 |
6540746 | Buehler | Apr 2003 | B1 |
6545097 | Pinchuk | Apr 2003 | B2 |
6558734 | Koulik | May 2003 | B2 |
6596402 | Soerens | Jul 2003 | B2 |
6600010 | Mao | Jul 2003 | B2 |
6620194 | Ding | Sep 2003 | B2 |
6632446 | Hubbell | Oct 2003 | B1 |
6656517 | Michal | Dec 2003 | B2 |
6669980 | Hansen | Dec 2003 | B2 |
6673385 | Ding | Jan 2004 | B1 |
6692790 | Liu | Feb 2004 | B2 |
6723350 | Burrell | Apr 2004 | B2 |
6730324 | Troczynski | May 2004 | B2 |
6733768 | Hossainy | May 2004 | B2 |
6743521 | Hubbell | Jun 2004 | B2 |
6746685 | Williams | Jun 2004 | B2 |
6749639 | Lewallen | Jun 2004 | B2 |
6833192 | Caruso | Dec 2004 | B1 |
6833363 | Renier | Dec 2004 | B2 |
6855329 | Shakesheff | Feb 2005 | B1 |
6866860 | Nathan | Mar 2005 | B2 |
6869445 | Johnson | Mar 2005 | B1 |
6872799 | Nathan | Mar 2005 | B2 |
6881766 | Hain | Apr 2005 | B2 |
6899107 | Lewandrowski | May 2005 | B2 |
6899731 | Li | May 2005 | B2 |
6921811 | Zamora | Jul 2005 | B2 |
6923986 | Pathak | Aug 2005 | B2 |
6923996 | Epstein | Aug 2005 | B2 |
6945448 | Medlin et al. | Sep 2005 | B2 |
6946443 | Blanchat | Sep 2005 | B2 |
6967234 | Nathan | Nov 2005 | B2 |
6969400 | Rhee | Nov 2005 | B2 |
6986899 | Hossainy | Jan 2006 | B2 |
6991681 | Yoe | Jan 2006 | B2 |
6991802 | Ahola | Jan 2006 | B1 |
6994883 | Layrolle | Feb 2006 | B2 |
6998134 | Schmidmaier | Feb 2006 | B2 |
7001421 | Cheng | Feb 2006 | B2 |
7008979 | Schottman | Mar 2006 | B2 |
7112361 | Lynn | Sep 2006 | B2 |
7148209 | Hoemann | Dec 2006 | B2 |
7157096 | Zhang | Jan 2007 | B2 |
7163715 | Kramer | Jan 2007 | B1 |
7185695 | Santeler | Mar 2007 | B1 |
7186811 | Lindholm | Mar 2007 | B2 |
20020018798 | Sewing | Feb 2002 | A1 |
20020041899 | Chudzik | Apr 2002 | A1 |
20020082552 | Ding | Jun 2002 | A1 |
20020084194 | Redepenning | Jul 2002 | A1 |
20020087184 | Eder | Jul 2002 | A1 |
20020103526 | Steinke | Aug 2002 | A1 |
20020111590 | Davilia | Aug 2002 | A1 |
20020119179 | Rezania | Aug 2002 | A1 |
20020120333 | Keogh | Aug 2002 | A1 |
20020131989 | Brown | Sep 2002 | A1 |
20020151617 | Mao | Oct 2002 | A1 |
20020165608 | Llanos | Nov 2002 | A1 |
20020192182 | Massia | Dec 2002 | A1 |
20030004568 | Ken | Jan 2003 | A1 |
20030007991 | Masters | Jan 2003 | A1 |
20030083740 | Pathak | May 2003 | A1 |
20030088307 | Shulze | May 2003 | A1 |
20030099762 | Zhang | May 2003 | A1 |
20030113478 | Dang | Jun 2003 | A1 |
20030114937 | Leatherbury | Jun 2003 | A1 |
20030117579 | Morris | Jun 2003 | A1 |
20030118692 | Wang | Jun 2003 | A1 |
20030122124 | Nagano et al. | Jul 2003 | A1 |
20030124172 | Lopez | Jul 2003 | A1 |
20030124368 | Lynn | Jul 2003 | A1 |
20030129130 | Guire | Jul 2003 | A1 |
20030157030 | Davis | Aug 2003 | A1 |
20030185752 | Nathan | Oct 2003 | A1 |
20030219562 | Rypacek | Nov 2003 | A1 |
20030228364 | Nathan | Dec 2003 | A1 |
20030229393 | Kutryk | Dec 2003 | A1 |
20030232124 | Medlin et al. | Dec 2003 | A1 |
20040033249 | Sewing | Feb 2004 | A1 |
20040039441 | Rowland | Feb 2004 | A1 |
20040044404 | Stucke | Mar 2004 | A1 |
20040049265 | Ding | Mar 2004 | A1 |
20040051201 | Greenhalgh | Mar 2004 | A1 |
20040063654 | Davis | Apr 2004 | A1 |
20040081745 | Hansen | Apr 2004 | A1 |
20040086493 | Hubbell | May 2004 | A1 |
20040086543 | Keogh | May 2004 | A1 |
20040091462 | Lin | May 2004 | A1 |
20040091603 | Priewe | May 2004 | A1 |
20040093080 | Helmus | May 2004 | A1 |
20040106985 | Jang | Jun 2004 | A1 |
20040109892 | Shalaby | Jun 2004 | A1 |
20040117007 | Whitbourne | Jun 2004 | A1 |
20040120982 | Diana | Jun 2004 | A1 |
20040126405 | Sahatjian | Jul 2004 | A1 |
20040133271 | Jang | Jul 2004 | A1 |
20040137066 | Jayaraman | Jul 2004 | A1 |
20040138695 | Li | Jul 2004 | A1 |
20040147999 | Udipi | Jul 2004 | A1 |
20040157073 | Burrell | Aug 2004 | A1 |
20040170752 | Luthra | Sep 2004 | A1 |
20040172121 | Eidenschink | Sep 2004 | A1 |
20040185086 | Massia | Sep 2004 | A1 |
20040215313 | Cheng | Oct 2004 | A1 |
20040215336 | Udipi | Oct 2004 | A1 |
20040241202 | Chluba | Dec 2004 | A1 |
20040241234 | Vilkov | Dec 2004 | A1 |
20050025752 | Kutryk | Feb 2005 | A1 |
20050025799 | Hossainy | Feb 2005 | A1 |
20050031689 | Shults | Feb 2005 | A1 |
20050031793 | Moeller | Feb 2005 | A1 |
20050036946 | Pathak | Feb 2005 | A1 |
20050048121 | East | Mar 2005 | A1 |
20050049694 | Neary | Mar 2005 | A1 |
20050060028 | Horres | Mar 2005 | A1 |
20050079200 | Rathenow | Apr 2005 | A1 |
20050084515 | Udipi | Apr 2005 | A1 |
20050085605 | Nathan | Apr 2005 | A1 |
20050095267 | Campbell | May 2005 | A1 |
20050101692 | Sohier | May 2005 | A1 |
20050106204 | Hossainy | May 2005 | A1 |
20050112170 | Hossainy | May 2005 | A1 |
20050112172 | Pacetti | May 2005 | A1 |
20050129731 | Horres | Jun 2005 | A1 |
20050147647 | Glauser | Jul 2005 | A1 |
20050149171 | McCullagh et al. | Jul 2005 | A1 |
20050152955 | Akhave | Jul 2005 | A1 |
20050153429 | Liebmann-Vinson | Jul 2005 | A1 |
20050154442 | Eidenschink | Jul 2005 | A1 |
20050154450 | Larson | Jul 2005 | A1 |
20050158359 | Epstein | Jul 2005 | A1 |
20050165128 | Cohn | Jul 2005 | A1 |
20050169882 | Lowe | Aug 2005 | A1 |
20050169969 | Li | Aug 2005 | A1 |
20050180919 | Tedeschi | Aug 2005 | A1 |
20050183259 | Eidenschink | Aug 2005 | A1 |
20050187376 | Pacetti | Aug 2005 | A1 |
20050187602 | Eidenschink | Aug 2005 | A1 |
20050187611 | Ding | Aug 2005 | A1 |
20050191333 | Hsu | Sep 2005 | A1 |
20050208093 | Glauser | Sep 2005 | A1 |
20050208100 | Weber | Sep 2005 | A1 |
20050208200 | Ding | Sep 2005 | A1 |
20050214339 | Tang | Sep 2005 | A1 |
20050215722 | Pinchunk | Sep 2005 | A1 |
20050220837 | Disegi | Oct 2005 | A1 |
20050220839 | DeWitt | Oct 2005 | A1 |
20050220840 | DeWitt | Oct 2005 | A1 |
20050220841 | DeWitt | Oct 2005 | A1 |
20050220842 | DeWitt | Oct 2005 | A1 |
20050220843 | DeWitt | Oct 2005 | A1 |
20050244453 | Stucke | Nov 2005 | A1 |
20050244459 | DeWitt | Nov 2005 | A1 |
20050244636 | Ding | Nov 2005 | A1 |
20050245637 | Hossainy | Nov 2005 | A1 |
20050251250 | Verhoeven | Nov 2005 | A1 |
20050255142 | Chudzik | Nov 2005 | A1 |
20050266038 | Glauser | Dec 2005 | A1 |
20050266077 | Royer | Dec 2005 | A1 |
20050271700 | DesNoyer | Dec 2005 | A1 |
20050271701 | Cottone | Dec 2005 | A1 |
20050274478 | Verner | Dec 2005 | A1 |
20050283224 | King | Dec 2005 | A1 |
20050288229 | Sindrey | Dec 2005 | A1 |
20060003008 | Gibson | Jan 2006 | A1 |
20060008500 | Chavan | Jan 2006 | A1 |
20060009839 | Tan | Jan 2006 | A1 |
20060013850 | Domb | Jan 2006 | A1 |
20060018948 | Guire | Jan 2006 | A1 |
20060025848 | Weber | Feb 2006 | A1 |
20060035854 | Goldstein | Feb 2006 | A1 |
20060036311 | Nakayama | Feb 2006 | A1 |
20060036316 | Zeltinger | Feb 2006 | A1 |
20060039947 | Schmidmaier | Feb 2006 | A1 |
20060039950 | Zhou | Feb 2006 | A1 |
20060045901 | Weber | Mar 2006 | A1 |
20060057277 | Chappa | Mar 2006 | A1 |
20060067969 | Lu | Mar 2006 | A1 |
20060093646 | Cima | May 2006 | A1 |
20060105018 | Epstein | May 2006 | A1 |
20060121081 | Labrecque | Jun 2006 | A1 |
20060165754 | Ranade | Jul 2006 | A1 |
20060188541 | Richelsoph | Aug 2006 | A1 |
20060198868 | DeWitt | Sep 2006 | A1 |
20060204536 | Shults | Sep 2006 | A1 |
20060204542 | Zhang | Sep 2006 | A1 |
20060210598 | Evans | Sep 2006 | A1 |
20060210602 | Sehl | Sep 2006 | A1 |
20060216772 | Grinstaff | Sep 2006 | A1 |
20060222681 | Richard | Oct 2006 | A1 |
20060222756 | Davila | Oct 2006 | A1 |
20060233801 | Brunkow | Oct 2006 | A1 |
20060233841 | Brodbeck | Oct 2006 | A1 |
20060233941 | Olson | Oct 2006 | A1 |
20060240063 | Hunter et al. | Oct 2006 | A9 |
20060246103 | Ralph | Nov 2006 | A1 |
20060246105 | Molz | Nov 2006 | A1 |
20060246110 | Brandon | Nov 2006 | A1 |
20060247793 | Trieu | Nov 2006 | A1 |
20060251824 | Boulais | Nov 2006 | A1 |
20060252981 | Matsuda | Nov 2006 | A1 |
20060257377 | Atala | Nov 2006 | A1 |
20060263830 | Grinstaff | Nov 2006 | A1 |
20060263831 | Grinstaff | Nov 2006 | A1 |
20060264531 | Zhao | Nov 2006 | A1 |
20060286064 | Turnell | Dec 2006 | A1 |
20060286071 | Epstein | Dec 2006 | A1 |
20060293406 | Bennett | Dec 2006 | A1 |
20070016163 | Santini | Jan 2007 | A1 |
20070020308 | Richard | Jan 2007 | A1 |
20070020469 | Wood | Jan 2007 | A1 |
20070026043 | Guan | Feb 2007 | A1 |
20070032882 | Lodhi | Feb 2007 | A1 |
20070037737 | Hoemmann | Feb 2007 | A1 |
20070038300 | Bao | Feb 2007 | A1 |
20070041952 | Guilak | Feb 2007 | A1 |
20070042017 | Kutryk | Feb 2007 | A1 |
20070043374 | Evans | Feb 2007 | A1 |
20070043433 | Chandrasekaran | Feb 2007 | A1 |
20070045902 | Brauker | Mar 2007 | A1 |
20070048291 | Mang | Mar 2007 | A1 |
20070048292 | Morita | Mar 2007 | A1 |
20070053963 | Hotchkiss | Mar 2007 | A1 |
20070054127 | Hergenrother | Mar 2007 | A1 |
20070055095 | Chu | Mar 2007 | A1 |
20070055367 | Kutryk | Mar 2007 | A1 |
20080050699 | Zhang et al. | Feb 2008 | A1 |
Number | Date | Country |
---|---|---|
2008229804 | Dec 2012 | AU |
657519 | Sep 1986 | CH |
4106971 | Mar 1992 | DE |
0372662 | Jun 1990 | EP |
0616814 | Mar 1994 | EP |
0616814 | Sep 1994 | EP |
1273303 | Jan 2003 | EP |
1144018 | Mar 2004 | EP |
1806155 | Jul 2007 | EP |
2047937 | Apr 2009 | EP |
2914207 | Oct 2008 | FR |
62176966 | Aug 1987 | JP |
62235272 | Oct 1987 | JP |
2002348681 | Dec 2002 | JP |
2004041726 | Feb 2004 | JP |
2007231420 | Sep 2007 | JP |
2009090121 | Apr 2009 | JP |
WO9307835 | Apr 1993 | WO |
WO-9307835 | Apr 1993 | WO |
WO9628117 | Sep 1996 | WO |
WO9738469 | Oct 1997 | WO |
WO9738649 | Oct 1997 | WO |
WO0139680 | Jun 2001 | WO |
WO0182989 | Nov 2001 | WO |
WO03077772 | Sep 2003 | WO |
WO03077772 | Sep 2003 | WO |
WO2005120203 | Dec 2005 | WO |
WO-2006078864 | Jul 2006 | WO |
WO2007014279 | Feb 2007 | WO |
WO2007014279 | Feb 2007 | WO |
WO2007038559 | Apr 2007 | WO |
WO2007053022 | May 2007 | WO |
WO-2012145292 | Oct 2012 | WO |
Entry |
---|
ISR/WO From PCT/US2009/032608. |
Jegnathian Karthiekeyan. Cold Spray Technology, Mar. 2005, pp. 33-35, ASB Industries, Barberton, OH. |
ISR/WO From PCT/US2009/031502. |
ISR from Application No. 08252074.2. |
Uthoff. J. Orthop. Scie., 11:118-126 (2006). |
Aleksyniene. Medicinia (Kaunus), vol. 40 (9): 842-849 (2004). |
Termaat. J. Bone and Joint Surg., 870A(6): 1366-1378 (2005). |
Morris. J. Bone and Joint Surg., 87-A(7), 1608-1618 (2005). |
Pavoor. Biomat., 27, 1527-1533 (2006). |
European Search Report for EP08253300.1 dated May 31, 2011. |
Australian Government IP Examiner First Report for patent application AU 2008 229804 dated Jan. 1, 2012. |
“U.S. Appl. No. 13/092,169, Examiner Interview Summary mailed Apr. 30, 2012”, 3 pgs. |
“U.S. Appl. No. 13/092,174, Examiner Interview Summary mailed Apr. 27, 2012”, 3 pgs. |
“European Application Serial No. 08253300.1, European Search Report mailed May 24, 2011”, 4 pgs. |
“U.S. Appl. No. 13/092,169, Final Office Action mailed Mar. 21, 2012”, 11 pgs. |
“U.S. Appl. No. 13/092,169, Non Final Office Action mailed Sep. 22, 2011”, 8 pgs. |
“U.S. Appl. No. 13/092,169, Response filed Feb. 21, 2012 to Non Final Office Action mailed Sep. 22, 2011”, 13 pgs. |
“U.S. Appl. No. 13/092,169, Response filed Aug. 20, 2012 to Final Office Action mailed Mar. 21, 2012”, 11 pgs. |
“U.S. Appl. No. 13/092,174, Final Office Action mailed Mar. 20, 2012”, 11 pgs. |
“U.S. Appl. No. 13/092,174, Non Final Office Action mailed Jun. 26, 2013”, 9 pgs. |
“U.S. Appl. No. 13/092,174, Non Final Office Action mailed Sep. 19, 2011”, 12 pgs. |
“U.S. Appl. No. 13/092,174, Preliminary Amendment filed Apr. 22, 2011”, 7 pgs. |
“U.S. Appl. No. 13/092,174, Response filed Feb. 21, 2012 to Non Final Office Action mailed Sep. 19, 2011”, 12 pgs. |
“U.S. Appl. No. 13/092,174, Response filed Aug. 20, 2012 to Final Office Action mailed Mar. 20, 2012”, 9 pgs. |
“U.S. Appl. No. 13/092,174, Response filed Sep. 26, 2013 to Non Final Office Action mailed Jun. 26, 2013”, 11 pgs. |
“Australian Application Serial No. 2008229804, Office Action mailed Jan. 13, 2012”, 5 pgs. |
“Australian Application Serial No. 2008229804, Response Filed, Oct. 29, 2012”, 14 pgs. |
“European Application Serial No. 08253300.1, Extended European Search Report mailed May 31, 2011”, 5 pgs. |
“European Application Serial No. 08253300.1, Response filed Apr. 4, 2012 to Extended Search Report mailed May 31, 2011”, 4 pgs. |
“International Application Serial No. PCT/US2012/033898, International Search Report mailed Jul. 31, 2012”, 5 pgs. |
“International Application Serial No. PCT/US2012/033898, Written Opinion mailed Jul. 31, 2012”, 17 pgs. |
“Japanese Application Serial No. 2008-263235, Office Action mailed Mar. 26, 2013”, 9 pgs. |
“Japanese Application Serial No. 2008-263235, Response filed Sep. 18, 2013”, 8 pgs. |
Giulio, Maccauro, “An overview about biomedical applications of micron and nano size Tantalum”, Recent Patents on Biotechnology, vol. 3, No. 3,, (2009), 157-165. |
Karthikeyan, Jeganathan, “Cold Spray Technology, Advanced Materials & Processes”, ASB Industries, (Mar. 2005), 33-35. |
Number | Date | Country | |
---|---|---|---|
20090098310 A1 | Apr 2009 | US |