Claims
- 1. A method for bonding molded parts of expanded polystyrene or copolymers thereof having a closed cellular structure without the use of adhesive comprising:
- a. wetting at least one of the surfaces to be bonded with water containing up to about 2% of a wetting agent;
- b. placing the surfaces to be bonded in abutting relationship free from relative movement;
- c. passing high frequency electrical energy through said abutted surfaces for a time sufficient to vaporize said water and to effect a bond having substantial continuity along the joint between the abutting surfaces; and
- d. allowing the abutted surfaces to cool for sufficient time to complete the weld.
- 2. A method as set forth in claim 1 including the step of encapsulating the perimeter of the joint formed by the surfaces to be bonded to prevent post expansion foaming.
- 3. A method as set forth in claim 1 wherein said high frequency electrical energy is in a range of from 5 MHz to about 2,000 MHz.
PRIOR APPLICATIONS
This application is a continuation-in-part of U.S. application Ser. No. 258,089, filed May 30, 1972, now abandoned, and a continuation-in-part of U.S. application Ser. No. 480,974, filed June 19, 1974, now abandoned.
US Referenced Citations (5)
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
258089 |
May 1972 |
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