Claims
- 1. Apparatus for bonding a first element to a second element, each of said elements including a metallic component, wherein said elements are characterized by differing coefficients of thermal expansion comprising, in combination:
- a) a copper plate including a first surface having a plurality of indentations and a second, opposed surface comprising a corresponding plurality of cones;
- b) said plate being located in the region of the interface between said elements so that pluralities of points of tangency are formed between said plate and said first and second elements;
- c) said first element including metallization layers of predetermined composition including a surface metallization layer of silver and characterized in that the major portion thereof is ceramic; and
- d) bonds comprising an alloying braze compound being formed between said elements and said plate at said points of tangency whereby said elements are bonded to one another.
Parent Case Info
This application is a division of applciation Ser. No. 07/968,416, filed Oct. 29, 1992.
US Referenced Citations (11)
Foreign Referenced Citations (2)
Number |
Date |
Country |
97944 |
Jun 1983 |
EPX |
1215908 |
Mar 1986 |
SUX |
Divisions (1)
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Number |
Date |
Country |
Parent |
968416 |
Oct 1992 |
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