Claims
- 1. In a method for decontaminating radioactive metal surfaces with an aqueous solution containing acetic acid, the improvement comprising: contacting a radioactively contaminated metallic object with an aqueous solution comprising 0.05%-5.0% volume acetic acid until the acetic acid in contact with said radioactively contaminated metallic object is nearly completely stoichiometrically depleted thereby forming an aqueous, stoichiometrically depleted solution comprising radioactively charged metallic oxides and metallic hydroxides; repeating the contacting of the metallic object with an additional amount of the aqueous solution until the radioactively contaminated metallic object has a residual radioactivity level below a permissible threshold level; sedimenting out said radioactively charged metallic oxides and metallic hydroxides from the aqueous, stoichiometrically depleted solution, forming a radioactive sediment; separating the aqueous, stoichiometrically depleted solution from the radioactive sediment; and solidifying the radioactive sediment.
- 2. In a method according to claim 1, wherein the separated aqueous, stoichiometrically depleted solution is purified with a resin ion exchanger to form deionized water.
- 3. In a method according to claim 1, wherein the aqueous, stoichiometrically depleted solution is electrolytically treated.
- 4. In a method according to claim 1, wherein the radioactively contaminated metallic object comprises at least one of a metal and a metal alloy selected from the group consisting of aluminum, lead, copper, nickel, and mixtures thereof and an oxidizing agent is added to the aqueous solution.
- 5. In a method according to claim 4, wherein the oxidizing agent is hydrogen peroxide.
- 6. In a method according to claim 1, wherein the aqueous solution is maintained at a temperature between about ambient temperature and about 80.degree. C.
- 7. In a method according to claim 1, wherein the concentration of the acetic acid in the aqueous solution is 0.1 to 1.0 Mol/l, and a stripping rate is controlled by a temperature of the aqueous solution.
- 8. In a method according to claim 1, wherein contacting of the radioactively contaminated metallic objects is accomplished by dipping into a bath.
- 9. In a method according to claim 1, wherein contacting of the radioactively contaminated metallic object is accomplished by drizzling the aqueous solution on the metal surfaces.
- 10. In a method according to claim 9, wherein a mechanical surface cleaning of said metal surfaces is performed following drizzling of the aqueous solution.
- 11. In a method according to claim 9, wherein a phase of spraying off under increased pressure follows each drizzling phase, all phases of spraying off being performed with the aqueous solution until the desired degree of radioactive decontamination has been achieved whereupon a final spraying off with water is performed.
- 12. In a method for decontaminating radioactive metal surfaces with an aqueous solution containing acetic acid, the improvement comprising: contacting a radioactively contaminated metallic object with an aqueous solution consisting essentially of 0.05%-5.0% volume acetic acid and an oxidizing agent until the acetic acid is nearly completely stoichiometrically depleted thereby forming an aqueous, stoichiometrically depleted solution comprising radioactively charged metallic oxides and metallic hydroxides; repeating the contacting of the metallic object with an additional amount of the aqueous solution until the radioactively contaminated metallic object has a residual radioactivity level below a permissible threshold level; sedimenting out said radioactively charged metallic oxides and metallic hydroxides from the aqueous, stoichiometrically depleted solution, forming a radioactive sediment; separating the aqueous, stoichiometrically depleted solution from the radioactive sediment; and solidifying the radioactive sediment.
CROSS-REFERENCE TO RELATED APPLICATION
This is a continuation-in-part patent application of U.S. patent application having Ser. No. 08/188,250, filed 28 Jan. 1994, now U.S. Pat. No. 5,386,078.
US Referenced Citations (3)
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
188250 |
Jan 1994 |
|