Patent Grant
8545688
The present invention relates to a method for electrochemically depositing carbon nitride films on a conductive substrate using a molten salt electrolyte bath.
Carbon nitride such as β-C3N4 having the same crystalline structure as β-Si3N4 is one of most advanced and attractive material in recent years. β-C3N4 is expected to have a bulk modulus as high as 420-560 GPa which is comparable to that of diamond of 443 GPa. It also has an expected shear modulus as high as 300-400 GPa corresponding to that of boron nitride. See, A. Y. Liu and M. L. Cohen, Phys. Rev., B41:10727 (1990). By virtue of these properties, carbon nitride is expected to be highly valuable as surface protection films of cutting tools and also as materials having high thermal conductivity.
In the course of studying β-C3N4, a variety of other forms of carbon nitride including cubic carbon nitride and amorphous carbon nitride have been discovered. See, E. Kroke and M. Schwartz, Coordination Chem. Rev., 248:493 (2004). These new forms of carbon nitride are attracting increasing attention as well and include those having unique properties such as high hardness and high wear resistance or capability of varying band gaps.
Carbon nitride films have hitherto been produced by reacting carbon and nitrogen at a temperature above 2000° C. using plasma or laser beam. See, JP 11189472A, JP 2001232501A and U.S. Pat. No. 6,658,895B2. These methods require complicated and expensive apparatus and, therefore, make the cost of resulting products economically unacceptable.
H. Kawamura and Y. Ito reported in Journal of Applied electrochemistry, 30:571 (2000) a method for electrochemically depositing carbon films on a substrate using a molten salt electrolyte bath containing carbonate ion. The carbonate ion is reduced to deposit a carbon film on the surface of the substrate acting as cathode. As will be easily appreciated, this method per se is not applicable to deposit carbon nitride films on a substrate.
A need exists, therefore, for a novel method for depositing carbon nitride films on a substrate which can eliminate or ameliorate of the defects of the known methods while taking advantages of electrodeposition process.
We have found that carbon nitride films can be deposited electrochemically on a substrate made of conductive materials.
According to the present invention, a method for electrochemically depositing carbon nitride films on a conductive substrate is provided comprising the steps of:
providing a molten salt electrolyte bath containing a source of carbonate ion and a source of nitrate ion;
placing a conductive substrate and a counter electrode in said electrolyte bath, said substrate and said counter electrode being electrically connected to a DC current source and acting as cathode and anode, respectively; and
applying DC current across said substrate and said counter electrode through said electrolyte bath whereby said carbonate ion and said nitrate ion are electrochemically reduced concurrently to deposit a carbon nitride film on the substrate.
The molten salt electrolyte bath may comprise either (a) a mixture of an alkali metal or alkaline earth metal carbonate and an alkali metal or alkaline earth metal nitrate, or (b) an alkali metal or alkaline earth metal halide containing said mixture (a). The molten salt electrolyte bath (b) is preferable.
In a preferred embodiment, the source of carbonate ion and the source of nitrate ion are added to a binary mixture of alkali metal halides such as a binary mixture of LiCl and KCl.
The present invention allows carbon nitride films to deposit on the surface of a conductive substrate under mild conditions using simple apparatus. The method according to the present invention is particularly advantageous in that it enables the carbon nitride film to deposit on a substrate having any shape or contour due to a throwing power as high as that of electrolytic metal plating process.
The molten salt electrolyte bath used in the present invention is ether (a) a mixture of alkali metal or alkaline earth metal carbonate and an alkali metal or alkaline earth metal nitrate, or (b) an alkali metal or alkaline earth metal halide containing the mixture (a).
Examples of alkali metal and alkaline earth metal carbonates include Li2CO3, Na2CO3, K2CO3, MgCO3, CaCO3 and BaCO3. Examples of alkali metal and alkaline earth metal nitrates include LiNO3, NaNO3, KNO3, Mg(NO3)2, Ca(NO3)2 and Ba(NO3)2.
The alkali metal halides include the fluoride, chloride, bromide and iodide of lithium, sodium, potassium, rubidium and cesium.
The alkaline earth metal halides include the fluoride, chloride, bromide and iodide of magnesium, calcium, strontium and barium.
Mixture of alkali metal halides and mixtures of alkaline earth metal halide may also be employed. A binary mixture of LiCl and KCl is especially preferred. In case of binary mixture of LiCl and KCl, the molar ratio of LiCl:KCl generally ranges between 30%:70% and 100%:0%, preferably between 55%:45% and 65%:35%. A eutectic mixture consisting of 58.5 mol % of LiCl and 41.5 mol % of KCl may also be used.
The molar ratio of nitrate ion to carbonate ion in the molten salt bath is adjusted preferably between 0.01 and 1.0, more preferably 0.02 and 0.5, especially 0.03 and 0.2. The carbonate ion source is dissolved in the molten salt electrolyte bath preferably to a saturated concentration. In case of the molten salt electrolyte bath comprising a binary mixture of LiCl and KCl, for example, K2CO3 reaches saturation concentration at about 5-6 mol % at about 500° C.
It is preferable to carry out the electrolysis process in an inert gas atmosphere to prevent oxidation or otherwise deterioration of the deposited carbon nitride film at an elevated temperature. It is also preferable to carry out the electrolysis process while stirring or otherwise agitating the electrolyte bath to produce dense carbon nitride films and/or to accelerate the deposition rate of said film.
The bath temperature is kept higher than the melting point of electrolyte. Because the solubilities of carbonate ion source and nitrate ion source increase as the bath temperature elevates, it is possible to produce dense carbon nitride films and/or to accelerate the deposition rate by elevating the bath temperature. On the other hand, the bath temperature is restricted in practice by several factors including the material of electrolyte vessel, handling problems and so on. Therefore, the bath temperature generally ranges between 250° C. and 800° C. and preferably between 350° C. and 700° C.
According to the invention, the following electrochemical reaction takes place on the cathode.
CO32−+XNO3−+(4+5X)e−
→CNx+3(1+X)O2− (1)
Thus, the substrate on which carbon nitride film is deposited acts as cathode. Therefore, the substrate acting as cathode is made of an electroconductive material, typically made of metals.
On the counter electrode acting as anode, the following electrochemical reaction takes place.
O2−→½O2+2e− (2)
Accordingly, the counter electrode is required to be made of a material which can withstand the above reaction. Commercially available electrodes sold as being suitable as acting anode, as well as nickel ferrite electrodes or diamond electrodes may be used.
Carbonaceous electrodes such as graphite electrodes may also be used as anode. In this case, the following reaction takes place on the carbonaceous anode.
3O2−+C(electrode)→CO32−+4e− (3)
Thus carbonate ion is continuously replenished into the molten salt bath until the carbonaceous electrode has been consumed by the above reaction.
It is imperative to carry out the electrolysis process according to the present invention at a potential capable of electrochemically reducing carbonate ion and nitrate ion. In case of LiCl/KCl mixed molten salt bath, carbonate and nitrate ions are electrochemically reduced concurrently at a potential more negative than about 1.2V (vs. Li+/Li). However, at a potential more negative than about 0.4V, carbonate ion is preferentially reduced and smooth carbon nitride films tend not to be obtained. In order to reduce carbonate ion and nitrate ion concurrently, the electrolysis process is carried out at a potential between 0.4V and 1.2 V.
After the reaction, the substrate is taken out from the molten salt bath and then washed to remove adhered electrolyte salt. Any washing method used for washing workpiece treated in the molten salt bath may be employed. For example, the substrate may be washed with deoxygenated warm water. The washing process may be carried out in an atmosphere of inert gas or hydrogen gas.
The following examples are offered without intending to limit the present invention thereto.
In the examples below, an apparatus as schematically shown in
After the electrolytic processing, the surface of the substrate was examined by the X-ray photoelectron spectroscopy (XPS).
The deposition of carbon nitride film was confirmed by the XPS analysis on the substrates of Examples 6-8.
The XPS spectra of N 1s and C 1s of the deposited film produced in Examples 6 and 7 are shown in
In the N 1s spectra of both Examples, in addition to a spectrum at 400.5 eV representing N atom bound to sp2 hybridized orbital of C atom, a spectrum at 398.5 eV presumably representing N atom bound to sp3 hybridized orbital of C atom is observed.
In the C 1s spectra of both Examples, a shoulder may be observed on the high energy side indicating the formation of a carbon nitride compound such as β-C3N4.
It was also found that N 1s binding energy was shifted to lower energy side by carrying out the electrolysis at more negative potential. This indicates that the status of C—N binding may be controlled by varying the electrolysis potential.
The substrates treated in Examples 3-5 were also examined by the XPS analysis but any occurrence of a carbon nitride compound was not confirmed by this method. However, due to remarkable change in the cathodic reaction and the deposited product on the substrate acting as cathode, it was presumed that a carbon nitride compound was produced in fact even in a very small amount.
Finally, no evidence of the formation of a carbon nitride compound was observed on the substrates of Examples 1 and 2 in the XPS analysis. Moreover, remarkable changes in the cathode reaction and the deposited product on the cathode indicating the formation of a carbon nitride compound were not observed.
Example 8 demonstrates that a satisfactory result may be achieved at a molar ratio of nitrate ion to carbonate ion as high as 0.2. However, the amount of deposited carbon nitride decreases inversely proportionally to the molar ratio of nitrate ion to carbonate ion above 0.2. Therefore, it is preferable to avoid the ratio of nitrate ion to carbonate ion in excess of 1.0.
| Number | Name | Date | Kind |
|---|---|---|---|
| 6617058 | Schier | Sep 2003 | B2 |
| 6658895 | Lieberman et al. | Dec 2003 | B2 |
| Number | Date | Country |
|---|---|---|
| 6-88291 | Mar 1994 | JP |
| 11-189472 | Jul 1999 | JP |
| 2001-232501 | Aug 2001 | JP |
| 2006169554 | Jun 2006 | JP |
| Entry |
|---|
| Fu et al., “Attempt to Deposit Carbon Nitride Films by Electrodeposition from an Organic Liquid” in Phys. Rev. B 59(3), pp. 1693-1696 (1999). |
| Oishi et al., “Formation of Carbon Nitride by Anode-Discharge Electrolysis of Molten Salt” in J. Electrochem. Soc. 149(11), pp. D178-D181 (2002). |
| English Abstract of JP2006-169554A. |
| U.S. Appl. No. 12/789,848 to Tokujiro Nishikiori et al., filed May 28, 2010. |
| Amy Y.Liu et al., ““Structural properties and electronic structure of low-compressibility materials: β-Si3N4 and hypothetical β-C3N4””, Physical Review B—vol. 41 No. 15, May 1990, pp. 10727-10735. |
| Edwin Kroke et al., ““Novel group 14 nitrides””, Coordination Chemistry Reviews, 248 (2004), pp. 493-532. |
| Number | Date | Country | |
|---|---|---|---|
| 20110290656 A1 | Dec 2011 | US |
