The aluminum oxide intermediate layer is conformally deposited, via step 16.
A trench has also been formed in the intermediate layer, for example using an aluminum oxide reactive ion etch (RIE), via step 20. Step 20 typically includes providing a mask having an aperture over the portions of the intermediate layer that are desired to be removed. The RIE is performed in the presence of the mask. The RIE proceeds until the etch stop layer 54 is reached. Thus,
A nonmagnetic seed layer for electroplating is provided, via step 22. For example Ru or another conductive material may be deposited via chemical vapor deposition (CVD), sputtering, or some other method. The main pole is then provided, via step 24. Step 24 typically includes plating high saturation magnetization pole materials, planarizing these material(s) using a chemical mechanical planarization (CMP) and forming a trailing (top) bevel, if any. For example, CoFe may be plated in step 12. Because of the profiles of the underlayer 52, etch stop layer 54, the intermediate layer 56 and trench, a leading edge bevel may be formed in the electroplated materials.
Although the conventional magnetic recording head 50 formed using the method 10 functions, there are drawbacks. For example, formation of the leading bevel 62 may require multiple process steps. Fabrication times for the conventional transducer 50 may thus be longer. Yield for the method 10 may also be lower than desired. In addition, variations in the fabrication process may result in poorer performance of the conventional transducer 50. For example, the sidewalls of the pole 60 may have a different shape (angle) or location than designed. Accordingly, what is needed is a system and method for improving the performance of a magnetic recording head and manufacturing yield.
An intermediate layer is provided on the underlayer, via step 102. In some embodiments, the intermediate layer is also on the etch stop layer discussed above. The bottom (leading) surface of the intermediate layer is substantially flat because the underlayer is substantially flat. This geometry may be obtained simply by depositing the intermediate layer on the underlying topology. No additional processing of the intermediate layer may be required.
A trench is formed in the intermediate layer, via step 104. In some embodiments, step 102 includes performing one or more reactive ion etches (RIEs). The trench has a shape and location that corresponds to a main pole.
A nonmagnetic seed layer is deposited, via step 106. For example, step 106 may include depositing a Ru layer using CVD or another conformal deposition method.
A main pole is provided in the trench, via step 108. In some embodiments, step 108 may include electroplating one or more layers. Other deposition methods may be used in addition to or in lieu of plating. The main pole material(s) have a high saturation magnetization and thus may include material(s) such as CoFe. Step 108 may also include forming a trailing bevel.
Fabrication of the transducer may then be completed, via step 110. For example, coils, shields, contacts, insulating structures and other components may be provided. In addition, the slider may be lapped and otherwise completed.
Using the method 100, a magnetic transducer having improved performance may be fabricated. The method 100 forms the leading bevel 213 without complicated processing steps. Instead, the shape of the trench 206, intermediate layer 204′ and nonmagnetic layer 208 naturally result in formation of the leading bevel 213. Reduction in complexity of formation in the leading bevel 213 may improve fabrication time and yield. Further, it is posited that because formation of the trench 206 terminates within the intermediate layer 204′ in step 104, the variation in the width of the trench may be reduced over the conventional method, which terminates at the underlying etch stop layer. Thus, performance and/or yield may be improved. In addition, the geometry of the pole tip 212 is not adversely affected by use of the method 100. It is noted that any leading shield that is part of the underlayer 202 may be further spaced apart from the pole tip 212 by the nonmagnetic layer 208. However, it is believed that this does not significantly or adversely affect performance. Thus, performance and yield may be improved while fabrication is simplified using the method 100.
An underlayer that is substantially flat is provided, via step 152. Step 152 may include forming a leading shield in the underlayer. However, in contrast to the underlayer for the conventional transducer 50 the top surface of the leading shield may be substantially perpendicular to the ABS location.
An etch stop layer is provided on the underlayer, via step 154. The etch stop layer may include multiple sublayers. Alternatively, multiple etch stop layer may be considered to be provided. The top surface of the etch stop layer(s) is substantially flat.
An intermediate layer is full film deposited on the etch stop 254, via step 106. In some embodiments, the intermediate layer is an aluminum oxide layer.
One or more RIEs are performed to remove a portion of the intermediate layer 256 and form a trench therein, via step 158. Step 158 may include forming a mask having an aperture corresponding to the location and footprint of the trench. Further, the RIE(s) performed in step 158 terminate within the intermediate layer 256 at and near the ABS location. However, the etch(es) terminate at the etch stop layer 254 in the yoke region. Thus, the depth of the trench formed in the intermediate layer varies at least in part because the width of the trench varies.
A seed layer that may be resistant to an etch of the intermediate layer 256′ is deposited in the trench, via step 160. In some embodiments, a Ru layer is deposited in step 160. In other embodiments, a Ta or other layer may be deposited. In some embodiments, a multilayer seed layer may be provided in step 160. The deposition performed in step 160 is conformal.
The main pole is provided using steps 162, 164 and, optionally, 166. The material(s) for the main pole are deposited, via step 162. In some embodiments, step 162 includes plating the pole materials.
The main pole material(s) may be planarized, via step 164. Step 164 may utilize a chemical mechanical planarization. In addition, an ion mill may be performed to remove the mask and/or other material(s) outside of the trench.
A trailing bevel may optionally be formed, via step 166. Step 166 may include providing a nonmagnetic structure on the pole material(s) 260 that is recessed from the ABS location, then milling the pole material(s).
The coil(s) that are used to energize the main pole 260′ are provided, via step 168. Step 168 may include forming a helical or spiral coil. Thus, a portion of the coil(s) may be formed before the pole. Single or multiple layers of turns may also be formed. A write gap is formed, via step 170. The write gap lies on top of the main pole 260′. The shield(s) may be provided, via step 172. Step 172 may include providing side shields, a trailing shield, and/or a wraparound shield (which includes side and trailing shields).
Using the method 150, a main pole 260 having improved performance may be fabricated more simply and with higher yield. For example, the leading bevel 261 may be more simply and readily formed. This may improve fabrication time and yield. Further, the variation in the width main pole 260′ at the ABS location may be reduced. Thus, performance and/or yield may be improved. In addition, the geometry of the pole tip for the pole 260′ is not adversely affected by use of the method 100. It is noted that the leading shield 252A may be further spaced apart from the pole tip by the nonmagnetic layer 258. However, it is believed that this does not significantly or adversely affect performance. Thus, performance and yield may be improved while fabrication is simplified using the method 150.
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