It is noted that the following embodiments and examples are intended to farther explain this invention but not to limit the scope of the same.
Referring to
Specifically, the conductive material can be a film of a metal or a metal alloy, or an insulating film coated with a metal or a metal alloy. The metal or metal alloy may include at least one material selected from the group consisting of gold (Au), silver (Ag), copper (Cu), aluminum (Al), nickel (Ni) and tin (Sn). The method of coating the insulating film with a metal or a metal alloy may be evaporation deposition or liquid plating, and the insulating film may include a polymer. The polymer may include at least one selected from a group including silicon rubber, neoprene rubber, acrylonitrile-butadiene rubber (NBR), styrene-butadiene rubber (SBR), polyacrylate, polyethylene (PE), thermoplastic elastomer (TPE) and polyethylene terephthalate (PET), etc.
In addition, the dielectric material 202 may include at least one selected from a group including polyethylene (PE), polyvinyl chloride (PVC), polypropylene (PP), polyethylene terephthalate (PET), acrylonitrile butadiene styrene (ABS) polymer, polycarbonate (PC), a mixture of ABS and PC, and paper, etc.
After the conductive material 200 and the dielectric material 202 are provided, they are laminated (step 110), possibly by using an applier 10 to apply an adhesive to at least one of respective surfaces to be joined of them and then press-bonding them by, for example, two opposite rollers 12. The adhesive may be applied along the patterns of the antenna circuits through screen printing or through the use of a spray gun controlled by a program, so that only the portions of the conductive material 200 to be separated as antenna circuits are bonded to the dielectric material 202 and the conductive material 200 other than the circuits can be removed easily. Alternatively, an adhesive having a relatively lower adhesion is applied all over at least one of the conductive material 200 and the dielectric material 202, wherein the adhesion thereof is sufficiently low so that the conductive material other than the circuits can be removed easily.
After the conductive material 200 and the dielectric material 202 are laminated, the conductive material 200 is press-cut with press-cutting means 14 to form therein a circuit 200a of an antenna unit (step 120). The press-cutting means 14 may include a stamp-cutting die 16 or a roll-cutting die 18. The die 16 or 18 may have thereon one or more patterns each being a relief-type pattern that corresponds to the boundary of the pattern of one circuit 200a, for the material between the circuit 200a and the rest (200b) of the conductive material 200 has to be thinned to allow separation of the circuit 200a.
The conductive material 200 may be press-cut such that the circuits 200a as formed are completely separated from or partially connected with the rest of the conductive material 200. In the later case, the connection sections between the circuits 200a and the rest of the conductive material 200 is preferably sufficiently thin so that the latter can be removed easily with a small force without damaging the structures of the circuits 200a or making the circuits 200a apart from the dielectric material 202.
After the press-cutting operation, the conductive material 200b other than the circuit 200a is removed (step 130), possibly with a tape winder 20 that is rotated to wind up the conductive material 200b. Preferably, the adhesive is applied along the pattern of the circuits 200a and the conductive material 200 is press-cut such that the circuits 200a as formed are completely separated from the conductive material 200b, so that the conductive material 200b can be removed relatively easily.
Thereafter, the resulting composite structure is cut to obtain an antenna unit 204 (step 160) possibly using a knife 22, wherein the cutting is usually done to the dielectric material 202 only or to a composite of the dielectric material 202 and a low-adhesion adhesive as mentioned above to form a dielectric base 202a of the antenna unit 204. In order to fabricate a plurality of antenna units in a continuous manner, it is possible to use a conveying mechanism (not shown), such as a conveyer belt, to continuously or intermittently forward the conductive material 200, the dielectric material 202 and their composite, so that a plurality of antenna units 204 can be cut-separated continuously. An important issue in the cutting is the positioning issue. For an intermittent forwarding mechanism, it is possible to set a positioning distance in advance and forward the composite structure by the positioning distance every time to achieve correct positioning. For a continuous one, it is possible to form positioning holes at the edges of the dielectric material film 202 so that the forwarding mechanism can stably forward the dielectric material 202 to achieve correct positioning.
Referring to
In a case, the chip 206 to be bonded has solder balls 212 thereon and is directly soldered onto the circuit 200a with the solder balls 212. In another case, a polymer-based conductive material 216 is applied between the chip 206 and the circuit 200a and is baked to bond the chip 206 to the circuit 200a, wherein the polymer-based conductive material 216 may be previously applied to the surface of the chip 206 to be bonded. The polymer-based conductive material 216 may include an anisotropic conductive film (ACF) or an anisotropic conductive paste (ACP). In cases where an ACF or ACP is used for bonding, gold bumps 214 may be disposed on the chip 206 in advance. The portions of the ACF or ACP between respective gold bumps 214 and the circuit 200a form conductive paths after the gold bumps 214 is pressed over the circuit 200a.
Nevertheless, in the second embodiment where the conductive material 200 is press-cut before being laminated with the dielectric material 202, the conductive material 200 is preferably press-cut such that the circuits 200a as formed are partially connected with the rest (200b) of the conductive material 200, so that the circuits 200a are stably forwarded together with the rest of the conductive material 200 and laminated with the dielectric material 202. The connection sections between the circuits 200a and the rest of the conductive material 200 is preferably sufficiently thin so that the rest of the conductive material 200 can be removed with a small force without damaging the circuits 200a or making the circuits 200a apart from the dielectric material 202.
By applying the method of this invention, a plurality of antenna units can be continuously fabricated in high efficiency, low cost and little pollution. The method also allows each antenna to have a fall receiving performance due to the precision of the process of the method.
This invention has been disclosed above in the preferred embodiments, but is not limited to those. It is known to persons skilled in the art that some modifications and innovations may be made without departing from the spirit and scope of this invention. Hence, the scope of this invention should be defined by the following claims.
Number | Date | Country | Kind |
---|---|---|---|
95131346 | Aug 2006 | TW | national |