Patent Application
20190011608
The present invention relates to a method of fabricating a lens array, and more particularly, to a method for fabricating a high sag lens array and a high sag lens array fabricated by a semiconductor process.
In general, a conventional method of fabricating a micro-lens array firstly injects an ultraviolet (UV) glue layer on a mold with a plurality of cavities, and then positions a glass substrate on the UV glue layer, and irradiates an UV ray while the glass substrate presses the UV glue layer to harden the UV glue layer and combine the glass substrate and the UV glue layer to fabricate the micro-lens array. However, when the cavities have a depth of over 300 micrometers, this method will cause unfilled forming or bubble in the UV glue layer in the cavities, and the incompletely forming process and the bubble issue would cause poor optical characteristics. In other words, when using the conventional method to fabricate a micro-lens array with a height of over 300 micrometers, there will be a deformation or a bubble issue on the top area of each micro-lens of the micro-lens array. Please refer to
It is therefore one of the objectives of the present invention to provide a method for fabricating a high sag lens array and a high sag lens array fabricated by a semiconductor process, so as to solve the above problem.
In accordance with an embodiment of the present invention, a method for fabricating a high sag lens array is disclosed. The method comprises: individually jetting an optical glue material into a plurality of lens mold cavities of a mold to forma plurality of lens parts independently; exposing the lens parts to harden the optical glue material in the lens mold cavities; jetting an optical glue layer on the lens parts; forming a transparent substrate on the optical glue layer; exposing the optical glue layer to harden the optical glue layer and combine the transparent substrate, the optical glue layer, and the lens parts; and removing the mold to form the high sag lens array.
In accordance with an embodiment of the present invention, a high sag lens array is disclosed. The high sag lens array comprises: a glass substrate, an optical glue layer, and a plurality of lenses. The optical glue layer is formed on the glass substrate. The lenses are formed on the optical glue layer and have a height of over 300 micrometers.
Briefly summarized, the present invention can use a semiconductor process to fabricate a high sag lens array with a height of over 300 micrometers, each lens in the high sag lens array has a good formation without the bubble issue.
These and other objectives of the present invention will no doubt become obvious to those of ordinary skill in the art after reading the following detailed description of the preferred embodiment that is illustrated in the various figures and drawings.
Certain terms are used throughout the following description and the claims to refer to particular system components . As one skilled in the art will appreciate, manufacturers may refer to a component by different names. This document does not intend to distinguish between components that differ in name but not function. In the following discussion and in the claims, the terms “include”, “including”, “comprise”, and “comprising” are used in an open-ended fashion, and thus should be interpreted to mean “including, but not limited to...”. The terms “couple” and “coupled” are intended to mean either an indirect or a direct electrical connection. Thus, if a first device couples to a second device, that connection may be through a direct electrical connection, or through an indirect electrical connection via other devices and connections.
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Step 200: Form a mold has a plurality of lens mold cavities.
Step 210: Individually jet an optical glue material into a plurality of lens mold cavities of a mold to form a plurality of lens parts independently.
Step 220: Expose the lens parts to harden the optical glue material in the lens mold cavities.
Step 230: Jet an optical glue layer on the lens parts.
Step 240: Form a transparent substrate on the optical glue layer.
Step 250: Expose the optical glue layer to harden the optical glue layer and combine the transparent substrate, the optical glue layer, and the lens parts
Step 260: Remove the mold to form the high sag lens array.
Briefly summarized, the present invention can use a semiconductor process to fabricate a high sag lens array with a height of over 300 micrometers, each lens in the high sag lens array has a good formation without the bubble issue.
Those skilled in the art will readily observe that numerous modifications and alterations of the device and method may be made while retaining the teachings of the invention. Accordingly, the above disclosure should be construed as limited only by the metes and bounds of the appended claims.
