Claims
- 1. A method of fabricating an ink jet print head, comprising steps of: spreading an adhesive over one major surface of a flat base plate having a relatively high rigidity and resistant to thermal deformation to form an adhesive layer of a predetermined thickness; joining a piezoelectric plate polarized in a direction of thickness to the adhesive layer; hardening the adhesive layer; forming a plurality of parallel grooves through the piezoelectric plate into the adhesive layer by grinding such that said plurality of parallel grooves include side surfaces which extend through the piezoelectric plate and into the adhesive layer with said plurality of parallel grooves each having a bottom surface located in said adhesive layer; forming electrodes by depositing a metal over the side and bottom surfaces of the grooves by electroless plating; attaching a top plate to the upper surface of the piezoelectric plate so as to close the upper open end of the grooves; attaching a nozzle plate provided with a plurality of ink jets to one end of the assembly of the base plate, the adhesive layer, the piezoelectric plate and the top plate so that the grooves are closed to form a plurality of pressure chambers and the pressure chambers can be connected to an ink supply unit, and wherein deformation of said side surfaces is enhanced upon application of a voltage to said electrodes as a result of said grooves extending into said adhesive layer.
- 2. A method of fabricating an ink jet print head according to claim 1, wherein the adhesive forming the adhesive layer contains particles of a material readily soluble in a chemical liquid, the inner surfaces of the grooves are etched before forming the electrodes by electroless plating.
- 3. A method of fabricating an ink jet print head according to claim 1 or 2, wherein the adhesive forming the adhesive layer contains a catalyst for electroless plating.
- 4. A method of fabricating an ink jet print head according to claim 1 or 2, wherein a catalyst for electroless plating is applied to the upper surface of the piezoelectric plate and the surfaces of the grooves, the upper surface of the piezoelectric plate excluding portions in which a wiring pattern is to be formed and the surfaces of the grooves are coated with a mask formed by a photolithographic process, the assembly of the base plate, the adhesive layer and the piezoelectric plate is immersed in an electroless plating bath to form the wiring pattern and the electrodes simultaneously.
Priority Claims (1)
Number |
Date |
Country |
Kind |
3-257531 |
Oct 1991 |
JPX |
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Parent Case Info
This is a division of application Ser. No. 07/872,352, filed on Apr. 23, 1992, now U.S. Pat. No. 5,311,219.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
5193256 |
Ochiai et al. |
Mar 1993 |
|
5265315 |
Hoisington et al. |
Nov 1993 |
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Divisions (1)
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Number |
Date |
Country |
Parent |
872352 |
Apr 1992 |
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