The present invention provides a method of fabricating a parallel leading wire in a focusing mesh of a field emission display and the structure thereof. In particular, it provides a method to fabricate a leading wire connected the metal mesh and the cathode plate in a field emission display. It not only makes the leading wire hard to break apart, but also easy to be enveloped. In addition, the method provided will not exceed the budget, affect the integral structure, and/or occur a short or break circuit. Furthermore, the method will not influence the installment of valid and invalid areas in a system and further simplify the usage of the invalid area.
It is known that the structure of the current field emission displays can be divided as 2, 3 and 4 pole types. The structure of 3 and 4 pole field emission displays both have metal mesh. When applying a controlled voltage to the metal mesh, the electron beams from the cathode plate successfully pass the metal mesh and reflect to the anode plate to display the images. Owing to the material difference with glass colloid, the cathode and anode plates, the metal mesh extends outside of the element and to be deemed as a leading wire. However, the foregoing method cannot provide the structure to be airtight enough, and thereby cause the insufficient vacuum and even sometimes happen air leakage.
In order to overcome the depicted defeats, a metal mesh is entirely enveloped within the cathode and anode plates, and additionally fabricates a leading wire extended outside of the element. Nevertheless, this method has some drawbacks as following:
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The present invention is to solve the foregoing problems and avoid the possible drawbacks. The present invention is to fabricate the leading wire of the metal mesh and the cathode plate in a field emission display. The fabrication will not take extra costs, affect the integral structure, and/or occur a short or break circuit. Furthermore, the method will not influence the installment of valid and invalid areas in the structure and further simplify the usage of the invalid area.
Accordingly the present invention includes firstly to fabricate a cathode leading wire along one edge of the cathode plate of a field emission display. After a metal mesh is formed in a cathode plate, a leading wire is fabricated along and parallel to the edge of the metal mesh. The parallel leading wire has a designated length and a thickness thinner than the metal mesh. Without applying external force, the parallel leading wire is drooped and contacted the cathode plate because of itself weight. Be way of sintering, the parallel leading wire is connected with the cathode leading wire and enveloped by the metal mesh in the substrate.
These and other objectives of the present invention will become obvious to those of ordinary skill in the art after reading the following detailed description of preferred embodiments.
It is to be understood that both the foregoing general description and the following detailed description are exemplary, and are intended to provide further explanation of the invention as claimed.
The above objects and advantages of the present invention will be become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings in which:
Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.
Please refer to
In order to envelop the metal mesh 1 into a glass substrate 21, the dimension of the glass substrate 21 of the cathode plate 2 should be larger than the dimension of the metal mesh 1 and allow the metal mesh 1 to be enveloped into a glass substrate 21;
When fabricating the cathode plate 2, the silver colloid is formed along the edge of the glass substrate 21 by method of screen print and/or coating and further forms a cathode leading wire 22. Simultaneously, a joint area 23 is formed in the cathode leading wire 22.
After the metal mesh 1 is formed in the cathode plate 2 by screen printing, coating, photoresisting, and lithography, one edge of the metal mesh 1 forms a leading wire 11 parallel to another edge of the mesh. The parallel leading wire 11 has a designated length, and the thickness of the metal mesh 1 is thinner than 0.2 mm. The square dimension is quite big (8, 12, and even 48 inches) and thereby the ratio of depth is small. According to the theory of cantilever beam, the parallel leading wire 11 can droop to the cathode leading wire 22 of the cathode plate and connect to the joint area 23 without applying an external force. Furthermore, the deformation occurred in the mesh 12 and the metal mesh 1 will not be affected. When the parallel leading wire 11 is connected to the joint area 23 of the cathode leading wire 22, joining the parallel leading wire 11 and joint area 23 by way sintering.
Connecting the parallel leading wire 11 and joint area 23 and proceed to vacuum package. It will prevent the air leakage and crack of the parallel leading wire and further increase the good fabrication rate of a field emission display.
Referring to
The cathode plate 2 has a glass substrate 21, wherein the edge of the glass substrate 21 forms a cathode leading wire 22, the cathode leading wire 22 forms a joint area 23 in a suitable location.
The metal mesh 1 formed in the cathode plate 2 wherein one edge of the metal mesh has a designated length and a parallel leading wire connected to the joint area 23, wherein the parallel leading wire 11 can be made of same or different material with respect to the metal mesh 11.
The parallel leading wire 11 has a designated length, so it will droop and connect to the joint area 23 by itself weight without the external force is applied. Then, connecting the parallel leading wire to the joint area 23 by method of sintering.
Thus, adding a parallel leading wire 11 on the metal mesh 1 will not take extra costs nor influence the integral structure or a short and break circuit. Furthermore, the method will not influence the installment of valid and invalid areas in a system and fully simplify the usage of invalid area.
Furthermore, when the material of metal mesh 1 is different to the parallel leading wire 11, the parallel leading wire 11 can be made of good conductive metal materials and connected to the metal mesh 1.
While the present invention has been particularly shown and described with reference to preferred embodiments thereof, it will be understood by those of ordinary skill in the art the various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the appended claims.
This application is a divisional application of U.S. patent application Ser. No. 10/883,717, filed on Jul. 6, 2004 now abandoned.
Number | Name | Date | Kind |
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2453118 | Buckingham et al. | Nov 1948 | A |
Number | Date | Country | |
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20060051984 A1 | Mar 2006 | US |
Number | Date | Country | |
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Parent | 10883717 | Jul 2004 | US |
Child | 11254912 | US |