Patent Application
20110206905
The present disclosure relates to a method for forming a block copolymer pattern on a substrate.
Patterning techniques based on block copolymers are often described as a potential means of surpassing the pattern resolution that may be achieved using conventional photolithography used in microfabrication. With block copolymer (BCP) patterning, a thin film of an appropriate block copolymer is cast onto a substrate, and chemical interactions between the polymer blocks induce the formation of a phase segregated nanostructure. Thin films with a thickness incorporating a single layer of phase separated polymer features are normally employed, and with block concentrations and anneal conditions appropriate to the formation of spherical micelles, a hexagonal lattice of polymer structures is formed on the surface. When polymer block concentrations and anneal conditions generate a cylindrical phase separation, an arrangement of parallel cylinders is formed in the thin film. The ultimate resolution (or minimum feature size) that can be formed is generally limited by thermodynamics and the selection of polymers available. Simple processing/handling techniques to increase the block copolymer feature density without redesigning the polymers potentially allow more devices to be packed on a given substrate, improving performance measures such as device density or cost effectiveness.
In the literature, the value of “density doubling” has been discussed. In one instance, a chemical pattern was printed on a substrate, and the block copolymer feature density of these chemically pre-patterned substrates was doubled, tripled or quadrupled, by choosing block-copolymers known to generate patterns with exact fractional decrements from the spacing of the chemical pre-pattern. This method, however, allows patterning of the block co-polymer with resolutions beyond that of the chemical pre-pattern, but does not increase the actual resolution of the polymer. No systems have currently been reported for increasing the feature density of the polymers themselves, nor have any methods for producing intermixed arrays of multiple materials.
Once formed, several methods exist for transferring the block copolymer pattern to the substrate or another material, including selective etching or selective chemical binding.
It has now been determined that the feature density of a block copolymer pattern on a substrate is increased by increasing the thickness of the film of block copolymer that is applied to the substrate.
Accordingly, the present disclosure relates to a method of forming a block copolymer pattern on a substrate, the method comprising:
In another embodiment of the disclosure, the nanostructures in the first layer are interstitially spaced apart from the nanostructures in the second layer. In a further embodiment, at least three layers comprising nanostructures are formed on the substrate. In an embodiment, the nanostructures formed in each layer are interstitially spaced apart from the nanostructures in each adjacent layer.
In another embodiment, the nanostructure density on the substrate is between 50 nanostructures/μm2 and 2000 nanostructures/μm2, optionally between 150/μm2 and 1500/μm2, optionally between 400/μm2 and 1200/μm2.
In another embodiment of the disclosure, the spacing between adjacent nanostructures is between 1 nm and 500 nm, optionally between 10 nm and 100 nm, optionally between 20 nm and 60 nm, optionally between 25 nm and 50 nm.
In another embodiment, the nanostructures of the block copolymer pattern comprise micelles in the shape of nanodots or nanolines. In a further embodiment, spherical micelles in the block copolymer form a rectangular or hexagonal array pattern in the block copolymer pattern. In another embodiment, nanolines in the block copolymer pattern form nanowires or nanocylinders.
In an embodiment of the disclosure, the block copolymer is a diblock copolymer. In a further embodiment, the diblock copolymer comprises functional groups that bind to a metal salt.
In another embodiment of the disclosure, the diblock copolymer is a polymer of the formula (I):
A-B (I)
wherein A is a repeating polymeric monomer unit of the formula (II)
wherein each R is independently or simultaneously selected from H, halo, (C1-C6)-alkyl, —O—(C1-C6)-alkyl or fluoro-substituted-(C1-C6)-alkyl,
n is 1, 2, 3, 4 or 5; and
B is a repeating polymeric monomer unit of the formula (III)
wherein each R′ is independently or simultaneously selected from H, halo, (C1-C6)-alkyl, —O—(C1-C6)-alkyl or fluoro-substituted-(C1-C6)-alkyl, and
m is 1, 2, 3 or 4.
In another embodiment, A is
In a further embodiment, B is
wherein each R′ is independently or simultaneously selected from H, halo, (C1-C6)-alkyl, —O—(C1-C6)-alkyl or fluoro-substituted-(C1-C6)-alkyl, and m is 1, 2, 3 or 4. In another embodiment, B is
In another embodiment of the disclosure, the block copolymer comprises polystyrene-block-polyvinylpyridine (PS-b-PVP), polystyrene-block-polydimethylsiloxane (PS-b-PDMS), polystyrene-block-polyethyleneoxide (PS-b-PEO), polyethyleneoxide-block-polyisoprene (PEO-b-PI), polyethyleneoxide-block-polybutadiene (PEO-b-PBD), polyethyleneoxide-block-polymethylmethacrylate (PEO-b-PMMA), polyethyleneoxide-block-polyvinylpyridine (PEO-b-PVP), polystyrene-block-polymethylmethacrylate (PS-b-PMMA), polyvinyl pyridine-block-polymethyl methacrylate (PVP-b-PMMA), polyethyleneoxide-block-polyethylethylene (PEO-b-PEE), polystyrene-block-polybutadiene (PS-b-PBD), styrene-isoprene-styrene (SIS), or polybutadiene-block-polyvinylpyridine (PBD-b-PVP). In another embodiment, the disclosure also comprises block copolymer films including diblock, triblock and multiblock copolymers or blends of several block copolymers. One skilled in the art will understand that it is possible to synthesize and organize many different block copolymers, and that the substitution of a block copolymer not listed above does not constitute a departure from the disclosure.
In another embodiment of the disclosure, the substrate comprises silicon (Si), gallium arsenide (GaAs), germanium (Ge), another semiconductor, a metal, indium tin oxide, or a plastic. In another embodiment of the disclosure, the substrate comprises silicon, GaAs, Ge, a semiconductor, a metal, indium tin oxide, or a plastic.
In another embodiment, there is also included a method of forming a metallic nanostructure array comprising:
In a further embodiment of the disclosure, the block copolymer coated substrate is contacted with a first metal salt and subsequently contacted with a second metal salt. In another embodiment, the first and second metal salts are independently selected from CoCl2, ZnCl2, Na2PtCl4, Na2PdCl4, RhCl3, AgNO3 and HAuCl4. In a further embodiment, the metal ion is Co2+, Zn2+, PtCl42−, PdCl42, Rh3+, Ag+ and/or AuCl4−. In another embodiment, each layer of the block copolymer pattern is contacted with more than one metal salt, for example two metal salts, to form metal alloys, or core-shell metal complexes, in each independent layer.
In another embodiment, the substrate is treated with plasma, such as oxygen plasma, to remove the block copolymer from the substrate.
In another embodiment, the BCP-coated substrate is treated with a first metal salt, then exposed to a plasma to reduce the metal ions and partially remove the polymer. Subsequently, the substrate is treated with a second metal salt, and exposed to a second plasma process to reduce the second metal ions and completely remove the polymer.
In another embodiment, a metallic nanostructure array is formed using galvanic displacement, in which metallic nanostructures are directly formed during the galvanic displacement process. In this embodiment, the block copolymer is removed by dissolving the polymer on the substrate using an organic solvent, such as toluene or tetrahydrofuran (THF).
In another embodiment, the method further comprises selectively etching the organized BCP-coated substrate such that the BCP is treated with an etchant that selectively attacks one of the blocks. In an embodiment, the etching removes one block and exposes the substrate underneath only that block. In another embodiment, after this, the exposed areas are attacked with a different chemical.
In another embodiment of the disclosure, the multilayer BCP film is selectively etched by ozone treatment or reactive ion etching. In another embodiment, the BCP is PS-b-PBD, the substrate is silicon nitride, and the organized multilayer PS-b-PBD film is first ozonated, then etched by reactive ion etching to produce a silicon nitride film with a pattern of holes (see for example Park, et al., Science, 276, 1401 (1997)). In another embodiment, the BCP is PS-b-PBD, the substrate is silicon nitride, and the organized multilayer PS-b-PBD film is first stained with an osmium dye, then etched by reactive ion etching to produce a pattern on the silicon nitride.
In a further embodiment, the block copolymer pattern is transferred into an alternate material by treatment with nanoparticles (see for example, Kashem et al., Macromolecules, 42, 6202 (2009)). In a further embodiment, the BCP is PS-b-PMMA and an amount of iron oxide nanoparticles are mixed with the BCP film. The nanoparticles selectively bind to the PMMA block and assume the organization of the PMMA component within the block copolymer film.
The present disclosure is also directed to a substrate comprising a nanostructure array produced in accordance with the method of the present disclosure.
In another embodiment, the substrate comprising a nanostructure array produced in accordance with the present disclosure is used as a nanostructured battery.
In another embodiment, the substrate comprising a nanostructure array produced in accordance with the present disclosure is used as a nanostructured solar cell.
Other features and advantages of the present disclosure will become apparent from the following detailed description. It should be understood, however, that the detailed description and the specific examples while indicating preferred embodiments of the disclosure are given by way of illustration only, since various changes and modifications within the spirit and scope of the disclosure will become apparent to those skilled in the art from this detailed description.
The present disclosure will now be described in greater detail with reference to the attached drawings in which:
The term “substrate” as used herein refers to any substrate in which the surface can be coated with a block copolymer. Examples of substrates include, but are not limited to, silicon, germanium, other semiconductors, metals, glass, and plastic films.
The term “copolymer” as used herein refers to a polymer comprising two or more chemically-distinct monomeric subunits. These monomeric subunits are covalently attached to one another in a single polymer chain.
The term “block copolymer” as used herein refers to a copolymer comprising two or more different types of monomeric subunits, wherein the monomeric subunits are grouped into blocks containing only one type of monomeric subunit. These blocks are covalently attached to other blocks containing different subunits in the same polymer chain, and the monomeric subunits of the block copolymer undergo phase segregated arrangement as a result of the affinity of the monomeric subunits to organize with similar monomeric subunits.
The term “diblock copolymer” as used herein refers to a block copolymer in which there are only two different types of monomeric subunits.
The term “functional groups” as used herein refers to chemical moieties present in the polymer subunits of the block copolymer and which may be able to bind to metal ions. Examples of functional groups include, but are not limited to, pyridyl and pyridyl derivatives which bind to metal salts. Accordingly, the metal salts bind to the functional groups in the block copolymer domains formed by the block copolymer. In an embodiment, after removal of the block copolymer from the substrate and reduction of the metal salt, the metal nanostructures remain in the shape of the block copolymer domains.
The term “(C1-C6)-alkyl” as used herein means straight and/or branched chain, saturated alkyl radicals containing from one to six carbon atoms and includes methyl, ethyl, propyl, isopropyl, n-butyl, s-butyl, isobutyl, t-butyl, 2,2-dimethylbutyl, n-pentyl, 2-methylpentyl, 3-methylpentyl, 4-methylpentyl, n-hexyl and the like.
The term “halo” us used herein means any of the halogen atoms fluorine, chlorine, bromine and iodine.
The term “contacting” as used herein refers to the intimate contact of a particular reagent with a specific substrate. In an embodiment, the term contacting refers to the intimate contact of a block copolymer with the surface of the substrate such that a film of block copolymer is applied to the substrate. In an embodiment, the block copolymer is applied as a neat solution, or is applied with a solvent, such as tetrahydrofuran. In another embodiment, the term contacting refers to the intimate contact of the block copolymer-coated substrate with a metal salt, such that the metal ions bind to the block copolymer features formed by phase segregated arrangement of the block copolymer. In an embodiment, a first metal salt is contacted with the block copolymer-coated substrate such that the block copolymer features close to the exposed surface of the block copolymer-coated substrate are loaded with the metal ions. In another embodiment, a second metal salt is subsequently contacted with the block copolymer-coated substrate such that the block copolymer features closer to the surface of the substrate (or further removed from the exposed surface) become loaded with the metal ions.
The term “phase-segregated arrangement” as used herein refers to the segments of a block copolymer and their characteristic of self-organizing into thermodynamically favourable positions or conformations as a result of hydrophobic and hydrophilic or other molecular interactions in the polymer blocks (e.g., hydrophobic components will organize together, and hydrophilic components will organize together).
The term “layer” as used herein, such as a first or second layer, refers to a distinct layer comprising organized nanostructures as a result of phase-segregated arrangement of the block copolymer. Accordingly, there is no specific barrier between adjacent layers. Each layer is defined by the presence of nanostructures contained in the layer.
The term “nanostructures” as used herein refers to nanoscale features or shapes, such as, but not limited to, micelles, cylinders, nanowires, nanolines, nanorods, and lamellae. In one embodiment, nanostructures comprise various materials, including block copolymers, metals, and metal oxides. Examples of nanostructures include, but are not limited to, block copolymer domains, metal nanoparticles, and metal nanolines (or metal cylinders). Nanostructures may be arranged in a disordered fashion or may be arrayed in an orderly fashion.
The term “block copolymer pattern” as used herein refers to the organized pattern of nanostructures which are formed from the particular blocks as a result of the phase-segregated arrangement of the block copolymer. Accordingly, in an embodiment, the block copolymer is segregated into periodically-spaced nanodots in the layers. In another embodiment, the block copolymer pattern comprises nanolines.
The term “metallic nanostructure array” as used herein refers to an organized pattern of metallic nanostructures on the surface of a substrate. In an embodiment, the metallic nanostructures form arrangements such as, but not limited to, a hexagonal lattice (as seen schematically in
The terms “nanodots” or “nanolines” as used herein refer to nanostructures which are in the shapes of dots or particles (nanoparticles), or cylinders or wires, respectively.
The term “density” as used herein refers to the quantity of nanostructures, such as nanoparticles or nanocylinders per unit area of substrate. In one embodiment with respect to nanocylinders, it also refers to the number of nanocylinders per unit length of the substrate in a direction along the substrate perpendicular to the nanocylinders.
The term “metal salt” as used herein refers to any metallic salt in which the metal ions are able to diffuse through a block copolymer and bind to the block copolymer domains. Examples of metal salts include, but are not limited to, CoCl2, ZnCl2, Na2PtCl4, Na2PdCl4, RhCl3, AgNO3 or HAuCl4. It will be understood that when the term metal salt is used in the context of a first and/or second metal salt, the BCP-coated substrate is first contacted with a first metal salt, and subsequently, contacted with a second metal salt.
The term “metal ion” as used herein refers to the charged metal atom of the metal salt. Accordingly, examples of metal ions include, but are not limited to, Co2+, Zn2+, PtCl42−, PdCl42−, Rh3+, Ag+ or AuCl4−.
The term “galvanic displacement” as used herein refers to the reaction and reduction of metal ions, and subsequently, the deposition of the corresponding metal onto the substrate, and after removal of the block copolymer, forms a metallic nanostructure array.
The term “treating the substrate” to remove the block copolymer as used herein refers to any method for the removal or etching away of the block copolymer on the substrate, leaving the metallic nanostructure array on the substrate. In an embodiment, oxygen plasma is used to remove the block copolymer from the substrate. In another embodiment, when galvanic displacement is used to deposit the metal ions, the substrate is contacted with an organic solvent, such as toluene or THF, to remove the block copolymer.
It has now been determined that the density of nanostructures in a block copolymer pattern on a substrate is increased by increasing the thickness of the film of block copolymer that is applied to the substrate.
In an embodiment, the thickness of the block copolymer film applied to the substrate correlates to the concentration of the block copolymer in a solution. Accordingly, in an embodiment, a copolymer having a lower concentration in a solution will have a lower thickness, whereas a copolymer with a higher concentration in solution will have a comparatively higher thickness.
Accordingly, the present disclosure relates to a method of forming a block copolymer pattern on a substrate, the method comprising:
In another embodiment of the disclosure, the nanostructures in the first layer are interstitially spaced apart from the nanostructures in the second layer. In an embodiment, metallic nanoparticle arrays templated from block copolymer patterns is shown in
In a further embodiment, at least three layers comprising nanostructures are formed on the substrate. In an embodiment, the nanostructures formed in each layer are interstitially spaced apart from the nanostructures in each adjacent layer. It will be understood by those skilled in the art that the nanostructures will, in an embodiment, assume the lowest energy state, and in most cases successive layers will be laterally offset. In an embodiment, the third layer will be directly above the first layer. In an embodiment, the third layer will be offset from both the first and second layers
In another embodiment, the block copolymer pattern has a nanostructure density greater than that of a single layer of block copolymer features. In an embodiment, using the block copolymer PS(125k)-b-P2VP(58.5k) (the number after each block denotes the molecular weight of that block in g/mol), for instance, leads to hexagonal nanodots spaced 66 nm apart for a single layer which corresponds to a nanostructure density of 265/μm2. For a double layer of nanostructures, the spacing is reduced to about 38 nm and the nanostructure density is increased to about 530/μm2.
In another embodiment, the nanostructure density on the substrate is between 50 nanostructures/μm2 and 200/μm2, optionally between 150/μm2 and 1500/μm2, optionally between 400/μm2 and 1200/μm2.
In another embodiment of the disclosure, the areal nanostructure spacing (for example, the spacing between adjacent metallic nanostructures, after the block copolymer has been removed) is between 1 nm and 500 nm, optionally between 10 nm and 100 nm, optionally between 20 nm and 60 nm, optionally between 25 nm and 50 nm. In another embodiment, the nanostructure spacing is less than about 40 nm.
In another embodiment, the block copolymer pattern has a nanostructure density based on the variety of block copolymer utilized and the arrangement of the block copolymer features. Average areal distances between adjacent nanostructures for several types of block copolymers are shown below in the table:
In another embodiment, the nanostructures of the block copolymer pattern comprise hexagonally-arranged nanodots, or nanolines such as nanocylinders. In a further embodiment, a block copolymer pattern consisting of hexagonally arranged nanostructures is used as a template to form a hexagonal metallic nanoparticle array (as seen in
In another embodiment, the nanostructures of the block copolymer pattern comprise nanodots such as spherical micelles, or nanolines such as nanocylinders, wherein the nanocylinders are horizontally oriented. In another embodiment, the nanostructures comprise lamellar structures, thin sheets which periodically alternate in a direction parallel to the substrate. In a further embodiment, a lamellar block copolymer pattern is used as a template to form nanowires or nanolines in the metallic nanoparticle array.
In another embodiment of the disclosure, the nanostructures which form in the block copolymer pattern are controlled by manipulating the ratio of the blocks in a block copolymer. For example, in an embodiment, copolymers with a smaller ratio of PVP (polyvinylpyridine) to PS (polystyrene) are more likely to form nanodots, such as spherical micelles, while copolymers with a larger ratio (i.e., closer to 1:1) are more likely to form nanolines, such as nanocylinders. In another embodiment, if a copolymer has significantly more PVP than PS, then it is the PS component that will form spherical micelles within a PVP matrix, and the resulting metallized nanostructure array comprises a matrix of metal with an array of holes.
In an embodiment, the thickness of the block copolymer film applied to the substrate correlates to the concentration of the block copolymer in a solution contacting the substrate. Accordingly, in an embodiment, a block copolymer having a lower concentration in a solution will have a lower thickness, whereas a block copolymer with a higher concentration in a solution will have a comparatively higher thickness. In an embodiment, a sufficient amount of a block copolymer is applied to the substrate for phase-segregated arrangement of the block copolymer, such that at least a first layer and a second layer are formed on the substrate, wherein nanostructures are present in each of the layers, and the nanostructures comprise a block copolymer pattern, which is used as a template to form, for example, a metallic nanoparticle array. Accordingly, the sufficient amount of the block copolymer will form a first layer comprising nanostructures, and at least a second distinct layer also comprising nanostructures. In an embodiment, the nanostructures in each layer will self-organize into thermodynamically favourable positions, and accordingly, in an embodiment, the nanostructures in a particular layer will be laterally offset from the nanostructures in each adjacent layer (as seen in
In another embodiment, the thickness of the block copolymer layer is controlled by the concentration of the block copolymer applied in a coating solution to the substrate. In an embodiment, the block copolymer is dissolved in a suitable organic solvent such as toluene, THF, chlorobenzene, or any other solvent which solubilizes the block copolymer, at a concentration of between 0.1 wt % and 5 wt %, 0.5 wt % and 3 wt %, suitably between 1.0 wt % and 2.5 wt %, optionally 2.0 wt %.
In an embodiment, the molecular weight of the first block of the block polymer is between 5,000 and 2,000,000, optionally between 75,000 and 175,000, optionally between 100,000 and 150,000, optionally 125,000 g/mol. In an embodiment, the first block of the block copolymer comprises polystyrene and/or polystyrene derivatives. In another embodiment, the molecular weight of the second block of the block copolymer is between 5,000 and 2,000,000, optionally between 40,000 and 80,000, optionally between 45,000 and 60,000, optionally 58,500 g/mol. In another embodiment, the second block of the block copolymer comprises poly-2-vinylpyridine or poly-4-vinylpyridine.
In another embodiment of the disclosure, the block copolymer is spin-coated on the substrate. Accordingly, for example, in an embodiment, a 2.0 wt % solution of the block copolymer in toluene is spin cast at a speed of between 500 rpm and 7,000 rpm, optionally between 2,000 rpm and 6,000 rpm, optionally between 3,000 rpm and 5,000 rpm, optionally 4,000 rpm, after an acceleration of between 4,000 rpm/s and 10,000 rpm/s, optionally between 5,000 rpm/s and 9,000 rpm/s, optionally between 6,000 rpm/s and 8,000 rpm/s, optionally between 7,500 rpm/s and 8,000 rpm/s, optionally 7,700 rpm/s. In an embodiment, under the conditions for the phase-segregated arrangement, the thickness of the block copolymer coated on the substrate is between 20 nm and 150 nm, optionally between 40 nm and 120 nm, optionally between 60 nm and 100 nm, optionally between 65 nm and 80 nm, optionally between 65 nm and 70 nm, optionally 70 nm. In another embodiment, the thickness is between 60 nm and 90 nm, optionally 90 nm.
In an embodiment, the block copolymer pattern comprises a first layer and second layer, each layer comprising nanostructures. In another embodiment, the block copolymer pattern comprises, in addition to a first and a second layer, a third layer, each layer comprising nanostructures. In a further embodiment, the block copolymer pattern is used as a template to form a metallic nanostructure array.
In an embodiment, phase-segregated arrangement of the block copolymer resulting in at least a first and second layer, results in a three-dimensional block copolymer pattern throughout the layers.
In an embodiment, the phase-segregated arrangement of the block copolymer pattern is performed by annealing the BCP-coated substrate. In an embodiment, the annealing process is accomplished by a heat treatment or by exposure to an appropriate solvent vapor, such as toluene, tetrahydrofuran or xylene, to swell the BCP film on the substrate, which helps form thermodynamically stable nanostructures and/or patterns. In an embodiment, the BCP-coated substrate is annealed using tetrahydrofuran vapor. After spin coating of the BCP onto the substrate, the BCP phase-segregates into an arrangement of nano-dots (although highly disordered), which is a thermodynamically unstable arrangement relative to other more stable nanostructures or patterns such as nanolines or nanocylinders. In one embodiment, the degree of swelling of the BCP on the substrate is directly related to the amount of solvent that has been absorbed, or penetrated, into the film. Accordingly, as the solvent concentration of the film increases during solvent-assisted annealing, so does the mobility of the BCP, allowing the BCP to self-assemble into a more thermodynamically favored configuration. As the solvent concentration increases, the BCP chains have greater mobility and form more stable nanostructures, such as nanocylinders or nanolines parallel to the substrate surface. When the amount of solvent is less, the BCP has less mobility, and therefore rearranges locally to form higher-ordered nano-dot patterns than the as-deposited patterns. It will be understood that different polymers will possess different thermodynamic equilibria with respect to the nanostructures that the polymer forms upon annealing, and will form whatever is their energetically-favoured arrangement. The thermodynamically-favored arrangement may be predicted with the aid of a phase diagram, which takes into account factors such as the block lengths, solvent, polymer concentration, and temperature.
In another embodiment, after the solvent-assisted annealing, the film is then treated to remove and/or dry the solvent from the BCP film. In one embodiment, this relaxation rate (relaxed from the swelling) is performed at different rates depending upon how quickly the solvent is removed (dried or evaporated) from the BCP film.
In an embodiment of the disclosure, the block copolymer is a diblock copolymer. In a further embodiment, the diblock copolymer comprises functional groups that bind to the metal salt. It will be understood by those skilled in the art that functional groups comprise any moiety within the nanostructures that is able to bind to a metal ion. For example, the functional group comprises a pyridyl moiety which is able to bind metal ions. In another embodiment, the functional group is any functional group comprising at least one heteroatom, such as N, P and/or O that binds to the metal.
In another embodiment, one block of the diblock copolymer comprises polymethylmethacrylate or polydimethylsiloxane. In another embodiment, one block of the diblock copolymer comprises polymethylmethacrylate.
In another embodiment of the disclosure, the block copolymer comprises polystyrene-block-polyvinylpyridine (PS-b-PVP), polystyrene-block-polyethyleneoxide (PS-b-PEO), polyethyleneoxide-block-polyisoprene (PEO-b-PI), polyethyleneoxide-block-polybutadiene (PEO-b-PBD), polyethyleneoxide-block-polymethylmethacrylate (PEO-b-PMMA), polystyrene-block-polymethylmethacrylate (PS-b-PMMA), polystyrene-block-polydimethylsiloxane (PS-b-PDMS), polyethyleneoxide-block-polyvinylpyridine (PEO-b-PVP), polystyrene-block-polymethylmethacrylate (PS-b-PMMA), polyvinylpyridine-block-polymethylmethacrylate (PVP-b-PMMA), polyethyleneoxide-block-polyethylethylene (PEO-b-PEE), polystyrene-block-polybutadiene (PS-b-PBD), styrene-isoprene-styrene (SIS), or polybutadiene-block-polyvinylpyridine (PBD-b-PVP). In another embodiment, the block copolymer comprises polystyrene-block-poly-2-vinyl-pyridine (PS-b-P2VP), polystyrene-block-poly-4-vinyl-pyridine (PS-b-P4VP), polystyrene-block-polymethylmethacrylate (PS-b-PMMA) or polystyrene-block-polydimethylsiloxane (PS-PDMS). In another embodiment, the disclosure also comprises block copolymer films including diblock, triblock and multiblock copolymers or blends of several block copolymers.
In another embodiment of the disclosure, the diblock copolymer is a polymer of the formula (I):
A-B (I)
wherein A is a repeating polymeric monomer unit of the formula (II)
wherein each R is independently or simultaneously selected from H, halo, (C1-C6)-alkyl, —O—(C1-C6)-alkyl or fluoro-substituted-(C1-C6)-alkyl,
n is 1, 2, 3, 4 or 5; and
B is a repeating polymeric monomer unit of the formula (III)
wherein each R′ is independently or simultaneously selected from H, halo, (C1-C6)-alkyl, —O—(C1-C6)-alkyl or fluoro-substituted-(C1-C6)-alkyl, and
m is 1, 2, 3 or 4.
In another embodiment, A is
In a further embodiment, B is
wherein each R′ is independently or simultaneously selected from H, halo, (C1-C6)-alkyl, —O—(C1-C6)-alkyl or fluoro-substituted-(C1-C6)-alkyl, and m is 1, 2, 3 or 4. In another embodiment, B is
In another embodiment of the disclosure, the substrate comprises silicon, GaAs, Ge, another semiconductor, a metal, indium tin oxide, or a plastic. In an embodiment, the substrate is any surface which is flat or level and unreactive towards the block copolymer.
In another embodiment, there is also included a use of the block copolymer pattern to form a metallic nanostructure array wherein the use comprises:
(i)
(a) contacting the block copolymer-coated substrate with a metal salt comprising metal ions under conditions for the metal ions to bind to the block copolymer domains; and
(b) subsequently treating the substrate obtained in (a) to reduce the metal ions to metal and to remove the block copolymer from the substrate to form a metallic nanostructure array corresponding to the block copolymer pattern; or
(ii)
In a further embodiment of the disclosure, the block copolymer-coated substrate is contacted with a first metal salt and subsequently contacted with a second metal salt. It will be understood by those skilled in the art that, in an embodiment, when more than one metal salt is used, functional groups near the polymer surface are more likely to be loaded with metals from the first metal salt, while functional groups near the substrate are more likely to be saturated with metals from the second metal salt. Accordingly, in such an embodiment, for example, when a block copolymer forms layers of hexagonal nanodots, a hexagonal lattice of metal nanoparticles is produced wherein the composition of the individual nanoparticles alternates across the substrate. In another embodiment, the block copolymer-coated substrate is contacted with a first metal salt and subsequently contacted with a second metal salt, a third metal salt and, optionally, a fourth metal salt.
In another embodiment, the metal salt is CoCl2, ZnCl2, Na2PtCl4, Na2PdCl4 RhCl3, AgNO3 or HAuCl4. In a further embodiment, the metal ion is Co2+, Zn2+, Rh3+, Ag+, PtCl42−, PdCl42− or AuCl4−. It will be understood by those skilled in the art, that in an embodiment, the metal ions of the metal salt bind to the functional groups within the block copolymer nanostructures, and accordingly, form metal-loaded nanostructures. Accordingly, after removal of the block copolymer from the substrate, a metallic nanostructure array remains on the substrate.
In another embodiment, the substrate is treated with plasma, such as oxygen plasma, to remove the block copolymer from the substrate. In an embodiment, the metal ions are reduced during the plasma process to form the metallic nanostructure array.
In another embodiment, galvanic displacement is used to form the metallic nanostructure array. In an embodiment, galvanic displacement comprises an electrochemical reaction in which a sufficiently oxidizing metal ion is spontaneously reduced at a semiconductor interface (see Chem. Mater. 2007, 19, 5090-5101, herein incorporated by reference). Metal salts are localized near functional groups, such as the pyridyl groups on polyvinylpyridine (PVP), and directly interact with the semiconductor substrate at locations of high PVP concentration. In an embodiment, the metal is Ag, Cu, Au, Pt or Pd. It will be understood by a person skilled in the art that when galvanic displacement is used with metals, such as gold or silver, the reaction directly produces metal nanostructures, rather than first having to complex a metal salt to the block copolymer (such as polyvinylpyridine) and then reducing to the metal during plasma processing. In another embodiment, hydrofluoric acid is used in the galvanic displacement reaction to assist the displacement process. After galvanic displacement, soaking the substrate in an organic solvent (like toluene or THF) removes the polymer from the substrate. In a further embodiment, the block copolymer layer in direct contact with the substrate (or any other layers beneath the layer exposed to the environment) is reduced to form metallic nanostructure arrays using galvanic displacement.
The present disclosure is also directed to a substrate comprising a metallic nanostructure array produced in accordance with the method of the present disclosure.
In another embodiment, the substrate comprising a metallic nanostructure array produced in accordance with the present disclosure is used as a nano-battery. For example, a battery comprises two different metals (with different work functions) immersed in an electrolyte solution. For a nanostructured battery, when contacting the two different metals with an electrolyte, a voltage will be generated between the metals. In another embodiment, the substrate comprising a metallic nanostructure array produced in accordance with the present disclosure is used as a solar cell.
The following non-limiting examples are illustrative of the present disclosure:
Si(100) wafers were purchased from Addison Engineering. Asymmetric diblock copolymers of PS-b-P2VP were purchased from Polymer Source Inc., and Na2PtCl4 was obtained from Strem Chemicals. Toluene and THF were HPLC grade, purchased from Sigma-Aldrich. Hydrogen peroxide (Fisher, 30%), ammonium hydroxide (J. T. Bakers, 30%), and hydrochloric acid (J. T. Bakers, 36.5%) were used as received. High purity Millipore water (18 MΩ·cm, Barnstead Nanopure water) was used throughout the experiment, and plasma treatments were performed in a PlasmaLab μEtch reactive ion etch system.
A silicon wafer (<100>, n-type, B-doped, ρ=0.01-0.02 Ωcm) was diced into ˜1 cm2 pieces and degreased in a methanol ultrasonic bath for 15 min followed by drying in a nitrogen stream. The substrates were then cleaned via a standard RCA clean: the diced wafers were first immersed in a hot solution of H2O:NH4OH:H2O2 (5:1:1) for 15 min and then rinsed with excess Millipore water. They were then immersed in a hot H2O:HCl:H2O2 (6:1:1) solution for 15 min and re-rinsed with excess Millipore water. Following this cleaning procedure, the wafers were visibly hydrophilic. Water on the surface was immediately removed with a stream of nitrogen before polymer spin-coating.
The block copolymer polystyrene (PS-125k)-b-poly-2-vinylpyridine (P2VP-58.5 k) was dissolved in toluene at 70° C. to make 1 wt %-2 wt % solutions and allowed to cool to room temperature. A volume of 10 μL of the polymer solution was then dropped onto the cleaned Si substrate and spin coated at 4000 rpm. The as-spun thin films were then annealed for 24 hours by placing them in an enclosed chamber at room temperature in the presence of tetrahydrofuran (THF). The films were then removed from the chamber and allowed to dry under ambient conditions, forming a block copolymer pattern.
The wafer containing the block copolymer pattern was then immersed in 10 mM Na2PtCl4/0.9% HCl (aq) solution for 12 h. After metal deposition, the sample was thoroughly rinsed with water and dried under a nitrogen stream. Oxygen plasma in a Microetch reactor was employed to remove the polymer and reduce the metal ions (conditions: 50 mtorr, 50 sccm O2, RF power 30 W, and time 30 s).
In an embodiment, the anneal cycle of the thin films in an enclosed chamber with THF helps with the formation of an organized hexagonal block copolymer pattern. The pattern is shown in
A silicon wafer (<100>, n-type, B-doped, 1-10 ohmcm) was diced into ˜1 cm2 pieces and degreased in a methanol ultrasonic bath for 15 min followed by drying in a nitrogen stream. The substrates were then cleaned via a standard RCA clean: the diced wafers were first immersed in a 80° C. solution of H2O:NH4OH:H2O2 (5:1:1) for 15 min and then rinsed with excess Millipore water. They were then immersed in a hot H2O:HCl:H2O2 (6:1:1) solution for 15 min and re-rinsed with excess Millipore water. Following this cleaning procedure, the wafers were visibly hydrophilic; water on the surface was immediately removed with a stream of nitrogen before polymer spin-coating.
The block copolymer PS(125k)-b-P2VP(58.5 k) was dissolved in toluene at 70° C. to make 1 wt %-2 wt % solutions and allowed to cool to room temperature. A volume of 10 μL of the polymer solution was then dropped onto the cleaned Si substrate and spin-coated at 4000 rpm for 40s. The as-spun thin films were then annealed for 72 hours by placing them in an enclosed chamber at room temperature in the presence of tetrahydrofuran (THF). In an embodiment, this anneal cycle helps with the formation of an organized block copolymer pattern of parallel cylinders. The films were then removed from the chamber and allowed to dry under ambient conditions.
The polymer-coated wafer was then immersed in 10 mM Na2PtCl4/0.9% HCl (aq) solution for 3 h to metal-load the P2VP portion of the block copolymer with platinum ions. After metal deposition, the sample was thoroughly rinsed with water and dried under a nitrogen stream.
Oxygen plasma in a Microetch reactor was employed to remove the polymer and reduce the metal ions (conditions: 50 mtorr, 50 sccm O2, RF power 30 W, and time 35 s) followed by an argon plasma (conditions: 100 mTorr, 50 sccm Ar, RF power 50 W, and time 5 s).
In an embodiment, the anneal cycle of the thin films in an enclosed chamber with THF for 72 hours helps with the formation of an organized pattern of parallel nanolines. The pattern is shown in
A silicon wafer (<100>, n-type, B-doped, 1-10 Ωcm) was diced into ˜1 cm2 pieces and degreased in a methanol ultrasonic bath for 15 min followed by drying in a nitrogen stream. The substrates were then cleaned via a standard RCA clean: the diced wafers were first immersed in a 80° C. solution of H2O:NH4OH:H2O2 (5:1:1) for 15 min and then rinsed with excess Millipore water. They were then immersed in a hot H2O:HCl:H2O2 (6:1:1) solution for 15 min and re-rinsed with excess Millipore water. Following this cleaning procedure, the wafers were visibly hydrophilic; water on the surface was immediately removed with a stream of nitrogen before polymer spin-coating.
The block copolymer PS(125k)-b-P2VP(58.5 k) was dissolved in toluene at 70° C. to make 1 wt %-2 wt % solutions and allowed to cool to room temperature. A volume of 10 μL of the polymer solution was then dropped onto the cleaned Si substrate and spin coated at 4000 rpm for 40s. The as-spun thin films were then annealed for 72 hours by placing them in an enclosed chamber at room temperature in the presence of tetrahydrofuran (THF). In an embodiment, this anneal cycle helps with the formation of an organized block copolymer pattern of parallel nanolines. The films were then removed from the chamber and allowed to dry under ambient conditions.
The polymer-coated wafer was then immersed in 10 mM Na2PdCl4/0.9% HCl (aq) solution for 12 h to metal-load the P2VP portion of the block copolymer with palladium ions. After metal deposition, the sample was thoroughly rinsed with water and dried under a nitrogen stream.
Oxygen plasma in a Microetch reactor was employed to remove the polymer and reduce the metal ions (conditions: 50 mtorr, 50 sccm O2, RF power 30 W, and time 45 s.) followed by an argon plasma (conditions: 100 mTorr, 50 sccm Ar, RF power 50 W, and time 5 s).
A silicon wafer (<100>, n-type, B-doped, 1-10 Ωcm) was diced into ˜1 cm2 pieces and degreased in a methanol ultrasonic bath for 15 min followed by drying in a nitrogen stream. The substrates were then cleaned via a standard RCA clean: the diced wafers were first immersed in a 80° C. solution of H2O:NH4OH:H2O2 (5:1:1) for 15 min and then rinsed with excess Millipore water. They were then immersed in a hot H2O:HCl:H2O2 (6:1:1) solution for 15 min and re-rinsed with excess Millipore water. Following this cleaning procedure, the wafers were visibly hydrophilic; water on the surface was immediately removed with a stream of nitrogen before polymer spin-coating.
The block copolymer PS(125k)-b-P2VP(58.5 k) was dissolved in toluene at 70° C. to make 1 wt %-2 wt % solutions and allowed to cool to room temperature. A volume of 10 μL of the polymer solution was then dropped onto the cleaned Si substrate and spin-coated at 4000 rpm for 40s). The as-spun thin films were then annealed for 72 hours by placing them in an enclosed chamber at room temperature in the presence of tetrahydrofuran (THF). In an embodiment, this anneal cycle helps with the formation of an organized block copolymer pattern of parallel nanolines. The films were then removed from the chamber and allowed to dry under ambient conditions.
The polymer coated wafer was then immersed in 0.1 mM AgNO3/0.9% HF (aq) solution for 10 min to metal-load the P2VP portion of the block copolymer with silver ions. After metal deposition, the sample was thoroughly rinsed with water and dried under a nitrogen stream.
Oxygen plasma in a Microetch reactor was employed to remove the polymer and reduce the metal ions (conditions: 50 mtorr, 50 sccm O2, RF power 30 W, and time 60 s) followed by an argon plasma (conditions: 100 mTorr, 50 sccm Ar, RF power 50 W, and time 5 s).
A silicon wafer (<100>, n-type, B-doped, 1-10 Ωcm) was diced into ˜1 cm2 pieces and degreased in a methanol ultrasonic bath for 15 min followed by drying in a nitrogen stream. The substrates were then cleaned via a standard RCA clean: the diced wafers were first immersed in a 80° C. solution of H2O:HCl:H2O2 (5:1:1) for 15 min and then rinsed with excess Millipore water. They were then immersed in a hot H2O:HCl:H2O2 (6:1:1) solution for 15 min and re-rinsed with excess Millipore water. Following this cleaning procedure, the wafers were visibly hydrophilic; water on the surface was immediately removed with a stream of nitrogen before polymer spin-coating.
The block copolymer PS(125k)-b-P2VP(58.5 k) was dissolved in toluene at 70° C. to make 1 wt %-2 wt % solutions and allowed to cool to room temperature. A volume of 10 μL of the polymer solution was then dropped onto the cleaned Si substrate and spin-coated at 4000 rpm for 40s). The as-spun thin films were then annealed for 72 hours by placing them in an enclosed chamber at room temperature in the presence of tetrahydrofuran (THF). In an embodiment, this anneal cycle helps with the formation of an organized block copolymer pattern of parallel nanolines. The films were then removed from the chamber and allowed to dry under ambient conditions.
The polymer-coated wafer was then immersed in 10 mM CuCl2/0.9% HF (aq) solution for 10 min to metal-load the P2VP portion of the block copolymer with copper ions. After metal deposition, the sample was thoroughly rinsed with water and dried under a nitrogen stream.
Oxygen plasma in a Microetch reactor was employed to remove the polymer and reduce the metal ions (conditions: 50 mtorr, 50 sccm O2, RF power 30 W, and time 60 s) followed by an argon plasma (conditions: 100 mTorr, 50 sccm Ar, RF power 50 W, and time 5 s).
A silicon wafer (<100>, n-type, phosphorous-doped, 5-10 Ωcm resistivity, ˜500 μm thick) was diced into ˜100 mm2 pieces and degreased in a methanol ultrasonic bath for 15 min followed by drying in a nitrogen stream. The substrates were then cleaned via a standard RCA clean: the diced wafers were first immersed in a 80° C. solution of H2O:HCl:H2O2 (5:1:1) for 15 min and then rinsed with excess Millipore water. They were then immersed in a 80° C. solution of H2O:HCl:H2O2 (6:1:1) solution for 15 min and re-rinsed with excess Millipore water. Following this cleaning procedure, the wafers were visibly hydrophilic; water on the surface was immediately removed with a stream of nitrogen before polymer spin coating.
The block copolymer PS(50k)-b-P2VP(16.5 k) was dissolved in toluene at 70° C. to make a 1 wt % solution and allowed to cool to room temperature. A volume of 10 μL of the polymer solution was then dropped onto the cleaned Si substrate and spin-coated at 2000 rpm for 40 s, giving a film thickness of 43 nm. The as-spun thin films were then annealed for between 20 to 40 minutes by placing them in an enclosed chamber at room temperature in the presence of 1 mL of liquid tetrahydrofuran (THF) in a trench next to the substrate. The progress of the annealing of the block copolymer was followed using in situ ellipsometry. The chamber was then opened in a controlled fashion to reduce the vapor pressure inside the chamber in a controlled fashion. Opening the chamber in a controlled fashion results in the film relaxing and returning to its original thickness. After the sample had returned to its original thickness, the sample was removed from the chamber.
The polymer-coated wafer was then immersed in 10 mM PtCl2/0.9% HCl (aq) solution for 3 hours to metal-load the P2VP portion of the block copolymer with platinum ions. After metal deposition, the sample was thoroughly rinsed with water and dried under a nitrogen stream.
Oxygen plasma in a Microetch reactor was employed to remove the polymer and reduce the metal ions (conditions: 50 mtorr, 50 sccm O2, RF power 30 W, and time 25 s). Scanning electron micrographs of the metal nanostructure patterns are shown in
The degree of swelling (DoS) of the block copolymer pattern as measured by in situ ellipsometry tracks the status as the block copolymer anneals. The degree of swelling is the ratio of the thickness of the swelled polymer film vs. that of the unswelled polymer film. DoS values less than about 1.7 (as measured by in situ ellipsometry) lead to block copolymer features which are dots, rather than lines (or cylinders). Without being bound by theory, it is thought that certain block copolymers which are annealed with a degree of swelling of less than about 1.7 have insufficient mobility to allow for the reorganization into cylinders (when annealed using a solvent, such as THF) (as seen in
Silicon wafers (<100>, n-type, phosphorous-doped, 5-10 Ωcm resistivity, ˜500 μm thick) were diced into ˜100 mm2 pieces and degreased in a methanol ultrasonic bath for 15 min followed by drying in a nitrogen stream. The substrates were then cleaned via a standard RCA clean: the diced wafers were first immersed in a 80° C. solution of H2O:HCl:H2O2 (5:1:1) for 15 min and then rinsed with excess Millipore water. They were then immersed in a 80° C. solution of H2O:HCl:H2O2 (6:1:1) solution for 15 min and re-rinsed with excess Millipore water. Following this cleaning procedure, the wafers were visibly hydrophilic; water on the surface was immediately removed with a stream of nitrogen before polymer spin-coating.
The block copolymer PS(50k)-b-P2VP(16.5 k) was dissolved in toluene at 70° C. to make a 1 wt % solution and allowed to cool to room temperature. A volume of 10 μL of the polymer solution was then dropped onto the cleaned Si substrate and spin coated at 2000 rpm for 40 s, giving a film thickness of 43 nm. The as-spun thin films were then annealed for 6 or 35 minutes by placing them in an enclosed chamber at room temperature in the presence of 1 mL or 2 mL of liquid tetrahydrofuran (THF). The THF was placed in different trenches next to the substrate depending on the rate of swelling desired. A larger exposed surface area of THF will cause the swelling rate to increase, thus shortening the time required to achieve a given degree of swelling. For a short, 6-minute anneal, 1 mL of THF was placed into a trench so that it had an exposed surface area of ˜150 mm2. For a longer anneal (35 min), 2 mL of THF was placed into a trench so that it had an exposed surface area of ˜1500 mm2. The progress of the annealing of the block copolymer was followed using in situ ellipsometry. Scanning electron micrographs are shown in
The polymer-coated wafer was then immersed in 10 mM PtCl2/0.9% HCl (aq) solution for 3 hours to metal-load the P2VP portion of the block copolymer with platinum ions. After metal deposition, the sample was thoroughly rinsed with water and dried under a nitrogen stream.
Oxygen plasma in a Microetch reactor was employed to remove the polymer and reduce the metal ions (conditions: 50 mtorr, 50 sccm O2, RF power 30 W, and time 25 s).
As shown in
A silicon wafer (<100>, n-type, phosphorous-doped, 5-10 Ωcm resistivity, ˜500 μm thick) was diced into ˜100 mm2 pieces and degreased in a methanol ultrasonic bath for 15 min followed by drying in a nitrogen stream. The substrates were then cleaned via a standard RCA clean: the diced wafers were first immersed in a 80° C. solution of H2O:HCl:H2O2 (5:1:1) for 15 min and then rinsed with excess Millipore water. They were then immersed in a 80° C. solution of H2O:HCl:H2O2 (6:1:1) solution for 15 min and re-rinsed with excess Millipore water. Following this cleaning procedure, the wafers were visibly hydrophilic; water on the surface was immediately removed with a stream of nitrogen before polymer spin-coating.
The block copolymer PS(50k)-b-P2VP(16.5 k) was dissolved in toluene at 70° C. to make a 1.8 wt % solution and allowed to cool to room temperature. A volume of 10 μL of the polymer solution was then dropped onto the cleaned Si substrate and spin-coated at 4000 rpm for 40 s, giving a film thickness of 55 nm. The as-spun thin films were then annealed for 40 minutes by placing them in an enclosed chamber at room temperature in the presence of 1 mL of liquid tetrahydrofuran (THF) (exposed surface area of ˜150 mm2). The progress of the annealing of the block copolymer was followed using in situ ellipsometry. Scanning electron micrographs are shown in
For a fast relaxation rate, the chamber was opened, and air was immediately blown on the sample to induce rapid drying of the substrate. For normal relaxation, the chamber was opened to a certain position to allow for a moderate relaxation (the same position as used in Examples 6, 7 and 9). For the slow relaxation, the chamber was opened just a crack so that the relaxation would occur very slowly.
The polymer-coated wafer was then immersed in 10 mM PtCl2/0.9% HCl (aq) solution for 3 hours to metal-load the P2VP portion of the block copolymer with platinum ions. After metal deposition, the sample was thoroughly rinsed with water and dried under a nitrogen stream.
Oxygen plasma in a Microetch reactor was employed to remove the polymer and reduce the metal ions (conditions: 50 mtorr, 50 sccm O2, RF power 30 W, and time 25 s).
As shown in
A silicon wafer (<100>, n-type, phosphorous-doped, 5-10 Ωcm resistivity, ˜500 μm thick) was diced into ˜100 mm2 pieces and degreased in a methanol ultrasonic bath for 15 min followed by drying in a nitrogen stream. The substrates were then cleaned via a standard RCA clean: the diced wafers were first immersed in a 80° C. solution of H2O:HCl:H2O2 (5:1:1) for 15 min and then rinsed with excess Millipore water. They were then immersed in a 80° C. solution of H2O:HCl:H2O2 (6:1:1) solution for 15 min and re-rinsed with excess Millipore water. Following this cleaning procedure, the wafers were visibly hydrophilic; water on the surface was immediately removed with a stream of nitrogen before polymer spin-coating.
The block copolymer PS(50k)-b-P2VP(16.5 k) was dissolved in toluene at 70° C. to make 0.5 wt % to 1.8 wt % solutions and allowed to cool to room temperature. A volume of 10 μL of the polymer solution was then dropped onto the cleaned Si substrate and spin-coated at between 1000 rpm to 6000 rpm for 40 s, giving film thicknesses of 30 to 50 nm. The as-spun thin films were then annealed for 40 minutes by placing them in an enclosed chamber at room temperature in the presence of 1 mL of liquid tetrahydrofuran (THF) (−150 mm2 exposed surface area). The progress of the annealing of the block copolymer was followed using in situ ellipsometry. Samples were then relaxed in a controlled fashion, metallized, and also subjected to a plasma treatment (same conditions as in Example 6).
This example, as shown in
During swelling of the block copolymer exposed to THF vapor, terraces first appear and continue growing until they fill the entire substrate, at which point a double layer is formed over the entire substrate. As the film further swells, a new set of terraces corresponding to the formation of a third layer, grow and coalesce as well. The first terraces (corresponding to the second layer) appear at around 60 nm, and a full double layer is around 90 nm, at which point a second set of terraces (corresponding to a third layer) appear.
Examples 6-8 demonstrated how different annealing conditions affect the types of structures that are formed by the BCP. Example 9 shows that, as the film thickness increases, these structures must stack on top of each other (forming terraces and eventually whole layers). When two layers are formed, then metallizing both layers effectively doubles the (areal) density of metal features on the substrate.
This application claims the benefit of priority to corresponding U.S. Provisional Patent Application No. 61/301,914 filed Feb. 5, 2010, which is incorporated herein in its entirety.
| Number | Date | Country | |
|---|---|---|---|
| 61301914 | Feb 2010 | US |
