The invention relates to a method for forming an electrical interconnection in an organic photovoltaic device and an organic photovoltaic device.
Organic photovoltaics (OPV) offer a big promise for the efficient and large scale conversion of light into electricity. The production of organic photovoltaic devices is less material demanding than the production of inorganic crystalline photovoltaic devices. The production also consumes considerably less energy than the production of any other inorganic photovoltaic device.
Efficiency of organic photovoltaic devices has been improving steadily. In 2008 a certified power conversion efficiency value of 5% was reached, and in 2010 the psychological barrier of 8% was broken, aligning the efficiency of the organic photovoltaic devices to typical values of amorphous Si devices.
OPV devices comprise at least one solar cell, or an arrangement of solar cells. Organic solar cells have the most different layer stack architectures. Typically they comprise at least one organic photovoltaic layer between two electrodes. That organic layer can be a blend of a donor and an acceptor such as P3HT (poly3-hexyl-tiophene) and PCBM (phenyl C61 Butyric Acid Methyl Ester). Such simple device structures only achieve reasonably efficiencies if interfacial injection layers are used to facilitate charge carrier injection/extraction (Liao et al., Appl. Phys. Lett., 2008. 92: p. 173303). Other organic solar cells have multi-layer structures, sometimes even hybrid polymer and small molecule structures. Also tandem or multi-unit stacks are known (U.S. Pat. No. 7,675,057, or Ameri, et al., Energy & Env. Science, 2009. 2: p. 347). Multi-layer devices can be easier optimized since different layers can comprise different materials which are suitable for different functions. Typical functional layers are transport layers, optically active layers, injection layers, etc.
Optically active materials are materials with a high absorption coefficient, for at least a certain wavelength range of the solar spectra, which materials convert absorbed photons into excitons which excitons in turn contribute to the photocurrent. The optically active materials are typically used in a donor-acceptor heterojunction, where at least one of the donor or acceptor is the light absorbing material. The interface of the donor-acceptor heterojunction is responsible for separating the generated excitons into charge carriers. The heterojunction can be a bulk-heterojunction (a blend), or a flat (also called planar) heterojunction, additional layers can also be provided (Hong et al, J. Appl. Phys., 2009. 106: p. 064511).
The loss by recombination must be minimized for high efficiency OPV devices. Therefore, the materials in the heterojunction must have high charge carrier mobilities and high exciton diffusion lengths. The excitons have to be separated at the heterointerface and the charge carriers have to leave the optically active region before any recombination takes place. Currently, fullerenes (C60, C70, PCBM, and so on) are the preferred choice as acceptor in OPV devices.
Transport materials for transport layers for opto-electronic devices are required to be transparent, at least in the wavelengths wherein the device is active, and have good semiconducting properties. These semiconducting properties are intrinsic, such as energy levels or mobility, or extrinsic such as charge carrier density. The charge carrier density can also be influenced, for instance, by doping the material with an electrical dopant.
Although the current efficiency record for an organic solar cell is about 8%, this value is still much lower than the theoretical Shockley-Queisser limit applied to multiple tandem solar cells of 86%. For further increasing the efficiency, all loss mechanism has to be taken into account, such as optical optimizations, optimization of excitonic transport and separation, electrical optimizations, etc. Still, when transferring a single solar cell into larger arrangements (called herein as OPV device), other losses occur due to increased series resistance. The series resistance is mainly due to the thin film electrodes used in a organic solar cell, very often due to the resistance of the transparent electrode, since the non-transparent one can be made thicker and hence more conductive. Organic solar cells with higher efficiency have lower currents and higher voltages, to reduce the effect of the series resistance. Such higher voltages are obtained by using multiple tandem solar cells as explained in U.S. Pat. No. 7,675,057.
To realize a large area OPV device, usually individual solar cells are connected in series. The series connection has a drawback: the area, of the surface which is exposed to light, is reduced. That area is necessary to provide the interconnection between top and bottom electrodes from adjacent devices. Such interconnections require several patterning steps.
The known patterning processes are complex and time demanding. Typically, shadow masks are used to define the evaporation pattern of the several layers. The alignment accuracy of the shadow mask defines the useful and clearly visible gap, between the organic solar cells. Alternatively, if no fine masking is available, the gap between the organic solar cells will be very large (in the range of 1 mm and above).
The invention solves the problem of the prior art, providing an OPV device with series connected solar cells, having a reduced gap necessary for the connections. The invention also provides a method for producing such an OPV device, which method doe not required the use of shadow masks for creating the series interconnection.
The invention provides a method for forming an electrical interconnection in an organic photovoltaic device, the method comprising steps of:
The step of providing the interconnection is performed preferably by laser and after the steps of providing a second conductive layer.
In a preferred embodiment, step of providing the interconnection comprises providing several aligned interconnections. The aligned interconnections are electrical interconnections made consecutively in a line which can be a straight line or a curve, the interconnections can be merged or spaced apart from each other. The aligned interconnections can consist of several spot sized interconnections aligned in a straight or curved line.
Optionally the aligned interconnections are more than one line in parallel such as double or triple aligned interconnections.
In an advanced mode of the invention, the interconnecting step is preceded by the step of encapsulating the organic photovoltaic device. The laser light may be irradiated through the substrate or through the encapsulation, however it is preferred that the laser which does the electrical interconnection is irradiated through the encapsulation. In some cases, UV filters, or other layers (films) are fabricate over the encapsulation. It is preferably that the deposition of these layers is made after the electrical interconnection. The encapsulation may be a glass cover or thin film encapsulation. It is necessary that the encapsulation does not absorb the laser light (Absorbance<2%). A highly transparent encapsulation, with a transmittance>95% to the wavelength of laser being used is preferred. The electrical interconnection is made by a laser process, in which step vacuum or inert atmosphere are not required.
At least one of the organic photovoltaic layer or the second conductive layer, and preferably both layers, are formed on the substrate by a maskless deposition process comprising a step of maskless depositing materials in at least an active area.
In a preferred embodiment, for a method of producing an OPV device comprising a plurality of organic solar cells, the method includes providing a substrate, and providing a first conductive layer over the substrate. The first conductive layer is patterned by any known method. Preferentially the step of providing a first conductive layer includes:
In the patterning the first conductive layer step, parts of the first conductive layer are removed, forming at least two electrically isolated areas spaced by narrow gaps, a first and a second section. This step is preferentially performed with laser ablation to ensure that the gaps are very narrow.
Known lasers can be used for the sectioning step, which is applied on the first or the second conductive layer (or on both). For instance, a table top lasers from ACI Laser-components.
Preferentially, the step of patterning the first conductive layer by laser is performed before the step of providing an organic photovoltaic layer. This can easily be done since this step could be performed outside of the process equipment for the remaining layer (specially the photovoltaic layers) and careful cleaning of the patterned first conductive layer is still provided to remove remaining particles from the laser ablation step.
In an advanced mode of the invention, in the method for forming an electrical interconnection in an organic photovoltaic device, the step of providing an interconnection, includes the steps of:
Forming the interconnection with laser requires that the laser does not ablate the layers; therefore it is preferably that the laser power is lower than the power used for ablation. It is further preferably that the power of the laser is between 200 mW to 15 W, more preferably between 200 mW to 5 W, for an infrared laser with a wavelength between 800 to 10 μm; for laser with shorter wavelengths in the range of 300 to 800 nm, it is preferred that the power is between 200 mW and 3 W, more preferably from 200 mW to 1 W, even more preferably from 200 to 500 mW.
The laser emission can be between 300 and 550 nm, especially in the range between 300 and 450 nm; in these ranges, the absorption of the metal layer is stronger, and it is easier to promote a heating. Any laser can be used, such as tripled or quadrupled Nd lasers, excimer lasers, or semiconducting lasers. Non limiting examples of such short wavelength lasers are InGaN blue-violet laser, tripled Nd:YAG, XeF excimer layer.
The laser used for the electrical interconnection can also have a wavelength from 500 to 1500 μm. Exemplary lasers are Nd lasers operating in their main wavelength which is typically in the range of 1020-1050 nm, however other modes as well as the double frequency can be used. Examples of such lasers are Nd:YAG at 1064 nm or 532 nm; Nd:YVO4 at 914, 1064 or 1342 nm; Nd:YLF at 1047 or 1053 nm.
Other wavelengths and power values can also be used, a calibration step can be necessary to find the optimum configuration of the laser.
Gas and excimer lasers can also be used, as well as semiconductor or fiber lasers. The laser can also match the absorption of transparent oxide layer (if such is used as first or second conductive layer); it can also match an absorption wavelength of the organic semiconductive layer. Preferentially, pulsed lasers are used which make it easier to control the laser power per shot, which shot is forming the electrical interconnection.
For a diode-pumped Nd:YAG (1064 nm), ns Q-switched laser, good results were obtained using pulses with an energy higher or equal to 10 μJ. About 1000 shots at 10 μJ do deliver a good contact.
With a ps diode-pumped Nd:YAG (1064 nm), Q-switched laser by Pockets cell, best results were obtained at power above 300 mW. Tested repetition rates were between 10 kHz and 640 kHz.
In an advanced alternative mode of the invention, in the method for forming an electrical interconnection in an organic photovoltaic device, the step of providing an interconnection, includes the steps of:
Preferentially, the step of providing the electrical interconnection is made after the step of providing the encapsulation, or at least part of the encapsulation.
The invention also foresees an OPV device made by the method as described above, the device comprising a substrate, a first conductive layer, a second conductive layer, a first string, the first string comprising in-series connected organic solar cells over the substrate (see for example
The electrical interconnection is formed by a laser process, namely the irradiation of light into a connection area in which the interconnection is to be formed. The material modification generated by the laser process laser may be, for example, a molten material, a re-solidified material, or other. The interconnection can be recognized by its typical shape formed by the high energy density of the laser. Preferentially, the interconnection is a punctual connection (dot like). In a large area device, the interconnections need to provided enough conductivity to transport larger current densities, therefore, the interconnections are a plurality, preferentially a plurality of dots, which dots may be spaced apart from each other or merged to each other. Optionally, the device comprises multiple strings. A calibration step can be introduced to calibrate the laser parameters before performing the interconnection step.
In one embodiment of the invention, the OPV device comprising a string, further comprises electrical terminals at the string's ends.
In another embodiment of the invention, the OPV device comprising a string, further comprises a second string, which first string and second string are connected in parallel by electrical connecting their positive terminals to a common terminal, and electrical connecting their negative terminals to another common terminal. This embodiment also foresees multiple strings connected in parallel, wherein each string is a string of organic solar cells connected in series.
Preferably the OPV device in all embodiments is a very large area device. The area of the device is preferentially larger than about 25 cm2, preferentially larger than about 100 cm2. Each individual device is preferentially larger than 1 cm2.
An advantage of the invention is the realization of large area OPV devices comprising arrays of solar cells connected together, with maximum area utilization.
Another advantage is the maskless production process, which enhances production efficiency, reducing maintenance, material consumption, calibration complexity, and considerably increasing the output-speed. The invention consequently also increases the production yield.
Further the production tool complexity is reduced; in the special case of production with VTE or organic vapor phase deposition, the deposition chamber is simplified and can be limited to the deposition of continuous layers. The present invention also does not require the use of moving shadow masks during deposition of the layers.
The invention is preferably used in web production methods, such as roll-to-roll processing.
An especial feature of the invention is the use of the OPV devices, produced with the inventive method, in glass for buildings, such applications are also known as building integrated photovoltaics. Especially in windows and glass façades, were semi-transparent OPV devices can be used; OPV devices with no (or almost no) visible patterns give the optical impression of a smooth optical coating.
In the following, the invention will be described in further detail, by the way of example, with reference to different embodiments. The figures show:
a a device without interconnection,
b the device of
c the device of
a-c demonstrates the production of an exemplary embodiments, and
The figures are only schematic representations, and are not in scale. Especially in
Still on the method of
More preferably, at least a first encapsulation, such as a passivation layer, or even the complete encapsulation, is provided before the step of creating the interconnection. This enables the interconnection to be made under relaxed conditions, for instance, in air. In air, it is easier to handle laser positioning and there is no generation of waste material outside the encapsulation.
The encapsulation can be, for example, a glass lid with an air-gap, laminated foil, edge glued foil, direct thin film encapsulation.
a shows a device comprising a first conductive layer 31 over a substrate 30, an organic photovoltaic layer 32, and a second conductive layer 33. The first conductive layer 31 comprises a first section 34 and a second section 35. After the step of patterning the second conductive layer into a first 36 and a second 37 sections, the device can be represented schematically by
The schematic of
Still on
The deposition tools 701 and 705 could be integral part of the same deposition tool. Also the cleaning step 704 can take place inside the tool, for instance also in low or high vacuum.
The cleaning means 704 can be, for example, plasma etching, mechanical, chemical or chemical-mechanical polishing, brushing or other equivalent means.
Following additional information on terms used is provided.
A substrate can be a rigid or flexible substrate; it can be preferentially a metal layer, a glass plate, a polymer foil, paper, or a web of one of these materials or their combinations.
A web substrate has the common technical meaning, examples of such substrates are such as a continuous sheet of paper, metal, or polymer.
Encapsulation, the encapsulation is a moisture and oxygen barrier layer, non-limiting examples are glass cover, metal cover, thin oxide or nitride films, thin film encapsulation with multilayer stack, laminated foils, edge glued foils, a combination of these, etc.
Organic photovoltaic (OPV) device is an electrical device capable of transforming light into electricity. An OPV device is comprised of at least one organic solar cell, preferably several organic solar cells. An individual organic solar cell, or simply an organic solar cell, is a single device (typically a diode) comprising two electrodes and an organic photovoltaic layer.
Section herein means to divide; to section a layer into a sections, means to pattern the layer in such a way that electrically disconnected sections (or areas) are formed.
Organic photovoltaic layer is an organic semiconductive layer used for a solar cell as known in the prior art, it comprises at least a donor-acceptor heterojunction, where at least one of the donor or acceptor materials is the light absorbing material. The organic photovoltaic layer can further comprise other layers with functions such as transport, injection, connecting units.
Interconnection or electrical interconnection are used as synonyms. The interconnection provided by a laser is an electrical connection between two electrical conductive layers made with laser through an organic photovoltaic layer. The interconnection is made after the deposition of the two electrical conductive layers and the organic photovoltaic layer, where the laser treatment promotes a local, low resistance, electrical contact between the two electrical conductive layers. Since a carbonization of the organic material is not expected, it is believed that the interconnection is a direct connection of both layers, created by locally disrupting the organic semiconductor layer. Interconnection in series or electrical interconnection in series is one kind of electrical interconnection.
Maskless (or essentially maskless): in this method the deposition area is defined by a shadow mask which defines only the limiting external borders of the layer, the shadow mask has an opening (a through-hole) which is defined by one close geometric shape, which can be convex or concave, preferentially convex, more preferentially a rectangular, closed conic section, or other closed curved shape. A non limiting example is a rectangular frame with one rectangular opening, the one rectangular opening defines the deposition area over the whole substrate, except for the borders, which need to be isolated, there is no further structure. In a continuous production process, such as a roll-to-roll process, the outer limitation of the layers can be defined by avoiding deposition at the lateral areas of the roll (or web), defining something like a margin.
The following example will be explained in conjunction with
The second conductive layer, a 100 nm thick Au:Ag (atomic ratio 1:1) layer, represented by the rectangle (65), was deposited on top of the organic photovoltaic layer. Only the upper half of the second conductive layer (65) is shown, to explicitly show that the organic photovoltaic layer is unpatterned. The second conductive layer is also unpatterned, at this stage. The substrate was taken out of the vacuum chamber and stored in a glove box filled with nitrogen.
In the glovebox, after the providing the layers 64 and 65, a glass encapsulation is provided, by gluing a glass cover to the substrate using a light curing sealant XNR5516 (Nagase). The glass cover contained moisture and oxygen getter adhesives in its interior. Thin film encapsulation, such as a multilayer barrier could have been provided instead of a glass cover.
The OPV device was almost completed, still requiring the serial connection. For that purpose, the substrate was taken out of the glove box and the interconnection between the first and second conductive layers and the sectioning of the second conductive layers were performed. Although the order of the steps of interconnection and sectioning are not relevant, the following procedure was performed for the purpose of measuring the quality of the connections:
At this stage, the external electrical connections (61, 62) can be used to measure the quality of the sectioning and of the interconnection. An open circuit voltage of 0.55 V was measured at the external electrical connections (61, 62), the active solar cell is defined by the area 66. After sectioning the second conductive layer (63) by laser ablating a line (
Other lasers were also tested, and the parameters for each different laser can be easily adjusted to provide the interconnection.
The features disclosed in at least one of the specification, the claims, and the figures may be material for the realization of the invention in its various embodiments, taken in isolation or in various combinations thereof.
Number | Date | Country | Kind |
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10193587.2 | Dec 2010 | EP | regional |
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/EP2011/006078 | 12/5/2011 | WO | 00 | 8/16/2013 |