Method for forming fine pitch contacts and fine pitch contacts obtained thereby

Information

  • Patent Grant
  • 6533591
  • Patent Number
    6,533,591
  • Date Filed
    Wednesday, December 19, 2001
    22 years ago
  • Date Issued
    Tuesday, March 18, 2003
    21 years ago
Abstract
A method for forming fine pitch contacts (1) used in a ZIF socket comprises the following steps: stamping a contact strip (3) to form a plurality of contacts each comprising a first portion, a retaining portion (10) and a second portion being coplanar with each other, the first portion comprising a pair of arcuate arms (121) defining a circular receiving space (20) therebetween and a pair of parallel contacting fingers (120) defining engaging space (21) therebetween; bending the first portion to form a contacting portion (12) perpendicular to the retaining portion and the second portion; bending the second portion to form a soldering portion (11) perpendicular to the retaining portion and parallel to the contacting portion.
Description




BACKGROUND OF THE INVENTION




1. Field of the Invention




The present invention relates to a method for forming fine pitch contacts and fine pitch contacts obtained thereby. Particularly, the present invention relates to a method for forming fine pitch contacts used in a Zero Insertion Force (ZIF) socket and fine pitch contacts used in a ZIF socket.




2. Description of Prior Art




As shown in

FIGS. 4 and 5

, a conventional contact


9


used in a ZIF socket is illustrated. The conventional contact


9


comprises a soldering portion


93


configured as a round plate for being surface-mounted on a printed circuit board through a solder ball attached thereon, a retaining portion


92


extending vertically with respect to the soldering portion


93


and connected thereto through a connecting tab


95


, and a contacting portion


91


for electrically engaging with a pin of a Central Processing Unit (CPU) mounted on the ZIF socket for establishing an electrical connection between the CPU and the printed circuit board. The contacting portion


91


has a neck portion


914


connecting with the retaining portion


92


and a pair of resilient arms


910


projecting oppositely from the neck portion


914


and between which a circular receiving space


913


is defined for receiving the pin of the CPU. The pair of resilient arms


910


have a pair of cantilever contacting fingers


912


defining an engaging gap


911


therebetween.




The conventional contact


9


as described above is formed by the following steps:




a. providing a contact strip with a plurality of contacts stamped thereon (only one stamped contact


9


′ shown in FIG.


5


);




b. curving the horizontal portions


91


′ of the stamped contact


9


′ to form the resilient arms


910


defining a circular receiving space


913


therebetween and the contacting fingers


912


confronting each other;




c. bending the round portion


93


′ of the stamped contact


9


′ to be vertical to the joint portion


92


′ to respectively form the soldering portion


93


and the retaining portion


92


of the final contact


9


; and




d. inserting the plurality of stamped contacts


9


′ in a housing of the ZIF socket and cutting the plurality of stamped contacts


9


′ from the contact strip to obtain the final contacts


9


.




To maintain a fine pitch (which is 1.27 mm as well known in the art) between two adjacent contacts in the ZIF socket, the width “A” of the expanded contacting portion


91


′ stamped on the contact strip should at least double the pitch, that is, at least 2.54 mm. Thus, a problem of the above method for forming the conventional contact is that the expanded contact


9


′ shown in

FIG. 5

wastes a great deal of material.




Furthermore, residual stress is accumulated in the contacting portion


91


when curving the resilient arms


910


of the contacting portion


91


by a bending device.Once the contacting portions


91


of the contacts


9


are removed from the bending device, the pairs of resilient arms


910


will deviate from their intended positions due to stress relaxation. When this happens, the contacting portions


91


of the contacts


9


are unable to accurately mate with the pins of the CPU, thereby adversely affecting a proper engagement between the CPU and the printed circuit board.




Hence, an improved method for forming a contact used in a ZIF socket is required to overcome the above-mentioned disadvantages of the prior art.




BRIEF SUMMARY OF THE INVENTION




A first object of the present invention is to provide a method for forming fine pitch contacts used in a ZIF socket and fine pitch contacts obtained thereby, whereby the space occupied by contacts stamped on a contact strip can be greatly decreased to thus reduce the manufacturing cost of the contacts.




A second object of the present invention is to provide a method for forming fine pitch contacts used in a ZIF socket and fine pitch contacts obtained thereby, whereby the deviation problem of contacting portions of the contacts from their intended positions due to stress relaxation can be effectively solved.




To fulfill the above-mentioned objects, a method for forming fine pitch contacts used in a ZIF socket in accordance with the present invention comprises the following steps:




a. stamping a contact strip comprising a carrier strip and a plurality of contacts, each contact comprising a first portion opposite the carrier strip, a retaining portion extending from the first portion to the carrier strip, and a second portion projecting from the retaining portion and connecting with the carrier strip, the first portion, the retaining portion and the second portion being coplanar with each other, the first portion comprising a pair of arcuate arms defining a circular receiving space therebetween and a pair of parallel contacting fingers extending from respective distal ends of the pair of arcuate arms;




b. bending the first portions of the contacts to form contacting portions perpendicular to the retaining portions and the second portions;




c. bending the second portions of the contacts to form soldering portions perpendicular to the retaining portions and parallel to the contacting portions; and




d. inserting the plurality of contacts in a housing of the ZIF socket and cutting them from the carrier strip.




Other objects, advantages and novel features of the invention will become more apparent from the following detailed description of the present embodiment when taken in conjunction with the accompanying drawings.











BRIEF DESCRIPTION OF THE DRAWINGS





FIG. 1

is a top plan view of a contact strip having a plurality of contacts stamped thereon in accordance with a first embodiment of the present invention;





FIG. 2

is a perspective view of a contact used in a ZIF socket in accordance with a first embodiment of the present invention;





FIG. 3

is a perspective view of a contact used in a ZIF socket in accordance with a second embodiment of the present invention;





FIG. 4

is a perspective view of a conventional contact used in a ZIF socket; and





FIG. 5

is an expanded view of the conventional contact used in a ZIF socket shown in FIG.


3


.











DETAILED DESCRIPTION OF THE INVENTION




Referring to

FIGS. 1 and 2

, in order to obtain a contact


1


used in a ZIF socket (not shown) in accordance with a first embodiment of the present invention, a contact strip


3


is first stamped from a metal sheet to comprise a carrier strip


30


and a plurality of contacts


1


. The contacts


1


connect to the carrier strip


30


through a link


31


, one end of which connects with the carrier strip


30


and the other end of which connects with a soldering portion


11


of the contact


1


. A substantially rectangular retaining portion


10


of the contact


1


extends from the soldering portion


11


opposite to the carrier strip


30


. A plurality of barbs


100


are formed on opposite lateral edges of the retaining portion


10


for interference with corresponding contact receiving holes of the ZIF socket. The soldering portion


11


is formed as a circular plate for SMT purpose.




The contact strip


3


further comprises a contacting portion


12


for each contact


1


. The contacting portion


12


extends from the retaining portion


10


and is coplanar with the retaining portion


10


and the soldering portion


11


. The contacting portion


12


has a pair of arcuate arms


121


extending from the retaining portion


10


, between which an approximate circular receiving space


20


is defined for correspondingly receiving a pin of a CPU (not shown) which engages with the ZIF socket. A pair of parallel contacting fingers


120


project from respective distal ends of the pair of arcuate arms


121


and extend a predeterminate distance. Between the pair of contacting fingers


120


, an engaging space


21


is defined communicating with the circular receiving space


20


. The pair of contacting fingers


120


comprise a pair of respective contacting faces


1200


on inner surfaces thereof confronting each other for electrical connection with the pin of the CPU. The highness of the contacting face


1200


is substantially equal to the thickness of the metal sheet.




The contact strip


3


is then subject to two bending operations successively. During the first bending operation, the contacting portion


12


is integrally bent to be perpendicular to the retaining portion


10


along an upper side


101


of the retaining portion


10


. During the second bending operation, the soldering portion


11


is integrally bent to be perpendicular to the retaining portion


10


along a lower side


102


of the retaining portion


10


and parallel to the contacting portion


12


. The soldering portion


11


extends in a same direction as the contacting portion


12


. Finally, a cutting operation is applied to the contact strip


3


to cut the plurality of contacts


1


from the contact strip


3


after insertion the contacts


1


in a housing of the ZIF socket.




Compared with the prior art, because the circular receiving space


20


and the engaging space


21


of the contact


1


have been defined by the pair of arms


121


and the pair of contacting fingers


120


stamped on the contact strip


3


prior to a bending operation applied thereto, the width “a” of the contacting portion


12


is necessarily and smaller than 1.27 mm (a fine pitch between two adjacent contacts as known in the art), which is distinctly smaller than the width A of the expanded, conventional contacting portion


91


shown in

FIG. 5

, thereby occupying little space on the contact strip


3


, saving the material and decreasing the cost of forming the contact


1


.




On the other hand, the arcuate arms


121


and the contacting fingers


120


are configured and directly stamped on the contact strip


3


so that the method for producing the contact


1


of the present invention is much simplifier than the conventional method which requires the resilient arms


910


and the contacting portions


912


of the conventional contacts


9


be precisely curved for assuring a substantially correct and proper engagement between the pin of the CPU and the contact. Thus, no additional device for curving the contacting portion


91


is needed by the present invention. Moreover, the residual stress accumulated in the contact


1


of the present invention is greatly reduced compared with the prior art. Additionally, the contacting highness of the contacting portion


12


of the present invention is the thickness of the metal sheet, while the contacting highness of the contacting portion


91


of the conventional contact


9


is designed and stamped from the metal sheet, which is larger than the thickness of the metal sheet.





FIG. 3

illustrates a contact


1


′ in accordance with a second embodiment of the present invention. A contacting portion


12


′ of the contact


1


′ has a neck portion


122


′ connecting with a retaining portion


10


′, and a C-shaped portion


121


′ defining a circular receiving space


20


′ therein. A pair of parallel contacting fingers


120


′ project from opposites distal ends of the C-shaped portion


121


′ and extend parallel to the retaining portion


10


′, with which an engaging space


21


′ is defined for receiving the pin of the CPU. The contact


1


′ also defines a soldering portion


11


′ for being soldered to a printed circuit board (not shown) through a solder ball (not shown) attached thereon.




It is to be understood, however, that even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.



Claims
  • 1. A method for forming fine pitch contacts used in a ZIF socket comprising the following steps:stamping a contact strip to form a plurality of contacts and a carrier strip interconnecting the contacts, each contact having a first portion distal from the carrier strip, said first portion comprising a pair of arcuate arms defining a circular receiving space therebetween and a pair of contacting fingers projecting from respective distal ends of said pair of arcuate arms and extending parallel to each other, said contact also comprising a retaining portion extending from said first portion to the carrier strip, and a second portion projecting from said retaining portion and connecting with the carrier strip, said first portion, said retaining portion and said second portion being coplanar with each other; bending said first portions of the contacts to form contacting portions perpendicular to said retaining portions and said second portions; and configuring said second portions of the contacts to form soldering portions; wherein the width of said portion stamped on the contact strip is smaller than 1.27 mm, wherein the stamping step comprises forming contacting faces on inner surfaces of said pair of contacting fingers, which are perpendicular to said retaining portion and said second portion during the stamping step, wherein a thickness of the contacting faces is equal to a thickness of the arms and the fingers.
  • 2. The method as described in claim 1, wherein the stamping step comprises configuring said retaining portion of each contact in a rectangular shape and forming a plurality of barbs on opposite lateral edges thereof.
  • 3. The method as described in claim 1, wherein the stamping step comprises configuring said soldering portion of each contact as a circular plate perpendicular to said retaining portion.
  • 4. A contact used in a ZIF socket adapted for electrical connection a pin of a CPU with a printed circuit board, comprising:a retaining portion having a plurality of barbs on opposite lateral edges thereof; a soldering portion projecting from and extending perpendicular to a lower side of said retaining portion for soldering to the printed circuit board; and a contacting portion projecting from and extending perpendicular to said retaining portion, said contacting portion having a pair of arcuate arms with a circular receiving space being defined therebetween, each arcuate arm defining a contacting finger at a distal end with a contacting face being defined in an inner surface thereof for electrical connection with the pin of the CPU, wherein said contacting face is obtained from a metal sheet by a stamping step and a height of said contacting face is along a thickness of the metal sheet, wherein the width of said contacting portion is smaller than 1.27 mm, wherein said contacting portion comprises a pair of contacting fingers extend parallel to each other from respective distal ends of said pair of arcuate arms and between the contacting fingers an engaging space is defined in communication with said circular receiving space, said fingers having a thickness equal to a thickness of the contacting face.
  • 5. The contact as described in claim 4, wherein said contacting portion is bent along an upper side edge of said retaining portion after being directly stamped from the metal sheet together with said soldering portion and said retaining portion, which are coplanar with each other during stamping operation.
  • 6. A contact for use with a pin type complementary contact, comprising:a vertical retaining portion with barbs thereon; a soldering portion horizontally extending from a bottom end of said retaining portion; a contacting portion horizontally extending from an upper end of said retaining portion, said contacting portion defining a pair of arcuate arms with a pair of contacting fingers at free ends thereof, respectively, said pair of arcuate arms defining a larger space therebetween for allowing said pin type complementary contact to freely extend downwardly while said pair of contacting fingers defining a smaller space therebetween for tightly sandwiching said pin type complementary contact therebetween after said pin type complementary contact moves horizontally away from said retaining portion and enters said smaller space; wherein said contact is stamped from a metal sheet, and said contacting portion on said metal sheet defines a lateral dimension similar to said retaining portion so that a fine pitch arrangement of a plurality. of contacts on the metal sheet can be obtained; wherein a thickness of said contacting portion is equal to that of the metal sheet, wherein for each stamped contact, said contacting portion is originally coplanary located above the retaining portion and successively downwardly bent with a right angle to be perpendicular to said retaining portion.
US Referenced Citations (1)
Number Name Date Kind
5188535 Bertho et al. Feb 1993 A