Method for high-density packaging and cooling of high-powered compute and storage server blades

Information

  • Patent Application
  • 20060090889
  • Publication Number
    20060090889
  • Date Filed
    October 29, 2004
    19 years ago
  • Date Published
    May 04, 2006
    18 years ago
Abstract
According to the present invention, there is provided a system for removing heat from server blades densely packaged in a rack of server blades. The system includes a liquid distribution manifold. In addition, the system includes a plurality of cold blades attached to the liquid distribution manifold, wherein liquid is circulated through the liquid distribution manifold and the cold blades. Moreover, the system includes at least one server blade attached to each of the cold blades.
Description
FIELD OF THE INVENTION

The present invention relates to computer cooling systems and, more specifically, to a system and method for providing the removal of heat from server blades densely packaged in a rack of server blades.


BACKGROUND OF THE INVENTION

Servers implemented as racks of full of blades (unpackaged printed circuit boards) are becoming increasingly popular because of their potentially high density. However, the difficulty of removing heat from such systems via forced air cooling has emerged as a very significant problem. It is so severe that in most actual datacenter installations blade server racks need to be kept half empty because they cannot be cooled with standard methods.


SUMMARY OF THE INVENTION

According to the present invention, there is provided a system for removing heat from server blades densely packaged in a rack of server blades. The system includes a liquid distribution manifold. In addition, the system includes a plurality of cold blades attached to the liquid distribution manifold, wherein liquid is circulated through the liquid distribution manifold and the cold blades. Moreover, the system includes at least one server blades attached to each of the cold blades.




BRIEF DESCRIPTION OF THE DRAWINGS


FIG. 1 shows the interior layout of a rack for iceblades.



FIG. 2 shows two iceblades in close, direct thermal contact with a water-cooled coldblade.



FIG. 3 shows the cross-section of a generic iceblade.



FIG. 4 shows the cross-section of an iceblade holding disks.



FIG. 5 shows a pair of iceblades, one diskless and one with disks, embracing a coldblade.



FIG. 6 shows two diskless iceblades embracing a coldblade.



FIG. 7 shows the relative location of two clamps utilized in holding two iceblades together, where the iceblades surround a coldblade.



FIG. 8 shows a detailed view of the clamping mechanism utilized in holding two iceblades together, where the iceblades surround a coldblade, according to an exemplary embodiment of the invention.



FIG. 9 is a diagram showing how iceblades make contact with a backplane, according to an exemplary embodiment of the invention.




DETAILED DESCRIPTION OF THE INVENTION

The invention describes a system and method for removing heat from server blades densely packaged in a rack of server blades.



FIG. 1 shows the interior layout of a rack for iceblades within rack enclosure 10. Rack enclosure 10 includes a water distribution manifold. The water distribution manifold includes manifold columns 14. Multiple coldblades 16 can be attached to each of the manifold columns 14. Water flows horizontally through coldblades 16. The coldblades 16 are accessible from the front of enclosure 10. Airflow parallel to the coldblades 16 may be employed to remove residual heat which cannot be removed by the coldblades 16.



FIG. 2 shows two iceblades 18 in close thermal contact with a coldblade 16. In one embodiment, the coldblade 16 is water-cooled. Each iceblade 18 is a carrier for electronic components. Each coldblade 16 is tightly embraced by two iceblades 18.



FIG. 3 shows a cross-section of an iceblade 18. In one embodiment, Iceblade 18 consists of printed circuit board 20 and heat-conducting metal plate 22. Major heat producing circuits (e.g., chips 24) on the printed circuit board 20 are in direct thermal contact with aluminum plate 22. Heat spreading methods of various kinds may be employed to carry heat from dissipating electronic elements to aluminum plate 22. In an exemplary embodiment, the space between printed circuit board 20 and aluminum plate 22 heat is filled with conducting polymer 26 or other materials, such as crushed copper wool. In another exemplary embodiment, metallic thermal shims may be used to carry heat form from dissipating electronic elements to aluminum plate 22. Also, heat dissipating elements (e.g., DIMMS) can be mounted on the backside of printed circuit board 20, where they are exposed to airflow.



FIG. 4 shows a cross-section of an iceblade 18 holding multiple disks 28. The rigid surface of aluminum plate 22 makes it practical to rigidly mount disks 28. In contrast, conventional blades are typically unable to hold more than one or two disks 28.



FIG. 5 shows one embodiment of a field replaceable unit (FRU) 30, consisting of a pair of iceblades 18, one diskless and one with disks 28, embracing a coldblade 16. A clamping mechanism automatically clamps the two iceblades 18 onto the coldblade 16 upon insertion. The clamping mechanisms includes clamping unit 32.



FIG. 6 shows another embodiment of field replaceable unit (FRU) 30, consisting of a pair of diskless iceblades 18 embracing a coldblade 16.



FIG. 7 is a diagram 36 showing the action associated with the insertion and removal of FRU 30 in conjunction with coldblade 30. In diagram 36, FRU 30 is shown with clamping unit 32 mounted on the top and bottom of FRU 30. In diagram 36, FRU 30 is inserted from the front of coldblade 16 towards manifold columns 14.



FIG. 8 shows the details of an exemplary clamping unit 32 utilized by FRU 30. Clamping unit 32 includes self-locking worm gear 40, DC motor 42, shaft 44, steel nuts 46. DC motor 42 drives worm gear 40 through shaft 44. The ends of shaft 44 contain threads of opposite handedness (left handed and right handed, respectively) and engage nut 46 and nut 48. Nut 46 and nut 48 are each embedded in iceblades 18.


Application of DC voltage of one polarity to DC motor 42 will simultaneously draw iceblades 18 closer to coldblade 16. Application of the opposite polarity will drive iceblades 18 apart. In a DC motor 42, current draw and torque are nearly linearly related. This fact can be used to measure the applied torque and shut off the power when a pre-determined amount of torque or clamping force has been achieved.


Worm gear 40 is of self-locking design, where removing the voltage to the DC motor 42 will not result in a loosening of the clamping force. The axis of each DC motor 42 included in FRU 30 is extended to the front of the FRU 30 and fitted with a small handle. The small handle can be used to release FRU 30 in the event of the failure of DC motor 42.



FIG. 9 shows one embodiment of the contact mechanism utilized in rack enclosure 10, between iceblades 18 and backplane 46. Extending perpendicular from backplane 46 two arrays of contact points 48. Each iceblade 18 includes multiple contact blocks 50. Contact blocks 50 penetrate aluminum plate 22, so that they slightly protrude over the level of the mating surface of aluminum plate 22. The protruding contact blocks make contact with corresponding contact points 48. Clamping unit 32 provides the force necessary for contact between contact points 48 and contact blocks 50. In an alternative embodiment, capacitive coupling mechanisms can be employed as well.


Thus, a system, method and service to provide a cooling system for high-powered compute and storage server blades have been described. Although the present invention has been described with reference to specific exemplary embodiments, it will be evident that various modifications and changes may be made to these embodiments without departing from the broader spirit and scope of the invention. Accordingly, the specification and drawings are to be regarded in an illustrative rather than a restrictive sense.

Claims
  • 1. A system for removing heat from server blades, comprising: a liquid distribution manifold; a plurality of cold blades attached to the liquid distribution manifold, wherein liquid is circulated through the liquid distribution manifold and the cold blades; and at least one server blade attached to each of the cold blades.
  • 2. The system of claim 1 wherein the liquid distribution manifold comprises: a base portion; and at least one vertical pipe ascending from the base portion.
  • 3. The system of claim 1 wherein the cold blade is attached to the liquid distribution manifold at the at least one vertical pipe.
  • 4. The system of claim 3 further comprises a means for circulating the liquid through the base portion, the vertical pipe and each of the cold blades attached to the vertical pipe.
  • 5. The system of claim 1 wherein the server blade comprises a printed circuit board.
  • 6. The system of claim 1 wherein the server blade comprises at least one disk drive.
  • 7. The system of claim 1 wherein the server blade includes a base portion, wherein the base portion is an aluminum plate, wherein the base portion faces the cold blade.
  • 8. The system of claim 7 wherein heat producing elements within the server blade are in direct thermal contact with the base portion.
  • 9. The system of claim 8 wherein the direct thermal contact is achieved via thermal shims.
  • 10. The system of claim 8 wherein the direct thermal contact is achieved via filling the space via the aluminum plate and the heat producing elements with heat conducting polymers.
  • 11. The system of claim 1 wherein heat producing elements are attached to the side of the server blade opposite of the side facing the cold blade, wherein airflow within the blade server rack is utilized to supplement heat dissipation achieved via the cold blade.
  • 12. The system of claim 1 wherein two server blades are attached as a pair of server blades to each of the cold blades.
  • 13. The system of claim 12 wherein the pair of server blades are attached to each other by a clamping unit at the top and clamping unit at the bottom of the pair of server blades.
  • 14. The system of claim 13 wherein installation of the pair of server blades within the system comprises sliding the pair of server blades over the cold blade and tightening the pair of server blades around the cold blade via the clamping units.